HOME Top Market Reports 3D IC and 2.5D IC Packaging Market by Application (Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, Power), Packaging Technology (3D Wafer-Level Chip-Scale Packaging, 3D TSV, 2.5D), End-User Industry, and Region - Global Forecast to 2022

3D IC and 2.5D IC Packaging Market by Application (Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, Power), Packaging Technology (3D Wafer-Level Chip-Scale Packaging, 3D TSV, 2.5D), End-User Industry, and Region - Global Forecast to 2022

By: marketsandmarkets.com
Publishing Date: January 2017
Report Code: SE 4844

 

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The global 3D IC and 2.5D IC packaging market is expected to be worth USD 170.46 Billion by 2022, at a CAGR of 38.30% between 2016 and 2022.

The years considered for the study are as follows:

  • Base Year: 2015
  • Estimated Year: 2016
  • Projected Year: 2022
  • Forecast Period: 2016 to 2022

The major objectives of the study are as follows:

  • To define, describe, and forecast the  3D IC and 2.5D IC packaging market, in terms of value, on the basis of application, packaging technology, and end-user industry
  • To provide the market statistics for the 3D IC and 2.5D IC packaging market based on application in terms of volume
  • To forecast the market size, in terms of value, for various segments with respect to four regions, namely, North America (NA), Europe, Asia-Pacific (APAC), and Rest of the World (RoW)
  • To provide detailed information regarding the major factors influencing the growth of the market (drivers, restraints, opportunities, and challenges)
  • To strategically analyze the micromarkets2 with respect to individual growth trends, future prospects, and contributions to the total market
  • To analyze opportunities in the market for stakeholders by identifying high-growth segments of the 3D IC and 2.5D IC packaging market
  • To provide a detailed overview of the value chain in the market and analyze market trends with the  Porter’s five forces analytical framework
  • To strategically profile the key players and comprehensively analyze their market position in terms of ranking and core competencies2 along with detailing the competitive landscape for market leaders
  • To analyze strategic developments such as new product launches and related developments, acquisitions, expansions, and agreements in the 3D IC packaging market

During this research study, major players of the 3D IC and 2.5D IC packaging ecosystem in various regions have been identified and their offerings, regional presence, and distribution channels have been understood through in-depth discussions. To find the overall market size, top-down and bottom-up approaches have been used to estimate the sizes of other individual markets by using percentage splits from secondary sources such as Hoovers, Bloomberg BusinessWeek, Factiva, and OneSource, and primary research. The entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews with industry leaders such as CEOs, VPs, directors, and marketing executives for key insights (both qualitative and quantitative) pertaining to the market. The figure below shows the breakdown of the primaries on the basis of the company type, designation, and region conducted during the research study.

3D IC and 2.5D IC Packaging Market

To know about the assumptions considered for the study, download the pdf brochure

The ecosystem of the 3D IC and 2.5D IC packaging market comprises a network of integrated circuit designers, raw material suppliers, foundries, and outsourced semiconductor assembly and testing services (OSATS) players, among others. The key companies in the IC packaging market include Taiwan Semiconductor Manufacturing Company Ltd. (Taiwan), Samsung Electronics Co., Ltd. (South Korea), Toshiba Corp. (Japan), Advanced Semiconductor Engineering Group, (Taiwan), and Amkor Technology (U.S.). The prominent companies in the markets are well-established, financially stable players with technical expertise that have been operating in the industry for several years and have diversified product portfolios, proprietary technologies, and strong distribution networks through collaborations and acquisitions.

Target Audience:

  • Semiconductor foundries
  • Original equipment manufacturers (OEMs)
  • ODM and OEM technology solution providers
  • Research institutes
  • Foundry vendors
  • Fabless vendors
  • Electronic design automation (EDA) vendors
  • Market research and consulting firms
  • Technology investors
  • Governments and financial institutions
  • Analysts and strategic business planners
  • End users who want to know more about 3D IC and 2.5D IC packaging technologies

Report Scope:

By Packaging Technology:

  • 3D wafer-level chip-scale packaging
  • 3D TSV
  • 2.5D

By Application:  

  • Logic
  • Imaging & optoelectronics
  • Memory
  • MEMS/sensors
  • LED
  • Power, analog & mixed signal, RF, photonics

By End-User Industry:

  • Consumer electronics
  • Telecommunication
  • Industrial sector
  • Automotive
  • Military and aerospace
  • Smart technologies
  • Medical devices

Geography:

  • APAC
  • North America
  • Europe
  • RoW

Available Customizations:

With the given market data, MarketsandMarkets offers customizations according to the client’s specific needs. The following customization options are available for the report:

Geographic Analysis

  • Further analysis of the 3D IC and 2.5D IC packaging market for additional countries

Company Information

  • Detailed analysis and profiling of additional market players (up to five)

Table of Contents

1 Introduction (Page No. - 15)
    1.1 Objectives of the Study
    1.2 Market Definition
    1.3 Study Scope
           1.3.1 Markets Covered
           1.3.2 Years Considered for the Study
    1.4 Currency
    1.5 Limitations
    1.6 Stakeholders

2 Research Methodology (Page No. - 18)
    2.1 Research Data
           2.1.1 Secondary Data
                    2.1.1.1 List of Major Secondary Sources
                    2.1.1.2 Key Data From Secondary Sources
           2.1.2 Primary Data
                    2.1.2.1 Key Data From Primary Sources
                    2.1.2.2 Breakdown of Primaries
           2.1.3 Secondary and Primary Research
                    2.1.3.1 Key Industry Insights
    2.2 Market Size Estimation
    2.3 Bottom-Up Approach
    2.4 Approach for Capturing the Market Share By Bottom-Up Analysis (Demand Side)
    2.5 Top-Down Approach
           2.5.1 Approach for Capturing the Market Share By Top-Down Analysis (Supply Side)
    2.6 Market Breakdown and Data Triangulation
    2.7 Research Assumptions

3 Executive Summary (Page No. - 29)

4 Premium Insights (Page No. - 34)
    4.1 3D IC and 2.5D IC Packaging Market Opportunities
    4.2 IC Packaging Market for Memory Application, By End-User Industry
    4.3 Consumer Electronics IC Packaging Market, By Packaging Technology
    4.4 Geographic Snapshot of the IC Packaging Market
    4.5 IC Packaging Market in APAC, By Country

5 Market Overview (Page No. - 37)
    5.1 Introduction
    5.2 Market Segmentation
           5.2.1 By Packaging Technology
           5.2.2 By Application
           5.2.3 By End-User Industry
           5.2.4 By Region
    5.3 Market Dynamics
           5.3.1 Drivers
                    5.3.1.1 Increasing Need for Advanced Architecture in Electronic Products
                    5.3.1.2 Rising Trend of Miniaturization of Electronics Devices
                    5.3.1.3 Growing Market for Smartphones, Tablets, and Gaming Devices
           5.3.2 Restraints
                    5.3.2.1 Higher Level of Integration Results in Thermal Issues
                    5.3.2.2 High Unit Cost of 3D IC and 2.5D IC Packages
           5.3.3 Opportunities
                    5.3.3.1 Growing Adoption of High-End Computing, Servers, and Data Centers
           5.3.4 Challenges
                    5.3.4.1 Effective Supply Chain Management

6 Industry Trends (Page No. - 45)
    6.1 Introduction
    6.2 Supply Chain Analysis
    6.3 Technology Trends
    6.4 Porter’s Five Forces Analysis
           6.4.1 Threat of New Entrants
           6.4.2 Threat 0f Substitutes
           6.4.3 Bargaining Power of Buyers
           6.4.4 Bargaining Power of Suppliers
           6.4.5 Intensity of Competitive Rivalry

7 Market, By Packaging Technology (Page No. - 56)
    7.1 Introduction
    7.2 3D Wafer-Level Chip-Scale Packaging (WLCSP)
    7.3 3D TSV
    7.4 2.5D

8 Market, By Application (Page No. - 62)
    8.1 Introduction
    8.2 Logic
    8.3 Imaging & Optoelectronics
    8.4 Memory
    8.5 MEMS/Sensors
    8.6 LED
    8.7 Power, Analog & Mixed Signal, RF, Photonics

9 Market, By End-User Industry (Page No. - 73)
    9.1 Introduction
    9.2 Consumer Electronics
    9.3 Telecommunication
    9.4 Industrial Sector
    9.5 Automotive
    9.6 Military & Aerospace
    9.7 Smart Technologies
    9.8 Medical Devices

10 Geographic Analysis (Page No. - 95)
     10.1 Introduction
     10.2 APAC
             10.2.1 China
             10.2.2 Japan
             10.2.3 Taiwan
             10.2.4 South Korea
             10.2.5 Rest of APAC
     10.3 North America
             10.3.1 U.S.
             10.3.2 Canada
             10.3.3 Mexico
     10.4 Europe
             10.4.1 U.K.
             10.4.2 Germany
             10.4.3 France
             10.4.4 Rest of Europe
     10.5 Rest of the World
             10.5.1 Middle East & Africa
             10.5.2 South America

11 Competitive Landscape (Page No. - 132)
     11.1 Overview
     11.2 Key Players in the 3D IC and 2.5D IC Packaging Market
     11.3 Competitive Situations and Trends
             11.3.1 Partnerships, Agreements, Joint Ventures, and Collaborations
             11.3.2 New Product Launches and Developments
             11.3.3 Investments and Expansions
             11.3.4 Acquisitions

12 Company Profiles (Page No. - 139)
     12.1 Introduction
(Business Overview, Products & Services, Key Insights, Recent Developments, SWOT Analysis, Ratio Analysis, MnM View)*
     12.2 Taiwan Semiconductor Manufacturing Company Limited (Taiwan)
     12.3 Samsung Electronics Co., Ltd. (South Korea)
     12.4 Toshiba Corp. (Japan)
     12.5 ASE Group (Taiwan)
     12.6 Amkor Technology (U.S.)
     12.7 United Microelectronics Corp. (Taiwan)
     12.8 Stmicroelectronics Nv (Switzerland).
     12.9 Broadcom Ltd. (Singapore)
     12.10 Intel Corporation. (U.S.)
     12.11 Jiangsu Changjiang Electronics Technology Co., Ltd (China)

*Details on Business Overview, Products & Services, Key Insights, Recent Developments, SWOT Analysis, MnM View Might Not Be Captured in Case of Unlisted Companies.

13 Appendix (Page No. - 165)
     13.1 Insights of Industry Experts
     13.2 Questionnaire
     13.3 Knowledge Store: Marketsandmarkets’ Subscription Portal
     13.4 Introducing RT: Real Time Market Intelligence
     13.5 Available Customizations
     13.6 Related Report
     13.7 Author Details


List of Tables (76 Tables)

Table 1 3D IC and 2.5D IC Packaging Market, By Packaging Technology, 2013–2022 (USD Million)
Table 2 IC Packaging Market for 3D WLCSP, By End-User Industry, 2013–2022 (USD Million)
Table 3 IC Packaging Market for 3D TSV, By End-User Industry, 2013–2022 (USD Million)
Table 4 IC Packaging Market for 2.5D, By End-User Industry, 2013–2022 (USD Million)
Table 5 IC Packaging Market, By Application, 2013–2022 (USD Million)
Table 6 3D IC and 2.5D IC Wafer (12” Eq.) Market, By Application, 2013–2022 (Thousand Units)
Table 7 IC Packaging Market for Logic Application, By End-User Industry, 2013–2022 (USD Million)
Table 8 IC Packaging Market for Imaging & Optoelectronics Application, By End-User Industry, 2013–2022 (USD Million)
Table 9 IC Packaging Market for Memory, By End-User Industry, 2013–2022 (USD Million)
Table 10 IC Packaging Market for MEMS/Sensors, By End-User Industry, 2013–2022 (USD Million)
Table 11 IC Packaging Market for LED, By End-User Industry, 2013–2022 (USD Million)
Table 12 3D IC and 2.5D IC Packaging Market for Power, Analog & Mixed Signal, RF, Photonics, By End-User Industry, 2013–2022 (USD Million)
Table 13 IC Packaging Market, By End-User Industry, 2013–2022 (USD Million)
Table 14 IC Packaging Market for Consumer Electronics, By Application, 2013–2022 (USD Million)
Table 15 IC Packaging Market for Consumer Electronics, By Packaging Technology, 2013–2022 (USD Million)
Table 16 IC Packaging Market for Consumer Electronics, By Region, 2013–2022 (USD Million)
Table 17 3D IC and 2.5D IC Packaging Market for Telecommunication, By Application, 2013–2022 (USD Million)
Table 18 IC Packaging Market for Telecommunication, By Packaging Technology, 2013–2022 (USD Million)
Table 19 Packaging Market for Telecommunication, By Region, 2013–2022 (USD Million)
Table 20 Packaging Market for Industrial Sector, By Application, 2013–2022 (USD Million)
Table 21 Packaging Market for Industrial Sector, By Packaging Technology, 2013–2022 (USD Million)
Table 22 Packaging Market for Industrial Sector, By Region, 2013–2022 (USD Million)
Table 23 Packaging Market for Automotive, By Application, 2013–2022 (USD Million)
Table 24 IC Packaging Market for Automotive, By Packaging Technology, 2013–2022 (USD Million)
Table 25 IC Packaging Market for Automotive, By Region, 2013–2022 (USD Million)
Table 26 IC Packaging Market for Military & Aerospace, By Application, 2013–2022 (USD Million)
Table 27 IC Packaging Market for Military & Aerospace, By Packaging Technology, 2013–2022 (USD Million)
Table 28 IC Packaging Market for Military & Aerospace, By Region, 2013–2022 (USD Million)
Table 29 IC Packaging Market For Smart Technologies, By Application, 2013–2022 (USD Million)
Table 30 3D IC and 2.5D IC Packaging Market for Smart Technologies, By Packaging Technology, 2013–2022 (USD Million)
Table 31 IC Packaging Market for Smart Technologies, By Region, 2013–2022 (USD Million)
Table 32 IC Packaging Market for Medical Devices, By Application, 2013–2022 (USD Million)
Table 33 IC Packaging Market for Medical Devices, By Packaging Technology, 2013–2022 (USD Million)
Table 34 IC Packaging Market for Medical Devices, By Region, 2013–2022 (USD Million)
Table 35 IC Packaging Market, By Region, 2013–2022 (USD Million)
Table 36 IC Packaging Market in APAC, By Country, 2013–2022 (USD Million)
Table 37 IC Packaging Market in APAC, By End-User Industry, 2013–2022 (USD Million)
Table 38 IC Packaging Market for Consumer Electronics in APAC, By Country, 2013–2022 (USD Million)
Table 39 IC Packaging Market for Telecommunication in APAC, By Country, 2013–2022 (USD Million)
Table 40 IC Packaging Market for Industrial Sector in APAC, By Country, 2013–2022 (USD Million)
Table 41 3D IC and 2.5D IC Packaging Market for Automotive in APAC, By Country, 2013–2022 (USD Million)
Table 42 IC Packaging Market for Military & Aerospace in APAC, By Country, 2013–2022 (USD Million)
Table 43 IC Packaging Market for Smart Technologies in APAC, By Country, 2013–2022 (USD Million)
Table 44 3D IC Packaging Market for Medical Devices in APAC, By Country, 2013–2022 (USD Million)
Table 45 IC Packaging Market in North America, By Country, 2013–2022 (USD Million)
Table 46 IC Packaging Market in North America, By End-User Industry, 2013–2022 (USD Million)
Table 47 Consumer Electronics IC Packaging Market in North America, By Country, 2013–2022 (USD Million)
Table 48 IC Packaging Market for Telecommunication in North America, By Country, 2013–2022 (USD Million)
Table 49 3D IC and 2.5D IC Packaging Market for Industrial Sector in North America, By Country, 2013–2022 (USD Million)
Table 50 Automotive IC Packaging Market in North America, By Country, 2013–2022 (USD Million)
Table 51 Military & Aerospace IC Packaging Market in North America, By Country, 2013–2022 (USD Million)
Table 52 IC Packaging Market for Smart Technologies in Canada Expected to Grow at the Highest Rate During the Forecast Period
Table 53 IC Packaging Market for Smart Technologies in North America, By Country, 2013–2022 (USD Million)
Table 54 IC Packaging Market for Medical Devices in North America, By Country, 2013–2022 (USD Million)
Table 55 IC Packaging Market in Europe, By End-User Industry, 2013–2022 (USD Million)
Table 56 3D IC and 2.5D IC Packaging Market in Europe, By Country, 2013–2022 (USD Million)
Table 57 IC Packaging Market for Consumer Electronics in Europe, By Country, 2013–2022 (USD Million)
Table 58 IC Packaging Market for Telecommunication in Europe, By Country, 2013–2022 (USD Million)
Table 59 IC Packaging Market in Europe for Industrial Sector, By Country, 2013–2022 (USD Million)
Table 60 IC Packaging Market for Automotive in Europe, By Country, 2013–2022 (USD Million)
Table 61 IC Packaging Market for Military & Aerospace in Europe, By Country, 2013–2022 (USD Million)
Table 62 IC Packaging Market for Smart Technologies in Europe, By Country, 2013–2022 (USD Million)
Table 63 IC Packaging Market for Medical Devices in Europe, By Country, 2013–2022 (USD Million)
Table 64 IC Packaging Market in RoW, By Region, 2013–2022 (USD Million)
Table 65 IC Packaging Market in RoW, By End-User Industry, 2013–2022 (USD Million)
Table 66 IC Packaging Market for Consumer Electronics in RoW, By Region, 2013–2022 (USD Million)
Table 67 IC Packaging Market for Telecommunication in RoW, By Region, 2013–2022 (USD Million)
Table 68 3D Packaging Market for Industrial Sector in RoW, By Region, 2013–2022 (USD Million)
Table 69 3D IC Packaging Market for Automotive in RoW, By Region, 2013–2022 (USD Million)
Table 70 3D IC Packaging Market for Military & Aerospace in RoW, By Region, 2013–2022 (USD Million)
Table 71 3D IC Packaging Market for Smart Technologies in RoW, By Region, 2013–2022 (USD Million)
Table 72 3D IC Packaging Market for Medical Devices in RoW, By Region, 2013–2022 (USD Million)
Table 73 Partnerships, Agreements, Joint Ventures, and Collaborations (2014–2016)
Table 74 New Product Launches and Developments (2013–2016)
Table 75 Investments and Expansions (2013–2016)
Table 76 Acquisitions (2015–2016)


List of Figures (76 Figures)

Figure 1 3D IC Packaging Market Segmentation
Figure 2 3D IC Packaging Market: Research Design
Figure 3 Market Size Estimation Methodology: Bottom-Up Approach
Figure 4 Market Size Estimation Methodology: Top-Down Approach
Figure 5 Data Triangulation
Figure 6 3D IC Packaging Market for Memory Application Expected to Grow at the Highest Rate Between 2016 and 2022
Figure 7 Memory Shipment Market is Expected to Grow at the Highest CAGR Between 2016 and 2022
Figure 8 Market for 3D TSV Packaging Technology Expected to Grow at the Highest Rate During the Forecast Period
Figure 9 Market for Smart Technologies Industry Expected to Grow at the Highest Rate During the Forecast Period
Figure 10 APAC Accounted for the Largest Market Share in 2015
Figure 11 IC Packaging Market to Provide Attractive Opportunities During the Forecast Period
Figure 12 IC Packaging Market for Memory Application in Automotive Industry to Grow at the Highest Rate During the Forecast Period
Figure 13 Market for 3D TSV Technology for Consumer Electronics Industry Expected to Grow at the Highest Rate During the Forecast Period
Figure 14 3D IC Packaging Market in China Expected to Grow at the Highest Rate During the Forecast Period
Figure 15 Chinese Market Expected to Grow at the Highest Rate During the Forecast Period
Figure 16 Geographic Segmentation of the 3D IC Packaging Market
Figure 17 Rising Trend of Miniaturization of Electronic Devices is the Major Driver for the 3D IC Packaging Market
Figure 18 Shipments of Smartphones Worldwide, 2013–2019 (Million Units)
Figure 19 Supply Chain: 3D IC Packaging Market
Figure 20 Key Technology Trends in the 3D IC Packaging Market
Figure 21 Porter’s Five Forces Analysis (2015)
Figure 22 Porter’s Five Forces Analysis for the IC Packaging Market, 2015
Figure 23 Impact of Threat of New Entrants Considered to Be Low
Figure 24 Impact of Threat of Substitutes Considered to Be Medium
Figure 25 Impact of Bargaining Power of Buyers Considered to Be Medium
Figure 26 Impact of Bargaining Power of Suppliers Considered to Be High
Figure 27 Impact of Intensity of Competitive Rivalry Considered to Be Medium
Figure 28 3D IC and 2.5D IC Packaging Market, By Packaging Technology
Figure 29 Market for 3D TSV Expected to Grow at the Highest Rate During the Forecast Period
Figure 30 IC Packaging Market, By Application
Figure 31 IC Packaging Market for Memory Expected to Grow at the Highest Rate During the Forecast Period
Figure 32 Market for Imaging & Optoelectronics in Automotive Industry Expected to Grow at the Highest Rate During the Forecast Period
Figure 33 Market for LED in Smart Technologies Industry Expected to Grow at the Highest Rate During the Forecast Period
Figure 34 3D IC and 2.5D IC Packaging Market, By End-User Industry
Figure 35 IC Packaging Market for Smart Technologies Expected to Grow at the Highest Rate During Forecast Period
Figure 36 Market for Memory Application in Telecommunication Industry Expected to Grow at the Highest Rate During Forecast Period
Figure 37 Market for Telecommunication Industry in APAC Expected to Grow at the Highest Rate During Forecast Period
Figure 38 Market for Memory Application in Industrial Sector Expected to Grow at the Highest Rate During Forecast Period
Figure 39 Market for Memory in Automotive Industry Expected to Grow at the Highest Rate During Forecast Period
Figure 40 Market for Automotive Industry in North America Expected to Grow at the Highest Rate During Forecast Period
Figure 41 Market for Military and Aerospace Industry in APAC to Grow at the Highest Rate During Forecast Period
Figure 42 Market for Memory Application in Smart Technologies Expected to Grow at the Highest Rate During Forecast Period
Figure 43 Market for 3D TSV in Medical Devices Industry Expected to Grow at the Highest Rate During Forecast Period
Figure 44 IC Packaging Market in APAC Expected to Grow at the Highest Rate During the Forecast Period
Figure 45 APAC: 3D IC Packaging Market Snapshot
Figure 46 3D Packaging Market in China Expected to Grow at the Highest Rate During the Forecast Period
Figure 47 3D IC Packaging Market for Telecommunication in Chine Expected to Grow at the Highest Rate During the Forecast Period.
Figure 48 Chinese 3D IC and 2.5D IC Packaging Market in Military & Aerospace Expected to Grow at the Highest Rate During the Forecast Period
Figure 49 North America: IC Packaging Market Snapshot
Figure 50 IC Packaging Market in North America for Smart Technologies Expected to Grow at the Highest Rate During the Forecast Period
Figure 51 IC Packaging Market for Telecommunication in Canada Expected to Grow at the Highest Rate During the Forecast Period.
Figure 52 Europe: 3D IC Packaging Market Snapshot
Figure 53 3D IC Packaging Market in France Expected to Grow at the Highest Rate During the Forecast Period
Figure 54 3D IC Packaging Market for Military & Aerospace in France Expected to Grow at the Highest Rate During the Forecast Period
Figure 55 RoW: 3D IC Packaging Market Snapshot
Figure 56 3D IC Packaging Market for Industrial Sector in South America Expected to Grow at A Highest Rate During the Forecast Period
Figure 57 IC Packaging Market for Medical Devices in South America Expected to Grow at the Highest Rate During the Forecast Period
Figure 58 Companies Adopted New Product Launches/Developments and Collaborations as the Key Growth Strategies Between 2012–2016
Figure 59 Ranking Analysis for the Top 5 Players in the 3D IC and 2.5D IC Packaging Market
Figure 60 Battle for Market Share: Partnerships, Agreements, Joint Ventures, and Collaborations Were the Key Strategies Adopted
Figure 61 Geographic Revenue Mix of the Top 5 Market Players
Figure 62 TSMC Ltd. (Taiwan): Company Snapshot
Figure 63 TSMC Ltd. (Taiwan): SWOT Analysis
Figure 64 Samsung Electronics Co., Ltd. (South Korea): Company Snapshot
Figure 65 Samsung Electronics Co., Ltd. (South Korea): SWOT Analysis
Figure 66 Toshiba Corp. (Japan): Company Snapshot
Figure 67 Toshiba Corp. (Japan): SWOT Analysis
Figure 68 ASE Group (Taiwan): Company Snapshot
Figure 69 ASE Group (Taiwan): Company Snapshot
Figure 70 Amkor Technology (U.S.): Company Snapshot
Figure 71 Amkot Technology (U.S.): SWOT Analysis
Figure 72 United Microelectronics Corp. (Taiwan): Company Snapshot
Figure 73 Stmicroelectronics Nv (Switzerland): Business Overview
Figure 74 Broadcom Ltd (Singapore): Company Snapshot
Figure 75 Intel Corporation (U.S.): Business Overview
Figure 76 Jiangsu Changjiang Electronics Technology Co., Ltd. (China): Company Snapshot

The global 3D IC and 2.5D IC packaging market is expected to be worth USD 170.46 Billion by 2022, at a CAGR of 38.30% between 2016 and 2022.  Some of the key factors driving this market are the increasing need for advanced architecture in electronics products, trend of miniaturization of electronic devices, and growing market for tablets, smartphones, and gaming devices.

The market for 3D wafer-level chip-scale packaging (WLCSP) led the market in 2015. 3D WLCSP is one of the most compact package types with increased functionality and improved thermal performance in printed circuit boards compared to 3D TSV and 2.5D IC. WLCSP has gained popularity in space-constrained mobile applications and other portable consumer devices as well as industrial products as it offers a cost-effective, small, lightweight, high-performance semiconductor solution.

The market for memory is expected to grow at the highest rate during the forecast period. The use of 3D ICs is expected to provide a cost-effective solution and drive the wide-scale adoption of this technology in potential end products. The average number of stacked dies in DRAM modules would grow with the increasing demand for notebook computers. Moreover, the innovations in advanced data storage such as flash memory, hybrid memory cube, and so on create a demand for 3D IC and 2.5D IC packaging to get high-performing compact memory solutions.

Among all the major end-user industries of the 3D IC and 2.5D IC packaging, the market for consumer electronics industry accounted the largest share in 2015. The adoption of 3D ICs is high in smartphones and tablets because of their small form factor and better performance requirements to operate at a higher bandwidth, at a relatively lower cost. These are portable computing devices which encompass additional advanced features and higher connectivity than a regular feature phone, with many functions built in a single device. As a result, many ICs need to be incorporated in a single chip module for reducing the board space, cost, and the overall time to market.

In terms of geographic regions, APAC held the largest market size for 3D IC and 2.5D IC packaging in 2015. This is because of the broad scope of 3D IC and 2.5D IC packages in various consumer electronics applications, particularly in smartphones and tablets. This is mainly because of the high population density in the APAC region as well as the presence of big companies in this sector such as Samsung Electronics Co. (South Korea), Sony Corp. (Japan), and many others.

3D IC and 2.5D IC Packaging Market

Thermal-related issues caused by higher levels of integration and the high unit cost of 3D IC and 2.5D IC packages are the restraining factors for the growth of 3D IC packaging market.

Taiwan Semiconductor Manufacturing Company Limited (Taiwan) is one of the leading companies in the 3D IC and 2.5D IC packaging market, followed by Samsung Electronics Co., Ltd. (South Korea), providing advanced packages consisting of 3D wafer-level chip-scale packaging and 3D TSV integration to address the need of high-performance and miniaturized products. Companies are strengthening their product portfolio with new launches by increasing R&D investments. Key players in this market are increasingly undertaking partnerships and collaborations to develop new technologies.

To speak to our analyst for a discussion on the above findings, click Speak to Analyst

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