HOME Research Insight SCHOTT AG (Germany) and Teledyne Microelectronics (U.S.) are main players in Hermetic Packaging Market



SCHOTT AG (Germany) and Teledyne Microelectronics (U.S.) are main players in Hermetic Packaging Market


The hermetic packaging market has witnessed enormous developments in the past few years. The APAC region is expected to capture the largest market share in 2016 followed by North America. The market in the APAC region is expected to grow at the highest rate between 2016 and 2022. Hence, these are the major regions wherein hermetic packaging is expected to witness maximum growth. This is because of the presence of the large number of manufacturing companies in these regions. The hermetic packaging market is highly competitive with a number of big and small players.

Till 2016, the hermetic packaging market was dominated by Teledyne Microelectronics (U.S.), SCHOTT AG (Germany), AMETEK, Inc. (U.S.), Amkor Technology (U.S.), and Texas Instruments Incorporated (U.S.). New product launches and acquisitions were the prevailing strategies adopted by the top players to capture a larger share in the hermetic packaging market.

Top 2 players in the hermetic packaging market:

SCHOTT AG (Germany) is one of the market leaders in the hermetic packaging market. The company has more than 130 years of experience of outstanding development, glass materials, and technology expertise and offers a broad portfolio of high-quality products and intelligent solutions. It is an innovative enabler for many industries including the home appliance, pharmaceutical, electronics, optics, automotive, and aviation. SCHOTT AG is one of the few companies in the world that develop and manufacture ultrathin glasses that offer numerous advantages, and have excellent growth potential for use in the electronics and semiconductor industries. New product launches has been a key strategy adopted by the company for dominating the hermetic packaging market. For instance, in September 2015, the company developed a special coating that protects glass-to-metal seals against corrosion, even after 24-hour salt spray tests.

Teledyne Microelectronics (U.S.), being one of the key players for hermetic packaging, has a well-established product portfolio focused on aerospace applications. The company offers multichip modules and microelectronics packaging solutions for spacecraft, satellites, and launch vehicles. For instance, Transmit/Receive Module (TRM) and Up/Down Microwave Module (UDMM) are two modules installed on Mars Science Laboratory Curiosity Rover. Teledyne Microelectronics had assisted Jet Propulsion Laboratory of National Aeronautics and Space Administration (JPL NASA) (U.S.) by providing extensive manufacturing designs for these two modules. The company is certified for MIL-PRF-38534 Class H and K standards by the Department of Defense, U.S. and follows these standards for manufacturing highly reliable microelectronic multichip modules. The company adopts the strategy of expansion as its key business growth strategy. For instance, in June 2013, the company started a manufacturing center at Lewisburg, Tennessee, U.S., to meet the growing demand of semiconductor packaging from the customers in North America.

Related Reports:

Hermetic Packaging Market by Configuration (Multilayer Ceramic, Metal Can, and Pressed Ceramic Packages), Type (Ceramic–Metal and Glass–Metal Sealing), End-User Industry (Military & Defense and Aeronautics & Space), Geography - Global Forecast to 2022

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