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Market Leadership - Printed Electronics Market


The printed electronics market is highly competitive with a significant number of players in the competitive market. The printed electronics ecosystem comprises large number of small companies engaged in manufacturing a particular printed device. Very few companies are engaged in manufacturing more than one printed electronics components. As of 2015, some of the active companies in the printed electronics component manufacturing include ThinFilm Electronics ASA (Norway), PARC, Inc. (U.S.), and GSI Technologies (U.S.). Some of the top material manufacturers whose activities have had a significant effect on the printed electronics market are BASF SE (Germany) and E.I. DuPont de Nemours & Co. (U.S.). The players have a strong printed electronics product portfolio as well as robust R&D facilities and a presence in both mature and emerging markets.

Partnership was the key strategy adopted by the players to achieve growth and stay competitive in the printed electronics market. This strategy accounted for a share of ~50% of the overall growth strategies adopted by the players in the printed electronics market between January 2015 and September 2016. Companies are partnering with manufacturers in different verticals such as packaging, automotive, consumer electronics, healthcare, and others to integrate printed electronics components in various products. Besides this, new product launches, agreements, collaborations and acquisitions are also used to strengthen their market share and position in the overall printed electronics market.

ThinFilm Electronics ASA (Norway) is engaged in the production, research, development, and commercialization of products and technology related to printed electronics components and smart systems. Thinfilm provides its products and services through the printed memory and systems segment. This segment includes memory, display, sensing, and wireless communication. The company focuses on implementing its core growth strategies: global market expansion, partnerships and collaborations, and investments in new products and technologies. For instance, the company has partnered with many companies such as Sarine Technologies Ltd. (Israel), Maria & Donato (Spain), and Constantia Flexibles (Germany), among others in 2016 to solve problems using its technology in different applications.

PARC, Inc. (U.S.) offers different R&D services such as custom research and development, technology, expertise, best practice, and intellectual property to the customers. The company’s work in the field of printed flexible electronics includes a variety of projects such as printed methane sensors, printed chiplets, hybrid printed strain sensors, hybrid electronics for wearables, vanishing electronics, peel-and-stick sensors for buildings, flexible X-ray detectors, and RF energy harvesting platform. The company invests heavily in R&D to develop innovative products and enhance its existing product portfolio. Owing to the company’s strong focus on R&D, it had 2500 intellectual properties registered on its name along with 4000 books and 100 industry-defined books published. The company is also engaged in new product launch for the new technologies such as innovation in printed electronics technologies as well as networking technologies. The company announced a partnership with the Australian Information Industry Association (AIIA) in August 2016 to offer Australian companies the ability to leverage Silicon Valley innovation, providing new ways to gain insights, develop new technologies, and launch innovative product offerings.

Related Reports:

Printed Electronics Market by Material (Ink, Substrate), Technology (Inkjet, Screen, Gravure, Flexographic), Device (Sensors, Displays, Batteries, RFID, Lighting, Photovoltaic) and Geography - Global Forecast to 2022

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