Here are relevant reports on : lab-on-chip-market
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Organ-on-Chip Market Size, Share & Trends by Organ Type (Liver, Kidney, Intestine, Lung, Heart), Products (Instruments, Consumable, Software), Services (Standard, Custom), Model Type, Application (Toxicology, Drug Discovery, Stem Cell), Purpose & Region - Global Forecast to 2029
The size of global organ-on-chip market in terms of revenue was estimated to be worth USD 123,285 thousand in 2024 and is poised to reach USD 631,073 thousand by 2029, growing at a CAGR of 38.6% from 2024 to 2029. The new research study consists of an industry trend analysis of the market. The new research study consists of industry trends, pricing analysis, patent analysis, conference and webinar materials, key stakeholders, and buying behaviour in the market.
- Published: February 2024
- Price: $ 4950
- TOC Available:
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Chip Scale Package (CSP) LED Market by Application (Backlighting Unit (BLU), Flash Lighting, General Lighting, Automotive, Others), Power Range (Low- & Mid-Power, and High-Power), and Geography (APAC, North America, Europe, RoW) - Global Forecast to 2023
Chip-scale package (CSP) LEDs are the latest trend in the LED package market. According to IPC's standard J-STD-012 (implementation of flip chip and chip scale technology), to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die, and it must be a single-die and direct surface mountable package. As of 2017, CSP LEDs have only penetrated 4% in the global LED package market—valued at USD 16 billion in 2017; with low-cost potential and attractive features, CSP LEDs are expected to penetrate about 10% of the total LED package market by 2023. Major players in the market are Lumileds (The Netherlands), Samsung (South Korea), Seoul Semiconductor (South Korea), LG Innotek (South Korea), OSRAM (Germany), Nichia (Japan), EPISTAR (Taiwan), Cree (US), Genesis Photonics (Taiwan), and Lumens (South Korea).
- Published: October 2018
- Price: $ 4950
- TOC Available:
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Advanced Tires Market by Type (Pneumatic, Run-Flat, Airless), Technology (Self-Inflating, Chip-Embedded, Multi-chamber, All-in-one, Self-Sealing), Vehicle (ICE, Electric, Hybrid, Off-highway), Niche Technology, Material & Region - Global Forecast to 2030
The advanced tires market is projected to reach USD 3.2 billion by 2030, at a CAGR of 14.4% during the forecast period. The advanced tire market is dominated by several global and regional players. Some of the manufacturers in the advanced tires market are Bridgestone Corporation (Japan), Michelin (France), Continental AG (Germany), Pirelli & C. S.p.A (Italy), The Goodyear Tyre and Rubber Company (US), Sumitomo Rubber Industries Ltd (Japan), Yokohama Tire Corporation (Japan), Hankook Tire & Technology Co., Ltd., (South Korea), and Nokian Tyres plc (Finland).
- Published: May 2023
- Price: $ 4950
- TOC Available:
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Digital Signage Market Size, Share & Industry Growth Analysis Report by Product (Video Walls, Kiosks, Billboards, System-on-chip), Displays (LCD, OLED, Micro-LED), Resolution (4K, 8K, FHD, HD), Software (Edge Server, Content Management), Display Size, Application and Region - Global Forecast to 2028
The indoor location market is expected to grow from USD 18.7 billion in 2023 to USD 26.1 billion by 2028, at a compound annual growth rate (CAGR) of 6.9% during the forecast period.The key Players such as Samsung Electronics Co., Ltd. (South Korea), LG Electronics (South Korea), Sharp NEC Display Solutions, Ltd. (Japan), Leyard Optoelectronic Co., ltd. (China), Sony Group Corporation (Japan), Barco (Belgium), Panasonic Holdings Corporation (Japan), Shanghai Goodview Electronics Technology Co., Ltd. (China), AUO Corporation (Taiwan), and BrightSign LLC (US).
- Published: June 2023
- Price: $ 4950
- TOC Available:
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Micro Battery Market Size, Share, Statistics and Industry Growth Analysis Report by Type (Thin Film, Printed, Solid-state Chip, Button), Capacity (Below 10 mAh, 10 to 100 mAh, Above 100 mAh), Battery Type (Primary, Secondary), Application (Smart cards, Wireless Sensors) and Region - Global Forecast to 2028
The global micro battery market is expected to grow from USD 0.5 billion in 2023 to USD 1.3 billion by 2028, at a compound annual growth rate (CAGR) of 22.4% during the forecast period.The key players Cymbet Corporation (US), Enfucell (Finland), Ultralife Corporation (US), Molex, LLC (US), Panasonic Holdings Corporation (Japan), Murata Manufacturing Co., Ltd. (Japan), TDK Corporation (Japan), Maxell, Ltd. (Japan), VARTA AG (Germany), Renata SA (Switzerland), and Duracell Inc. (US) among others.
- Published: July 2023
- Price: $ 4950
- TOC Available:
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System in Package Market by Packaging Technology (2D IC, 2.5D IC, 3D IC), Package Type (BGA, SOP), Packaging Method (Flip Chip, Wire Bond), Device (RF Front-End, RF Amplifier), Application (Consumer Electronics, Communications) - Global Forecast to 2023
The system in package market is likely to witness high growth in the coming years due to the increasing need for advanced architecture in electronic products and the growing market for smartphones, tablets, and gaming devices. The system in package market is expected to grow from USD 5.44 Billion in 2016 to USD 9.07 Billion by 2023, at a CAGR of 9.4% between 2017 and 2023. The base year considered for the study is 2016, and the forecast period is between 2017 and 2023. ASE Group (Taiwan), Amkor Technology (US), JCET (China), Chipmos Technologies (Taiwan), Chipbond Technology (Taiwan), KYEC (Taiwan), Intel (US), Samsung Electronics (South Korea), Texas Instruments (US), and Signetics (South Korea) are the major players operating in the system in package market.
- Published: November 2017
- Price: $ 4950
- TOC Available:
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Flip Chip Technology Market by Wafer Bumping Process (CU Pillar, Lead-Free), Packaging Technology (2D IC, 2.5D IC, 3D IC), Packaging Type (BGA, PGA, LGA, SIP, CSP), Product (Memory, LED, CPU, GPU, SOC), Application and Geography - Global Forecast to 2022
The flip chip technology market is expected to grow from USD 19.01 Billion in 2015 to USD 31.27 Billion by 2022, at a CAGR of 7.1% between 2016 and 2022. The report aims at estimating the size and future growth potential of the flip chip technology market across different segments on the basis of bumping process, packaging technology, packaging type, product, application, and region.
- Published: April 2016
- Price: $ 4950
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Embedded Antenna Systems Market Size, Share and Industry Growth Analysis Report by Antenna Type (Chip, Patch, PCB Trace and FPC), Connectivity (Wi-Fi/Bluetooth, GNSS/GPS, Cellular, LPWAN, and UWB), End User, and Geography - Global Growth Driver and Industry Forecast to 2027
The global embedded antenna systems market size is projected to reach USD 8.4 billion by 2027, it is anticipated to register a CAGR of 14.9% during the forecast period. The global embedded antenna systems market was valued at USD 3.2 billion in 2020 and is expected to reach USD 8.4 billion by 2027; it is anticipated to register a CAGR of 14.9% during the forecast period
- Published: January 2022
- Price: $ 4950
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IoT Chip Market Size, Share by Hardware (Processor, Connectivity IC, Sensor, Memory Device and Logic Device), Power Consumption, End-use Application (Wearable Devices, Consumer Electronics, Building Automation and Retail) and Region - Global Forecast to 2025
The IoT Chip Market is expected to grow from USD 392.0 billion in 2020 to USD 525.4 billion by 2025, at a CAGR of 6.0% during the forecast period. Key players in the IoT chip market are Intel Corporation (US), Texas Instruments Incorporated (US), Qualcomm Incorporated (US), NXP Semiconductors N.V. (Netherlands), MediaTek Inc. (Taiwan), Marvell Technology Group Ltd. (Bermuda), Microchip Technology Inc. (US), Cypress Semiconductor Corporation (US), Renesas Electronics Corporation (Japan), Huawei Technologies Co., Ltd. (China), NVIDIA Corporation (US), Samsung Electronics (South Korea), Advanced Micro Devices (US), STMicroelectronics N.V. (Switzerland), TE Connectivity Ltd (Switzerland), Nordic Semiconductor (Norway), GainSpan (US), Expressif Systems (China), Dialog Semiconductor (UK), and Silicon Labs (US). These players are increasingly undertaking product launches and developments and acquisitions to develop and introduce new technologies and products in the market.
- Published: June 2020
- Price: $ 7150
- TOC Available:
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Semiconductor Bonding Market Size, Share & Industry Growth Analysis Report by Type (Die Bonder, Wafer Bonder, and Flip Chip Bonder), Application (RF Devices, MEMS and Sensors, LED, 3D NAND and CMOS Image Sensors), Process Type, Technology and Region - Global Growth Driver and Industry Forecast to 2026
The global semiconductor bonding market size is projected to reach USD 1,059 million by 2026; it is expected to grow at a CAGR of 3.6% during the forecasting period. The semiconductor bonding market is dominated by a few globally established players such as Intel Corporation (US), Google. Inc (US), NVIDIA Corporation (US), Xilinx Inc. (US), IBM Corporation (US), Advanced Micro Devices, Inc (US), Marvell Technology (Hamilton), and Qualcomm Technology (US).
- Published: September 2021
- Price: $ 4950
- TOC Available:
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