The interposer and fan-out WLP market is expected to be valued at USD 13.42 Billion by 2022, growing at a CAGR of 28.09% between 2016 and 2022. The key opportunities for this market include the increasing adoption of high-end computing, servers, and data centers and rising government initiatives. Some of the key factors driving the growth of the interposer and fan-out wafer-level packaging market include the rising trend of miniaturization of electronics devices; increasing demand for advanced architecture in smartphones, tablets, and gaming devices; and increased usage of interposers and FOWLP technology in MEMS and sensors.
The key players operating in the interposer and fan-out WLP market include Taiwan Semiconductor Manufacturing Company Ltd. (Taiwan), Samsung Electronics Co., Ltd. (South Korea), Toshiba Corp. (Japan), Advanced Semiconductor Engineering Group, (Taiwan), and Amkor Technology (U.S.). Most of the leading companies have adopted organic strategies, such as new product developments and launches, and inorganic strategies, such as partnerships and collaborations, to grow in the market. These leading strategies help companies to remain competitive in the market.
Leading players in the interposer and fan-out WLP market:
Taiwan Semiconductor Manufacturing Company Ltd. (Taiwan) is a leader in the interposer and fan-out WLP market because of its wide parent market share contribution and technical expertise. The company has strong brand recognition worldwide, and it is one of the leading providers of semiconductor components. With huge R&D investments, the company focuses on the development of advanced packaging. It invested approximately USD 2.06 billion in R&D in 2015 and USD 2.21 billion in 2016. Its InFo PoP technology has been successfully qualified for advanced mobile considering the latest IC packaging. In March 2016, the company collaborated with Cadence Design Systems, Inc. (US), a leading company involved in the designing and development of integrated circuits and electronic devices, to drive the integrated design flow in 3D modeling. In December 2013, the company released the reference design for 16nm FinFET design flows and 3D-stalked ICs with silicon, leading the development of future advanced architecture. The company has future R&D plans and projects for 2017, which are dedicated toward the development of advanced packaging technologies for higher integration.
Samsung Electronics Co., Ltd. (South Korea) ranked second in the market in 2015. Its R&D is expected to set new trends in the advanced packaging market. In August 2015, the company launched three-dimensional (3D) vertical NAND (V-NAND) flash memory based on 48 layers of 3-bit multi-level-cell (MLC) arrays for use in solid-state drives (SSDs), and started the mass production of the first analyzed TSV technology-based DDR4 modules for enterprise servers. Also in August 2014, the company started the mass production of the first analyzed TSV technology-based DDR4 modules for enterprise servers. The company has strong financial power and invests heavily in R&D for consistent inventions. The company follows multidimensional business approach with both backward and forward integration.
Interposer and Fan-Out WLP Market by Application (Logic, Imaging & Optoelectronics, Memory, MEMS/Sensors, LED, Power), Packaging Technology (TSV, Interposer, and Fan-Out WLP), End-User Industry, and Region - Global Forecast to 2022
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