KEY TAKE AWAYS

• To define and classify the global 3D IC Market with in-detail segmentation.
• To measure the global 3D IC Market and its various sub-segments, technologies, fabrication methods and applications.
• To get a clear picture of the future of the 3D IC technology from both, in a technical and market-oriented perspective.
• To identify the major driving factors and inhibitors for the global 3D IC market.
• To analyze the trends and forecasts of the 3D IC market and its individual segments.
• To measure the global consumption of 3D ICs market in several end user verticals.
• To identify the major stakeholders in the market and draw a competitive landscape for the market leaders.
• To analyze the trends and forecasts of the 3D IC market specific to various geographical regions across the globe.

Report description

The advances in semiconductor technology brought in the demand for faster and energy efficient interconnects in the ICs to be used in semiconductor devices. Usually, for ICs, interconnects face the challenge to meet up the demands for speed for data transfer. In addition, a marginal increase in speed is coupled with a significant increase in the energy requirements. To meet the extended demands, 3D ICs was proposed as a solution. Several companies in the IC interconnect market are entering the race to conduct extensive research in 3D IC technology, to improve the performance and reliability. Though the researches are trying to deal with several challenges in-front of this new technology, the promising features of 3D ICs are bound to make 3D IC technology, a mainstream technology in the next five to ten years. Though their application in 2009 is limited to only some memory chips and semiconductor technologies, but the companies have plans to implement this technology to more complex products, for example by 2014, the 3D ICs are planned to be integrated in vertical devices on CMOS technology. Also considering the huge investments being made, the market will surely hold tremendous potential for the early movers but huge investment for R&D is a compulsion to succeed in this market.

MARKETS COVERED

Global 3D IC Market and TSV Interconnect Market (2011 - 2016) research report analyzes in detail the important types of 3D IC structures. We have also included in-depth research on the 3D IC technologies and 3D IC fabrication technologies like Beam Re-crystallization, Process Wafer Bonding, Silicon Epitaxial growth and Solid Phase Crystallization. This report also discusses the reliability issues of 3D ICs like thermal stability, EMI issues, etc and the advantages that 3D ICs induces in interconnect design and performance. The applications of 3D ICs like CMOS Image sensors, 3D stacked memory, and multi-core processors with cache memory, Multi-level 3D IC and Vertical device on CMOS have been included and analyzed in this report. We have done an in-depth geographic analysis for each of the markets and their sub-segments, covering the major regional markets.

TABLE OF CONTENTS

1 Introduction
  1.1 Key Take-Away
  1.2 Report Description
  1.3 Markets Covered
  1.4 Stakeholders
  1.5 Research Methodology
      1.5.1 Market Size
      1.5.2 Key Data Points Taken from Secondary Sources
      1.5.3 Key Data Points Taken from Primary Sources
      1.5.4 Assumptions Made for This Report
      1.5.5 List Of Companies Covered During Primaries

2 Executive Summary

3 Market Overview
  3.1 Introduction
  3.2 Global 3-Dimensional Integrated Circuit (3D IC) Market
  3.3 Global TSV Interconnect Market
  3.4 History and its evolution
  3.5 Allied Industry Segments to 3D IC
      3.5.1 EDA Overview
      3.5.2 Foundry Market Overview
      3.5.3 Fabless Industry Overview
      3.5.4 IDM Market Overview
      3.5.5 Wafer Level Packaging (WLP) Market Overview
  3.6 Components of an 3D IC
      3.6.1 Heterogeneous 3D IC
      3.6.2 Stacked 2D Simple ICs
      3.6.3 Physical Design and Synthesis
  3.7 General 3D IC Block Diagram
  3.8 TSV Interconnect Electronic Circuit Diagram
  3.9 3D IC Intellectual Property
  3.10 3D IC Technological Road Map
      3.10.1 Overall roadmap and by application (MEMS, CMOS, image sensors, logic, analog and memory)
      3.10.2 Future of 3D IC and TSV Interconnect Technology
      3.10.3 Stacked Silicon Interconnect Technology (SSIT)
      3.10.4 Special Sectors (sample)
            3.10.4.1 CMOS Image Sensors
            3.10.4.2 Flash Memories
            3.10.4.3 Logic SiPs
            3.10.4.4 MEMS Sector
            3.10.4.5 RF-SiPs
            3.10.4.6 SRAM and DRAMs
  3.11 Market Dynamics
      3.11.1 Drivers (sample)
            3.11.1.1 Reduction in Timing
            3.11.1.2 Improved Energy Performance
            3.11.1.3 Form Factor Motivation
            3.11.1.4 Cost Motivation
            3.11.2 Restraints (sample)
            3.11.2.1 Thermal Issues
                     3.11.2.1.1 Causes of thermal issues
                     3.11.2.1.2 Solutions to counter the thermal issues
            3.11.2.2 Electromagnetic Interference Effect Issues
                     3.11.2.2.1 EMI Effect Causes
                     3.11.2.2.2 Solutions to counter EMI Effect Issues
            3.11.2.3 Reliability Issues
                     3.11.2.3.1 Electro-Thermal Effect
                     3.11.2.3.2 Thermo-Mechanical Effect
      3.11.3 Opportunities (sample)
            3.11.3.1 Need for advanced architectures in Electronic Products
            3.11.3.2 Need for faster communication speeds in ICT Sector
      3.11.4 Challenges (sample)
            3.11.4.1 Supply Chain Challenges
            3.11.4.2 I/O Interface Standardizations
            3.11.4.3 Thermal Management
  3.12 Market Share Analysis
      3.12.1 EDA Vendors
      3.12.2 Foundry Market Vendors
      3.12.3 Fabless Vendors
      3.12.4 IDM Vendors
  3.13 Value Chain Analysis
      3.13.1 Value Chain Analysis based on Industry Segments
      3.13.2 Value Chain Analysis based on 3D IC Design Phase
  3.14 Burning Issues
  3.15 Winning Imperatives
  3.16 Patent Analysis

4 3D IC Market Classification
  4.1 3D IC Market Classification by Technology
      4.1.1 3D IC Market Segmentation by Substrate
            4.1.1.1 Silicon on Insulator (SOI) – 3D IC
            4.1.1.2 Bulk Si – 3D IC
      4.1.2 3D IC Market Segmentation by Bonding Technique
            4.1.2.1  Die to Die – 3D IC
            4.1.2.2  Die to Wafer – 3D IC
            4.1.2.3  Wafer to Wafer – 3D IC
            4.1.2.4  Substrate Thinned – 3D IC
            4.1.2.5  Face to Face – 3D IC
            4.1.2.6  Face to Back – 3D IC
            4.1.2.7  Direct Bonding – 3D IC
            4.1.2.8  Glue Bonding – 3D  IC
            4.1.2.9  Metallic Bonding – 3D IC
      4.1.3 3D IC & TSV Interconnects Market Segmentation by Process Realization
            4.1.3.1 Via First
            4.1.3.2 Via Middle
            4.1.3.3 Via Last
            4.1.3.4 Via After Bonding
  4.2 3D IC Market Classification by Fabrication Technology
      4.2.1 Beam Re-Crystallization
      4.2.2 Wafer-Bonding
      4.2.3 Silicon Epitaxial Growth
      4.2.4 Solid Phase Crystallization
  4.3 3D IC Market Classification by Circuit Design & Architecture
      4.3.1 Buffer Insertion  – 3D IC
      4.3.2 Critical Path Layouts – 3D IC
      4.3.3 Microprocessor Design – 3D IC
      4.3.4 Mixed Signal – 3D ICs

5 3D IC and TSV Market by Applications
  5.1 Present Applications
      5.1.1 CMOS Camera Modules
      5.1.2 Ultra-Thin Smart Phones
      5.1.3 CMOS Image Sensors
      5.1.4 DDR3 Modules
      5.1.5 Memory I/O Interfaces
      5.1.6 Stacked NAND Flash Chips
      5.1.7 DRAM Memory Chips
      5.1.8 Silicon LED Modules
      5.1.9 DRAM Logic ICs
      5.1.10 Silicon Interposers
      5.1.11 MEMS Oscillators
      5.1.12 Filters and Power Amplifiers
      5.1.13 MEMS Accelerometers
      5.1.14 Fingerprint Sensors
      5.1.15 Solar Industry Components
  5.2 Future Applications
      5.2.1 Logic + Memory 3D Integration
      5.2.2 DDR SDRAM 3D Stacks

6 Geographic Analysis
  6.1 Global Market Perspective
  6.2 North America
  6.3 Japan
  6.4 Europe
  6.5 APAC (Excluding Japan)
  6.6 ROW

7 Competitive Landscape
  7.1 Market Growth Strategies
  7.2 Recent Industry Activities
      7.2.1 Technological Developments
      7.2.2 New Product Development & Announcements
      7.2.3 Mergers and Acquisitions
      7.2.4 Agreements, Partnerships and Collaborations

8 Company Profiles
  8.1  3D-Plus
  8.2  Allvia
  8.3  Amkor
  8.4  ASE
  8.5  ASET
  8.6  DALSA  Semiconductor
  8.7  Elpida Memory
  8.8  EPworks
  8.9 Freescale Semiconductor
  8.10 Hymite
  8.11 Hynix Semiconductor
  8.12 IBM
  8.13 IMEC
  8.14 Intel
  8.15 Irvine Sensors
  8.16 KTH
  8.17 Leti
  8.18 MagnaChip
  8.19 Micron
  8.20 Nanya
  8.21 NEC Electronics
  8.22 Northrop Gruman Corporation
  8.23 NXP Semiconductor
  8.24 OKI Electric
  8.25 Optopac Inc
  8.26 Qimonda
  8.27 Renesas
  8.28 RPI
  8.29 Samsung
  8.30 Sanyo
  8.31 Schott
  8.32 Sharp
  8.33 Silex Microsystems
  8.34 Sony
  8.35 Spansion
  8.36 STATS ChipPAC
  8.37 ST Microelectronics
  8.38 Tessera
  8.39 Tezzaron
  8.40 Toshiba Corporation
  8.41 Tracit Technologies
  8.42 TSMC
  8.43 VTI
  8.44 Xintec
  8.45 Ziptronix
  8.46 Zycube

9 Appendix
  9.1 U.S Patents
  9.2 Europe Patents
  9.3 Asia Patents