HOME Research Insight The key players in the 3D IC and 2.5D IC Packaging Market include Taiwan Semiconductor Manufacturing Company Ltd. (Taiwan), Samsung Electronics Co., Ltd. (South Korea),



The key players in the 3D IC and 2.5D IC Packaging Market include Taiwan Semiconductor Manufacturing Company Ltd. (Taiwan), Samsung Electronics Co., Ltd. (South Korea),


The global 3D IC and 2.5D IC packaging market is expected to reach USD 170.46 Billion by 2022, at a CAGR of 38.30% between 2016 and 2022. The key opportunity for this market is the growing adoption of high-end computing, servers, and data centers. Some of the key factors driving this market are increasing need for advanced architecture in electronic products, rising trend of miniaturization of electronic devices, and growing market for tablets, smartphones, and gaming devices

The key players in the 3D IC and 2.5D IC packaging market include Taiwan Semiconductor Manufacturing Company Ltd. (Taiwan), Samsung Electronics Co., Ltd. (South Korea), Toshiba Corp. (Japan), Advanced Semiconductor Engineering Group (Taiwan), and Amkor Technology (U.S.). Most of the leading companies have followed the organic strategy of new product developments and launches, and inorganic strategies such as partnerships and collaborations to boost the revenue of the company. This market is evolving worldwide and many partnerships and collaborations are taking place globally. These leading strategies help companies to sustain and grow in the technically competitive market.

Top 2 players in the 3D IC and 2.5D IC packaging market:

 Taiwan Semiconductor Manufacturing Company Ltd. (Taiwan) is the leader in 3D IC and 2.5D IC packaging market because of its wide parent market share contribution and technical expertise. The company has good worldwide brand recognition, and it is one of the leading providers of semiconductor components. With huge R&D investment, the company focuses on the development of 3D IC. It invested approximately USD 2.06 Billion on R&D in 2015. At the same time, its InFo PoP technology for advanced mobile was successfully qualified considering the latest 3D IC packaging. In March 2016, the company collaborated with Cadence Design Systems, Inc. (U.S.), a leading company involved in designing and developing integrated circuits and electronic devices, to drive the integrated design flow in 3D modeling. In December 2013, the company released a reference design for 16nm FinFET design flows and 3D-stalked ICs with silicon, leading to the development of future 3D IC products.

Samsung Electronics Co., Ltd. (South Korea) has been ranked second in the market. Its R&D is expected to set new trends in the 3D IC and 2.5D IC packaging market. In August 2015, the company launched and developed three-dimensional (3D) Vertical NAND (V-NAND) flash memory based on 48 layers of 3-bit multi-level-cell (MLC) arrays for use in solid-state drives (SSDs) and started the mass production of the first analyzed 3D TSV technology-based DDR4 modules for enterprise servers. In August 2014, the company started the mass production of the first analyzed 3D TSV technology-based DDR4 modules for enterprise servers. The company has a strong financial power and invests a lot in R&D for consistent inventions. The company follows the multidimensional business approach with both backward and forward integration. This is the only company that provides one-stop foundry, testing, packaging, memory integration such as DRAM, flash, and low-power memory, and end-user application products.

Related Reports:

3D IC and 2.5D IC Packaging Market by Application (Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, Power), Packaging Technology (3D Wafer-Level Chip-Scale Packaging, 3D TSV, 2.5D), End-User Industry, and Region - Global Forecast to 2022

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