Thin Wafer Market

Thin Wafer Market with COVID-19 impact analysis by Wafer Size (125 mm, 200 mm, and 300 mm), Process (Temporary Bonding & Debonding and Carrier-less/Taiko Process), Technology , Application, and Geography - Global Forecast to 2025

Report Code: SE 4029 Sep, 2020, by marketsandmarkets.com

[179] The global thin wafer market is estimated to be USD 10.8 billion by 2025 from USD 7.6 billion in 2020 (estimated year), at a CAGR of 7.2% between 2020 and 2025. The growth of the thin wafer market is fueled by rising adoption of MEMS technology in portable health monitoring devices, reducing sizes of electronic devices, growing smartphone and consumer electronics markets, and high amount of material saving. Moreover, growing demand for telecommunication systems owing to the increasing focus towards e-learning amid COVID-19 is expected to propel the thin wafer market.

Thin Wafer Market

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COVID-19 Impact on the Global Thin Wafer Market

The thin wafer market includes major Tier 1 and 2 suppliers like Shin-Etsu Chemical Co., Ltd., SUMCO Corporation, GlobalWafers Co., Ltd., Siltronic, and SK Siltron. These suppliers have their manufacturing facilities spread across various countries across Asia Pacific, Europe, America, and RoW. Thin wafers supplied by these companies are used by end-use industries such as consumer electronics, automotive, industrial, medical and few others. Covid-19 not only impacted the operations of the thin wafer market players, but also affected the businesses of companies from the above-mentioned industries. A decline in demand for MEMS products from the automotive and consumer electronics industries is also expected. Also, consumers have reduced their spending on expensive products, such as premium smartphones, wearables, and smart home systems. Product features are being considered as a second priority, and basic functionalities are being preferred. All these factors are expected to negatively impact the thin wafer market.

Thin Wafer Market Dynamics

Driver: Rising adoption of MEMS technology in portable health monitoring devices

The demand for MEMS is increasing owing to their growing adoption in applications such as portable medical devices, communication systems, and automotive sensor devices. The miniature design of MEMS allows it to be used in almost all electronic devices, which contributes majorly to its adoption in various applications, thereby boosting demand for MEMS in the semiconductor market. Thin wafers not only support the trend of miniaturization of electronic devices but also help in effective thermal management of such devices. Portable medical equipment, such as patient monitoring devices, have experienced a surge in demand during this pandemic period owing to their increased usage by health workers globally to tackle the virus. Moreover, the increased global awareness regarding the COVID-19 situation has created an immense demand for personal monitoring devices.

Restraint: Efficiency maintenance—major issue for thin wafers

Currently, the main issue faced by companies in adopting thin wafers is efficiency. A thin wafer has a low light absorption capacity for long wavelengths, especially if the thickness is below 50 ìm. In the case of long wavelengths, the distance traveled by the light to be completely absorbed by the wafer is long. The main motive behind developing a thin wafer is to ensure that chip manufacturers have the advantage of all the benefits of thin wafers, such as low power consumption, high performance, and smaller die area.

Opportunity: Expanding IC industry in China

The growing demand for thin wafers in the semiconductor industry is a major reason for the growth of the thin wafer market. The advancement in this technology has helped overcome many traditional fabrication processes. With benefits such as ultra-low power consumption and ultra-high electrical performance, the thin wafer is attracting Chinese IC manufacturers who are looking forward to leveraging this important technology. At present, the need for thin chips—for high performance at a low operating voltage and low cost—is the main motive of a large number of IC suppliers in China; therefore, the thin wafer technology is gaining popularity among Chinese IC manufacturers such as Hisilicon Technologies, Co., Ltd. (China), Spreadtrum Communications (China), and RDA Microelectronics (China).

Challenges: Delay of investment plans for capacity expansion by wafer manufacturers due to COVID-19

Major wafer manufacturers, such as SUMCO Corporation (Japan) and Hemlock Semiconductor (US), have not invested in new capacity expansion due to the declining prices of silicon wafers, and it has become difficult for manufacturers to maintain or increase profit margins. According to SEMI (US), total silicon wafer area shipments during the first half of 2019 declined by 3.3% from what it was during the first half of 2018. In 2019, the capacity utilization of major Chinese wafer manufacturers went down to 95% from 100% in 2018. Also, wafer manufacturers are hesitant to expand silicon manufacturing facilities without prior commitments by chipmakers to fund additional silicon capacity. Moreover, the pandemic has added to the challenge faced by wafer manufacturers in expanding their facilities owing to the weakening financial situation. Leading manufacturers have experienced a decline in revenue during Q2 of FY2020. SUMCO Corporation (Japan) experienced a decline of YEN 9.3 billion in revenue during the first 6 months of FY2020 as compared to FY2019.

Thin Wafer Market: Ecosystem

Thin Wafer Market  by Region

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300 mm wafers expected to grow at the highest CAGR during the forecast period

An exponential use of 300 mm wafers in LED applications due to the greater yield offered by these wafers is fueling the growth of the thin wafer market across the world. It has become highly essential for LED manufacturers to achieve economies of scale and improve profitability, which is offered by these wafers. Also, the increasing number of operational 300 mm wafer fabrication facilities is expected to create a significant rise in demand for 300 mm wafers.

Wafer dicing technology to account for largest market share of the thin wafer market in 2019

Wafer dicing dominated the thin wafer market in 2019. The growth can be attributed to the increasing demand for high-speed dicing coupled with superior breakage strength. Also, the requirement for smaller, higher performing, and lower cost device configuration for use in applications such as memory devices, logic devices, power devices, and sensors is expected to contribute toward the growth of the wafer dicing equipment market during the forecast period.M.

Logic: The second largest growing segment of thin wafer market, by application

The growing implementation of server and data center systems across various businesses and industries due to the high penetration of affordable cloud computing solutions is expected to drive the demand for logic devices such as microprocessors and digital signal processors. Also, the increasing adoption of IoT-enabled connected devices has led to a rise in the use of microprocessors. Thin wafers are increasingly being used in these devices to enable efficient thermal management and optimize performance. All these factors are contributing to the growth of the thin wafer market for logic devices.

APAC is leading the thin wafer market, globally, by market share, in 2019

Based on geography, APAC dominated the thin wafer market in 2019.The commanding position of APAC can be contributed to the surging adoption of high-end consumer electronics, such as wearables and smart home devices in China and Japan. The region has emerged as a global focal point for large investments and business expansion opportunities. In 2019, major South Korean chip manufacturer Samsung Electronics invested ~USD 111 billion to expand its Memory and Foundry businesses over the next 10 years. This growth of the NAND flash memory and fabrication industries is imperative to raise the demand for thin wafers in APAC. Moreover, the global semiconductor market is expected to unveil substantial development in the APAC region due to favorable economic conditions and increasing demand for consumer electronics. All these factors are placing thin wafer market in APAC towards a positive growth trajectory.

The outbreak of COVID-19 has threatened the global supply chain of the semiconductor wafer industry. The supply chain of semiconductor devices is complex and depends on several suppliers from disparate locations to be in synchronization with each other. The shortage of even a single component can hold up an entire production line, resulting in inventory and cashflow backlogs. Unless the entire supply chain of the semiconductor device is operational and functioning smoothly, their production is still challenged and constrained. A decrease in demand for thin wafers from foundry vendors and IDMs is expected to negatively impact the thin wafer market.

Thin Wafer Market  by Region

Key Market Players

The thin wafer market is dominated by a few globally established players such as Shin-Etsu Chemical Co., Ltd. (Japan), SUMCO Corporation (Japan), GlobalWafers Co., Ltd. (Taiwan), Siltronic (Germany), and SK Siltron (South Korea).

These companies focus on adopting both organic and inorganic growth strategies, such as new product launches, collaborations, agreements, expansions, and mergers and acquisitions to strengthen their position in the market.

Scope of the Report

Report Metric

Details

Market Size Available for Years

2016–2025

Base Year

2019

Forecast Period

2020–2025

Forecast Unit

Value (USD Million/Billion)

Segments Covered

By Wafer Size, By Process, By Technology, By Application, and By Geography

Geographic Regions Covered

Americas, EMEA, and APAC.

Companies Covered

The major players include Shin-Etsu Chemical Co., Ltd. (Japan), SUMCO Corporation (Japan), GlobalWafers Co., Ltd. (Taiwan), Siltronic (Germany), and SK Siltron (South Korea) (Total 25 companies)

This report categorizes the thin wafer market based on wafer size, process, technology, application at the regional and global level

By Wafer Size:

  • 125 mm
  • 200 mm
  • 300 mm

By Process:

  • Temporary Bonding & Debonding
  • Carrier-less/Taiko Process

By Technology:

  • Grinding
  • Polishing
  • Dicing

By Application:

  • MEMS
  • CIS
  • Memory
  • RF Devices
  • LED
  • Interposer
  • Logic
  • Others

By Geography

  • Americas
  • EMEA
  • Asia Pacific (APAC)

Recent Developments

  • In June 2020, GlobalWafers Co., Ltd. invested NTD 10 billion (USD 339 million) in its Taisil (Taiwan) branch to boost the 300-mm silicon wafer capacity. The increased production capacity is expected to meet the growing demand for high-quality silicon wafers.
  • In June 2020, Siltronic invested in an epitaxial reactor to increase its production capacity of GaN-on-Si (Gallium Nitride-on-Silicon) wafers portfolio in response to the increasing demand for such wafers in applications such as data centers and 5G wireless networks. GaN technology supports efficient energy distribution under high power densities.
  • In March 2020, SK Siltron acquired DuPont’s silicon carbide (SiC) wafer business. DuPont (US) is one of the world’s largest chemical companies providing innovative solutions for industries such as automotive, construction, energy, electronics, healthcare, and defense. The acquisition will enable SK Siltron to enter the SiC wafer market and expand its consumer network to electric vehicles (EV) and 5G networks.
  • In February 2020, GlobalWafers Co., Ltd. and GLOBALFOUNDRIES (US), the world’s leading specialty foundry, signed a memorandum of understanding (MOU) to develop a long-term supply agreement for 300 mm SOI wafers. The agreement is expected to strengthen its 300-mm SOI wafer manufacturing capabilities.
  • In December 2019, DISCO Corporation launched the new DDS2320, an automatic die separator designed for processing 300 mm wafers with improved productivity. 300 mm wafers have found an increasing application for use in memory devices—an improvement in processing capabilities is expected to improve the productivity of memory chip manufacturing.

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TABLE OF CONTENTS

1 INTRODUCTION (Page No. - 27)
    1.1 STUDY OBJECTIVES
    1.2 MARKET DEFINITION
           1.2.1 INCLUSIONS AND EXCLUSIONS
    1.3 STUDY SCOPE
           1.3.1 MARKETS COVERED
                    FIGURE 1 GEOGRAPHIC SCOPE
           1.3.2 YEARS CONSIDERED
    1.4 CURRENCY
    1.5 PACKAGE SIZE
    1.6 MARKET STAKEHOLDERS
    1.7 SUMMARY OF CHANGES

2 RESEARCH METHODOLOGY (Page No. - 31)
    2.1 RESEARCH DATA
           FIGURE 2 THIN WAFER MARKET: RESEARCH DESIGN
           2.1.1 SECONDARY DATA
                    2.1.1.1 Key data from secondary sources
           2.1.2 PRIMARY DATA
                    2.1.2.1 Key data from primary sources
                    2.1.2.2 Key industry insights
                    2.1.2.3 Breakdown of primaries
    2.2 MARKET SIZE ESTIMATION
           FIGURE 3 MARKET SIZE ESTIMATION METHODOLOGY: APPROACH 1 (SUPPLY SIDE): REVENUE GENERATED FROM KEY MARKET PLAYERS IN THIN WAFER MARKET
           FIGURE 4 MARKET SIZE ESTIMATION METHODOLOGY: APPROACH 2 (SUPPLY SIDE): ILLUSTRATION OF REVENUE ESTIMATION OF KEY MARKET PLAYERS IN THIN WAFER MARKET
           FIGURE 5 MARKET SIZE ESTIMATION METHODOLOGY: APPROACH 3—BOTTOM-UP ESTIMATION OF THIN WAFER MARKET, BY WAFER SIZE
           2.2.1 BOTTOM-UP APPROACH
                    2.2.1.1 Approach for capturing market size by bottom-up analysis (demand side)
                               FIGURE 6 MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH
           2.2.2 TOP-DOWN APPROACH
                    2.2.2.1 Approach for capturing market size by top-down analysis (supply side)
                               FIGURE 7 MARKET SIZE ESTIMATION METH0DOLOGY: TOP-DOWN APPROACH
    2.3 MARKET BREAKDOWN AND DATA TRIANGULATION
           FIGURE 8 DATA TRIANGULATION
    2.4 RESEARCH ASSUMPTIONS AND LIMITATIONS
           2.4.1 ASSUMPTIONS
           2.4.2 LIMITATIONS

3 EXECUTIVE SUMMARY (Page No. - 42)
    3.1 SCENARIO ANALYSIS
           FIGURE 9 COMPARISON OF PRE- AND POST-COVID-19 MARKET SIZE AND CAGR OF THIN WAFER MARKET, BY SCENARIO, 2016–2025
           FIGURE 10 COMPARISON OF PRE- AND POST-COVID-19 MARKET SIZE AND CAGR OF WAFER THINNING EQUIPMENT MARKET, BY SCENARIO, 2016–2025
           3.1.1 PRE-COVID-19 SCENARIO
           3.1.2 PESSIMISTIC SCENARIO (POST-COVID-19)
           3.1.3 OPTIMISTIC SCENARIO (POST-COVID-19)
           3.1.4 REALISTIC SCENARIO (POST-COVID-19)
                    FIGURE 11 300 MM WAFER TO ACCOUNT FOR LARGEST MARKET SHARE IN 2020
                    FIGURE 12 THIN WAFER MARKET, BY WAFER SIZE, 2020-2025 (MILLION SQUARE INCHES)
                    FIGURE 13 MEMORY APPLICATION TO HOLD LARGEST SIZE OF THIN WAFER MARKET IN 2025
                    FIGURE 14 WAFER THINNING EQUIPMENT MARKET FOR LED APPLICATION TO GROW AT HIGHEST CAGR BETWEEN 2020 AND 2025
                    FIGURE 15 APAC TO BE MOST FAVOURABLE REGION FOR THIN WAFER MARKET IN 2025
                    FIGURE 16 WAFER THINNING EQUIPMENT MARKET IN APAC TO HOLD LARGEST SHARE IN 2025

4 PREMIUM INSIGHTS (Page No. - 50)
    4.1 ATTRACTIVE GROWTH OPPORTUNITIES IN THIN WAFER MARKET
           FIGURE 17 THIN WAFERS EXPECTED TO WITNESS HIGH ADOPTION RATE DURING FORECAST PERIOD
    4.2 WAFER THINNING EQUIPMENT MARKET, BY TECHNOLOGY
           FIGURE 18 DICING TECHNOLOGY TO CONTINUE TO HOLD LARGEST MARKET SHARE IN COMING YEARS
    4.3 THIN WAFER MARKET, BY APPLICATION
           FIGURE 19 MARKET FOR LED EXPECTED TO GROW AT HIGHEST CAGR BETWEEN 2020 AND 2025
    4.4 WAFER THINNING EQUIPMENT MARKET, BY TECHNOLOGY AND APPLICATION
           FIGURE 20 MEMORY AND LOGIC TO BE MOST FAVOURABLE APPLICATION AREAS FOR WAFER THINNING EQUIPMENT MARKET IN 2025
    4.5 GEOGRAPHICAL ANALYSIS OF THIN WAFER MARKET
           FIGURE 21 CHINA TO EXHIBIT HIGHEST CAGR IN THIN WAFER MARKET GLOBALLY BETWEEN 2020 AND 2025

5 MARKET OVERVIEW (Page No. - 53)
    5.1 INTRODUCTION
    5.2 MARKET DYNAMICS
           FIGURE 22 THIN WAFER MARKET: DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES
           5.2.1 DRIVERS
                    5.2.1.1 Rising adoption of MEMS technology in portable health monitoring devices
                    5.2.1.2 Increasing focus on e-learning amid COVID-19 drives demand for smartphones, tablets, laptops, and telecommunication systems
                    5.2.1.3 Reducing sizes of electronic devices
                    5.2.1.4 Growing smartphone and consumer electronics markets
                    5.2.1.5 High amount of material saving
                               FIGURE 23 DRIVERS: IMPACT ANALYSIS
           5.2.2 RESTRAINTS
                    5.2.2.1 Efficiency maintenance—major issue for thin wafers
                               FIGURE 24 RESTRAINTS: IMPACT ANALYSIS
           5.2.3 OPPORTUNITIES
                    5.2.3.1 Expanding IC industry in China
                    5.2.3.2 Growing adoption of IoT and AI in automotive sector
                               FIGURE 25 ESTIMATION OF IOT CONNECTIONS BY 2025 (BILLION)
                    5.2.3.3 Rising adoption of portable devices
                               FIGURE 26 OPPORTUNITIES: IMPACT ANALYSIS
           5.2.4 CHALLENGES
                    5.2.4.1 Thin wafers being volatile and susceptible to damage caused by pressure or stress
                    5.2.4.2 Delay of investment plans for capacity expansion by wafer manufacturers due to COVID-19
                               FIGURE 27 CHALLENGES: IMPACT ANALYSIS
    5.3 AVERAGE SELLING PRICE TREND
           FIGURE 28 AVERAGE COST OF THIN WAFERS PER SQUARE INCH
    5.4 REGULATORY UPDATE
    5.5 VALUE CHAIN ANALYSIS
           FIGURE 29 VALUE CHAIN ANALYSIS: INTEGRATED DEVICE MANUFACTURERS ADD  MAJOR VALUE
    5.6 MARKET MAP
    5.7 TECHNOLOGY ANALYSIS
           5.7.1 SILICON CARBIDE (SIC) TECHNOLOGY
                    TABLE 1 COMPARISON OF BENEFITS OF SIC TECHNOLOGY WITH OTHER TECHNOLOGIES
    5.8 CASE STUDY ANALYSIS
           5.8.1 STMICROELECTRONICS SELECT CREE’S SILICON CARBIDE BARE AND EPITAXIAL WAFERS
           5.8.2 INFINEON TECHNOLOGIES AND UMC ANNOUNCE MANUFACTURING AGREEMENT

6 THIN WAFER MARKET, BY PROCESS (Page No. - 64)
    6.1 INTRODUCTION
           FIGURE 30 TEMPORARY BONDER AND DEBONDER MARKET SIZE
    6.2 TEMPORARY BONDING & DEBONDING
           6.2.1 MARKET ADHESIVES
                    6.2.1.1 UV-release adhesives
                    6.2.1.2 Thermal-release adhesives
                    6.2.1.3 Solvent-release adhesives
    6.3 CARRIER-LESS APPROACH (TAIKO PROCESS)

7 THIN WAFER MARKET, BY WAFER SIZE (Page No. - 67)
    7.1 INTRODUCTION
           FIGURE 31 300-MM WAFER MARKET TO GROW AT HIGHEST CAGR BETWEEN 2020 AND 2025
           TABLE 2 THIN WAFER MARKET, BY WAFER SIZE, 2016–2019 (MILLION SQUARE INCHES)
           TABLE 3 THIN WAFER MARKET, BY WAFER SIZE, 2020–2025 (MILLION SQUARE INCHES)
           TABLE 4 THIN WAFER MARKET, BY WAFER SIZE, 2016–2019 (USD MILLION)
           TABLE 5 THIN WAFER MARKET, BY WAFER SIZE, 2020–2025 (USD MILLION)
    7.2 125 MM
           7.2.1 MARKET FOR 125 MM WAFERS TO BE IMPACTED DUE TO GROWING ADOPTION OF LARGER DIAMETER WAFERS BY SEMICONDUCTOR MANUFACTURERS
                    TABLE 6 THIN WAFER MARKET FOR 125 MM WAFER SIZE BY APPLICATION, 2016–2019 (MILLION SQUARE INCHES)
                    TABLE 7 THIN WAFER MARKET FOR 125 MM WAFER SIZE BY APPLICATION, 2020–2025 (MILLION SQUARE INCHES)
                    TABLE 8 THIN WAFER MARKET FOR 125 MM WAFER SIZE, BY APPLICATION, 2016–2019 (USD MILLION)
                    TABLE 9 THIN WAFER MARKET FOR 125 MM WAFER SIZE, BY APPLICATION, 2020–2025 (USD MILLION)
    7.3 200 MM
           7.3.1 DEMAND FOR 200 MM WAFERS TO WITNESS A STEADY GROWTH DURING THE FORECAST PERIOD
                    TABLE 10 THIN WAFER MARKET FOR 200 MM WAFER SIZE, BY APPLICATION, 2016–2019 (MILLION SQUARE INCHES)
                    TABLE 11 THIN WAFER MARKET FOR 200 MM WAFER SIZE, BY APPLICATION, 2020–2025 (MILLION SQUARE INCHES)
                    TABLE 12 THIN WAFER MARKET FOR 200 MM WAFER SIZE, BY APPLICATION, 2016–2019 (USD MILLION)
                    TABLE 13 THIN WAFER MARKET FOR 200 MM WAFER SIZE, BY APPLICATION, 2020–2025 (USD MILLION)
    7.4 300 MM
           7.4.1 300 MM WAFER MARKET EXPECTED TO WITNESS HIGHEST GROWTH RATE DURING THE FORECAST PERIOD
                    TABLE 14 THIN WAFER MARKET FOR 300MM WAFER SIZE, BY APPLICATION, 2016–2019 (MILLION SQUARE INCHES)
                    TABLE 15 THIN WAFER MARKET FOR 300MM WAFER SIZE, BY APPLICATION, 2020–2025 (MILLION SQUARE INCHES)
                    TABLE 16 THIN WAFER MARKET FOR 300 MM WAFER SIZE, BY APPLICATION, 2016–2019 (USD MILLION)
                    TABLE 17 THIN WAFER MARKET FOR 300 MM WAFER SIZE, BY APPLICATION, 2020–2025 (USD MILLION)

8 THIN WAFER MARKET, BY APPLICATION (Page No. - 76)
    8.1 INTRODUCTION
           FIGURE 32 THIN WAFER SHIPMENTS FOR LED APPLICATIONS TO GROW AT HIGHEST RATE BETWEEN 2020 AND 2025
           TABLE 18 THIN WAFER MARKET SIZE, BY APPLICATION, 2016–2019 (MILLION SQUARE INCHES)
           TABLE 19 THIN WAFER MARKET SIZE, BY APPLICATION, 2020–2025 (MILLION SQUARE INCHES)
           FIGURE 33 MEMORY TO BE LARGEST SEGMENT OF THIN WAFERS MARKET IN 2020
           TABLE 20 THIN WAFER MARKET SIZE, BY APPLICATION, 2016–2019 (USD MILLION)
           TABLE 21 THIN WAFER MARKET SIZE, BY APPLICATION, 2020–2025 (USD MILLION)
           TABLE 22 WAFER THINNING EQUIPMENT MARKET SIZE, BY APPLICATION, 2016–2019 (USD MILLION)
           TABLE 23 WAFER THINNING EQUIPMENT MARKET SIZE, BY APPLICATION, 2020–2025 (USD MILLION)
    8.2 MEMS
           8.2.1 GROWTH OF MEMS IS ATTRIBUTED TO ITS HUGE ADOPTION IN PORTABLE ELECTRONIC DEVICES
                    TABLE 24 THIN WAFER MARKET FOR MEMS DEVICES, BY WAFER SIZE, 2016–2019 (MILLION SQUARE INCHES)
                    TABLE 25 THIN WAFER MARKET FOR MEMS DEVICES, BY WAFER SIZE, 2020–2025 (MILLION SQUARE INCHES)
                    TABLE 26 THIN WAFER MARKET FOR MEMS DEVICES, BY WAFER SIZE, 2016–2019 (USD MILLION)
                    TABLE 27 THIN WAFER MARKET FOR MEMS DEVICES, BY WAFER SIZE, 2020–2025 (USD MILLION)
                    TABLE 28 WAFER THINNING EQUIPMENT MARKET SIZE FOR MEMS APPLICATION, BY REGION, 2016–2019 (USD MILLION)
                    TABLE 29 WAFER THINNING EQUIPMENT MARKET SIZE FOR MEMS APPLICATION, BY REGION, 2020–2025 (USD MILLION)
    8.3 CIS
           8.3.1 INCREASING DEMAND FOR CIS FROM AUTOMOTIVE VERTICAL IS EXPECTED TO DRIVE THE DEMAND
                    TABLE 30 THIN WAFER MARKET FOR CIS APPLICATIONS, BY WAFER SIZE,  2016–2019 (MILLION SQUARE INCHES)
                    TABLE 31 THIN WAFER MARKET FOR CIS APPLICATIONS, BY WAFER SIZE,  2020–2025 (MILLION SQUARE INCHES)
                    FIGURE 34 300 MM WAFER SIZE SEGMENT TO HOLD LARGEST MARKET SHARE IN 2020
                    TABLE 32 THIN WAFER MARKET FOR CIS APPLICATIONS, BY WAFER SIZE,  2016–2019 (USD MILLION)
                    TABLE 33 THIN WAFER MARKET FOR CIS APPLICATIONS, BY WAFER SIZE,  2020–2025 (USD MILLION)
                    TABLE 34 WAFER THINNING EQUIPMENT MARKET SIZE FOR CIS APPLICATION, BY REGION,  2016–2019 (USD MILLION)
                    TABLE 35 WAFER THINNING EQUIPMENT MARKET SIZE FOR CIS APPLICATION, BY REGION,  2020–2025 (USD MILLION)
    8.4 MEMORY
           8.4.1 GROWING ADOPTION OF NAND FLASH MEMORY IN MOBILE ELECTRONICS TO DRIVE THE DEMAND
                    TABLE 36 THIN WAFER MARKET FOR MEMORY DEVICES, BY WAFER SIZE, 2016–2019 (MILLION SQUARE INCHES)
                    TABLE 37 THIN WAFER MARKET FOR MEMORY DEVICES, BY WAFER SIZE, 2020–2025 (MILLION SQUARE INCHES)
                    FIGURE 35 300 MM WAFER SIZE SEGMENT TO REGISTER HIGHEST CAGR BETWEEN  2020 AND 2025
                    TABLE 38 THIN WAFER MARKET FOR MEMORY DEVICES, BY WAFER SIZE,  2016–2019 (USD MILLION)
                    TABLE 39 THIN WAFER MARKET FOR MEMORY DEVICES, BY WAFER SIZE, 2020–2025 (USD MILLION)
                    TABLE 40 WAFER THINNING EQUIPMENT MARKET SIZE FOR MEMORY APPLICATION, BY REGION, 2016–2019 (USD MILLION)
                    TABLE 41 WAFER THINNING EQUIPMENT MARKET SIZE FOR MEMORY APPLICATION, BY REGION, 2020–2025 (USD MILLION)
    8.5 RF DEVICES
           8.5.1 GROWING ADOPTION OF RF DEVICES IN SMARTPHONES TO PROPEL THE MARKET GROWTH DURING THE FORECAST PERIOD
                    TABLE 42 THIN WAFER MARKET FOR RF DEVICES, BY WAFER SIZE, 2016–2019 (MILLION SQUARE INCHES)
                    TABLE 43 THIN WAFER MARKET FOR RF DEVICES, BY WAFER SIZE, 2020–2025 (MILLION SQUARE INCHES)
                    TABLE 44 THIN WAFER MARKET FOR RF DEVICES, BY WAFER SIZE, 2016–2019 (USD MILLION)
                    TABLE 45 THIN WAFER MARKET FOR RF DEVICES, BY WAFER SIZE, 2020–2025 (USD MILLION)
                    TABLE 46 WAFER THINNING EQUIPMENT MARKET SIZE FOR RF DEVICES APPLICATION, BY REGION, 2016–2019 (USD MILLION)
                    TABLE 47 WAFER THINNING EQUIPMENT MARKET SIZE FOR RF DEVICES APPLICATION, BY REGION, 2020–2025 (USD MILLION)
    8.6 LED
           8.6.1 INCREASING DEMAND FOR LED COMPONENTS IN HOME AND INFRASTRUCTURE MARKET TO AUGMENT THE GROWTH DURING THE FORECAST PERIOD
                    TABLE 48 THIN WAFER MARKET FOR LED DEVICES, BY WAFER SIZE, 2016–2019 (MILLION SQUARE INCHES)
                    TABLE 49 THIN WAFER MARKET FOR LED DEVICES, BY WAFER SIZE, 2020–2025 (MILLION SQUARE INCHES)
                    FIGURE 36 300 MM TO BE LARGEST SEGMENT IN 2020
                    TABLE 50 THIN WAFER MARKET FOR LED DEVICES, BY WAFER SIZE, 2016–2019 (USD MILLION)
                    TABLE 51 THIN WAFER MARKET FOR LED DEVICES, BY WAFER SIZE, 2020–2025 (USD MILLION)
                    TABLE 52 WAFER THINNING EQUIPMENT MARKET SIZE FOR LED APPLICATION, BY REGION,  2016–2019 (USD MILLION)
                    TABLE 53 WAFER THINNING EQUIPMENT MARKET SIZE FOR LED APPLICATION, BY REGION,  2020–2025 (USD MILLION)
    8.7 INTERPOSERS
           8.7.1 REQUIREMENT FOR ADVANCED ARCHITECTURE IN MINIATURE ELECTRONIC DEVICES TO DRIVE THE DEMAND
                    TABLE 54 THIN WAFER MARKET FOR INTERPOSERS, BY WAFER SIZE, 2016–2019 (MILLION SQUARE INCHES)
                    TABLE 55 THIN WAFER MARKET FOR INTERPOSERS, BY WAFER SIZE, 2020–2025 (MILLION SQUARE INCHES)
                    TABLE 56 THIN WAFER MARKET FOR INTERPOSERS, BY WAFER SIZE, 2016–2019 (USD MILLION)
                    TABLE 57 THIN WAFER MARKET FOR INTERPOSERS, BY WAFER SIZE, 2020–2025 (USD MILLION)
                    TABLE 58 WAFER THINNING EQUIPMENT MARKET SIZE FOR INTERPOSER APPLICATION, BY REGION, 2016–2019 (USD MILLION)
                    TABLE 59 WAFER THINNING EQUIPMENT MARKET SIZE FOR INTERPOSER APPLICATION, BY REGION, 2020–2025 (USD MILLION)
    8.8 LOGIC
           8.8.1 HIGH PENETRATION OF AFFORDABLE CLOUD COMPUTING SOLUTIONS TO DRIVE THE DEMAND FOR LOGIC DEVICES
                    TABLE 60 THIN WAFER MARKET FOR LOGIC, BY WAFER SIZE,  2016–2019 (MILLION SQUARE INCHES)
                    TABLE 61 THIN WAFER MARKET FOR LOGIC, BY WAFER SIZE,  2020–2025 (MILLION SQUARE INCHES)
                    TABLE 62 THIN WAFER MARKET FOR LOGIC, BY WAFER SIZE, 2016–2019 (USD MILLION)
                    TABLE 63 THIN WAFER MARKET FOR LOGIC, BY WAFER SIZE, 2020–2025 (USD MILLION)
                    TABLE 64 WAFER THINNING EQUIPMENT MARKET SIZE FOR LOGIC APPLICATION, BY REGION, 2016–2019 (USD MILLION)
                    TABLE 65 WAFER THINNING EQUIPMENT MARKET SIZE FOR LOGIC APPLICATION, BY REGION, 2020–2025 (USD MILLION)
    8.9 OTHERS
           TABLE 66 THIN WAFER MARKET FOR OTHERS, BY WAFER SIZE,  2016–2019 (MILLION SQUARE INCHES)
           TABLE 67 THIN WAFER MARKET FOR OTHERS, BY WAFER SIZE,  2020–2025 (MILLION SQUARE INCHES)
           TABLE 68 THIN WAFER MARKET FOR OTHERS, BY WAFER SIZE, 2016–2019 (USD MILLION)
           TABLE 69 THIN WAFER MARKET FOR OTHERS, BY WAFER SIZE, 2020–2025 (USD MILLION)
           TABLE 70 WAFER THINNING EQUIPMENT MARKET SIZE FOR OTHER APPLICATIONS, BY REGION, 2016–2019 (USD MILLION)
           TABLE 71 WAFER THINNING EQUIPMENT MARKET SIZE FOR OTHER APPLICATIONS,  BY REGION, 2020–2025 (USD MILLION)
    8.10 MOST NEGATIVELY IMPACTED INDUSTRY BY COVID-19
           8.10.1 RF DEVICES
                    FIGURE 37 PRE- AND POST-COVID-19 MARKET COMPARISON FOR THIN WAFER MARKET,  BY RF DEVICES APPLICATION
                    FIGURE 38 PRE- AND POST-COVID-19 MARKET COMPARISON FOR WAFER THINNING EQUIPMENT, BY RF DEVICES APPLICATION
                    TABLE 72 THIN WAFER MARKET FOR RF DEVICES APPLICATION, BY PRE- AND  POST-COVID-19 SCENARIO, 2016–2025 (USD MILLION)
                    TABLE 73 WAFER THINNING EQUIPMENT MARKET FOR RF DEVICES APPLICATION, BY PRE- AND  POST-COVID-19 SCENARIO, 2016–2025 (USD MILLION)
                    8.10.1.1 Impact analysis
    8.11 LEAST IMPACTED INDUSTRY BY COVID-19
           8.11.1 LED
                    FIGURE 39 PRE- AND POST-COVID-19 MARKET COMPARISON FOR THIN WAFER MARKET,  BY LED APPLICATION
                    FIGURE 40 PRE- AND POST-COVID-19 MARKET COMPARISON FOR WAFER THINNING EQUIPMENT, BY LED APPLICATION
                    TABLE 74 THIN WAFER MARKET FOR LED APPLICATION, BY PRE- AND POST-COVID-19 SCENARIO, 2016–2025 (USD MILLION)
                    TABLE 75 WAFER THINNING EQUIPMENT MARKET FOR LED APPLICATION, BY PRE- AND  POST-COVID-19 SCENARIO, 2016–2025 (USD MILLION)
                    8.11.1.1 Impact analysis

9 THIN WAFER MARKET, BY TECHNOLOGY (Page No. - 105)
    9.1 INTRODUCTION
           FIGURE 41 WAFER POLISHING EQUIPMENT MARKET TO GROW AT HIGHEST CAGR BETWEEN 2020 AND 2025
           TABLE 76 WAFER THINNING EQUIPMENT MARKET SIZE, BY TECHNOLOGY, 2016–2019 (USD MILLION)
           TABLE 77 WAFER THINNING EQUIPMENT MARKET SIZE, BY TECHNOLOGY, 2020–2025 (USD MILLION)
    9.2 WAFER GRINDING
           9.2.1 WAFER GRINDING PROCESS IS ATTRACTING MANUFACTURERS DUE TO ITS PROMISING APPLICATION IN THE MINIATURIZATION AND PACKAGING OF SEMICONDUCTOR DEVICES
                    TABLE 78 WAFER GRINDING EQUIPMENT MARKET SIZE, BY APPLICATION, 2016–2019 (USD MILLION)
                    TABLE 79 WAFER GRINDING EQUIPMENT MARKET SIZE, BY APPLICATION, 2020–2025 (USD MILLION)
                    TABLE 80 WAFER GRINDING EQUIPMENT MARKET SIZE, BY REGION, 2016–2019 (USD MILLION)
                    TABLE 81 WAFER GRINDING EQUIPMENT MARKET SIZE, BY REGION, 2020–2025 (USD MILLION)
    9.3 WAFER POLISHING
           9.3.1 DEMAND FOR THIN WAFERS WITH SMOOTH SURFACE FOR SEAMLESS INTEGRATION TO DRIVE THE DEMAND FOR WAFER POLISHING EQUIPMENT
                    TABLE 82 WAFER POLISHING EQUIPMENT MARKET SIZE, BY APPLICATION, 2016–2019 (USD MILLION)
                    TABLE 83 WAFER POLISHING EQUIPMENT MARKET SIZE, BY APPLICATION, 2020–2025 (USD MILLION)
                    TABLE 84 WAFER POLISHING EQUIPMENT MARKET SIZE, BY REGION, 2016–2019 (USD MILLION)
                    TABLE 85 WAFER POLISHING EQUIPMENT MARKET SIZE, BY REGION, 2020–2025 (USD MILLION)
    9.4 WAFER DICING
           9.4.1 WAFER DICING EQUIPMENT MARKET TO ACCOUNT FOR THE LARGEST MARKET SHARE DURING THE FORECAST PERIOD
                    TABLE 86 WAFER DICING EQUIPMENT MARKET SIZE, BY APPLICATION, 2016–2019 (USD MILLION)
                    TABLE 87 WAFER DICING EQUIPMENT MARKET SIZE, BY APPLICATION, 2020–2025 (USD MILLION)
                    TABLE 88 WAFER DICING EQUIPMENT MARKET SIZE, BY REGION, 2016–2019 (USD MILLION)
                    TABLE 89 WAFER DICING EQUIPMENT MARKET SIZE, BY REGION, 2020–2025 (USD MILLION)

10 THIN WAFER MARKET, BY GEOGRAPHY (Page No. - 113)
     10.1 INTRODUCTION
               FIGURE 42 THIN WAFER MARKET: GEOGRAPHIC SNAPSHOT, 2020–2025
               TABLE 90 THIN WAFER MARKET, BY REGION, 2016–2019 (USD MILLION)
               TABLE 91 THIN WAFER MARKET, BY REGION, 2020–2025 (USD MILLION)
               TABLE 92 WAFER THINNING EQUIPMENT MARKET, BY REGION, 2016–2019 (USD MILLION)
               TABLE 93 WAFER THINNING EQUIPMENT MARKET, BY REGION, 2020–2025 (USD MILLION)
     10.2 AMERICAS
               FIGURE 43 AMERICAS: GEOGRAPHIC SNAPSHOT, 2019
               TABLE 94 AMERICAS: THIN WAFER MARKET, BY COUNTRY, 2016–2019 (USD MILLION)
               TABLE 95 AMERICAS: THIN WAFER MARKET, BY COUNTRY, 2020–2025 (USD MILLION)
               TABLE 96 AMERICAS: WAFER THINNING EQUIPMENT MARKET, BY APPLICATION,  2016–2019 (USD MILLION)
               TABLE 97 AMERICAS: WAFER THINNING EQUIPMENT MARKET, BY APPLICATION,  2020–2025 (USD MILLION)
             10.2.1 IMPACT OF COVID-19 ON THIN WAFER MARKET IN AMERICAS
                       FIGURE 44 PRE- AND POST-COVID-19 MARKET SCENARIOS FOR THIN WAFER MARKET IN AMERICAS
                       FIGURE 45 PRE- AND POST-COVID-19 MARKET COMPARISON FOR WAFER THINNING EQUIPMENT IN AMERICAS
                       TABLE 98 THIN WAFER MARKET IN AMERICAS, BY PRE- AND POST-COVID-19 SCENARIO,  2016–2025 (USD BILLION)
                       TABLE 99 WAFER THINNING EQUIPMENT MARKET IN AMERICAS, BY PRE- AND  POST-COVID-19 SCENARIO, 2016–2025 (USD MILLION)
             10.2.2 US
                       10.2.2.1 US would lead thin wafer market in Americas during forecast period
             10.2.3 CANADA
                       10.2.3.1 Government support to promote use of electric vehicles and growing telecom industry to drive thin wafer market in Canada
             10.2.4 REST OF AMERICAS
                       10.2.4.1 Growing demand for semiconductor devices from consumer electronics and automotive industries to fuel thin wafer market growth in Rest of Americas
     10.3 EMEA
               FIGURE 46 EMEA: GEOGRAPHIC SNAPSHOT, 2019
               TABLE 100 EMEA: THIN WAFER MARKET, BY COUNTRY, 2016–2019 (USD MILLION)
               TABLE 101 EMEA: THIN WAFER MARKET, BY COUNTRY, 2020–2025 (USD MILLION)
               TABLE 102 EMEA: WAFER THINNING EQUIPMENT MARKET, BY APPLICATION,  2016–2019 (USD MILLION)
               TABLE 103 EMEA: WAFER THINNING EQUIPMENT MARKET, BY APPLICATION,  2020–2025 (USD MILLION)
             10.3.1 IMPACT OF COVID-19 ON THIN WAFER MARKET IN EMEA
                       FIGURE 47 PRE- AND POST-COVID-19 MARKET SCENARIOS FOR THIN WAFER MARKET IN EMEA
                       FIGURE 48 PRE- AND POST-COVID-19 MARKET COMPARISON FOR WAFER THINNING EQUIPMENT IN EMEA
                       TABLE 104 THIN WAFER MARKET IN EMEA, BY PRE- AND POST-COVID-19 SCENARIO,  2016–2025 (USD BILLION)
                       TABLE 105 WAFER THINNING EQUIPMENT MARKET IN EMEA, BY PRE- AND POST-COVID-19 SCENARIO, 2016–2025 (USD MILLION)
             10.3.2 UK
                       10.3.2.1 Increase in demand for portable medical devices in UK to spur demand for thin wafers
             10.3.3 GERMANY
                       10.3.3.1 Growing adoption of MEMS sensors in automotive industry to drive thin wafer market
             10.3.4 FRANCE
                       10.3.4.1 Increased EV manufacturing to bolster market growth in France
             10.3.5 REST OF EMEA
                       10.3.5.1 Dearth of thin wafer manufacturers could be an opportunity for new investments in Rest of EMEA
     10.4 APAC
               FIGURE 49 APAC: GEOGRAPHIC SNAPSHOT, 2019
               TABLE 106 APAC: THIN WAFER MARKET, BY COUNTRY, 2016–2019 (USD MILLION)
               TABLE 107 APAC: THIN WAFER MARKET, BY COUNTRY, 2020–2025 (USD MILLION)
               TABLE 108 APAC: WAFER THINNING EQUIPMENT MARKET, BY APPLICATION, 2016–2019 (USD MILLION)
               TABLE 109 APAC: WAFER THINNING EQUIPMENT MARKET, BY APPLICATION, 2020–2025 (USD MILLION)
             10.4.1 IMPACT OF COVID-19 ON THIN WAFER MARKET IN APAC
                       FIGURE 50 PRE- AND POST-COVID-19 MARKET SCENARIOS FOR THIN WAFER MARKET IN APAC
                       FIGURE 51 PRE- AND POST-COVID-19 MARKET COMPARISON FOR WAFER THINNING EQUIPMENT IN APAC
                       TABLE 110 THIN WAFER MARKET IN APAC, BY PRE- AND POST-COVID-19 SCENARIO,  2016–2025 (USD BILLION)
                       TABLE 111 WAFER THINNING EQUIPMENT MARKET IN APAC, BY PRE- AND  POST-COVID-19 SCENARIO, 2016–2025 (USD MILLION)
             10.4.2 TAIWAN
                       10.4.2.1 Presence of several fabrication facilities and IC manufacturing firms to drive thin wafer market in Taiwan
             10.4.3 CHINA
                       10.4.3.1 China’s focus on achieving 70% IC self-sufficiency by 2025 to drive thin wafer market
             10.4.4 JAPAN
                       10.4.4.1 Presence of major market players and end-user industries drive thin wafer market in Japan
             10.4.5 SOUTH KOREA
                       10.4.5.1 South Korea is expected to hold largest share of thin wafer market in APAC
             10.4.6 REST OF APAC
                       10.4.6.1 Growing demand for connected devices to drive thin wafer market in Rest of APAC

11 COMPETITIVE LANDSCAPE (Page No. - 133)
     11.1 COMPETITIVE LANDSCAPE OVERVIEW
               FIGURE 52 KEY DEVELOPMENTS OF LEADING PLAYERS IN THIN WAFER MARKET BETWEEN JANUARY 2017 AND JULY 2020
     11.2 MARKET SHARE ANALYSIS OF KEY COMPANIES, 2019
               TABLE 112 SHARE OF TOP 5 PLAYERS IN THIN WAFER MARKET, 2019
     11.3 COMPETITIVE SITUATION AND TRENDS
               FIGURE 53 PRODUCT LAUNCHES IS THE KEY STRATEGY ADOPTED BY THE PLAYERS IN THE THIN WAFER MARKET
             11.3.1 PRODUCT LAUNCHES
                       TABLE 113 PRODUCT LAUNCHES, JANUARY 2017–JULY 2020
             11.3.2 AGREEMENTS, COLLABORATIONS, AND CONTRACTS
                       TABLE 114 AGREEMENTS, COLLABORATIONS, AND CONTRACTS, JANUARY 2017–JULY 2020
             11.3.3 EXPANSIONS AND MERGERS & ACQUISITIONS
                       TABLE 115 EXPANSIONS AND MERGERS & ACQUISITIONS, JANUARY 2017–JULY 2020
     11.4 THIN WAFER MARKET, COMPANY EVALUATION MATRIX, 2019
             11.4.1 STAR
             11.4.2 PERVASIVE
             11.4.3 PARTICIPANT
             11.4.4 EMERGING LEADER
                       FIGURE 54 THIN WAFER MARKET, COMPANY EVALUATION MATRIX (2019)
     11.5 STRENGTH OF PRODUCT PORTFOLIO
               FIGURE 55 PRODUCT PORTFOLIO ANALYSIS OF TOP PLAYERS IN THIN WAFER  MARKET, 2019
     11.6 BUSINESS STRATEGY EXCELLENCE
               FIGURE 56 BUSINESS STRATEGY EXCELLENCE OF TOP PLAYERS IN THIN WAFER  MARKET, 2019

12 COMPANY PROFILES (Page No. - 143)
     12.1 INTRODUCTION
(Business overview, Products offered, Recent Developments, SWOT Analysis, MNM view)*
     12.2 KEY PLAYERS
             12.2.1 SK SILTRON
                       FIGURE 57 SK SILTRON: COMPANY SNAPSHOT
             12.2.2 SHIN-ETSU CHEMICAL CO., LTD.
                       FIGURE 58 SHIN-ETSU CHEMICAL CO., LTD.: COMPANY SNAPSHOT
             12.2.3 SILTRONIC
                       FIGURE 59 SILTRONIC: COMPANY SNAPSHOT
             12.2.4 SUMCO CORPORATION
                       FIGURE 60 SUMCO CORPORATION: COMPANY SNAPSHOT
             12.2.5 GLOBALWAFERS CO., LTD.
                       FIGURE 61 GLOBALWAFERS CO., LTD.: COMPANY SNAPSHOT
             12.2.6 SUSS MICROTEC
                       FIGURE 62 SUSS MICROTEC AG: COMPANY SNAPSHOT
             12.2.7 LINTEC CORPORATION
                       FIGURE 63 LINTEC CORPORATION: COMPANY SNAPSHOT
             12.2.8 DISCO CORPORATION
                       FIGURE 64 DISCO CORPORATION: COMPANY SNAPSHOT
             12.2.9 3M
                       FIGURE 65 3M: COMPANY SNAPSHOT
             12.2.10 APPLIED MATERIALS
                       FIGURE 66 APPLIED MATERIALS, INC.: COMPANY SNAPSHOT
     12.3 FIVE YEAR REVENUE ANALYSIS OF MAJOR PLAYERS IN THE THIN WAFER MARKET
               FIGURE 67 THIN WAFER MARKET: FIVE YEAR REVENUE SNAPSHOT OF MAJOR PLAYERS  (USD MILLION)
     12.4 RIGHT TO WIN
     12.5 OTHER COMPANIES
             12.5.1 NISSAN CHEMICAL CORPORATION
             12.5.2 MECHATRONIC SYSTEMTECHNIK
             12.5.3 SYNOVA
             12.5.4 EV GROUP
             12.5.5 BREWER SCIENCE
             12.5.6 ULVAC GMBH
             12.5.7 WAFER WORKS CORPORATION
             12.5.8 OKMETIC
             12.5.9 ATECOM TECHNOLOGY CO., LTD.
             12.5.10 SILTRONIX SILICON TECHNOLOGIES

*Details on Business overview, Products offered, Recent Developments, SWOT Analysis, MNM view might not be captured in case of unlisted companies.

13 APPENDIX (Page No. - 172)
     13.1 INSIGHTS OF INDUSTRY EXPERTS
     13.2 DISCUSSION GUIDE
     13.3 KNOWLEDGE STORE: MARKETSANDMARKETS’  SUBSCRIPTION PORTAL
     13.4 AVAILABLE CUSTOMIZATIONS
     13.5 RELATED REPORTS
     13.6 AUTHOR DETAILS

The study involved four major activities in estimating the size of the thin wafer market. Exhaustive secondary research was done to collect information on the market, peer market, and parent market. The next step was to validate these findings, assumptions, and sizing with industry experts across the value chain through primary research. Both top-down and bottom-up approaches were employed to estimate the complete market’s size. After that, market breakdown and data triangulation were used to estimate the market sizes of segments and sub-segments.

Secondary Research

In the thin wafer market report, both top-down and bottom-up approaches have been used to estimate and validate the size of the t thin wafer market, along with other dependent submarkets. The key players in the thin wafer market have been identified through secondary research, and their market ranks have been determined through primary and secondary research. This entire research methodology involved studying annual and financial reports of the top players and interviewing experts (such as CEOs, VPs, directors, and marketing executives) for key insights (both quantitative and qualitative). All percentage shares, splits, and breakdowns have been determined using secondary sources and verified through primary sources. All the possible parameters that may affect the markets covered in this research study have been accounted for, viewed in detail, verified through primary research, and analyzed to obtain the final quantitative and qualitative data. This data has been consolidated and supplemented with detailed inputs and analysis from MarketsandMarkets and presented in this report.

Primary Research

The thin wafer market supply chain comprises several stakeholders, such as raw material suppliers, manufacturers, foundry vendors, distribution channels, integrated device manufacturers, and end-users. The demand side of this market is characterized by MEMS, CIS, memory, RF devices, LED, interposers, logic, and other industries; while the supply side is characterized by raw material suppliers. Various primary sources from both the supply and demand sides of the market were interviewed to obtain qualitative and quantitative information.

Primary data has been collected through questionnaires, emails, and telephonic interviews. In the canvassing of primaries, various departments within organizations, such as sales, operations, and administration, were covered to provide a holistic viewpoint in our report. After interacting with industry experts, brief sessions were conducted with highly experienced independent consultants to reinforce the findings from our primaries. This, along with the in-house subject matter experts’ opinions, has led us to the findings as described in the remainder of this report. The breakdown of the primary respondents is provided below:

Thin Wafer Market  Size, and Share

To know about the assumptions considered for the study, download the pdf brochure

Market Size Estimation

Both top-down and bottom-up approaches have been used to estimate and validate the size of thin wafer market and its segments. The research methodology used to estimate the market size includes the following:

  • Key players in the market have been identified through extensive secondary research
  • The supply chain and the size of the thin wafer market, in terms of value, have been determined through primary and secondary research processes
  • Several primary interviews have been conducted with key opinion leaders related to thin wafer supply chain, including key OEMs, IDMs, and Tier I suppliers.
  • All percentage shares, splits, and breakdowns have been determined using secondary sources and verified through primary sources
  • Qualitative aspects such as market drivers, restraints, opportunities, and challenges have been taken into consideration while calculating and forecasting the market size.

Global Thin wafer Market Size: Bottom-Up Approach

Thin Wafer Market  Size, and Share

To know about the assumptions considered for the study, Request for Free Sample Report

Data Triangulation

After arriving at the overall market size—using the market size estimation process explained above—the market has been split into several segments and subsegments. Data triangulation and market breakdown procedures have been employed, wherever applicable, to complete the overall market engineering process and arrive at the exact statistics for each segment and subsegment of the market. The data has been triangulated by studying various factors and trends from both demand and supply sides of the thin wafer market.

Report Objectives

  • To describe and forecast the global thin wafer market, by process, wafer size, application, technology, and region, in terms of value and volume
  • To describe and forecast the markets of various segments of the thin wafer market with respect to the 3 main regions, namely the Americas, EMEA, and Asia Pacific (APAC), in terms of value and volume
  • To provide detailed information regarding drivers, restraints, opportunities, and industry-specific challenges influencing the growth of the thin wafer market
  • To study the complete value chain and allied industry segments and perform a value chain analysis of the global thin wafer landscape
  • To describe the impact of COVID-19 on the thin wafer market
  • To strategically analyze micromarkets1 with respect to individual growth trends, prospects, and contributions to the overall market
  • To analyze growth opportunities for stakeholders in the thin wafer market
  • To strategically profile key players and comprehensively analyze their position in the thin wafer market in terms of their market share and core competencies2 and detail the competitive landscape for market leaders
  • To analyze various developments such as agreements, collaborations, contracts, expansions, mergers and acquisitions, and product launches, along with research and development activities, in the global thin wafer market

Available Customizations:

Along with the market data, MarketsandMarkets offers customizations according to the specific requirements of companies. The following customization options are available for the report:

Company Information

  • Detailed analysis and profiling of additional market players (up to 5)
  • Additional country-level analysis of thin wafer market
  • Estimation of the market size of the product segments of the thin wafer market based on different subsegments
COVID-19

Get in-depth analysis of the COVID-19 impact on the Thin Wafer Market

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