HOME Top Market Reports Thin Wafer Market by Wafer Size (125mm, 200mm, 300mm), Process (Temporary Bonding & Debonding, Carrier-less/Taiko Process), Application (MEMS, CMOS Image Sensor, Memory, RF Devices, LED, Interposer, Logic), and Region - Global Trend and Forecast to 2022

Thin Wafer Market by Wafer Size (125mm, 200mm, 300mm), Process (Temporary Bonding & Debonding, Carrier-less/Taiko Process), Application (MEMS, CMOS Image Sensor, Memory, RF Devices, LED, Interposer, Logic), and Region - Global Trend and Forecast to 2022

By: marketsandmarkets.com
Publishing Date: January 2016
Report Code: SE 4029

 

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The thin wafer market was valued at USD 6.76 Billion in 2015 and is projected to reach USD 9.17 Billion by 2022, at a CAGR of 3.7% between 2016 and 2022. The base year considered for this study is 2015 and the forecast period is from 2016 to 2022. This report provides a detailed analysis of the thin wafer market on the basis of wafer size, application, and region. The 300mm wafer segment is estimated to account for a large share of the thin wafer market; this segment is expected to grow at the highest CAGR between 2016 and 2022.

The research methodology used to estimate and forecast the thin wafer market began with capturing data on key vendor revenues through secondary research. The vendor offerings were also taken into consideration to determine the market segmentation. The bottom-up procedure was employed to arrive at the overall market size of the global thin wafer market by determining the revenue of key players in this market. After arriving at the overall market size, the total market was split into several segments and subsegments, which was later verified through primary research by conducting extensive interviews with key personnel such as CEOs, VPs, directors, and executives. The market breakdown and data triangulation procedures were employed to complete the overall market engineering process and arrive at the exact statistics for all segments and subsegments in this market.

Thin Wafer Market

To know about the assumptions considered for the study, download the pdf brochure

This report provides valuable insights regarding the ecosystem of this market, such as product manufacturers and suppliers, OEMs, system integrators, suppliers and distributors, electronic device manufacturers, and semiconductor device manufacturers. This study answers several questions for stakeholders, primarily which focus on prioritizing efforts and investments in this market, in the next two to six years.

Target Audience:

  • Raw Material Suppliers
  • Silicon Wafer Providers
  • System Integrators
  • Middleware and Firmware Providers
  • Semiconductor Device Manufacturers 
  • Suppliers and Distributors
  • Government and Other Regulatory Bodies
  • Research Institutes and Organizations
  • Market Research and Consulting Firms

Key players operating in this market are LG Siltronic, Inc. (South Korea), Shin-Etsu Chemical Co., (Japan), Siltronic AG (Germany), SUMCO Corporation (Japan), SunEdision Semiconductor Ltd. (U.S.), SUSS MicroTec AG (Germany), Lintec Corporation (Japan), DISCO Corporation (Japan), 3M (U.S.), Applied Materials, Inc. (U.S.), Nissan Chemical Corporation (Japan), Synova (Switzerland), EV Group (U.S.), Brewer Science, Inc. (U.S.), and Ulvac GmbH (Germany).

Scope of the Report:

This research report categorizes the global thin wafer market based on wafer size, application, and region.

Report Scope:

This research report categorizes the thin wafer market into the following segments:

Global Thin Wafer Market, by Wafer Size

  • 125mm
  • 200mm
  • 300mm

Global Thin Wafer Market, by Application

  • MEMS
  • CMOS Image Sensors
  • Memory
  • RF Devices
  • LEDs
  • Interposers
  • Logic

Global Thin Wafer Market, by Region

  • North America
  • Europe
  • Asia-Pacific
  • RoW

Available Customizations:

With the given market data, MarketsandMarkets offers customizations as per the company’s specific needs. The following customization options are available for the report:

  • Product Analysis

Product matrix, which gives a detailed comparison of the product portfolio of each company

  • Emerging Application Analysis

Information pertaining to varied applications in the thin wafer market

  • Company Information

Detailed analysis and profiling of additional market players (up to five)

Table of Contents

1 Introduction (Page No. - 12)
    1.1 Objectives of the Study
    1.2 Market Definition
    1.3 Market Scope
           1.3.1 Market Covered
           1.3.2 Years Considered for the Study
    1.4 Currency and Pricing
    1.5 Market Stakeholders

2 Research Methodology (Page No. - 15)
    2.1 Research Data
           2.1.1 Secondary Data
                    2.1.1.1 Key Data From Secondary Sources
           2.1.2 Primary Data
                    2.1.2.1 Key Data From Primary Sources
                    2.1.2.2 Key Industry Insights
                    2.1.2.3 Breakdown of Primaries
    2.2 Market Estimation
           2.2.1 Bottom-Up Approach
           2.2.2 Top-Down Approach
    2.3 Market Breakdown and Data Triangulation
    2.4 Research Assumptions and Limitations
           2.4.1 Assumptions
           2.4.2 Limitations

3 Executive Summary (Page No. - 23)

4 Premium Insights (Page No. - 27)
    4.1 Attractive Growth Opportunities in the Thin Wafer Market
    4.2 Market, By Application
    4.3 Market in the APAC Region, 2015
    4.4 U.S. to Hold the Largest Share of the Market in 2015

5 Market Overview (Page No. - 30)
    5.1 Introduction
    5.2 Market Segmentation
    5.3 Market Dynamics
           5.3.1 Drivers
                    5.3.1.1 Reduction in the Size of Electronic Devices
                    5.3.1.2 Growing Mobile and Consumer Electronics Markets
                    5.3.1.3 High Amount of Material Saving
           5.3.2 Restraints
                    5.3.2.1 Efficiency Maintenance is Major Issue in the Thin Wafer Market
           5.3.3 Opportunities
                    5.3.3.1 Growing Ic Industry in China
                    5.3.3.2 High Adoption of Portable Devices
           5.3.4 Opportunities
           5.3.5 Challenges
                    5.3.5.1 Volatility and Susceptibility to Damage

6 Industry Trend (Page No. - 38)
    6.1 Introduction
    6.2 Porter’s Five Forces Analysis
           6.2.1 Threat of Substitutes
           6.2.2 Bargaining Power of Suppliers
           6.2.3 Bargaining Power of Buyers
           6.2.4 Degree of Competition
           6.2.5 Threat of New Entrants

7 Thin Wafer Handling Market, By Process (Page No. - 46)
    7.1 Introduction
    7.2 Temporary Bonding & Debonding
           7.2.1 Market Adhesives
                    7.2.1.1 Uv-Release Adhesives
                    7.2.1.2 Thermal-Release Adhesives
                    7.2.1.3 Solvent-Release Adhesives
    7.3 Carrier–Less Approach (Taiko Process)

8 Thin Wafer Market, By Wafer Size (Page No. - 50)
    8.1 Introduction
    8.2 125mm
    8.3 200mm
    8.4 300mm

9 Thin Wafer Market, By Application (Page No. - 56)
    9.1 Introduction
    9.2 MEMS
    9.3 Cmos Image Sensor
    9.4 Memory
    9.5 RF Devices
    9.6 LED
    9.7 Interposers
    9.8 Logic
    9.9 Others

10 Thin Wafer Market, By Geography (Page No. - 69)
     10.1 Introduction
     10.2 North America
     10.3 Europe
     10.4 APAC

11 Competitive Landscape (Page No. - 78)
     11.1 Competitive Landscape Overview
     11.2 Market Ranking Analysis
     11.3 Competitive Situation and Trends
             11.3.1 New Product Developments/Launches
             11.3.2 Contracts, Agreements, Partnerships, and Collaborations
             11.3.3 Mergers & Acquisitions
             11.3.4 Expansions and Joint Ventures, (2013-2014)

12 Company Profiles (Page No. - 84)
(Overview, Products and Services, Financials, Strategy & Development)*
     12.1 Introduction
     12.2 LG Siltron Inc.
     12.3 Shin-Etsu Chemical Co., Ltd.
     12.4 Siltronic AG
     12.5 Sumco Corporation
     12.6 Sunedison Semiconductor Ltd.
     12.7 Süss Micro Tec AG
     12.8 Lintec Corporation
     12.9 Disco Corporation
     12.10 3M
     12.11 Applied Materials, Inc.
     12.12 Nissan Chemical Corporation
     12.13 Mechatronik Systemtechnik GmbH.
     12.14 Synova
     12.15 EV Group
     12.16 Brewer Science Inc.
     12.17 ULVAC GmbH

*Details on Overview, Products and Services, Financials, Strategy & Development Might Not Be Captured in Case of Unlisted Companies.

13 Appendix (Page No. - 116)
     13.1 Insights of Industry Experts
     13.2 Discussion Guide
     13.3 Introducing RT: Real-Time Market Intelligence
     13.4 Available Customizations
     13.5 Related Reports


List of Tables (41 Tables)

Table 1 Thin Wafer Market, By Wafer Size
Table 2 Market, By Application
Table 3 Drivers: Impact Analysis
Table 4 Restraints: Impact Analysis
Table 5 Opportunities: Impact Analysis
Table 6 Challenges: Impact Analysis
Table 7 Market, By Wafer Size , 2013–2022 (Million Square Inches)
Table 8 Market, By Wafer Size, 2013–2022 (USD Million)
Table 9 Market for 125mm Wafer Size By Application, 2013–2022 (Million Square Inches)
Table 10 Market for 125mm Wafer Size, By Application, 2013–2022 (USD Million)
Table 11 Market for 200 Mm Wafer Size, By Application, 2013–2022 (Million Square Inches)
Table 12 Thin Wafer Market for 200 Mm Wafer Size, By Application, 2013–2022 (USD Million)
Table 13 Market for 300mm Wafer Size, By Application, 2013–2022 (Million Square Inches)
Table 14 Market for 300 Mm Wafer Size, By Application, 2013–2022 (USD Million)
Table 15 Market Size, By Application, Million Square Inches 2013–2022
Table 16 Market Size, By Application, 2013–2022 (USD Million)
Table 17 Market for MEMS Devices, By Wafer Size, 2013–2022 (Million Square Inches)
Table 18 Market for MEMS Devices, By Wafer Size, 2013–2022 (USD Million)
Table 19 Market for CIS Applications , By Wafer Size, 2013–2022 (Million Square Inches)
Table 20 Market for CIS Applications, By Wafer Size, 2013-2020 (USD Million)
Table 21 Market for Memory Devices, By Wafer Size, 2013–2022 (Million Square Inches)
Table 22 Thin Wafer Market for Memory Devices, By Wafer Size, 2013-2022 (USD Million)
Table 23 Market for RF Devices, By Wafer Size, 2013–2022 (Million Square Inches)
Table 24 Market for RF Devices, By Wafer Size, 2013-2022 (USD Million)
Table 25 Market for LED Devices, By Wafer Size, 2013-2022 (Million Square Inches)
Table 26 Market for LED Devices, By Wafer Size, 2013-2022 (USD Million)
Table 27 Market for Interposers, By Wafer Size, 2013-2022 (Million Square Inches)
Table 28 Market for Interposers, By Wafer Size, 2013-2022 (USD Million)
Table 29 Market for Logic, By Wafer Size, 2013-2022 (Million Square Inches)
Table 30 Market for Logic, By Wafer Size, 2013-2022 (USD Million)
Table 31 Market for Others, By Wafer Size, 2013-2022 (Million Square Inches)
Table 32 Market for Others, By Wafer Size, 2013-2022 (USD Million)
Table 33 Market, By Region, 2013-2022 (USD Million)
Table 34 North America: Market, By Country, 2013-2022 (USD Million)
Table 35 Europe: Market, By Geography, 2013-2022 (USD Million)
Table 36 APAC: Market, By Geography, 2013-2022 (USD Million)
Table 37 Ranking Analysis of Key Players in the Market, 2014
Table 38 New Product Launches, (2013-2015)
Table 39 Contracts, Agreements, Partnerships and Collaborations, (2013-2015)
Table 40 Mergers & Acquisitions, (2013-2015)
Table 41 Expansions


List of Figures (53 Figures)

Figure 1 Thin Wafer Market: Research Design
Figure 2 Market Size Estimation Methodology: Bottom-Up Approach
Figure 3 Market Size Estimation Meth0dology: Top-Down Approach
Figure 4 Data Triangulation
Figure 5 Limitations of the Study
Figure 6 Thin Wafer Market, By Wafer Size
Figure 7 Market, By Application
Figure 8 Global Thin Wafer Market, By Application, 2015
Figure 9 APAC: Thin Wafer Market, By Region
Figure 10 Global Thin Wafer Market, By Region, 2015
Figure 11 Thin Wafers Expected to Witness High Adoption Rate During the Forecast Period
Figure 12 Market for LEDs Expected to Grow With Highest CAGR From 2016 to 2022
Figure 13 Taiwan to Hold the Largest Market Share of the Market in 2015
Figure 14 U.S. and Taiwan Expected to Be the Leading Markets for Thin Wafers in 2015
Figure 15 Decreasing Size of Electronic Devices is A Major Driver for the Thin Wafer Market
Figure 16 Reduction in the Thickness of Mobile Devices
Figure 17 Value Chain Analysis: Thin Wafer Market Major Value is Added During Fabrication Stage
Figure 18 Porter’s Five Forces Analysis
Figure 19 Porters Five Force Analysis: Impact Analysis
Figure 20 Thin Wafer Market: Threat of Substitutes
Figure 21 Market: Bargaining Power of Suppliers
Figure 22 Market: Bargaining Power of Buyers
Figure 23 Market: Degree of Competition
Figure 24 Market: Threat of New Entrants
Figure 25 Temporary Bonder and Debonder Market Size
Figure 26 Shipments of 300mm Wafers Expected to Grow at the Highest CAGR From 2016 to 2022
Figure 27 Thin Wafer Shipments for LED Applications Expected to Grow at the Highest Rate From 2016 to 2022
Figure 28 Memory to Be the Largest Market for Thin Wafers in 2015
Figure 29 300mm Wafer Size to Hold the Largest Market Share in 2015
Figure 30 300mm Wafer Market Expected to Grow at the Highest CAGR From 2016 to 2022
Figure 31 Market for 300mm-Sized Wafers to Be the Largest in 2015
Figure 32 Thin Wafer Market: Geographic Snapshot, 2016-2022
Figure 33 North America: Geographic Snapshot, 2015
Figure 34 Europe: Geographic Snapshot, 2015
Figure 35 APAC: Geographic Snapshot, 2015
Figure 36 Companies Adopted Agreements, Partnerships, and Joint Ventures as the Key Growth Strategy From 2013 to 2015
Figure 37 Thin Wafer Market Growth Approach Analysis, 2013-2015
Figure 38 Geographic Revenue Mix of Major Companies
Figure 39 SWOT Analysis: LG Siltronic
Figure 40 Shin-Etsu Chemical Co., Ltd.: Company Snapshot
Figure 41 SWOT Analysis: Shin-Etsu Chemicals Co.
Figure 42 Siltronic AG: Company Snapshot
Figure 43 SWOT Analysis: Siltronic AG
Figure 44 Sumco Corporation: Company Snapshot
Figure 45 SWOT Analysis: Sumco Corporation
Figure 46 Sunedison Semiconductor Ltd.: Company Snapshot
Figure 47 SWOT Analysis: Sunedison Semiconductor Ltd
Figure 48 Suss Micro Tec AG : Company Snapshot
Figure 49 Lintec Corp.: Company Snapshot
Figure 50 Disco Corporation: Company Snapshot
Figure 51 3M: Company Snapshot
Figure 52 Applied Materials, Inc.: Company Snapshot
Figure 53 Nissan Chemical Corporation: Company Snapshot

The thin wafer market was valued at 6.76 Billion in 2015, and is projected to reach USD 9.17 Billion by 2022, at a CAGR of 3.7% between 2016 and 2022. The increasing demand for semiconductor devices in varied industry verticals such as automotive, consumer electronics, and telecommunication, among others, serves to be one of the most significant factor propelling the growth of the thin wafer market. Thin wafers have applications in LEDs, MEMS, CIS, power devices, RF devices, memory, and other semiconductor devices. In addition to this, the growing IC industry and high adoption of portable devices are creating opportunities for thin wafers worldwide.

The memory application accounted for the largest share in the thin wafer market. This large share is attributed to the growing usage of memory devices in computers, laptops, digital music players, gaming devices, and mobile internet devices.

Thin Wafer Market

The 300mm wafer segment is the fastest-growing segment in the thin wafer market. The 300mm wafer offers the ability to manufacture a large number of devices in a single batch. This is one of the prime reasons companies are developing their semiconductor devices by using this wafer. For instance, in 2011, Infineon Technologies (Germany) started developing power semiconductor devices by utilizing this wafer.

The Asia-Pacific thin wafer market is projected to grow at the highest CAGR between 2016 and 2022. This growth is attributed to the development of semiconductor devices in economies such as China, South Korea, and Taiwan, among other countries in this region. In addition to this, cheap labor costs and high demand of consumer electronic devices are also propelling the growth of the thin wafer market in the Asia-Pacific region.

North America accounted for the second-largest share of the global thin wafer market.  Several companies have their headquarters in the U.S. In addition to this, government support in the U.S. is propelling the growth of the semiconductor industry, thereby becoming one of the major factors influencing the demand of thin wafers in North America.

One of the key restraining factors in the thin wafer market is efficiency maintenance. A thin wafer has a low absorption capacity for a long wavelength, especially if the thickness is below 50μm. This inability to absorb long wavelengths impacts its efficiency. Moreover, delays in supply of thin wafers due to manufacturing defects can cause additional losses in the form of order cancellations and shift in customer preference. Key players in this market are focused on mergers & acquisitions and new product launches to increase their revenue. Shin-Etsu Chemical Co., Ltd. is one of the market leaders in the thin wafer market. The company adopted mergers & acquisitions as a key growth strategy to cater a large number of customers and increase its revenue in the thin wafer market. For instance, the acquisition of Asia Silicones Monomer Limited (Thailand) helped the company enhance its sale for silicon end products in other Asian countries.

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