Global System-In-Package (SIP) / Chip Stack Multi-Chip Module (MCM) Market, Global Forecast & Analysis (2011-2016)
By: marketsandmarkets.com
Publishing Date:
July 2012
Report Code:
SE 1830
A system-in-a-package or system in package (SiP), also known as a Chip Stack MCM, comprises several integrated circuits enclosed in a single package or module. The SiP performs all or most of the functions of an electronic system, and are typically used inside a mobile phone, digital music player, etc.
Global System-In-Package (SIP) / Chip Stack Multi-Chip Module (MCM) Market research report aims to capture the market roadmap with market sizes, revenue forecasts, value chain, market & product trends, price trends and regulations, competitive landscape, leading players and their key developments, strategies, and profiles. It also aims to analyze the market by products, applications, and geography.
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