HOME Top Market Reports Semiconductor & IC Packaging Materials Market by Types (Organic Substrates, Bonding Wires, Leadframes, Ceramic Packages, & so on), Packaging Technologies (SOP, GA, QFN, DFN, & Others), & Geography - Regional Trends & Forecast to 2019

Semiconductor & IC Packaging Materials Market by Types (Organic Substrates, Bonding Wires, Leadframes, Ceramic Packages, & so on), Packaging Technologies (SOP, GA, QFN, DFN, & Others), & Geography - Regional Trends & Forecast to 2019

By: marketsandmarkets.com
Publishing Date: April 2014
Report Code: CH 2348

 

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Semiconductor & IC packaging materials are known to protect the electronic components such as semiconductors and ICs from external impact, corrosion, and so on. These packaging materials are used along with various advanced packaging technologies for the packaging of semiconductors and integrated circuits.

Based on the types the semiconductor packaging materials market can be classified into eight types such as organic substrates, bonding wires, leadframes, encapsulation resins, ceramic packages, die attach materials, thermal interface materials, solder balls, and others. Organic substrates constitute the major global market in semiconductor and IC packaging materials and are widely used as base materials for the packaging of semiconductors and ICs. Bonding wires mainly of gold have been widely used as packaging materials, but lately there has been a shift towards copper bonding wires. Encapsulation resins are relatively recent types of packaging materials for semiconductors and IC and therefore, are expected to grow aggressively in the next five years.

The demand for these packaging materials is influenced by the growing awareness of the ability to reduce water to cement ratio, where a different dosage reflects different performance. With the growing demand for electronic components the semiconductor packaging materials market is also expected to grow in the future. Semiconductor and IC packaging materials are application specific and are available globally. There are different grades of semiconductor and IC packaging materials available in the market among the above mentioned eight types. These semiconductors and IC packaging materials apply various packaging technologies such as SOP, GA, QFN, DFN, QFP, and others depending upon the end-user’s interest.

Currently, semiconductor and IC packaging materials are mainly concentrated in Asia-Pacific, ROW, followed by Europe and North America. The Asia-Pacific and ROW markets are expected to grow at a higher rate in the future. This report estimates the size of semiconductor packaging materials market in terms of revenue, regionally, and in end-user markets. The report provides a comprehensive review of the major market drivers, challenges, and key issues in the industry. This market is further segmented and forecasted for major regions such as Asia-Pacific, Europe, North America, and ROW Top players of the industry are profiled in detail with their recent developments and other strategic industry activities. The segmentation by type of semiconductor & IC packaging materials in terms of consumption and value for each region is also discussed in this report.

By Type:

  1. Organic substrates
  2. Bonding wires
  3. Leadframes
  4. Encapsulation resins
  5. Ceramic packages
  6. Die attach materials
  7. Thermal interface materials
  8. Solder balls
  9. Others

By Packaging Technology:

  1. SOP
  2. GA
  3. QFN
  4. DFN
  5. QFP
  6. DIP
  7. Others

By Region:

  1. Asia-Pacific
  2. North America
  3. Europe
  4. ROW

This report also includes the leading manufacturers’ profiles such as BASF SE (Germany), Hitachi Chemical Co. Ltd. (Japan), Alent plc (U.K.), Henkel AG & Company (Germany), Kyocera Chemical Co. Ltd. (Japan), Sumitomo Chemical Co. Ltd. (Japan), and others.

Table Of Contents 

1 Introduction (Page No. - 23)
  1.1 Objectives
  1.2 Report Description
  1.3 Stakeholders
  1.4 Research Methodology
      1.4.1 Market Size
      1.4.2 Secondary Sources Used
      1.4.3 Key Data Points Taken From Primary Sources
      1.4.4 Assumptions Made For This Report
  1.5 Key Questions Answered

2 Executive Summary (Page No. - 34)
  2.1 Semiconductor & Ic Packaging Materials Market Revenue Share: By Region, 2013 Vs. 2019

3 Semiconductor & Ic Packaging Materials Premium Insights (Page No. - 37)
  3.1 Market Segmentation
  3.2 Market Share Analysis, By Segmentation
  3.3 Market Dynamics
  3.4 Porter’s Five Force Analysis
  3.5 Market Size, By Type
  3.6 Market, By Type
  3.7 Market Size In Packaging Technology, By Packaging Technology
 
4 Semiconductor & Ic Packaging Materials Market Overview (Page No. - 51)
  4.1 Introduction
  4.2 Value Chain Analysis
  4.3 Drivers And Restraints Of Semiconductor & Ic Packaging Materials Market
      4.3.1 Impact Analysis–Drivers & Restraints
  4.4 Opportunities
      4.4.1 Potential In Emerging Economies Such As India And Brazil
  4.5 Winning Imperative
      4.5.1 Technological Advancement And Product Innovation
  4.6 Semiconductor & Ic Packaging Materials: Porter’s Five Forces Analysis

5 Semiconductor & Ic Packaging Materials Market, By Type (Page No. - 60)
  5.1 Introduction
  5.2 Future Market Opportunities Of Packaging Materials, By Type
  5.3 Packaging Material Historical Shipments, By Type (2010–2013)
  5.4 Semiconductors & Ic Packaging Materials Market Trends, By Type
  5.5 Organic Substrates
      5.5.1 Organic Substrates Market Trends, By Type
  5.6 Bonding Wire
      5.6.1 Bonding Wires Market Trends, By Region
  5.7 Leadframes
      5.7.1 Leadframes Market Trends, By Type
  5.8 Encapsulation Resins
      5.8.1 Encapsulation Resins Trends, By Region
  5.9 Ceramic Packages
      5.9.1 Ceramic Packages Trends, By Type
  5.10 Die Attach Materials
      5.10.1 Die Attach Materials Trends, By Type
  5.11 Thermal Interface Materials
      5.11.1 Thermal Interface Materials Trends, By Type
  5.12 Solder Balls
      5.12.1 Solder Balls Trends, By Type
  5.13 Others
      5.13.1 Others Trends, By Region

6 Semiconductor & Ic Packaging Materials Market, By Packaging Technology (Page No. - 86)
  6.1 Introduction
  6.2 Market Size, By Packaging Technologies
  6.3 Market Trends, By Packaging Technologies
  6.4 Small Outline Package (SOP)
      6.4.1 Small Outline Package (SOP) Market Trends, By Region
  6.5 Grid Array (GA)
      6.5.1 Grid Array (GA) Market Trends, By Region
  6.6 Quad Flat No-Leads (QFN) Package
      6.6.1 Quad Flat No-Leads (QFN) Package Market Trends, By Type
  6.7 Dual Flat No-Leads (Dfn) Package
      6.7.1 Dual Flat No-Leads (DFN) Package Market Trends, By Type
  6.8 Quad Flat Package (QFP)
      6.8.1 Quad Flat Package (QFP) Market Trends, By Region
  6.9 Dual In-Line Package (DIP)
      6.9.1 Dual In-Line Package (DIP) Market Trends, By Region
  6.10 Others
      6.10.1 Others Market Trends, By Region

7 Semiconductor & Ic Packaging Materials Market, By Type (Page No. - 105)
  7.1 Introduction
  7.2 Asia-Pacific
      7.2.1 Asia-Pacific: Market Trends, By Type
      7.2.2 Asia-Pacific: Market Trends, By Packaging Technology
      7.2.3 Asia-Pacific: Market Trends, By Country
      7.2.4 China: Market Trends
            7.2.4.1 China: Market Trends, By Type
            7.2.4.2 China: Market Trends, By Packaging Technology
      7.2.5 Japan: Market Trends
            7.2.5.1 Japan: Market Trends, By Type
            7.2.5.2 Japan: Market Trends, By Packaging Technology
      7.2.6 Taiwan: Market Trends
            7.2.6.1 Taiwan: Market Trends, By Type
            7.2.6.2 Taiwan: Market Trends, By Packaging Technology
      7.2.7 South Korea: Market Trends
            7.2.7.1 South Korea: Market Trends, By Type
            7.2.7.2 South Korea: Market Trends, By Packaging Technology
      7.2.8 Others: Market Trends
            7.2.8.1 Others: Market Trends, By Type
            7.2.8.2 Others: Market Trends, By Packaging Technology
  7.3 North America
      7.3.1 North America: Market Trends, By Type
      7.3.2 North-America: Market Trends, By Packaging Technology
      7.3.3 North America: Market Trends, By Country
      7.3.4 U.S.: Market Trends
            7.3.4.1 U.S.: Market Trends, By Type
            7.3.4.2 U.S.: Market Trends, By Packaging Technology
      7.3.5 Canada: Market Trends
            7.3.5.1 Canada: Market Trends, By Type
            7.3.5.2 Canada: Market Trends, By Packaging Technology
      7.3.6 Mexico: Semiconductor & Ic Packaging Materials Market Trends
            7.3.6.1 Mexico: Market Trends, By Type
            7.3.6.2 Mexico: Market Trends, By Packaging Technology
  7.4 Europe
      7.4.1 Europe: Semiconductor & Ic Packaging Materials Market Trends, By Type
      7.4.2 Europe: Market Trends, By Packaging Technology
      7.4.3 Europe: Market Trends, By Country
      7.4.4 Germany: Market Trends, By Country
            7.4.4.1 Germany: Market Trends, By Type
            7.4.4.2 Germany: Market Trends, By Packaging Technology
      7.4.5 France: Market Trends, By Country
            7.4.5.1 France: Market Trends, By Type
            7.4.5.2 France: Market Trends, By Packaging Technology
      7.4.6 U.K.: Market Trends, By Country
            7.4.6.1 U.K.: Market Trends, By Type
            7.4.6.2 U.K.: Market Trends, By Packaging Technology
      7.4.7 Italy: Market Trends, By Country
            7.4.7.1 Italy: Market Trends, By Type
            7.4.7.2 Italy: Market Trends, By Packaging Technology
      7.4.8 Others: Market Trends, By Country
            7.4.8.1 Others: Market Trends, By Type
            7.4.8.2 Others: Market Trends, By Packaging Technology
  7.5 ROW
      7.5.1 ROW: Semiconductor & Ic Packaging Materials Market Trends, By Type
      7.5.2 ROW: Market Trends, By Packaging Technology
      7.5.3 ROW: Market Trends, By Country
      7.5.4 Brazil: Semiconductor & Ic Packaging Materials Market Trends, By Country
            7.5.4.1 Brazil: Market Trends, By Type
            7.5.4.2 Brazil: Market Trends, By Packaging Technology
      7.5.5 Others: Semiconductor & Ic Packaging Materials Market Trends, By Country
            7.5.5.1 Others: Market Trends, By Type
            7.5.5.2 Others: Market Trends, By Packaging Technology

8 Semiconductor & Ic Packaging Materials Market, Competetive Landscape (Page No. - 158)
  8.1 Growth Strategies: By Market Development
  8.2 Market Developments, By Year, 2010–2014
  8.3 Growth Strategies: By Key Players, 2010–2014
  8.4 Market Developments: By Key Players, 2010–2013
  8.5 Growth Strategies: By Region, 2010–2013

9 Company Profiles (Page No. - 164)
  9.1 Alent Plc
  9.2 Hitachi Chemical Co. Ltd.
  9.3 Kyocera Chemical Co. Ltd.
  9.4 LG Chemical Ltd.
  9.5 Sumitomo Chemical Co. Ltd.
  9.6 Basf Se
  9.7 Mitsui High-Tec Inc.
  9.8 Henkel Ag & Company
  9.9 Toray Industries Corporation
  9.10 Tanaka Holdings Co., Ltd.

10 Appppendix (Page No. - 195)
  10.1 New Product Launches
  10.2 Mergers & Acquisitions
  10.3 Agreements & Collaborations
  10.4 Expansions
  10.5 Others
 
 
List Of Tables (70 Tables)

Table 1 Detailed Methodology For Market Size 
Table 2 Data From Primary Sources 
Table 3 Semiconductors & Ic Packaging Materials Market Opportunities, By Type
Table 4 Semiconductors & Ic Packaging Material Shipments, By Type (2010–2013)
Table 5 Semiconductors & Ic Packaging Materials Market Size, By Type, 2012–2019 ($Million) 
Table 6 Organic Substrates: Market  Size, By Type, 2012–2019 ($Million) 
Table 7 Bonding Wires: Market  Share, By Type, 2012–2019 ($Million) 
Table 8 Leadframes: Market  Size, By Type, 2012–2019 ($Million) 
Table 9 Encapsulation Resins: Market  Size, By Type, 2012–2019 ($Million) 
Table 10 Ceramic Packages : Market  Size, By Type, 2012–2019 ($Million) 
Table 11 Die Attach Materials: Market  Size, By Type, 2012–2019 ($Million) 
Table 12 Thermal Interface Materials: Market  Size, By Type, 2012–2019 ($Million) 
Table 13 Solder Balls: Market  Size, By Type, 2012–2019 ($Million) 
Table 14 Others: Market  Size, By Type, 2012–2019 ($Million) 
Table 15 Semiconductor & Ic Packaging Materials Market Revenue, By Packaging Technologies, 2012–2019 ($Million)
Table 16 Small Outline Package (SOP): Market  Revenue, By Type, 2012–2019 ($Million) 
Table 17 Grid Array (GA) Market  Size, By Type, 2012–2019 ($Million) 
Table 18 Quad Flat No-Leads (QFN) Package Market Size, By Type, 2012–2019 ($Million) 
Table 19 Dual Flat No-Leads Package (DFN) Market  Size, By Type, 2012–2019 ($Million) 
Table 20 Quad Flat Package (QFP) Market  Size, By Type, 2012–2019 ($Million) 
Table 21 Dual In-Line Package (DIP) Market Size, By Type, 2012–2019 ($Million) 
Table 22 Others Market  Size, By Type, 2012–2019 ($Million) 
Table 23 Semiconductor & Ic Packaging Materials Market Size, By Region, 2012–2019 ($Million)
Table 24 Asia-Pacific: Market Size, By Type, 2012–2019 ($Million)
Table 25 Asia-Pacific: Market Size, By Packaging Technology, 2012–2019 ($Million)
Table 26 Asia-Pacific: Market Size, By Country, 2012–2019 ($Million)
Table 27 China: Market Size, By Type, 2012–2019 ($Million)
Table 28 China: Market Trends, By Packaging Technology, 2012–2019 ($Million)
Table 29 Japan: Market Size, By Type,  2012–2019 ($Million)
Table 30 Japan: Market Trends, By Packaging Technology, 2012–2019 ($Million)
Table 31 Taiwan: Market Size, By Type,  2012–2019 $Million)
Table 32 Taiwan: Market Trends, By Packaging Technology, 2012–2019 ($Million)
Table 33 South Korea: Semiconductor & Ic Packaging Materials Market Size, By Type  2012–2019 ($Million)
Table 34 South Korea: Market Trends, By Packaging Technology, 2012–2019 ($Million)
Table 35 Others: Market Size, By Type  2012–2019 ($Million)
Table 36 Others: Market Trends, By Packaging Technology, 2012–2019 ($Million)
Table 37 North America: Semiconductor & Ic Packaging Materials Market Size, By Type, 2012–2019 ($Million)
Table 38 North-America: Market Size, By Packaging Technology, 2012–2019 ($Million)
Table 39 North America: Market Size, By Country,  2012–2019 ($Million)
Table 40 U.S.: Semiconductor & Ic Packaging Materials Market Size, By Type  2012–2019 ($Million)
Table 41 U.S.: Market Trends, By Packaging Technology, 2012–2019 ($Million)
Table 42 Canada: Market Size, By Type  2012–2019 ($Million)
Table 43 Canada: Market Trends, By Packaging Technology, 2012–2019 ($Million)
Table 44 Mexico: Market Size, By Type  2012–2019 ($Million)
Table 45 Mexico: Market Trends, By Packaging Technology, 2012–2019 ($Million)
Table 46 Europe: Market Size, By Type, 2012–2019 ($Million)
Table 47 Europe: Market Size, By Packaging Technology, 2012–2019 ($Million)
Table 48 Europe: Market Size, By Country,  2012–2019 ($Million)
Table 49 Germany: Market Size, By Type  2012–2019 ($Million)
Table 50 Germany: Market Trends, By Packaging Technology, 2012–2019 ($Million)
Table 51 France: Market Size, By Type  2012–2019 ($Million)
Table 52 France: Market Trends, By Packaging Technology, 2012–2019 ($Million)
Table 53 U.K.: Market Size, By Type  2012–2019 ($Million)
Table 54 U.K.: Market Trends, By Packaging Technology, 2012–2019 ($Million)
Table 55 Italy: Market Size, By Type  2012–2019 ($Million)
Table 56 Italy: Market Trends, By Packaging Technology, 2012–2019 ($Million)
Table 57 Others: Market Size, By Type  2012–2019 ($Million)
Table 58 Others: Market Trends, By Packaging Technology, 2012–2019 ($Million)
Table 59 ROW : Market Size, By Type, 2012–2019 ($Million)
Table 60 ROW : Market Size, By Packaging Technology, 2012–2019 ($Million)
Table 61 ROW : Market Size, By Country,  2012–2019 ($Million)
Table 62 Brazil: Market Size, By Type, 2012–2019 ($Million)
Table 63 Brazil: Market Size, By Packaging Technology, 2012–2019 ($Million)
Table 64 Others: Semiconductor & Ic Packaging Materials Market Size, By Type, 2012–2019 ($Million)
Table 65 Others: Market Size, By Packaging Technology, 2012–2019 ($Million)
Table 66 New Product Launches, 2010 - 2014 
Table 67 Mergers & Acquisitions, 2010 - 2014 
Table 68 Agreements & Collaborations, 2010 - 2014 
Table 69 Expansions, 2010 - 2014 
Table 70 Other Developments, 2010 - 2014 
 
 
List Of Figures (32 Figures)

Figure 1 Semiconductor & Ic Packaging Materials Market Size, By Region, 2013 Vs. 2019
Figure 2 Market: By Segmentation 
Figure 3 Market Size: By Segmentation, 2013 
Figure 4 Market: Market Dynamics 
Figure 5 Market: Driver Vs. Restraints 
Figure 6 Market: Porter’s Five Force Analysis
Figure 7 Market Size, By Region, 2012–2019 ($Million) 
Figure 8 Market Revenue ($Million), Fastest Growing Markets, 2013 Vs. 2019
Figure 9 Market Size, By Type, 2013-2019
Figure 10 Semiconductor & Ic Packaging Materials Market Revenue, By Type, 2012–2019
Figure 11 Market Revenue: By Major Countries, By Type, 2013 Vs. 2019
Figure 12 Market Revenue ($Million) & Cagr (%), By Packaging Technology 2014 Vs. 2019
Figure 13 Market Revenue ($Million), By Packaging  Technology &  By Region, 2013 Vs. 2019
Figure 14 Global Semiconductor & Ic Packaging Materials Market: Value Chain Analysis
Figure 15 Global Market: Driver 1 
Figure 16 Global Market: Driver 2 
Figure 17 Global Market: Restraint 
Figure 18 Global Market: Drivers & Restraints Impact Analysis
Figure 19 Global Market: Porter’s Five Forces Analysis 
Figure 20 Semiconductor & Ic Packaging  Materials: By Type 
Figure 21 Market Size, By Type, 2013  Vs. 2019 (%) 
Figure 22 Application Trends, By Region
Figure 23 Market Size: By Packaging Technologies, 2013 Vs. 2019 ($Million) 
Figure 24 Asia-Pacific: Semiconductor & Ic Packaging Materials Market Size, By Country, 2014 ($Million)
Figure 25 North America: Market Size, By Country, 2014 ($Million)
Figure 26 Europe: Market Size, By Country, 2014 ($Million)
Figure 27 Row: Semiconductor & Ic Packaging Materials Market Size, By Country, 2014 ($Million)
Figure 28 Market Share: By Growth Strategies, 2010–2014 
Figure 29 Market Developments, By Year, 2010–2014 
Figure 30 Market Strategies: By Key Players, 2010–2014
Figure 31 Market Developments: By Key Players, 2010–2013
Figure 32 Strategies In Semiconductor & Ic Packaging Materials Market, By Region, 2010–2013

Semiconductor and IC Packaging materials are mainly developed to protect the electronic components such as semiconductors and ICs from external impact and corrosion. A few types of semiconductor and IC packaging materials are organic substrates, bonding wires, leadframes, and encapsulation resins. These materials are manufactured with several types of packaging technologies such as SP, GA, QFN, and DFN. The semiconductor packaging materials market revenue was estimated to be $21 billion in 2013.

Due to the recent global economic downturn in 2008, the electronics packaging market witnessed a downfall of over 20%. The decreased revenue in the semiconductor packaging materials market is due to the gradual decrease in demand of gold bonding wires and also the fluctuations in currency exchange rates.

The semiconductor and IC packaging materials market is driven by the range of applications, which increases the R&D efforts to make electronic packaging materials highly resourceful, along with the huge demand from the electronic components industry due to increased population that finds electronic packaging materials useful in a myriad of applications. Growing advancements and technological inventions in semiconductor packaging materials market would be quite effective in the future. These materials have been well perceived in various dominant end-user markets in the last few decades, and are expected to be used for diverse applications in the future.

Globally, the Asia-Pacific region dominated the semiconductor packaging materials market revenue in 2013. China, Japan, Taiwan, and South Korea are the major countries with emerging markets possessing a huge demand for electronic packaging materials. Asia-Pacific’s semiconductor and IC packaging materials market for end-user applications is expected to grow at a CAGR of 5.0% from 2014 to 2019, which is far higher than that of North America.

Semiconductor & IC Packaging Materials Market Share, by Geography, 2013

Semiconductor & IC Packaging Materials Market

Source: MarketsandMarkets Analysis

Market players concentrate on expanding their geographical reach. Other development strategies adopted by the market players are new products launch, agreements & collaborations, and mergers & acquisitions.

The semiconductor packaging materials market is contemplating on executing high research activities to create new compounds to minimize costs and environmental hazards. One of the major problems is the price range that makes choosing the material very difficult and hard, so as to derive optimal cost effectiveness.

The report analyzes the market on the basis of material types, penetration of each electronic chemical and material in each major region, and end-user market. It also covers the market behavior of leading producers, key developments, and strategies implemented to sustain and succeed in the semiconductor packaging materials market.

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