Thin Wafer Market with COVID-19 impact analysis by Wafer Size (125 mm, 200 mm, and 300 mm), Process (Temporary Bonding & Debonding and Carrier-less/Taiko Process), Technology , Application, and Geography - Global Forecast to 2025
[179 Pages Report] The global thin wafer market is estimated to be USD 10.8 billion by 2025 from USD 7.6 billion in 2020 (estimated year), at a CAGR of 7.2% between 2020 and 2025.
The growth of the market is fueled by rising adoption of MEMS technology in portable health monitoring devices, reducing sizes of electronic devices, growing smartphone and consumer electronics markets, and high amount of material saving. Moreover, growing demand for telecommunication systems owing to the increasing focus towards e-learning amid COVID-19 is expected to propel the thin wafer market.
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COVID-19 Impact on the Global Thin Wafer Market
The market includes major Tier 1 and 2 suppliers like Shin-Etsu Chemical Co., Ltd., SUMCO Corporation, GlobalWafers Co., Ltd., Siltronic, and SK Siltron. These suppliers have their manufacturing facilities spread across various countries across Asia Pacific, Europe, America, and RoW. Thin wafers supplied by these companies are used by end-use industries such as consumer electronics, automotive, industrial, medical and few others. Covid-19 not only impacted the operations of the market players, but also affected the businesses of companies from the above-mentioned industries. A decline in demand for MEMS products from the automotive and consumer electronics industries is also expected. Also, consumers have reduced their spending on expensive products, such as premium smartphones, wearables, and smart home systems. Product features are being considered as a second priority, and basic functionalities are being preferred. All these factors are expected to negatively impact the thin wafer market.
Thin Wafer Market Dynamics
Driver: Rising adoption of MEMS technology in portable health monitoring devices
The demand for MEMS is increasing owing to their growing adoption in applications such as portable medical devices, communication systems, and automotive sensor devices. The miniature design of MEMS allows it to be used in almost all electronic devices, which contributes majorly to its adoption in various applications, thereby boosting demand for MEMS in the semiconductor market. Thin wafers not only support the trend of miniaturization of electronic devices but also help in effective thermal management of such devices. Portable medical equipment, such as patient monitoring devices, have experienced a surge in demand during this pandemic period owing to their increased usage by health workers globally to tackle the virus. Moreover, the increased global awareness regarding the COVID-19 situation has created an immense demand for personal monitoring devices.
Restraint: Efficiency maintenance—major issue for thin wafers
Currently, the main issue faced by companies in adopting thin wafers is efficiency. A thin wafer has a low light absorption capacity for long wavelengths, especially if the thickness is below 50 ìm. In the case of long wavelengths, the distance traveled by the light to be completely absorbed by the wafer is long. The main motive behind developing a thin wafer is to ensure that chip manufacturers have the advantage of all the benefits of thin wafers, such as low power consumption, high performance, and smaller die area.
Opportunity: Expanding IC industry in China
The growing demand for thin wafers in the semiconductor industry is a major reason for the growth of the thin wafer market. The advancement in this technology has helped overcome many traditional fabrication processes. With benefits such as ultra-low power consumption and ultra-high electrical performance, the thin wafer is attracting Chinese IC manufacturers who are looking forward to leveraging this important technology. At present, the need for thin chips—for high performance at a low operating voltage and low cost—is the main motive of a large number of IC suppliers in China; therefore, the thin wafer technology is gaining popularity among Chinese IC manufacturers such as Hisilicon Technologies, Co., Ltd. (China), Spreadtrum Communications (China), and RDA Microelectronics (China).
Challenges: Delay of investment plans for capacity expansion by wafer manufacturers due to COVID-19
Major wafer manufacturers, such as SUMCO Corporation (Japan) and Hemlock Semiconductor (US), have not invested in new capacity expansion due to the declining prices of silicon wafers, and it has become difficult for manufacturers to maintain or increase profit margins. According to SEMI (US), total silicon wafer area shipments during the first half of 2019 declined by 3.3% from what it was during the first half of 2018. In 2019, the capacity utilization of major Chinese wafer manufacturers went down to 95% from 100% in 2018. Also, wafer manufacturers are hesitant to expand silicon manufacturing facilities without prior commitments by chipmakers to fund additional silicon capacity. Moreover, the pandemic has added to the challenge faced by wafer manufacturers in expanding their facilities owing to the weakening financial situation. Leading manufacturers have experienced a decline in revenue during Q2 of FY2020. SUMCO Corporation (Japan) experienced a decline of YEN 9.3 billion in revenue during the first 6 months of FY2020 as compared to FY2019.
Thin Wafer Market: Ecosystem
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300 mm wafers expected to grow at the highest CAGR during the forecast period
An exponential use of 300 mm wafers in LED applications due to the greater yield offered by these wafers is fueling the growth of the thin wafer market across the world. It has become highly essential for LED manufacturers to achieve economies of scale and improve profitability, which is offered by these wafers. Also, the increasing number of operational 300 mm wafer fabrication facilities is expected to create a significant rise in demand for 300 mm wafers.
Wafer dicing technology to account for largest market share of the thin wafer market in 2019
Wafer dicing dominated the market in 2019. The growth can be attributed to the increasing demand for high-speed dicing coupled with superior breakage strength. Also, the requirement for smaller, higher performing, and lower cost device configuration for use in applications such as memory devices, logic devices, power devices, and sensors is expected to contribute toward the growth of the wafer dicing equipment market during the forecast period.M.
Logic: The second largest growing segment of thin wafer market, by application
The growing implementation of server and data center systems across various businesses and industries due to the high penetration of affordable cloud computing solutions is expected to drive the demand for logic devices such as microprocessors and digital signal processors. Also, the increasing adoption of IoT-enabled connected devices has led to a rise in the use of microprocessors. Thin wafers are increasingly being used in these devices to enable efficient thermal management and optimize performance. All these factors are contributing to the growth of the market for logic devices.
APAC is leading the thin wafer market, globally, by market share, in 2019
Based on geography, APAC dominated the market in 2019.The commanding position of APAC can be contributed to the surging adoption of high-end consumer electronics, such as wearables and smart home devices in China and Japan. The region has emerged as a global focal point for large investments and business expansion opportunities. In 2019, major South Korean chip manufacturer Samsung Electronics invested ~USD 111 billion to expand its Memory and Foundry businesses over the next 10 years. This growth of the NAND flash memory and fabrication industries is imperative to raise the demand for thin wafers in APAC. Moreover, the global semiconductor market is expected to unveil substantial development in the APAC region due to favorable economic conditions and increasing demand for consumer electronics. All these factors are placing thin wafer market in APAC towards a positive growth trajectory.
The outbreak of COVID-19 has threatened the global supply chain of the semiconductor wafer industry. The supply chain of semiconductor devices is complex and depends on several suppliers from disparate locations to be in synchronization with each other. The shortage of even a single component can hold up an entire production line, resulting in inventory and cashflow backlogs. Unless the entire supply chain of the semiconductor device is operational and functioning smoothly, their production is still challenged and constrained. A decrease in demand for thin wafers from foundry vendors and IDMs is expected to negatively impact the market.
Key Market Players
The thin wafer market is dominated by a few globally established players such as Shin-Etsu Chemical Co., Ltd. (Japan), SUMCO Corporation (Japan), GlobalWafers Co., Ltd. (Taiwan), Siltronic (Germany), and SK Siltron (South Korea).
These companies focus on adopting both organic and inorganic growth strategies, such as new product launches, collaborations, agreements, expansions, and mergers and acquisitions to strengthen their position in the market.
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|
Report Metric |
Details |
|
Market Size Available for Years |
2016–2025 |
|
Base Year |
2019 |
|
Forecast Period |
2020–2025 |
|
Forecast Unit |
Value (USD Million/Billion) |
|
Segments Covered |
By Wafer Size, By Process, By Technology, By Application, and By Geography |
|
Geographic Regions Covered |
Americas, EMEA, and APAC. |
|
Companies Covered |
The major players include Shin-Etsu Chemical Co., Ltd. (Japan), SUMCO Corporation (Japan), GlobalWafers Co., Ltd. (Taiwan), Siltronic (Germany), and SK Siltron (South Korea) (Total 25 companies) |
This report categorizes the thin wafer market based on wafer size, process, technology, application at the regional and global level
By Wafer Size:
- 125 mm
- 200 mm
- 300 mm
By Process:
- Temporary Bonding & Debonding
- Carrier-less/Taiko Process
By Technology:
- Grinding
- Polishing
- Dicing
By Application:
- MEMS
- CIS
- Memory
- RF Devices
- LED
- Interposer
- Logic
- Others
By Geography
- Americas
- EMEA
- Asia Pacific (APAC)
Recent Developments
- In June 2020, GlobalWafers Co., Ltd. invested NTD 10 billion (USD 339 million) in its Taisil (Taiwan) branch to boost the 300-mm silicon wafer capacity. The increased production capacity is expected to meet the growing demand for high-quality silicon wafers.
- In June 2020, Siltronic invested in an epitaxial reactor to increase its production capacity of GaN-on-Si (Gallium Nitride-on-Silicon) wafers portfolio in response to the increasing demand for such wafers in applications such as data centers and 5G wireless networks. GaN technology supports efficient energy distribution under high power densities.
- In March 2020, SK Siltron acquired DuPont’s silicon carbide (SiC) wafer business. DuPont (US) is one of the world’s largest chemical companies providing innovative solutions for industries such as automotive, construction, energy, electronics, healthcare, and defense. The acquisition will enable SK Siltron to enter the SiC wafer market and expand its consumer network to electric vehicles (EV) and 5G networks.
- In February 2020, GlobalWafers Co., Ltd. and GLOBALFOUNDRIES (US), the world’s leading specialty foundry, signed a memorandum of understanding (MOU) to develop a long-term supply agreement for 300 mm SOI wafers. The agreement is expected to strengthen its 300-mm SOI wafer manufacturing capabilities.
- In December 2019, DISCO Corporation launched the new DDS2320, an automatic die separator designed for processing 300 mm wafers with improved productivity. 300 mm wafers have found an increasing application for use in memory devices—an improvement in processing capabilities is expected to improve the productivity of memory chip manufacturing.
Frequently Asked Questions (FAQ):
What is the current size of the global thin wafer market?
The global thin wafer market is estimated to be USD 10.8 billion by 2025 from USD 7.6 billion in 2020, growing at a CAGR of 7.2% between 2020 to 2025. The growth of the thin wafer market can be attributed to factors such rising adoption of MEMS technology in portable health monitoring devices, growing smartphone and consumer electronics markets, reducing sizes of electronic devices, and high amount of material saving.
Who are the winners in the global thin wafer market?
Companies such as Shin-Etsu Chemical Co., Ltd. (Japan), SUMCO Corporation (Japan), GlobalWafers Co., Ltd. (Taiwan), Siltronic (Germany), and SK Siltron (South Korea) fall under the winner’s category. These companies cater to the requirements of their customers by providing efficient thin wafers with a presence in majority of countries. Moreover, these companies have a strong and reliable distribution network which gives them an edge over other industry players.
What are the opportunities for the existing players and for those who are planning to enter various stages of the thin wafer value chain?
There are various opportunities for the existing players to enter the value chain of the thin wafer industry. Some of these include the growing use of thin wafers in automotive applications for the safety and in-vehicle communication systems, increased requirement for thin wafers in portable medical devices, and the growing implementation of different diameters of thin wafers in discrete semiconductor devices.
What is the Covid-19 impact on thin wafer market?
The shutdown of manufacturing facilities globally combined with strict restrictions over social movement in various COVID-19 affected countries impacted the operations of thin wafer manufacturing facilities. Leading thin wafer providers, such as GlobalWafers Co., Ltd. (Taiwan) and Siltronic (Germany), have incurred significant losses owing to the pandemic. Both companies have reported a decline of approximately 10% and 6% respectively in their half-year revenue as compared to the previous year. Also, devices such as MEMS, CIS, memory, RF devices, LEDs, interposers, and logic have experienced a decline in demand from end-user industries such as consumer electronics, automotive, industrial, and medical. This has resulted in a decline in the demand for thin wafers.
What are some of the technological advancements in the market?
Silicon Carbide (SiC) is evolving at a rapid space. SiC wafers are largely preferred by semiconductor device manufacturers and fabrication facilities as they offer several advantages over traditional silicon substrates. One of the major advantages of this substrate is its hardness. This substrate is increasingly used for thin wafers to minimize the impact of pressure or stress. Also, SiC has a low coefficient for thermal expansion, which means its shape does not gets altered when subjected to heating or cooling. It can operate on temperatures as high as 1600 °C, which makes it suitable for high-temperature applications. .
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TABLE OF CONTENTS
1 INTRODUCTION (Page No. - 27)
1.1 STUDY OBJECTIVES
1.2 MARKET DEFINITION
1.2.1 INCLUSIONS AND EXCLUSIONS
1.3 STUDY SCOPE
1.3.1 MARKETS COVERED
FIGURE 1 GEOGRAPHIC SCOPE
1.3.2 YEARS CONSIDERED
1.4 CURRENCY
1.5 PACKAGE SIZE
1.6 MARKET STAKEHOLDERS
1.7 SUMMARY OF CHANGES
2 RESEARCH METHODOLOGY (Page No. - 31)
2.1 RESEARCH DATA
FIGURE 2 THIN WAFER MARKET: RESEARCH DESIGN
2.1.1 SECONDARY DATA
2.1.1.1 Key data from secondary sources
2.1.2 PRIMARY DATA
2.1.2.1 Key data from primary sources
2.1.2.2 Key industry insights
2.1.2.3 Breakdown of primaries
2.2 MARKET SIZE ESTIMATION
FIGURE 3 MARKET SIZE ESTIMATION METHODOLOGY: APPROACH 1 (SUPPLY SIDE): REVENUE GENERATED FROM KEY MARKET PLAYERS IN MARKET
FIGURE 4 MARKET SIZE ESTIMATION METHODOLOGY: APPROACH 2 (SUPPLY SIDE): ILLUSTRATION OF REVENUE ESTIMATION OF KEY MARKET PLAYERS IN MARKET
FIGURE 5 MARKET SIZE ESTIMATION METHODOLOGY: APPROACH 3—BOTTOM-UP ESTIMATION OF THIN WAFER MARKET, BY WAFER SIZE
2.2.1 BOTTOM-UP APPROACH
2.2.1.1 Approach for capturing market size by bottom-up analysis (demand side)
FIGURE 6 MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH
2.2.2 TOP-DOWN APPROACH
2.2.2.1 Approach for capturing market size by top-down analysis (supply side)
FIGURE 7 MARKET SIZE ESTIMATION METH0DOLOGY: TOP-DOWN APPROACH
2.3 MARKET BREAKDOWN AND DATA TRIANGULATION
FIGURE 8 DATA TRIANGULATION
2.4 RESEARCH ASSUMPTIONS AND LIMITATIONS
2.4.1 ASSUMPTIONS
2.4.2 LIMITATIONS
3 EXECUTIVE SUMMARY (Page No. - 42)
3.1 SCENARIO ANALYSIS
FIGURE 9 COMPARISON OF PRE- AND POST-COVID-19 MARKET SIZE AND CAGR OF THIN WAFER MARKET, BY SCENARIO, 2016–2025
FIGURE 10 COMPARISON OF PRE- AND POST-COVID-19 MARKET SIZE AND CAGR OF WAFER THINNING EQUIPMENT MARKET, BY SCENARIO, 2016–2025
3.1.1 PRE-COVID-19 SCENARIO
3.1.2 PESSIMISTIC SCENARIO (POST-COVID-19)
3.1.3 OPTIMISTIC SCENARIO (POST-COVID-19)
3.1.4 REALISTIC SCENARIO (POST-COVID-19)
FIGURE 11 300 MM WAFER TO ACCOUNT FOR LARGEST MARKET SHARE IN 2020
FIGURE 12 THIN WAFER MARKET, BY WAFER SIZE, 2020-2025 (MILLION SQUARE INCHES)
FIGURE 13 MEMORY APPLICATION TO HOLD LARGEST SIZE OF MARKET IN 2025
FIGURE 14 WAFER THINNING EQUIPMENT MARKET FOR LED APPLICATION TO GROW AT HIGHEST CAGR BETWEEN 2020 AND 2025
FIGURE 15 APAC TO BE MOST FAVOURABLE REGION FOR MARKET IN 2025
FIGURE 16 WAFER THINNING EQUIPMENT MARKET IN APAC TO HOLD LARGEST SHARE IN 2025
4 PREMIUM INSIGHTS (Page No. - 50)
4.1 ATTRACTIVE GROWTH OPPORTUNITIES IN THIN WAFER MARKET
FIGURE 17 THIN WAFERS EXPECTED TO WITNESS HIGH ADOPTION RATE DURING FORECAST PERIOD
4.2 WAFER THINNING EQUIPMENT MARKET, BY TECHNOLOGY
FIGURE 18 DICING TECHNOLOGY TO CONTINUE TO HOLD LARGEST MARKET SHARE IN COMING YEARS
4.3 THIN WAFER MARKET, BY APPLICATION
FIGURE 19 MARKET FOR LED EXPECTED TO GROW AT HIGHEST CAGR BETWEEN 2020 AND 2025
4.4 WAFER THINNING EQUIPMENT MARKET, BY TECHNOLOGY AND APPLICATION
FIGURE 20 MEMORY AND LOGIC TO BE MOST FAVOURABLE APPLICATION AREAS FOR WAFER THINNING EQUIPMENT MARKET IN 2025
4.5 GEOGRAPHICAL ANALYSIS OF MARKET
FIGURE 21 CHINA TO EXHIBIT HIGHEST CAGR IN MARKET GLOBALLY BETWEEN 2020 AND 2025
5 MARKET OVERVIEW (Page No. - 53)
5.1 INTRODUCTION
5.2 MARKET DYNAMICS
FIGURE 22 THIN WAFER MARKET: DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES
5.2.1 DRIVERS
5.2.1.1 Rising adoption of MEMS technology in portable health monitoring devices
5.2.1.2 Increasing focus on e-learning amid COVID-19 drives demand for smartphones, tablets, laptops, and telecommunication systems
5.2.1.3 Reducing sizes of electronic devices
5.2.1.4 Growing smartphone and consumer electronics markets
5.2.1.5 High amount of material saving
FIGURE 23 DRIVERS: IMPACT ANALYSIS
5.2.2 RESTRAINTS
5.2.2.1 Efficiency maintenance—major issue for thin wafers
FIGURE 24 RESTRAINTS: IMPACT ANALYSIS
5.2.3 OPPORTUNITIES
5.2.3.1 Expanding IC industry in China
5.2.3.2 Growing adoption of IoT and AI in automotive sector
FIGURE 25 ESTIMATION OF IOT CONNECTIONS BY 2025 (BILLION)
5.2.3.3 Rising adoption of portable devices
FIGURE 26 OPPORTUNITIES: IMPACT ANALYSIS
5.2.4 CHALLENGES
5.2.4.1 Thin wafers being volatile and susceptible to damage caused by pressure or stress
5.2.4.2 Delay of investment plans for capacity expansion by wafer manufacturers due to COVID-19
FIGURE 27 CHALLENGES: IMPACT ANALYSIS
5.3 AVERAGE SELLING PRICE TREND
FIGURE 28 AVERAGE COST OF THIN WAFERS PER SQUARE INCH
5.4 REGULATORY UPDATE
5.5 VALUE CHAIN ANALYSIS
FIGURE 29 VALUE CHAIN ANALYSIS: INTEGRATED DEVICE MANUFACTURERS ADD MAJOR VALUE
5.6 MARKET MAP
5.7 TECHNOLOGY ANALYSIS
5.7.1 SILICON CARBIDE (SIC) TECHNOLOGY
TABLE 1 COMPARISON OF BENEFITS OF SIC TECHNOLOGY WITH OTHER TECHNOLOGIES
5.8 CASE STUDY ANALYSIS
5.8.1 STMICROELECTRONICS SELECT CREE’S SILICON CARBIDE BARE AND EPITAXIAL WAFERS
5.8.2 INFINEON TECHNOLOGIES AND UMC ANNOUNCE MANUFACTURING AGREEMENT
6 THIN WAFER MARKET, BY PROCESS (Page No. - 64)
6.1 INTRODUCTION
FIGURE 30 TEMPORARY BONDER AND DEBONDER MARKET SIZE
6.2 TEMPORARY BONDING & DEBONDING
6.2.1 MARKET ADHESIVES
6.2.1.1 UV-release adhesives
6.2.1.2 Thermal-release adhesives
6.2.1.3 Solvent-release adhesives
6.3 CARRIER-LESS APPROACH (TAIKO PROCESS)
7 THIN WAFER MARKET, BY WAFER SIZE (Page No. - 67)
7.1 INTRODUCTION
FIGURE 31 300-MM WAFER MARKET TO GROW AT HIGHEST CAGR BETWEEN 2020 AND 2025
TABLE 2 MARKET, BY WAFER SIZE, 2016–2019 (MILLION SQUARE INCHES)
TABLE 3 MARKET, BY WAFER SIZE, 2020–2025 (MILLION SQUARE INCHES)
TABLE 4 MARKET, BY WAFER SIZE, 2016–2019 (USD MILLION)
TABLE 5 MARKET, BY WAFER SIZE, 2020–2025 (USD MILLION)
7.2 125 MM
7.2.1 MARKET FOR 125 MM WAFERS TO BE IMPACTED DUE TO GROWING ADOPTION OF LARGER DIAMETER WAFERS BY SEMICONDUCTOR MANUFACTURERS
TABLE 6 MARKET FOR 125 MM WAFER SIZE BY APPLICATION, 2016–2019 (MILLION SQUARE INCHES)
TABLE 7 MARKET FOR 125 MM WAFER SIZE BY APPLICATION, 2020–2025 (MILLION SQUARE INCHES)
TABLE 8 THIN WAFER MARKET FOR 125 MM WAFER SIZE, BY APPLICATION, 2016–2019 (USD MILLION)
TABLE 9 MARKET FOR 125 MM WAFER SIZE, BY APPLICATION, 2020–2025 (USD MILLION)
7.3 200 MM
7.3.1 DEMAND FOR 200 MM WAFERS TO WITNESS A STEADY GROWTH DURING THE FORECAST PERIOD
TABLE 10 MARKET FOR 200 MM WAFER SIZE, BY APPLICATION, 2016–2019 (MILLION SQUARE INCHES)
TABLE 11 MARKET FOR 200 MM WAFER SIZE, BY APPLICATION, 2020–2025 (MILLION SQUARE INCHES)
TABLE 12 THIN WAFER MARKET FOR 200 MM WAFER SIZE, BY APPLICATION, 2016–2019 (USD MILLION)
TABLE 13 MARKET FOR 200 MM WAFER SIZE, BY APPLICATION, 2020–2025 (USD MILLION)
7.4 300 MM
7.4.1 300 MM WAFER MARKET EXPECTED TO WITNESS HIGHEST GROWTH RATE DURING THE FORECAST PERIOD
TABLE 14 MARKET FOR 300MM WAFER SIZE, BY APPLICATION, 2016–2019 (MILLION SQUARE INCHES)
TABLE 15 MARKET FOR 300MM WAFER SIZE, BY APPLICATION, 2020–2025 (MILLION SQUARE INCHES)
TABLE 16 MARKET FOR 300 MM WAFER SIZE, BY APPLICATION, 2016–2019 (USD MILLION)
TABLE 17 MARKET FOR 300 MM WAFER SIZE, BY APPLICATION, 2020–2025 (USD MILLION)
8 THIN WAFER MARKET, BY APPLICATION (Page No. - 76)
8.1 INTRODUCTION
FIGURE 32 THIN WAFER SHIPMENTS FOR LED APPLICATIONS TO GROW AT HIGHEST RATE BETWEEN 2020 AND 2025
TABLE 18 MARKET SIZE, BY APPLICATION, 2016–2019 (MILLION SQUARE INCHES)
TABLE 19 MARKET SIZE, BY APPLICATION, 2020–2025 (MILLION SQUARE INCHES)
FIGURE 33 MEMORY TO BE LARGEST SEGMENT OF THIN WAFERS MARKET IN 2020
TABLE 20 MARKET SIZE, BY APPLICATION, 2016–2019 (USD MILLION)
TABLE 21 MARKET SIZE, BY APPLICATION, 2020–2025 (USD MILLION)
TABLE 22 WAFER THINNING EQUIPMENT MARKET SIZE, BY APPLICATION, 2016–2019 (USD MILLION)
TABLE 23 WAFER THINNING EQUIPMENT MARKET SIZE, BY APPLICATION, 2020–2025 (USD MILLION)
8.2 MEMS
8.2.1 GROWTH OF MEMS IS ATTRIBUTED TO ITS HUGE ADOPTION IN PORTABLE ELECTRONIC DEVICES
TABLE 24 THIN WAFER MARKET FOR MEMS DEVICES, BY WAFER SIZE, 2016–2019 (MILLION SQUARE INCHES)
TABLE 25 MARKET FOR MEMS DEVICES, BY WAFER SIZE, 2020–2025 (MILLION SQUARE INCHES)
TABLE 26 MARKET FOR MEMS DEVICES, BY WAFER SIZE, 2016–2019 (USD MILLION)
TABLE 27 MARKET FOR MEMS DEVICES, BY WAFER SIZE, 2020–2025 (USD MILLION)
TABLE 28 WAFER THINNING EQUIPMENT MARKET SIZE FOR MEMS APPLICATION, BY REGION, 2016–2019 (USD MILLION)
TABLE 29 WAFER THINNING EQUIPMENT MARKET SIZE FOR MEMS APPLICATION, BY REGION, 2020–2025 (USD MILLION)
8.3 CIS
8.3.1 INCREASING DEMAND FOR CIS FROM AUTOMOTIVE VERTICAL IS EXPECTED TO DRIVE THE DEMAND
TABLE 30 THIN WAFER MARKET FOR CIS APPLICATIONS, BY WAFER SIZE, 2016–2019 (MILLION SQUARE INCHES)
TABLE 31 MARKET FOR CIS APPLICATIONS, BY WAFER SIZE, 2020–2025 (MILLION SQUARE INCHES)
FIGURE 34 300 MM WAFER SIZE SEGMENT TO HOLD LARGEST MARKET SHARE IN 2020
TABLE 32 MARKET FOR CIS APPLICATIONS, BY WAFER SIZE, 2016–2019 (USD MILLION)
TABLE 33 MARKET FOR CIS APPLICATIONS, BY WAFER SIZE, 2020–2025 (USD MILLION)
TABLE 34 WAFER THINNING EQUIPMENT MARKET SIZE FOR CIS APPLICATION, BY REGION, 2016–2019 (USD MILLION)
TABLE 35 WAFER THINNING EQUIPMENT MARKET SIZE FOR CIS APPLICATION, BY REGION, 2020–2025 (USD MILLION)
8.4 MEMORY
8.4.1 GROWING ADOPTION OF NAND FLASH MEMORY IN MOBILE ELECTRONICS TO DRIVE THE DEMAND
TABLE 36 THIN WAFER MARKET FOR MEMORY DEVICES, BY WAFER SIZE, 2016–2019 (MILLION SQUARE INCHES)
TABLE 37 MARKET FOR MEMORY DEVICES, BY WAFER SIZE, 2020–2025 (MILLION SQUARE INCHES)
FIGURE 35 300 MM WAFER SIZE SEGMENT TO REGISTER HIGHEST CAGR BETWEEN 2020 AND 2025
TABLE 38 MARKET FOR MEMORY DEVICES, BY WAFER SIZE, 2016–2019 (USD MILLION)
TABLE 39 MARKET FOR MEMORY DEVICES, BY WAFER SIZE, 2020–2025 (USD MILLION)
TABLE 40 WAFER THINNING EQUIPMENT MARKET SIZE FOR MEMORY APPLICATION, BY REGION, 2016–2019 (USD MILLION)
TABLE 41 WAFER THINNING EQUIPMENT MARKET SIZE FOR MEMORY APPLICATION, BY REGION, 2020–2025 (USD MILLION)
8.5 RF DEVICES
8.5.1 GROWING ADOPTION OF RF DEVICES IN SMARTPHONES TO PROPEL THE MARKET GROWTH DURING THE FORECAST PERIOD
TABLE 42 THIN WAFER MARKET FOR RF DEVICES, BY WAFER SIZE, 2016–2019 (MILLION SQUARE INCHES)
TABLE 43 MARKET FOR RF DEVICES, BY WAFER SIZE, 2020–2025 (MILLION SQUARE INCHES)
TABLE 44 MARKET FOR RF DEVICES, BY WAFER SIZE, 2016–2019 (USD MILLION)
TABLE 45 MARKET FOR RF DEVICES, BY WAFER SIZE, 2020–2025 (USD MILLION)
TABLE 46 WAFER THINNING EQUIPMENT MARKET SIZE FOR RF DEVICES APPLICATION, BY REGION, 2016–2019 (USD MILLION)
TABLE 47 WAFER THINNING EQUIPMENT MARKET SIZE FOR RF DEVICES APPLICATION, BY REGION, 2020–2025 (USD MILLION)
8.6 LED
8.6.1 INCREASING DEMAND FOR LED COMPONENTS IN HOME AND INFRASTRUCTURE MARKET TO AUGMENT THE GROWTH DURING THE FORECAST PERIOD
TABLE 48 THIN WAFER MARKET FOR LED DEVICES, BY WAFER SIZE, 2016–2019 (MILLION SQUARE INCHES)
TABLE 49 MARKET FOR LED DEVICES, BY WAFER SIZE, 2020–2025 (MILLION SQUARE INCHES)
FIGURE 36 300 MM TO BE LARGEST SEGMENT IN 2020
TABLE 50 MARKET FOR LED DEVICES, BY WAFER SIZE, 2016–2019 (USD MILLION)
TABLE 51 MARKET FOR LED DEVICES, BY WAFER SIZE, 2020–2025 (USD MILLION)
TABLE 52 WAFER THINNING EQUIPMENT MARKET SIZE FOR LED APPLICATION, BY REGION, 2016–2019 (USD MILLION)
TABLE 53 WAFER THINNING EQUIPMENT MARKET SIZE FOR LED APPLICATION, BY REGION, 2020–2025 (USD MILLION)
8.7 INTERPOSERS
8.7.1 REQUIREMENT FOR ADVANCED ARCHITECTURE IN MINIATURE ELECTRONIC DEVICES TO DRIVE THE DEMAND
TABLE 54 THIN WAFER MARKET FOR INTERPOSERS, BY WAFER SIZE, 2016–2019 (MILLION SQUARE INCHES)
TABLE 55 MARKET FOR INTERPOSERS, BY WAFER SIZE, 2020–2025 (MILLION SQUARE INCHES)
TABLE 56 MARKET FOR INTERPOSERS, BY WAFER SIZE, 2016–2019 (USD MILLION)
TABLE 57 MARKET FOR INTERPOSERS, BY WAFER SIZE, 2020–2025 (USD MILLION)
TABLE 58 WAFER THINNING EQUIPMENT MARKET SIZE FOR INTERPOSER APPLICATION, BY REGION, 2016–2019 (USD MILLION)
TABLE 59 WAFER THINNING EQUIPMENT MARKET SIZE FOR INTERPOSER APPLICATION, BY REGION, 2020–2025 (USD MILLION)
8.8 LOGIC
8.8.1 HIGH PENETRATION OF AFFORDABLE CLOUD COMPUTING SOLUTIONS TO DRIVE THE DEMAND FOR LOGIC DEVICES
TABLE 60 THIN WAFER MARKET FOR LOGIC, BY WAFER SIZE, 2016–2019 (MILLION SQUARE INCHES)
TABLE 61 MARKET FOR LOGIC, BY WAFER SIZE, 2020–2025 (MILLION SQUARE INCHES)
TABLE 62 MARKET FOR LOGIC, BY WAFER SIZE, 2016–2019 (USD MILLION)
TABLE 63 MARKET FOR LOGIC, BY WAFER SIZE, 2020–2025 (USD MILLION)
TABLE 64 WAFER THINNING EQUIPMENT MARKET SIZE FOR LOGIC APPLICATION, BY REGION, 2016–2019 (USD MILLION)
TABLE 65 WAFER THINNING EQUIPMENT MARKET SIZE FOR LOGIC APPLICATION, BY REGION, 2020–2025 (USD MILLION)
8.9 OTHERS
TABLE 66 THIN WAFER MARKET FOR OTHERS, BY WAFER SIZE, 2016–2019 (MILLION SQUARE INCHES)
TABLE 67 MARKET FOR OTHERS, BY WAFER SIZE, 2020–2025 (MILLION SQUARE INCHES)
TABLE 68 MARKET FOR OTHERS, BY WAFER SIZE, 2016–2019 (USD MILLION)
TABLE 69 MARKET FOR OTHERS, BY WAFER SIZE, 2020–2025 (USD MILLION)
TABLE 70 WAFER THINNING EQUIPMENT MARKET SIZE FOR OTHER APPLICATIONS, BY REGION, 2016–2019 (USD MILLION)
TABLE 71 WAFER THINNING EQUIPMENT MARKET SIZE FOR OTHER APPLICATIONS, BY REGION, 2020–2025 (USD MILLION)
8.10 MOST NEGATIVELY IMPACTED INDUSTRY BY COVID-19
8.10.1 RF DEVICES
FIGURE 37 PRE- AND POST-COVID-19 MARKET COMPARISON FOR THIN WAFER MARKET, BY RF DEVICES APPLICATION
FIGURE 38 PRE- AND POST-COVID-19 MARKET COMPARISON FOR WAFER THINNING EQUIPMENT, BY RF DEVICES APPLICATION
TABLE 72 MARKET FOR RF DEVICES APPLICATION, BY PRE- AND POST-COVID-19 SCENARIO, 2016–2025 (USD MILLION)
&nbnbsp; TABLE 73 WAFER THINNING EQUIPMENT MARKET FOR RF DEVICES APPLICATION, BY PRE- AND POST-COVID-19 SCENARIO, 2016–2025 (USD MILLION)
8.10.1.1 Impact analysis
8.11 LEAST IMPACTED INDUSTRY BY COVID-19
8.11.1 LED
FIGURE 39 PRE- AND POST-COVID-19 MARKET COMPARISON FOR THIN WAFER MARKET, BY LED APPLICATION
FIGURE 40 PRE- AND POST-COVID-19 MARKET COMPARISON FOR WAFER THINNING EQUIPMENT, BY LED APPLICATION
TABLE 74 MARKET FOR LED APPLICATION, BY PRE- AND POST-COVID-19 SCENARIO, 2016–2025 (USD MILLION)
TABLE 75 WAFER THINNING EQUIPMENT MARKET FOR LED APPLICATION, BY PRE- AND POST-COVID-19 SCENARIO, 2016–2025 (USD MILLION)
8.11.1.1 Impact analysis
9 THIN WAFER MARKET, BY TECHNOLOGY (Page No. - 105)
9.1 INTRODUCTION
FIGURE 41 WAFER POLISHING EQUIPMENT MARKET TO GROW AT HIGHEST CAGR BETWEEN 2020 AND 2025
TABLE 76 WAFER THINNING EQUIPMENT MARKET SIZE, BY TECHNOLOGY, 2016–2019 (USD MILLION)
TABLE 77 WAFER THINNING EQUIPMENT MARKET SIZE, BY TECHNOLOGY, 2020–2025 (USD MILLION)
9.2 WAFER GRINDING
9.2.1 WAFER GRINDING PROCESS IS ATTRACTING MANUFACTURERS DUE TO ITS PROMISING APPLICATION IN THE MINIATURIZATION AND PACKAGING OF SEMICONDUCTOR DEVICES
TABLE 78 WAFER GRINDING EQUIPMENT MARKET SIZE, BY APPLICATION, 2016–2019 (USD MILLION)
TABLE 79 WAFER GRINDING EQUIPMENT MARKET SIZE, BY APPLICATION, 2020–2025 (USD MILLION)
TABLE 80 WAFER GRINDING EQUIPMENT MARKET SIZE, BY REGION, 2016–2019 (USD MILLION)
TABLE 81 WAFER GRINDING EQUIPMENT MARKET SIZE, BY REGION, 2020–2025 (USD MILLION)
9.3 WAFER POLISHING
9.3.1 DEMAND FOR THIN WAFERS WITH SMOOTH SURFACE FOR SEAMLESS INTEGRATION TO DRIVE THE DEMAND FOR WAFER POLISHING EQUIPMENT
TABLE 82 WAFER POLISHING EQUIPMENT MARKET SIZE, BY APPLICATION, 2016–2019 (USD MILLION)
TABLE 83 WAFER POLISHING EQUIPMENT MARKET SIZE, BY APPLICATION, 2020–2025 (USD MILLION)
TABLE 84 WAFER POLISHING EQUIPMENT MARKET SIZE, BY REGION, 2016–2019 (USD MILLION)
TABLE 85 WAFER POLISHING EQUIPMENT MARKET SIZE, BY REGION, 2020–2025 (USD MILLION)
9.4 WAFER DICING
9.4.1 WAFER DICING EQUIPMENT MARKET TO ACCOUNT FOR THE LARGEST MARKET SHARE DURING THE FORECAST PERIOD
TABLE 86 WAFER DICING EQUIPMENT MARKET SIZE, BY APPLICATION, 2016–2019 (USD MILLION)
TABLE 87 WAFER DICING EQUIPMENT MARKET SIZE, BY APPLICATION, 2020–2025 (USD MILLION)
TABLE 88 WAFER DICING EQUIPMENT MARKET SIZE, BY REGION, 2016–2019 (USD MILLION)
TABLE 89 WAFER DICING EQUIPMENT MARKET SIZE, BY REGION, 2020–2025 (USD MILLION)
10 THIN WAFER MARKET, BY GEOGRAPHY (Page No. - 113)
10.1 INTRODUCTION
FIGURE 42 MARKET: GEOGRAPHIC SNAPSHOT, 2020–2025
TABLE 90 MARKET, BY REGION, 2016–2019 (USD MILLION)
TABLE 91 MARKET, BY REGION, 2020–2025 (USD MILLION)
TABLE 92 WAFER THINNING EQUIPMENT MARKET, BY REGION, 2016–2019 (USD MILLION)
TABLE 93 WAFER THINNING EQUIPMENT MARKET, BY REGION, 2020–2025 (USD MILLION)
10.2 AMERICAS
FIGURE 43 AMERICAS: GEOGRAPHIC SNAPSHOT, 2019
TABLE 94 AMERICAS: THIN WAFER MARKET, BY COUNTRY, 2016–2019 (USD MILLION)
TABLE 95 AMERICAS: MARKET, BY COUNTRY, 2020–2025 (USD MILLION)
TABLE 96 AMERICAS: WAFER THINNING EQUIPMENT MARKET, BY APPLICATION, 2016–2019 (USD MILLION)
TABLE 97 AMERICAS: WAFER THINNING EQUIPMENT MARKET, BY APPLICATION, 2020–2025 (USD MILLION)
10.2.1 IMPACT OF COVID-19 ON MARKET IN AMERICAS
FIGURE 44 PRE- AND POST-COVID-19 MARKET SCENARIOS FOR MARKET IN AMERICAS
FIGURE 45 PRE- AND POST-COVID-19 MARKET COMPARISON FOR WAFER THINNING EQUIPMENT IN AMERICAS
TABLE 98 MARKET IN AMERICAS, BY PRE- AND POST-COVID-19 SCENARIO, 2016–2025 (USD BILLION)
TABLE 99 WAFER THINNING EQUIPMENT MARKET IN AMERICAS, BY PRE- AND POST-COVID-19 SCENARIO, 2016–2025 (USD MILLION)
10.2.2 US
10.2.2.1 US would lead market in Americas during forecast period
10.2.3 CANADA
10.2.3.1 Government support to promote use of electric vehicles and growing telecom industry to drive market in Canada
10.2.4 REST OF AMERICAS
10.2.4.1 Growing demand for semiconductor devices from consumer electronics and automotive industries to fuel market growth in Rest of Americas
10.3 EMEA
FIGURE 46 EMEA: GEOGRAPHIC SNAPSHOT, 2019
TABLE 100 EMEA: THIN WAFER MARKET, BY COUNTRY, 2016–2019 (USD MILLION)
TABLE 101 EMEA: MARKET, BY COUNTRY, 2020–2025 (USD MILLION)
TABLE 102 EMEA: WAFER THINNING EQUIPMENT MARKET, BY APPLICATION, 2016–2019 (USD MILLION)
TABLE 103 EMEA: WAFER THINNING EQUIPMENT MARKET, BY APPLICATION, 2020–2025 (USD MILLION)
10.3.1 IMPACT OF COVID-19 ON MARKET IN EMEA
FIGURE 47 PRE- AND POST-COVID-19 MARKET SCENARIOS FOR MARKET IN EMEA
FIGURE 48 PRE- AND POST-COVID-19 MARKET COMPARISON FOR WAFER THINNING EQUIPMENT IN EMEA
TABLE 104 THIN WAFER MARKET IN EMEA, BY PRE- AND POST-COVID-19 SCENARIO, 2016–2025 (USD BILLION)
TABLE 105 WAFER THINNING EQUIPMENT MARKET IN EMEA, BY PRE- AND POST-COVID-19 SCENARIO, 2016–2025 (USD MILLION)
10.3.2 UK
10.3.2.1 Increase in demand for portable medical devices in UK to spur demand for thin wafers
10.3.3 GERMANY
10.3.3.1 Growing adoption of MEMS sensors in automotive industry to drive thin wafer market
10.3.4 FRANCE
10.3.4.1 Increased EV manufacturing to bolster market growth in France
10.3.5 REST OF EMEA
10.3.5.1 Dearth of thin wafer manufacturers could be an opportunity for new investments in Rest of EMEA
10.4 APAC
FIGURE 49 APAC: GEOGRAPHIC SNAPSHOT, 2019
TABLE 106 APAC: THIN WAFER MARKET, BY COUNTRY, 2016–2019 (USD MILLION)
TABLE 107 APAC: MARKET, BY COUNTRY, 2020–2025 (USD MILLION)
TABLE 108 APAC: WAFER THINNING EQUIPMENT MARKET, BY APPLICATION, 2016–2019 (USD MILLION)
TABLE 109 APAC: WAFER THINNING EQUIPMENT MARKET, BY APPLICATION, 2020–2025 (USD MILLION)
10.4.1 IMPACT OF COVID-19 ON MARKET IN APAC
FIGURE 50 PRE- AND POST-COVID-19 MARKET SCENARIOS FOR THIN WAFER MARKET IN APAC
FIGURE 51 PRE- AND POST-COVID-19 MARKET COMPARISON FOR WAFER THINNING EQUIPMENT IN APAC
TABLE 110 MARKET IN APAC, BY PRE- AND POST-COVID-19 SCENARIO, 2016–2025 (USD BILLION)
TABLE 111 WAFER THINNING EQUIPMENT MARKET IN APAC, BY PRE- AND POST-COVID-19 SCENARIO, 2016–2025 (USD MILLION)
10.4.2 TAIWAN
10.4.2.1 Presence of several fabrication facilities and IC manufacturing firms to drive market in Taiwan
10.4.3 CHINA
10.4.3.1 China’s focus on achieving 70% IC self-sufficiency by 2025 to drive market
10.4.4 JAPAN
10.4.4.1 Presence of major market players and end-user industries drive market in Japan
10.4.5 SOUTH KOREA
10.4.5.1 South Korea is expected to hold largest share of market in APAC
10.4.6 REST OF APAC
10.4.6.1 Growing demand for connected devices to drive market in Rest of APAC
11 COMPETITIVE LANDSCAPE (Page No. - 133)
11.1 COMPETITIVE LANDSCAPE OVERVIEW
FIGURE 52 KEY DEVELOPMENTS OF LEADING PLAYERS IN THIN WAFER MARKET BETWEEN JANUARY 2017 AND JULY 2020
11.2 MARKET SHARE ANALYSIS OF KEY COMPANIES, 2019
TABLE 112 SHARE OF TOP 5 PLAYERS IN MARKET, 2019
11.3 COMPETITIVE SITUATION AND TRENDS
FIGURE 53 PRODUCT LAUNCHES IS THE KEY STRATEGY ADOPTED BY THE PLAYERS IN THE MARKET
11.3.1 PRODUCT LAUNCHES
TABLE 113 PRODUCT LAUNCHES, JANUARY 2017–JULY 2020
11.3.2 AGREEMENTS, COLLABORATIONS, AND CONTRACTS
TABLE 114 AGREEMENTS, COLLABORATIONS, AND CONTRACTS, JANUARY 2017–JULY 2020
11.3.3 EXPANSIONS AND MERGERS & ACQUISITIONS
TABLE 115 EXPANSIONS AND MERGERS & ACQUISITIONS, JANUARY 2017–JULY 2020
11.4 THIN WAFER MARKET, COMPANY EVALUATION MATRIX, 2019
11.4.1 STAR
11.4.2 PERVASIVE
11.4.3 PARTICIPANT
11.4.4 EMERGING LEADER
FIGURE 54 MARKET, COMPANY EVALUATION MATRIX (2019)
11.5 STRENGTH OF PRODUCT PORTFOLIO
FIGURE 55 PRODUCT PORTFOLIO ANALYSIS OF TOP PLAYERS IN THIN WAFER MARKET, 2019
11.6 BUSINESS STRATEGY EXCELLENCE
FIGURE 56 BUSINESS STRATEGY EXCELLENCE OF TOP PLAYERS IN THIN WAFER MARKET, 2019
12 COMPANY PROFILES (Page No. - 143)
12.1 INTRODUCTION
(Business overview, Products offered, Recent Developments, SWOT Analysis, MNM view)*
12.2 KEY PLAYERS
12.2.1 SK SILTRON
FIGURE 57 SK SILTRON: COMPANY SNAPSHOT
12.2.2 SHIN-ETSU CHEMICAL CO., LTD.
FIGURE 58 SHIN-ETSU CHEMICAL CO., LTD.: COMPANY SNAPSHOT
12.2.3 SILTRONIC
FIGURE 59 SILTRONIC: COMPANY SNAPSHOT
12.2.4 SUMCO CORPORATION
FIGURE 60 SUMCO CORPORATION: COMPANY SNAPSHOT
12.2.5 GLOBALWAFERS CO., LTD.
FIGURE 61 GLOBALWAFERS CO., LTD.: COMPANY SNAPSHOT
12.2.6 SUSS MICROTEC
FIGURE 62 SUSS MICROTEC AG: COMPANY SNAPSHOT
12.2.7 LINTEC CORPORATION
FIGURE 63 LINTEC CORPORATION: COMPANY SNAPSHOT
12.2.8 DISCO CORPORATION
FIGURE 64 DISCO CORPORATION: COMPANY SNAPSHOT
12.2.9 3M
FIGURE 65 3M: COMPANY SNAPSHOT
12.2.10 APPLIED MATERIALS
FIGURE 66 APPLIED MATERIALS, INC.: COMPANY SNAPSHOT
12.3 FIVE YEAR REVENUE ANALYSIS OF MAJOR PLAYERS IN THE THIN WAFER MARKET
FIGURE 67 MARKET: FIVE YEAR REVENUE SNAPSHOT OF MAJOR PLAYERS (USD MILLION)
12.4 RIGHT TO WIN
12.5 OTHER COMPANIES
12.5.1 NISSAN CHEMICAL CORPORATION
12.5.2 MECHATRONIC SYSTEMTECHNIK
12.5.3 SYNOVA
12.5.4 EV GROUP
12.5.5 BREWER SCIENCE
12.5.6 ULVAC GMBH
12.5.7 WAFER WORKS CORPORATION
12.5.8 OKMETIC
12.5.9 ATECOM TECHNOLOGY CO., LTD.
12.5.10 SILTRONIX SILICON TECHNOLOGIES
*Details on Business overview, Products offered, Recent Developments, SWOT Analysis, MNM view might not be captured in case of unlisted companies.
13 APPENDIX (Page No. - 172)
13.1 INSIGHTS OF INDUSTRY EXPERTS
13.2 DISCUSSION GUIDE
13.3 KNOWLEDGE STORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL
13.4 AVAILABLE CUSTOMIZATIONS
13.5 RELATED REPORTS
13.6 AUTHOR DETAILS
The study involved four major activities in estimating the size of the thin wafer market. Exhaustive secondary research was done to collect information on the market, peer market, and parent market. The next step was to validate these findings, assumptions, and sizing with industry experts across the value chain through primary research. Both top-down and bottom-up approaches were employed to estimate the complete market’s size. After that, market breakdown and data triangulation were used to estimate the market sizes of segments and sub-segments.
Secondary Research
In the thin wafer market report, both top-down and bottom-up approaches have been used to estimate and validate the size of the t thin wafer market, along with other dependent submarkets. The key players in the thin wafer market have been identified through secondary research, and their market ranks have been determined through primary and secondary research. This entire research methodology involved studying annual and financial reports of the top players and interviewing experts (such as CEOs, VPs, directors, and marketing executives) for key insights (both quantitative and qualitative). All percentage shares, splits, and breakdowns have been determined using secondary sources and verified through primary sources. All the possible parameters that may affect the markets covered in this research study have been accounted for, viewed in detail, verified through primary research, and analyzed to obtain the final quantitative and qualitative data. This data has been consolidated and supplemented with detailed inputs and analysis from MarketsandMarkets and presented in this report.
Primary Research
The thin wafer market supply chain comprises several stakeholders, such as raw material suppliers, manufacturers, foundry vendors, distribution channels, integrated device manufacturers, and end-users. The demand side of this market is characterized by MEMS, CIS, memory, RF devices, LED, interposers, logic, and other industries; while the supply side is characterized by raw material suppliers. Various primary sources from both the supply and demand sides of the market were interviewed to obtain qualitative and quantitative information.
Primary data has been collected through questionnaires, emails, and telephonic interviews. In the canvassing of primaries, various departments within organizations, such as sales, operations, and administration, were covered to provide a holistic viewpoint in our report. After interacting with industry experts, brief sessions were conducted with highly experienced independent consultants to reinforce the findings from our primaries. This, along with the in-house subject matter experts’ opinions, has led us to the findings as described in the remainder of this report. The breakdown of the primary respondents is provided below:
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Market Size Estimation
Both top-down and bottom-up approaches have been used to estimate and validate the size of thin wafer market and its segments. The research methodology used to estimate the market size includes the following:
- Key players in the market have been identified through extensive secondary research
- The supply chain and the size of the thin wafer market, in terms of value, have been determined through primary and secondary research processes
- Several primary interviews have been conducted with key opinion leaders related to thin wafer supply chain, including key OEMs, IDMs, and Tier I suppliers.
- All percentage shares, splits, and breakdowns have been determined using secondary sources and verified through primary sources
- Qualitative aspects such as market drivers, restraints, opportunities, and challenges have been taken into consideration while calculating and forecasting the market size.
Global Thin wafer Market Size: Bottom-Up Approach
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Data Triangulation
After arriving at the overall market size—using the market size estimation process explained above—the market has been split into several segments and subsegments. Data triangulation and market breakdown procedures have been employed, wherever applicable, to complete the overall market engineering process and arrive at the exact statistics for each segment and subsegment of the market. The data has been triangulated by studying various factors and trends from both demand and supply sides of the thin wafer market.
Report Objectives
- To describe and forecast the global thin wafer market, by process, wafer size, application, technology, and region, in terms of value and volume
- To describe and forecast the markets of various segments of the thin wafer market with respect to the 3 main regions, namely the Americas, EMEA, and Asia Pacific (APAC), in terms of value and volume
- To provide detailed information regarding drivers, restraints, opportunities, and industry-specific challenges influencing the growth of the thin wafer market
- To study the complete value chain and allied industry segments and perform a value chain analysis of the global thin wafer landscape
- To describe the impact of COVID-19 on the thin wafer market
- To strategically analyze micromarkets1 with respect to individual growth trends, prospects, and contributions to the overall market
- To analyze growth opportunities for stakeholders in the thin wafer market
- To strategically profile key players and comprehensively analyze their position in the thin wafer market in terms of their market share and core competencies2 and detail the competitive landscape for market leaders
- To analyze various developments such as agreements, collaborations, contracts, expansions, mergers and acquisitions, and product launches, along with research and development activities, in the global thin wafer market
Available Customizations:
Along with the market data, MarketsandMarkets offers customizations according to the specific requirements of companies. The following customization options are available for the report:
Company Information
- Detailed analysis and profiling of additional market players (up to 5)
- Additional country-level analysis of thin wafer market
- Estimation of the market size of the product segments of the thin wafer market based on different subsegments
- Triangulate with your Own Data
- Get Data as per your Format and Definition
- Gain a Deeper Dive on a Specific Application, Geography, Customer or Competitor
- Any level of Personalization
- What are the Known and Unknown Adjacencies Impacting the Thin Wafer Market
- What will your New Revenue Sources be?
- Who will be your Top Customer; what will make them switch?
- Defend your Market Share or Win Competitors
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Growth opportunities and latent adjacency in Thin Wafer Market
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