HOME Top Market Reports Three-dimensional Integrated Circuit (3D IC/Chip) & Through-Silicon Via (TSV) Interconnects Market - Global Forecast & Trend Analysis (2011 - 2016)

Three-dimensional Integrated Circuit (3D IC/Chip) & Through-Silicon Via (TSV) Interconnects Market - Global Forecast & Trend Analysis (2011 - 2016)

By: marketsandmarkets.com
Publishing Date: April 2012
Report Code: SE 1081

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3D IC/Chip & TSV Interconnects Market - Global Forecast & Trend Analysis (2011 - 2016) By Technology (Substrate, Bonding Techniques, Process Realization, Fabrication), Products (Memory, LED, Sensor, MEMS, Power & Analog Components) & Applications (Mobile Devices, Processors, ICT, Networking, Automotive, Defense)

The gradual migration towards 3D ICs with TSVs happened with accelerated demand for higher bandwidths, reduced power consumption, and higher density. 3D IC technology and its integration with through silicon vias (TSVs) have been witnessing significant commercial strides in the past two years. This is mainly attributed to the high efficiency of the solution and the guaranteed return on investment (ROI) to the investors.

Improved performance, reduced timing, and form factor motivation serve as key drivers for adoption of 3D IC and TSV interconnect solutions. On the other hand, thermal and testing issues and high cost involved largely restrain the growth of the market. In terms of revenue generation, Asia is observed to hold the highest share of around 40%, followed by North America with 35%.

Amongst the different end-products that utilize 3D ICs and TSV interconnects, memories and sensors are expected to provide the largest market owing to improvements in design that can be achieved and the growing demand for such enhanced designs in a wide variety of applications. With respect to the application sectors, consumer electronics sector largely contributes to the overall growth of the market. In the near future, it is expected that newer applications such as hybrid memory, graphics processor unit, low density parity check decoder, and cell broadband engine will emerge and serve as potential markets for 3D ICs and TSV interconnects.

The global 3D IC market is expected to grow from $2.21 billion in 2009 to $6.55 billion in 2016 at a CAGR of 16.9% from 2011 to 2016. The companies in this market need to efficiently balance their expenditure between capacity expansion and technology advancement. This is considered critical since the market for 3D ICs is yet to gain complete recognition and its successful penetration into different end-user segments is largely governed by the R&D initiatives.

IntSim is an open-source CAD tool to simulate 2D and 3D-ICs. It can be used for predicting 2D/3D chip power, die size, number of metal levels, and optimal sizes of metal levels based on various technology and design parameters. Users can also study scaling trends, and use IntSim to optimize their chip designs.

Scope of the report

The 3D IC Chip and TSV interconnect market research report categorizes the global market on the basis of the different manufacturing approaches, use of these ICs in different end-products, use of these in various applications and geographical analysis; forecasting revenue and analyzing trends in the market.

On the basis of manufacturing approaches

The two types of substrates used in the process include silicon on insulator and bulk silicon. Based on the bonding technique employed, the different types include die to die, die to wafer, wafer to wafer, direct bonding, adhesive bonding, and metallic bonding. The different vias processing techniques include via first, via middle, and via last. The different fabrication technologies include beam recrystallization, wafer bonding, silicon epitaxial growth and solid phase crystallization. The market trend for these approaches is discussed.

On the basis of product

The product market is segmented into memories, LEDs, sensors, power and analog components, micro electro mechanical systems (MEMS), and others. The market trend for these products is discussed.

On the basis of applications

The application market is segmented into military, aerospace and defense, consumer electronics, information and communication technology, automotive, and others. The market trend for these applications is discussed.

On the basis of geography

  • North America
  • Europe
  • Asia
  • ROW

Each section will provide market data, market drivers, trends and opportunities, key players, and competitive outlook. This report will also provide market tables for covering the sub-segments and micro-markets. In addition, it provides more than 20 company profiles covering all the sub-segments.

TABLE OF CONTENTS  
  
1 INTRODUCTION  
  1.1 KEY TAKE-AWAYS  
  1.2 REPORT DESCRIPTION  
  1.3 MARKETS COVERED  
  1.4 STAKEHOLDERS  
  1.5 RESEARCH METHODOLOGY  
      1.5.1 MARKET SIZE  
      1.5.2 KEY DATA POINTS TAKEN FROM SECONDARY SOURCES  
      1.5.3 KEY DATA POINTS TAKEN FROM PRIMARY SOURCES  
      1.5.4 ASSUMPTIONS  
      1.5.5 LIST OF COMPANIES COVERED DURING PRIMARIES  
  
2 EXECUTIVE SUMMARY  
  
3 MARKET OVERVIEW  

  3.1 MARKET DEFINITION  
  3.2 GLOBAL THREE DIMENSIONAL INTEGRATED CIRCUIT (3D IC) MARKET  
  3.3 GLOBAL TSV INTERCONNECT MARKET  
  3.4 HISTORY & EVOLUTION  
  3.5 ALLIED INDUSTRY SEGMENTS TO 3D IC MARKET  
      3.5.1 ELECTRONIC DESIGN AUTOMATION (EDA) VENDORS  
      3.5.2 FOUNDRY VENDORS  
      3.5.3 FABLESS VENDORS  
      3.5.4 INTEGRATED DEVICE MANUFACTURERS  
  3.6 GLOBAL 3D IC MARKET ESTIMATES AND FORECASTS  
  3.7 GLOBAL 3D IC MARKET DYNAMICS  
      3.7.1 DRIVERS  
            3.7.1.1 Reduction in timing  
            3.7.1.2 Improved performance  
            3.7.1.3 Form factor motivation  
      3.7.2 RESTRAINTS  
            3.7.2.1 Cost  
            3.7.2.2 Thermal issues  
            3.7.2.3 Testing issues  
      3.7.3 OPPORTUNITIES  
            3.7.3.1 Need for advanced architecture in electronic products  
            3.7.3.2 Opportunity for reactive ion etching (RIE) equipment manufacturers  
  3.8 BURNING ISSUES  
      3.8.1 SUPPLY CHAIN ISSUES  
  3.9 WINNING IMPERATIVES  
      3.9.1 STANDARDIZATION  
  3.10 VALUE CHAIN ANALYSIS  
      3.10.1 VALUE CHAIN ANALYSIS BASED ON INDUSTRY SEGMENTS  
      3.10.2 VALUE CHAIN ANALYSIS BASED ON 3D IC DESIGN FLOW  
  
4 3D IC MARKET CLASSIFICATION  
  4.1 CLASSIFICATION OF 3D IC MARKET BY TECHNOLOGY  
      4.1.1 3D IC MARKET SEGMENTATION BY SUBSTRATE  
            4.1.1.1 Silicon on Insulator (SOI)  
            4.1.1.2 Bulk silicon  
      4.1.2 3D IC MARKET SEGMENTATION BY BONDING TECHNIQUE  
            4.1.2.1 Die to Die  
            4.1.2.2 Die to wafer  
            4.1.2.3 Wafer to wafer  
            4.1.2.4 Direct bonding  
            4.1.2.5 Adhesive bonding  
            4.1.2.6 Metallic bonding  
      4.1.3 3D IC & TSV INTERCONNECTS MARKET SEGMENTATION BY PROCESS REALIZATION  
            4.1.3.1 Via first  
            4.1.3.2 Via middle  
            4.1.3.3 Via last  
  4.2 3D IC MARKET SEGMENTATION BY FABRICATION TECHNOLOGY  
      4.2.1 BEAM RECRYSTALLIZATION  
            4.2.1.1 Restraint  
                    4.2.1.1.1 Need for high temperature  
      4.2.2 WAFER BONDING  
            4.2.2.1 Drivers  
                    4.2.2.1.1 Identical electrical properties  
                    4.2.2.1.2 Reduced complexity  
      4.2.3 SILICON EPITAXIAL GROWTH  
            4.2.3.1 Restraint  
                    4.2.3.1.1 Degradation in quality  
      4.2.4 SOLID PHASE CRYSTALLIZATION  
            4.2.4.1 Drivers  
                    4.2.4.1.1 Compatibility with conventional processing environments  
                    4.2.4.1.2 Absence of thermal issues  
  
5 PRODUCT MARKET  
  5.1 MEMORIES  
  5.2 LIGHT EMITTING DIODES  
  5.3 SENSORS  
  5.4 POWER AND ANALOG COMPONENTS  
  5.5 MICROELECTROMECHNICAL SYSTEMS (MEMS)  
  5.6 OTHERS  
  5.7 FUTURE APPLICATIONS  
  
6 APPLICATION MARKET  
  6.1 CONSUMER ELECTRONICS SECTOR  
      6.1.1 MOBILE DEVICES  
      6.1.2 PROCESSORS IN COMPUTERS AND LAPTOPS  
  6.2 INFORMATION AND COMMUNICATION TECHNOLOGY SECTOR  
      6.2.1 COMMUNICATIONS  
      6.2.2 INFORMATION TECHNOLOGY & NETWORKING  
  6.3 AUTOMOTIVE SECTOR  
      6.3.1 AUTOMOTIVE SENSORS  
      6.3.2 AUTOMOTIVE BODY ELECTRONICS  
  6.4 MILITARY, AEROSPACE AND DEFENSE  
  6.5 OTHER SECTORS  
  
7 GEOGRAPHIC ANALYSIS  
  7.1 NORTH AMERICA  
  7.2 EUROPE  
  7.3 ASIA  
  7.4 REST OF THE WORLD  
  
8 COMPETITIVE LANDSCAPE  
  8.1 OVERVIEW  
  8.2 MARKET PLAYERS AND MARKET REVENUE ANALYSIS  
  8.3 3D IC AND TSV INTERCONNECT MARKET ANALYSIS  
  8.4 COLLABORATIONS, PARTNERSHIPS, JOINT VENTURES AND AGREEMENTS  
  8.5 MERGERS & ACQUISITIONS  
  8.6 NEW PRODUCT DEVELOPMENT  
  
9 COMPANY PROFILES  
  9.1 AMKOR TECHNOLOGY  
      9.1.1 OVERVIEW  
      9.1.2 PRODUCTS & SERVICES  
      9.1.3 FINANCIALS  
      9.1.4 STRATEGY  
      9.1.5 DEVELOPMENTS  
  9.2 ELPIDA MEMORY INC  
      9.2.1 OVERVIEW  
      9.2.2 PRODUCTS & SERVICES  
      9.2.3 FINANCIALS  
      9.2.4 STRATEGY  
      9.2.5 DEVELOPMENTS  
  9.3 IBM CORP  
      9.3.1 OVERVIEW  
      9.3.2 PRODUCTS & SERVICES  
      9.3.3 FINANCIALS  
      9.3.4 STRATEGY  
      9.3.5 DEVELOPMENTS  
  9.4 INTEL CORPORATION  
      9.4.1 OVERVIEW  
      9.4.2 PRODUCTS & SERVICES  
      9.4.3 FINANCIALS  
      9.4.4 STRATEGY  
      9.4.5 DEVELOPMENTS  
  9.5 MICRON TECHNOLOGY INC  
      9.5.1 OVERVIEW  
      9.5.2 PRODUCTS & SERVICES  
      9.5.3 FINANCIALS  
      9.5.4 STRATEGY  
      9.5.5 DEVELOPMENTS  
  9.6 MONOLITHIC 3D INC  
      9.6.1 OVERVIEW  
      9.6.2 PRODUCTS & SERVICES  
      9.6.3 FINANCIALS  
      9.6.4 STRATEGY  
      9.6.5 DEVELOPMENTS  
  9.7 NEC ELECTRONICS CORPORATION  
      9.7.1 OVERVIEW  
      9.7.2 PRODUCTS & SERVICES  
      9.7.3 FINANCIALS  
      9.7.4 STRATEGY  
      9.7.5 DEVELOPMENTS  
  9.8 QUALCOMM INCORPORATED  
      9.8.1 OVERVIEW  
      9.8.2 PRODUCTS & SERVICES  
      9.8.3 FINANCIALS  
      9.8.4 STRATEGY  
      9.8.5 DEVELOPMENTS  
  9.9 RENESAS ELECTRONICS CORPORATION  
      9.9.1 OVERVIEW  
      9.9.2 PRODUCTS & SERVICES  
      9.9.3 FINANCIALS  
      9.9.4 STRATEGY  
      9.9.5 DEVELOPMENTS  
  9.10 SAMSUNG ELECTRONICS CO LTD  
      9.10.1 OVERVIEW  
      9.10.2 PRODUCTS & SERVICES  
      9.10.3 FINANCIALS  
      9.10.4 STRATEGY  
      9.10.5 DEVELOPMENTS  
  9.11 SONY  
      9.11.1 OVERVIEW  
      9.11.2 PRODUCTS & SERVICES  
      9.11.3 FINANCIALS  
      9.11.4 STRATEGY  
      9.11.5 DEVELOPMENTS  
 9.12 STATSCHIP PAC  
      9.12.1 OVERVIEW  
      9.12.2 PRODUCTS & SERVICES  
      9.12.3 FINANCIALS  
      9.12.4 STRATEGY  
      9.12.5 DEVELOPMENTS  
  9.13 ST MICROELECTRONICS  
      9.13.1 OVERVIEW  
      9.13.2 PRODUCTS & SERVICES  
      9.13.3 FINANCIALS  
      9.13.4 STRATEGY  
      9.13.5 DEVELOPMENTS  
  9.14 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED  
      9.14.1 OVERVIEW  
      9.14.2 PRODUCTS & SERVICES  
      9.14.3 FINANCIALS  
      9.14.4 STRATEGY  
      9.14.5 DEVELOPMENTS  
  9.15 TEXAS INSTRUMENTS INCORPORATED  
      9.15.1 OVERVIEW  
      9.15.2 PRODUCTS & SERVICES  
      9.15.3 FINANCIALS  
      9.15.4 STRATEGY  
      9.15.5 DEVELOPMENTS  
  9.16 TEZZARON SEMICONDUCTOR  
      9.16.1 OVERVIEW  
      9.16.2 PRODUCTS & SERVICES  
      9.16.3 FINANCIALS  
      9.16.4 STRATEGY  
      9.16.5 DEVELOPMENTS  
  9.17 TOSHIBA CORPORATION  
      9.17.1 OVERVIEW  
      9.17.2 PRODUCTS & SERVICES  
      9.17.3 FINANCIALS  
      9.17.4 STRATEGY  
      9.17.5 DEVELOPMENTS  
  9.18 UNITED MICROELECTRONICS CORPORATION  
      9.18.1 OVERVIEW  
      9.18.2 PRODUCTS & SERVICES  
      9.18.3 FINANCIALS  
      9.18.4 STRATEGY  
      9.18.5 DEVELOPMENTS  
  9.19 XILINX INCORPORATED  
      9.19.1 OVERVIEW  
      9.19.2 PRODUCTS & SERVICES  
      9.19.3 FINANCIALS  
      9.19.4 STRATEGY  
      9.19.5 DEVELOPMENTS  
  9.20 ZIPTRONIX, INC  
      9.20.1 OVERVIEW  
      9.20.2 PRODUCTS & SERVICES  
      9.20.3 FINANCIALS  
      9.20.4 STRATEGY  
      9.20.5 DEVELOPMENTS  
  
  
LIST OF TABLES  
  
TABLE 1 3D IC MARKET REVENUE, BY GEOGRAPHY, 2009 – 2016 ($BILLION)  
TABLE 2 GLOBAL 3D IC MARKET REVENUE, BY PRODUCTS, 2009 – 2016 ($BILLION)  
TABLE 3 GLOBAL 3D IC MARKET, BY APPLICATIONS, 2009 – 2016 ($BILLION)  
TABLE 4 GLOBAL 3D IC MARKET REVENUE ($BILLION) & VOLUME (BILLION UNITS), 2009 - 2016  
TABLE 5 IC IP MARKET REVENUE, BY SEGMENT, 2012 – 2017 ($MILLION)  
TABLE 6 IC IP MARKET VOLUME, BY SEGMENT 2012 – 2017 (MILLION UNITS)  
TABLE 7 GLOBAL IC IP MARKET REVENUE, BY APPLICATION 2012 – 2017 ($MILLION)  
TABLE 8 GLOBAL IC IP MARKET REVENUE, BY GEOGRAPHY, 2012 – 2017 ($MILLION)  
TABLE 9 3D IC MARKET REVENUE, BY GEOGRAPHY, 2009 – 2016 ($BILLION)  
TABLE 10 GLOBAL 3D IC MARKET REVENUE, BY PRODUCT TYPES, 2009 – 2016 ($BILLION)  
TABLE 11 GLOBAL 3D IC MARKET, BY APPLICATION SECTORS, 2009 – 2016 ($BILLION)  
TABLE 12 GLOBAL SOI WAFERS MARKET, BY TYPE, 2008 – 2015 ($MILLION)  
TABLE 13 GLOBAL THICK FILM SOI WAFERS MARKET REVENUE, BY PRODUCT, 2008 – 2015 ($MILLION)  
TABLE 14 GLOBAL THIN FILM SOI WAFERS MARKET REVENUE, BY APPLICATIONS, 2008 – 2015 ($MILLION)  
TABLE 15 COMPARATIVE STUDY OF BONDING TECHNIQUES  
TABLE 16 VIA FIRST APPROACH – ADVANTAGES & DISADVANTAGES  
TABLE 17 3D IC MARKET REVENUE FOR MEMORIES, BY GEOGRAPHY, 2009 – 2016 ($BILLION)  
TABLE 18 GLOBAL LED CHIPS MARKET, BY APPLICATIONS, 2007 – 2014 ($MILLION)  
TABLE 19 3D IC MARKET REVENUE FOR LEDS, BY GEOGRAPHY, 2009 – 2016 ($BILLION)  
TABLE 20 GLOBAL SENSORS MARKET FOR CONSUMER ELECTRONICS, BY SENSOR TYPES, 2008 – 2015 ($MILLION)  
TABLE 21 AUTOMOTIVE SENSOR MARKET REVENUE, BY APPLICATIONS, 2010 – 2016 ($BILLION)  
TABLE 22 3D IC MARKET REVENUE FOR SENSORS, BY GEOGRAPHY, 2009 – 2016 ($BILLION)  
TABLE 23 3D IC MARKET REVENUE FOR POWER AND ANALOG COMPONENTS, BY GEOGRAPHY, 2009 – 2016 ($BILLION)  
TABLE 24 3D IC MARKET REVENUE FOR MEMS, BY GEOGRAPHY, 2009 – 2016 ($BILLION)  
TABLE 25 3D IC MARKET FOR OTHER PRODUCTS, BY GEOGRAPHY, 2009 – 2016 ($BILLION)  
TABLE 26 FUTURE POTENTIAL APPLICATIONS FOR 3D ICS  
TABLE 27 GLOBAL MOBILE HANDSET MARKET REVENUE, BY TYPES, 2008 – 2015 ($MILLION)  
TABLE 28 GLOBAL SENSORS MARKET, BY APPLICATIONS UNDER CONSUMER ELECTRONICS SECTOR, 2008 – 2015 ($MILLION)  
TABLE 29 3D IC MARKET REVENUE IN CONSUMER ELECTRONICS SECTOR, BY GEOGRAPHY, 2009 – 2016 ($BILLION)  
TABLE 30 3D IC MARKET REVENUE IN INFORMATION AND COMMUNICATION TECHNOLOGIES SECTOR, BY GEOGRAPHY, 2009 – 2016 ($BILLION)  
TABLE 31 3D IC MARKET REVENUE IN AUTOMOTIVE SECTOR, BY GEOGRAPHY, 2009 – 2016 ($BILLION)  
TABLE 32 GLOBAL AUTOMOTIVE SENSORS MARKET REVENUE, BY PRODUCT TYPES, 2010 – 2016 ($BILLION)  
TABLE 33 3D IC MARKET REVENUE IN MILITARY, AEROSPACE & DEFENSE SECTOR, BY GEOGRAPHY, 2009 – 2016 ($BILLION)  
TABLE 34 3D IC MARKET REVENUE IN OTHER APPLICATION SECTORS, BY GEOGRAPHY, 2009 – 2016 ($BILLION)  
TABLE 35 NORTH AMERICA: 3D IC MARKET REVENUE, BY PRODUCTS, 2009 – 2016 ($BILLION)  
TABLE 36 NORTH AMERICA: 3D IC MARKET REVENUE, BY APPLICATIONS, 2009 – 2016 ($BILLION)  
TABLE 37 EUROPE: 3D IC MARKET REVENUE, BY PRODUCTS, 2009 – 2016 ($BILLION)  
TABLE 38 EUROPE: 3D IC MARKET, BY APPLICATIONS, 2009 – 2016 ($BILLION)  
TABLE 39 ASIA: 3D IC MARKET REVENUE, BY PRODUCTS, 2009 – 2016 ($BILLION)  
TABLE 40 ASIAN 3D IC MARKET REVENUE, BY APPLICATIONS, 2009 – 2016 ($BILLION)  
TABLE 41 REST OF THE WORLD: 3D IC MARKET REVENUE, BY PRODUCTS, 2009 – 2016 ($BILLION)  
TABLE 42 REST OF THE WORLD 3D IC MARKET, BY APPLICATIONS, 2009 – 2016 ($BILLION)  
TABLE 43 3D IC AND TSV INTERCONNECT MARKET – KEY PLAYER REVENUE ($BILLION)  
TABLE 44 3D IC AND TSV INTECONNECT MARKET – KEY PLAYERS’ REVENUE ANALYSIS, 2011 ($BILLION)  
TABLE 45 COLABORATIONS/PARTNERSHIPS/AGREEMENTS/JOINT VENTURES, 2009 – 2011  
TABLE 46 MERGERS AND ACQUISITIONS, 2009 - 2011  
TABLE 47 NEW PRODUCTS, 2009 - 2011  
TABLE 48 AMKOR TECHNOLOGY - FINANCIALS, 2010 - 2011 ($MILLION)  
TABLE 49 ELPIDA MEMORY INC. FINANCIALS, 2009 - 2010 ($MILLION)  
TABLE 50 IBM - FINANCIALS, 2010 - 2011 ($MILLION)  
TABLE 51 INTEL CORPORATION: MARKET REVENUE, 2009 – 2010 ($MILLION)  
TABLE 52 INTEL CORPORATION: MARKET REVENUE, BY SEGMENT, 2011 ($BILLION)  
TABLE 53 MICRON TECHNOLOGY – FINANCIALS, 2010 - 2011 ($MILLION)  
TABLE 54 MICRON TECHNOLOGY - NET SALES FROM DIFFERENT PRODUCT CATEGORIES, 2010 - 2011 ($MILLION)  
TABLE 55 NEC CORPORATION: MARKET REVENUE, 2010-2011 ($MILLION)  
TABLE 56 NEC CORPORATION: MARKET REVENUE, BY SEGMENT, 2011 ($BILLION)  
TABLE 57 QUALCOMM INC: MARKET REVENUE, BY SEGMENTS, 2010 – 2011 ($MILLION)  
TABLE 58 RENESAS ELECTRONICS: MARKET REVENUE, BY SEGMENTS, 2011 ($MILLION)  
TABLE 59 SAMSUNG ELECTRONICS: MARKET REVENUE, 2009-2010 ($MILLION)  
TABLE 60 SONY: MARKET REVENUE, 2010-2011 ($BILLION)  
TABLE 61 SONY: PROPORTION OF SALES BY BUSINESS SEGMENT, 2011  
TABLE 62 STATSCHIPPAC LTD: MARKET REVENUE, 2010-2011 ($MILLION)  
TABLE 63 STMICROELECTRONICS: MARKET REVENUE, BY SEGMENT, 2009 – 2010 ($MILLION)  
TABLE 64 STMICROELECTRONICS: MARKET REVENUE, BY GEOGRAPHY, 2009 – 2010 ($MILLION)  
TABLE 65 TSMC: MARKET REVENUE, BY SEGMENTS (UNCONSOLIDATED), 2009 – 2010 ($THOUSANDS)  
TABLE 66 TEXAS INSTRUMENTS: MARKET REVENUE, BY SEGMENTS, 2009 – 2010 ($MILLION)  
TABLE 67 TOSHIBA: MARKET REVENUE, 2010 – 2011 ($BILLION)  
TABLE 68 UMC: MARKET REVENUE, 2010 – 2011 ($MILLION)  
TABLE 69 XILINX: MARKET REVENUE, 2010 – 2011 ($THOUSANDS)  
TABLE 70 XILINX: % OF TOTAL NET REVENUES, BY END MARKETS, 2010 – 2011  
  
  
LIST OF FIGURES  
  
FIGURE 1 3D IC AND TSV INTERCONNECT MARKET SEGMENTATION  
FIGURE 2 IC IP MARKET REVENUE ($MILLION) & VOLUME (MILLION UNITS), 2011 – 2016  
FIGURE 3 HISTORY AND EVOLUTION OF 3D IC AND TSV INTERCONNECT  
FIGURE 4 ALLIED INDUSTRY SEGMENTS TO 3D IC & TSV INTERCONNECT MARKETS – MARKET SHARE ANALYSIS  
FIGURE 5 FABLESS IC VENDORS – MARKET SHARE ANALYSIS  
FIGURE 6 3D ICS AND TSV INTERCONNECTS MARKET DRIVERS – IMPACT ASSESSMENT  
FIGURE 7 3D ICS AND TSV INTERCONNECTS MARKET RESTRAINTS – IMPACT ASSESSMENT  
FIGURE 8 3D ICS AND TSV INTERCONNECTS MARKET OPPORTUNITIES – IMPACT ASSESSMENT  
FIGURE 9 3D IC – STANDARDS AND ORGANIZATIONS  
FIGURE 10 VALUE CHAIN ANALYSIS BASED ON INDUSTRY SEGMENTS  
FIGURE 11 VALUE CHAIN ANALYSIS BASED ON 3D IC DESIGN FLOW  
FIGURE 12 2D VS 3D TECHNOLOGIES FOR FLASH MEMORIES – COST ANALYSIS  
FIGURE 13 MARKET ASSESSMENT CHART FOR LED DRIVER ICS  
FIGURE 14 3D IC AND TSV INTERCONNECT MARKET – FUTURE POTENTIAL APPLICATIONS  

In electronics, a three-dimensional integrated circuit (3D IC, 3D-IC, or 3-D IC) is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit. The semiconductor industry is pursuing this promising technology in many different forms, but it is not yet widely used; consequently, the definition is still somewhat fluid.

A 3D package (System in Package, Chip Stack MCM, etc.) contains two or more chips (integrated circuits) stacked vertically so that they occupy less space and/or have greater connectivity. An alternate type of 3D package can be found in IBM's Silicon Carrier Packaging Technology, where ICs are not stacked but a carrier substrate containing TSVs is used to connect multiple ICs together in a package. In most 3D packages, the stacked chips are wired together along their edges; this edge wiring slightly increases the length and width of the package and usually requires an extra “interposer” layer between the chips. In some new 3D packages, through-silicon vias replace edge wiring by creating vertical connections through the body of the chips. The resulting package has no added length or width. Because no interposer is required, a TSV 3D package can also be flatter than an edge-wired 3D package. This TSV technique is sometimes also referred to as TSS (Through-Silicon Stacking or Thru-Silicon Stacking).

The industry players present along the supply chain are involved in initiatives to strike a balance between time-to-market expedition, cost reduction and optimization by using different equipments and materials and by adopting to different product standardization and commercialization methods. Consumer electronics, information and communication technology, military, aerospace and defense, automotive are among the major application areas for 3D ICs and TSV interconnects. Some of the key players involved in the design, development and supply of solutions based on 3D ICs and TSV interconnects include Taiwan Semiconductor Manufacturing Company Limited (Taiwan), Samsung (Korea), Xilinx (USA),  STMicroelectronics (Switzerland) and many more.

3D IC and TSV Interconnect Market Forecast (2011 - 2016)

3D IC Market, 3D chip Market, TSV Interconnect Market
Source: MarketsandMarkets Analysis

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