HOME Top Market Reports Interposer and Fan-Out WLP Market by Application (Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, Power), Packaging Technology (TSV, Interposer, and Fan-Out WLP), End-User Industry, and Region - Global Forecast to 2022

Interposer and Fan-Out WLP Market by Application (Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, Power), Packaging Technology (TSV, Interposer, and Fan-Out WLP), End-User Industry, and Region - Global Forecast to 2022

By: marketsandmarkets.com
Publishing Date: April 2017
Report Code: SE 5184

 

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The global interposer and fan-out WLP market is expected to be valued at USD 13.42 Billion by 2022, growing at a CAGR of 28.09% between 2016 and 2022.

The years considered for the study are as follows:

  • Base Year: 2015
  • Estimated Year: 2016
  • Projected Year: 2022
  • Forecast Period: 2016 to 2022

The major objectives of the study are as follows:

  • To define, describe, and forecast the overall interposer and fan-out wafer-level packaging (FOWLP) market on the basis of application, packaging technology, end-user industry, and region
  • To forecast the size of the market segments with respect to four main regions—North America (NA), Europe, Asia Pacific (APAC), and Rest of the World (RoW)
  • To provide detailed information regarding the key factors influencing the growth of the market (drivers, restraints, opportunities, and challenges)
  • To strategically analyze the micromarkets with respect to individual growth trends, future prospects, and contribution to the total market
  • To analyze the opportunities in the market for stakeholders by identifying the high-growth segments of the interposer and fan-out wafer-level packaging (FOWLP) market
  • To strategically profile the key players and comprehensively analyze their market position in terms of ranking and core competencies, along with detailing the competitive landscape for market leaders
  • To analyze the strategic developments such as new product launches and related developments, acquisitions, expansions, and agreements in the interposer and fan-out wafer-level packaging (FOWLP) market

The research methodology used to estimate and forecast the interposer and fan-out WLP market begins with obtaining data on key vendor revenues through secondary research. Some of the secondary sources referred to for this research include information from various journals and databases such as Hoovers, Bloomberg Business, Factiva, and OneSource. The vendor offerings have also been taken into consideration to determine the market segmentation. The bottom-up procedure has been employed to arrive at the overall size of the biosensors market from the revenues of the key players in the market. After arriving at the overall market size, the total market has been split into several segments and subsegments, which have then been verified through primary research by conducting extensive interviews of officials holding key positions in the industry such as CEOs, VPs, directors, and executives. The market breakdown and data triangulation procedures have been employed to complete the overall market engineering process and arrive at the exact statistics for all segments and subsegments. The breakdown of the profiles of primaries has been depicted in the figure below.

Interposer and Fan-Out WLP Market

To know about the assumptions considered for the study, download the pdf brochure

The ecosystem of interposer and fan-out WLP market comprises a network of integrated circuit designers, raw material suppliers, foundries, and outsourced semiconductor assembly & testing services (OSATS) players, among others. The major companies operating in the market include Taiwan Semiconductor Manufacturing Company Ltd. (Taiwan), Samsung Electronics Co., Ltd. (South Korea), Toshiba Corp. (Japan), Advanced Semiconductor Engineering Group, (Taiwan), and Amkor Technology (U.S.). The prominent companies in the market include well-established, financially stable, and technically sound players that have been operating in the industry for several years and have diversified product portfolios, proprietary technologies, and strong distribution networks through collaborations and acquisitions.

Target Audience:

  • Semiconductor foundries
  • Original equipment manufacturers (OEMs)
  • ODM and OEM technology solution providers
  • Research institutes
  • Foundry vendors
  • Fabless vendors
  • Electronic design automation (EDA) vendors
  • Market research and consulting firms
  • Technology investors
  • Governments and financial institutions
  • Analysts and strategic business planners

Report Scope:

By Packaging Technology:

  • Through-silicon vias (TSVs)
  • Interposers
  • Fan-out wafer-level packaging (FOWLP)

By Application:  

  • Logic
  • Imaging & optoelectronics
  • Memory
  • MEMS/sensors
  • LED
  • Power, analog & mixed signal, RF, photonics

By End-User Industry:

  • Consumer electronics
  • Telecommunication
  • Industrial sector
  • Automotive
  • Military and aerospace
  • Smart technologies
  • Medical devices

Geography:

  • APAC
  • North America
  • Europe
  • RoW

Available Customizations:

With the given market data, MarketsandMarkets offers customizations according to the client’s specific needs. The following customization options are available for the report:

Geographic Analysis

  • Further analysis of the interposer and fan-out WLP market for additional countries

Company Information

  • Detailed analysis and profiling of additional market players (up to five)

Table of Contents

1 Introduction
    1.1 Objectives of the Study
    1.2 Market Definition
    1.3 Market Scope
    1.4 Market Segmenttion 
    1.5 Stakeholders

2 Research Methodology
    2.1 Research Methodology
    2.2 Market Size Estimation
           2.2.1 Top Down Approch
           2.2.2 Bottom Up Approach
    2.3 Market Breakdown and Data Triangulation
    2.4 Market Share Estimation
           2.3.1 Key Data From Secondary Sources
           2.3.2 Key Data From Primary Sources
    2.5 Assumptions

3 Executive Summary

4 Premium Insights
    4.1 Market Size: Interposer and Fan-Out WLP Market, By Packaging Technology
           4.1.1 Market, By Packaging Technology (2015–2022)
    4.2 Market Size: Market, By Application
           4.2.1 Market, By Application (2015–2022)

5 Market Overview
    5.1 Market Segmentation
    5.2 Drivers
    5.3 Restraints
    5.4 Opprtunities
    5.5 Challenges
    5.6 Impact Analysis

6 Industry Trends
    6.1 Porter’s Five Forces Analysis (2016)
           6.1.1 Porter’s Five Forces Analysis (2016)
           6.1.2 Threat of New Entrants
           6.1.3 Threat 0f Substitutes
           6.1.4 Bargaining Power of Buyers
           6.1.5 Bargaining Power of Suppliers
           6.1.6 Intensity of Competitive Rivalry
    6.2 Value Chain Analysis
           6.2.1 Value Chain Analysis
    6.3 Key Players in the Interposer and Fan-Out WLP Market and Their Customers
    6.4 Business Model Analysis

7 Market, By Packaging Technology
    7.1 Introduction
    7.2 Market for TSV, By End-User Industry
    7.3 Market for Fan-Out WLP, By End-User Industry
    7.4 Market for Interposers, By End-User Industry 

8 Market, By Application
    8.1 Introduction
    8.2 Interposer and Fan-Out WLP Market, By Application
    8.3 Market for Logic Applications, By End-User Industry
    8.4 Market for Imaging & Optoelectronics Applications, By End-User Industry
    8.5 Market for Memory Applications, By End-User Industry
    8.6 Market for MEMS/ Sensors Applications, By End-User Industry
    8.7 Market for LED Applications, By End-User Industry
    8.8 Market for Power, Analog & Mixed Signal, RF, Photonics Applications, By End-User Industry

9 Market, By End-User Industry
    9.1 Introduction
    9.2 Interposer and Fan-Out WLP Market, By End-User Industry
    9.3 Market for Consumer Electronics Industry
    9.4 Market for Telecommunication Industry
    9.5 Market for Industrial Sector
    9.6 Market for Automotive Industry
    9.7 Market for Military & Aerospace Industry
    9.8 Market for Smart Technologies Industry
    9.9 Market for Medical Devices Industry

10 Market, By Region
     10.1 Interposer and Fan-Out WLP Market, By Region
             10.1.1 Market, By Region, 2015–2022 (USD Million)
     10.2 Market in APAC, By Country/Region
             10.2.1 Market in APAC, By Country/Region, 2015–2022 (USD Million))
     10.3 Market in North America, By Country
             10.3.1 Market in North America, By Country 2015–2022 (USD Million)
     10.4 Market in Europe, By Country/Region
             10.4.1 Market in Europe, By Country/Region, 2015–2022 (USD Million)
     10.5 Interposer and Fan-Out WLP Market in RoW, By Region
             10.5.1 Market in RoW, By Region 2015–2022 (USD Million)

11 Competitive Landscape
     11.1 Competitive Situation and Trends
             11.1.1 New Product Development and Launches
             11.1.2 Partnerships, Agreements, and Collaborations
             11.1.3 Acquisitions
             11.1.4 Investments and Expansions
     11.2 Ranking Analysis

12 Company Profiles
(Company at A Glance, Recent Financials, Products & Services, Strategies & Insights, & Recent Developments)*
     12.1 Introduction
     12.2 Taiwan Semiconductor Manufacturing Company Limited (Taiwan)
     12.3 Samsung Electronics Co., Ltd. (South Korea)
     12.4 Toshiba Corp. (Japan)
     12.5 ASE Group (Taiwan) 
     12.6 Qualcomm Incorporated (U.S.)
     12.7 Texas Instruments (U.S.)
     12.8 Amkor Technology (U.S.)
     12.9 United Microelectronics Corp. (Taiwan) 
     12.10 Stmicroelectronics NV (Switzerland)
     12.11 Broadcom Ltd. (Singapore) 
     12.12 Intel Corporation (U.S.)
     12.13 Jiangsu Changjiang Electronics Technology Co., Ltd. (China)
     12.14 Infineon Technologies AG (Germany)

*Details on Company at A Glance, Recent Financials, Products & Services, Strategies & Insights, & Recent Developments Might Not Be Captured in Case of Unlisted Companies.

13 Appendix
     13.1 Discussion Guide
     13.2 Knowledge Store: Marketsandmarkets’ Subscription Portal
     13.3 Introducing RT: Real Time Market Intelligence
     13.4 Related Report


List of Tables (25 Tables)

Table 7.2.1 Market for TSV, By End-User Industry, 2015–2022 (USD Million)
Table 7.3.1 Market for Fan-Out WLP, By End-User Industry, 2015–2022 (USD Million)
Table 7.4.1 Market for Interposer, By End-User Industry, 2015–2022 (USD Million)
Table 8.2.1 Interposer and Fan-Out WLP Market, By Application, 2015–2022 (USD Million)
Table 8.3.1 Market for Logic Applications, By End-User Industry, 2015–2022 (USD Million)
Table 8.4.1 Market for Imaging & Optoelectronics Applications, By End-User Industry (USD Million)
Table 8.5.1 Market for Memory Applications, By End-User Industry (USD Million)
Table 8.6.1 Market for MEMS/ Sensors Applications, By End-User Industry (USD Million)
Table 8.7.1 Market for LED Applications, By End-User Industry (USD Million)
Table 8.8.1 Market for Power, Analog & Mixed Signal, Rf, Photonics Applications, By End-User Industry (USD Million)
Table 9.2.1 Market, By End-User Industry, 2015–2022 (USD Million)
Table 9.3.1 Market for Consumer Electronics Industry, By Application, 2015–2022 (USD Million)
Table 9.3.2 Market for Consumer Electronics Industry, By Region, 2015–2022 (USD Million)
Table 9.4.1 Market for Telecommunication Industry, By Application, 2015–2022 (USD Million)
Table 9.4.2 Market for Telecommunication Industry, By Region, 2015–2022 (USD Million)
Table 9.5.1 Market for Industrial Sector, By Application, 2015–2022 (USD Million)
Table 9.5.2 Market for Industrial Sector, By Region, 2015–2022 (USD Million)
Table 9.6.1 Market for Automotive Industry, By Application, 2015–2022 (USD Million)
Table 9.6.2 Market for Automotive Industry, By Region, 2015–2022 (USD Million)
Table 9.7.1 Market for Military & Aerospace Industry, By Application, 2015–2022 (USD Million)
Table 9.7.2 Market for Military & Aerospace Industry, By Region, 2015–2022 (USD Million)
Table 9.8.1 Market for Smart Technologies Industry, By Application, 2015–2022 (USD Million)
Table 9.8.2 Market for Smart Technologies Industry, By Region, 2015–2022 (USD Million)
Table 9.9.1 Market for Medical Devices Industry, By Application, 2015–2022 (USD Million)
Table 9.9.2 Market for Medical Devices Industry, By Region, 2015–2022 (USD Million)


List of Figures (42 Figures)

Figure 4.1.1 Market, By Packaging Technology (2015-2022)
Figure 4.2.1 Market, By Application (2015-2022)
Figure 6.1.1 Porter’s Five Forces Analysis (2016)
Figure 6.1.2 Intensity of Competitive Rivalry
Figure 6.1.3 Threat of Substitutes
Figure 6.1.4 Bargaining Power of Buyers
Figure 6.1.5 Bargaining Power of Suppliers
Figure 6.1.6 Threat of New Entrants
Figure 6.2.1 Value Chain Analysis
Figure 7.1.1 Interposer and Fan-Out WLP Market, By Packaging Technology ( USD Billion)
Figure 7.1.2 Interposer and Fan-Out WLP Wafer Shipment (12" Eq.), By Packaging Technology, 2015–2022 (Million Units)
Figure 7.2.1 TSV Market, By End-User Industry, 2015–2022 (USD Million)
Figure 7.3.1 Fan-Out WLP Market, By End-User Industry, 2015–2022 (USD Million)
Figure 7.4.1 Interposer Market, By End-User Industry, 2015–2022 (USD Million)
Figure 8.2.1 Market, By Application, 2016–2022 (USD Million)
Figure 8.2.2 Interposer and Fan-Out WLP Wafer Shipment (12" Eq.), By Application, 2015–2022 (Million Units)
Figure 8.3.1 Market for Logic Applications, By End-User Industry (USD Million)
Figure 8.4.1 Market for Imaging & Optoelectronics Applications, By End-User Industry (USD Million)
Figure 8.5.1 Market for Memory Applications, By End-User Industry (USD Million)
Figure 8.6.1 Market for MEMS/ Sensors Applications, By End-User Industry (USD Million)
Figure 8.7.1 Market for LED Applications, By End-User Industry (USD Million)
Figure 8.8.1 Market for Power, Analog & Mixed Signal, Rf, Photonics Applications, By End-User Industry (USD Million)
Figure 9.2.1 Market, By End-User Industry, 2016–2022 (USD Million)
Figure 9.3.1 Market for Consumer Electronics Industry, By Application, 2016–2022 (USD Million)
Figure 9.3.2 Market for Consumer Electronics Industry, By Packaging Technology, 2016–2022 (USD Million)
Figure 9.4.1 Market for Telecommunication Industry, By Application, 2016–2022 (USD Million)
Figure 9.4.2 Market for Telecommunication Industry, By Packaging Technology, 2016–2022 (USD Million)
Figure 9.5.1 Market for Industrial Sector, By Application, 2016–2022 (USD Million)
Figure 9.5.2 Market for Industrial Sector, By Application, By Packaging Technology, 2016–2022 (USD Million)
Figure 9.6.1 Market for Automotive Industry, By Application, 2016–2022 (USD Million)
Figure 9.6.2 Market for Automotive Industry, By Packaging Technology, 2016–2022 (USD Million)
Figure 9.7.1 Market for Military & Aerospace Industry, By Application, 2016–2022 (USD Million)
Figure 9.7.2 Market for Military & Aerospace Industry, By Packaging Technology, 2016–2022 (USD Million)
Figure 9.8.1 Market for Smart Technologies Industry, By Application, 2016–2022 (USD Million)
Figure 9.8.2 Market for Smart Technologies Industry, By Packaging Technology, 2016–2022 (USD Million)
Figure 9.9.1 Market for Medical Devices Industry, By Application, 2016–2022 (USD Million)
Figure 9.9.2 Market for Medical Devices Industry, By Packaging Technology, 2016–2022 (USD Million)
Figure 10.1.1 Interposer and Fan-Out WLP Market, By Region, 2015–2022 (USD Million)
Figure 10.2.1 Market in APAC, By Country, 2015–2022 (USD Million)
Figure 10.3.1 Market in North America, By Country, 2015–2022 (USD Million)
Figure 10.4.1 Market in Europe, By Country, 2015–2022 (USD Million)
Figure 10.5.1 Market in RoW, By Region, 2015–2022 (USD Million)

The interposer and fan-out WLP market has entered the growth phase and is expected to be valued at USD 13.42 Billion in 2022, growing at a CAGR of 28.09% between 2016 and 2022. The major factors driving the growth of the market include rising trend of miniaturization of electronics devices; increasing demand for advanced architecture in smartphones, tablets, and gaming devices; and increased usage of advanced wafer level packaging technologies in MEMS and sensors.

The market for through-silicon vias (TSVs) is expected to grow at a high rate between 2016 and 2022. The major factors driving the growth of the interposer and fan-out WLP market for TSVs include high interconnect density and space efficiencies. Also, the compact structure of TSVs has led to the increase in its demand for use in various smart technologies, including wearable and connected devices.

The market for memory applications is expected to grow at a high rate between 2016 and 2022. The use of interposer and fan-out WLP is expected to provide a cost-effective solution and drive the wide-scale adoption of this technology in potential end products. The average number of stacked dice in memory modules is likely to grow with the increasing usage of interposers. Moreover, innovations in advanced data storage such as flash memory, hybrid memory cube, and so on are creating a demand for interposer and fan-out WLP to develop high-performing compact memory solutions. In addition, the advent of complex device designs has brought new challenges in interconnections such as need for higher I/O density and performance requirements, which are efficiently addressed by interposer and fan-out WLP.

Among all the major end-user industries, the consumer electronics industry accounted the largest share of the interposer and fan-out WLP market in 2015. The growth of the market for the consumer electronics is mainly driven by the increasing demand for smartphones, tablets, and other portable computing devices, which can be developed using advanced packaging to provide small form factors and improved performance at relatively lower cost.

APAC accounted for the largest share of the interposer and fan-out WLP market in 2015. The major factors driving the growth of the market in APAC include the presence of major semiconductor foundries, including TSMC (Taiwan) and UMC (Taiwan); proximity to major downstream electronics manufacturing operations; government-sponsored infrastructure support; tax incentives; and availability of skilled engineers and labor at a relatively low cost.

Interposer and Fan-Out WLP Market

Thermal-related issues due to higher level of integration are the major retraining factor for the growth of the interposer and fan-out WLP market.

Taiwan Semiconductor Manufacturing Company Limited (Taiwan) is one of the leading companies operating in the interposer and fan-out WLP market, followed by Samsung Electronics Co., Ltd. (South Korea) that provides advanced packages consisting fan-out WLP and TSV integration to address the need for high-performance and miniaturized products. Companies in the market are strengthening their product portfolio by launching new launches and investing more in R&D; they are increasingly undertaking partnerships and collaborations to develop new technologies.

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