HOME Research Insight Semiconductor & IC Packaging Materials Market by, Packaging Technologies, and Geography - Regional Trends & Forecast to 2019



Semiconductor & IC Packaging Materials Market by, Packaging Technologies, and Geography - Regional Trends & Forecast to 2019


The semiconductor and IC packaging technologies such as SOP, GA, QFN, DFN, and many more are used in the manufacturing of electronic packaging components. The end-user industries such as mobile phones, flat panel displays, and consumer electronics use components in the internal circuits.

In the recent economic downturn, the end-users industries for electronic packaging materials experienced a decline of around 5% to 10%. However, as a result of improvements in the global economy since 2009, the end-user industries have witnessed a marginal growth ranging from 4% to 6% which is reflected in the electronic packaging materials segments as well. For example, the electronics industry, which experienced a decline by over 20% in 2008-2009, grew by 4% in 2010, and remained the same for 2011 and 2012.

The end-user industry is always at the look-out of better innovations and technological advancements which can serve their customers better. This has generated the need for advanced electronic components with better output. Therefore, there is a growing demand from end-users industries.

Related Reports:

Semiconductor & IC Packaging Materials Market by Types (Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, and so on), Packaging Technologies (SOP, GA, QFN, DFN, and others) & Geography - Regional Trends & Forecast to 2019

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