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Market Leadership - Flip Chip Technology Market
The flip chip technology market has witnessed major developments in the past few years. Asia-Pacific and Americas are major regions where flip chip technology has witnessed maximum growth. This is because of the presence of key players in the flip chip technology market and key industries using flip chip wafers.
Major players operating in the flip chip technology market are Samsung (South Korea), Intel (U.S.), GlobalFoundries (U.S.), UMC (Taiwan), ASE, Inc. (Taiwan), Amkor Technology (U.S.), STATS ChipPAC (Singapore), Powertech Technology (Taiwan), and STMicroelectronics (Switzerland) among others. The Top 5 players that hold maximum share in flip chip technology market are Amkor Technology (U.S.), ASE Group (Taiwan), Intel (U.S.), Samsung (South Korea), and TSMC, Ltd. (Taiwan).
Intel Corporation is a multinational technology company and the world’s largest and highest-valued semiconductor chip maker as of 2014. The company invested approximately USD 10.15 billion, USD 10.61 billion, and USD 11.54 billion in R&D in 2012, 2013, and 2014, respectively. The company’s R&D investments as a proportion of its net revenue have increased steadily over the last three years. These R&D efforts help the company constantly upgrade and expand its product and service portfolio; gain an edge over its competitors; capitalize on megatrends; and explore new opportunities. In addition, being an integrated device manufacturer, the company has a direct control over quality control, processes, production timing, product cost, power consumption, performance, and manufacturing yield.
The company uses inorganic strategies, such as acquisitions, to tackle competition as well as broaden its product and technology portfolio. These also help the company expand its business worldwide. For example, in June 2015, it signed an agreement with Altera Corp. (U.S.) to acquire the latter in an all-cash transaction for around USD 16.7 billion. In January 2015, Intel purchased stocks of Vuzix Corp. (U.S.) worth USD 24.8 million, approximately 30% of the company’s stock value.
Amkor Technology is one of the world’s largest providers of contract semiconductor assembly and test services. The company is a strategic manufacturing partner of various leading semiconductor companies and electronics OEMs in the world.
The company has merged with Toshiba’s Malaysian Semiconductor Packaging (Japan) to develop a new research technology in advance semiconductor packaging. Amkor Technology has also established a state-of-the-art factory and a global R&D center in South Korea which focuses on the design, development, and full-scale production of innovative semiconductor packaging and test products and services for the world’s leading semiconductor and electronic manufacturing companies. Amkor has entered into a partnership with Electronics Industry Citizenship Coalition (EICC) to design and develop several package layouts and technologies, including the Package-on-Package (‘PoP’) platform with Through-Mold Via (‘TMV’) technology, fusion quad, flip chip ball grid array (FCBGA), multi-chip modules (MCM) with a silicon interposer placed between the module chips and substrate, copper pillar bumping, and fine pitch copper pillar flip chip packaging technologies. With a work-force of over 21,900 employees (as of December 2014), the company has been focusing on future packaging design and development of advance semiconductor packaging and testing technologies. It invested around 2.5% of its total revenue in R&D in FY 2014.
Flip Chip Technology Market by Wafer Bumping Process (CU Pillar, Lead-Free), Packaging Technology (2D IC, 2.5D IC, 3D IC), Packaging Type (BGA, PGA, LGA, SIP, CSP), Product (Memory, LED, CPU, GPU, SOC), Application and Geography - Global Forecast to 2022
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