Semiconductor Manufacturing Equipment Market

Semiconductor Manufacturing Equipment Market by Front-end Equipment (Lithography, Wafer Surface Conditioning, Cleaning Processes), Backend Equipment (Assembly & Packaging, Dicing, Bonding, Metrology), Fab Facility, and Geography - Global Forecast to 2023

Report Code: SE 5344 Jun, 2017, by marketsandmarkets.com

The overall semiconductor manufacturing equipment market is expected to grow from USD 39.07 billion in 2016 to USD 62.56 billion by 2023, at a CAGR of 6.86% from 2017 to 2023. Semiconductor manufacturing devices are used to produce complex semiconductor devices. The semiconductor production equipment mainly consists of two types: front-end and back-end process equipment. The front-end equipment comprises advanced technology and integration, which require heavy investment. Though expensive, front-end equipment is profitable and adds more value to the final product. Thus, frontend equipment holds a major share in the market compared with back-end equipment. The base year considered for the study is 2016, and the forecast has been provided for the period between 2017 and 2023.

Market Dynamics

Drivers

  • Progress in research and development facilities
  • Increasing demand for electric and hybrid vehicles
  • Growing consumer electronics market and increasing in the number of foundries

Restraints

  • High cost and maintenance of the equipment
  • Complexity of pattern and functional defects in manufacturing process

Opportunities

  • Rise in demand for silicon-based sensors in IoT
  • Expanding chip inductry in China
  • Growing number of data centers and servers

Challenges

  • Technical problems faced during fabrication process
  • Increased complexity related to miniaturized structures of circuit

Progress in research and development facilities

Semiconductor manufacturers are the key consumers of semiconductor equipment manufacturers. The constant developments and upgradations in electronic devices and changes in the chip designs and sizes make it necessary for semiconductor equipment manufacturers to maintain proper R&D facilities and carry out intense research for equipment upgradations to fulfill the demands of semiconductor industries. Thus, semiconductor manufacturing equipment companies assign substantial portions of their financial incomes to R&D to meet customer needs for advanced equipment.

In addition, the government programs to boost growth in the chip industry include tax incentives, R&D cost sharing, and land facilities in the main Taiwan industrial parks, as investors have enabled Taiwan to be one of the global leaders in the semiconductor manufacturing field. Research institutes carry out shared R&D with industries. For instance, Industrial Technology Research Institute (ITRI) received 55% of the funding from Taiwan Ministry of Economic Affairs (MOEA) for the integration and advancement of precision machinery.

The following are the major objectives of the study.

  • To define, describe, and forecast the semiconductor manufacturing equipment market on the basis of front-end equipment, back-end equipment, fab facility equipment, dimension, and geography
  • To forecast the market size of various segments with regard to 3 main regions: North America, Europe, and Asia Pacific
  • To provide detailed information regarding the major factors influencing the growth of the market (drivers, restraints, opportunities, and industry-specific challenges)
  • To analyze the value chain and market roadmaps to study the evolution  
  • To strategically analyze the micromarkets with regard to individual growth trends, prospects, and contributions to the total market
  • To analyze the opportunities in the market for stakeholders by identifying high-growth segments in the semiconductor manufacturing equipment market
  • To strategically profile key players, comprehensively analyze their market share and core competencies, and detail the competitive landscape of the market
  • To analyze competitive developments such as joint ventures, mergers and acquisitions, product launches and developments, business expansions, and research and development (R&D) activities in the semiconductor manufacturing equipment market

During this research study, major players operating in the semiconductor manufacturing equipment market in various regions have been identified, and their offerings, regional presence, and distribution channels have been analyzed through in-depth discussions. Top-down and bottom-up approaches have been used to determine the overall market size. Sizes of the other individual markets have been estimated using the percentage splits obtained through secondary sources such as Hoovers, Bloomberg BusinessWeek, and Factiva, along with primary respondents. The entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews with industry experts such as CEOs, VPs, directors, and marketing executives for key insights (both qualitative and quantitative) pertaining to the market. The figure below shows the breakdown of the primaries on the basis of the company type, designation, and region considered during the research study.

Semiconductor Manufacturing Equipment Market

To know about the assumptions considered for the study, download the pdf brochure

The semiconductor manufacturing equipment market comprises key manufacturers such as Tokyo Electron Limited (Japan), LAM RESEARCH Corporation (US), ASML Holdings N.V.  (Netherlands), Applied Materials Inc. (US); and raw material suppliers such as AlsilMaterial (US), Atecom Technology Co., Ltd (Taiwan); end users such as Qualcomm Technologies, Inc. (US), Micron Technology Inc. (US), Intel Corporation (US), and Samsung Group (South Korea); and suppliers such as KLA-Tencor Corporation (US), Screen Holdings Co., Ltd (Japan), Teradyne Inc. (US).

Major Market Developments

  • In November 2017, ASML Holding NV acquired all outstanding shares of Hermes Microvision, Inc. (Taiwan) in a cash transaction valued at TWD 100 billion. The combination will allow ASML to incorporate and promote their product offering at a faster pace.
  • In September 2016, Lam Research Corp. (US) added ALE capability on its Flex dielectric etch systems by extending its atomic layer etching (ALE) portfolio. The new technology helped manufacture high-volume logic devices and is expected to solve the vital challenges in scaling logic devices to 10 nm and below it.
  • In July 2016, Applied Materials Inc. launched a new PROVision system, which is an addition to its next-generation e-beam inspection system that delivers the highest resolution and image quality at the fastest throughput. The newly introduced system is expected to deliver 3 times faster throughput for challenging e-beam applications.

Target Audience:

  • Semiconductor Manufacturing Equipment Manufacturers
  • Semiconductor Manufacturing Equipment Panel Technicians and Technologists
  • Research Organizations and Consulting Companies
  • Associations and Forums

Report Scope:

By Front-end Equipment

  • Lithography
  • Wafer surface conditioning equipment
  • Cleaning processes
  • Others

By Back-end Equipment

  • Assembly and packaging equipment
  • Dicing equipment
  • Bonding equipment
  • Metrology equipment
  • Test equipment

By Fab Facility:

  • Automation
  • Chemical control equipment
  • Gas control equipment
  • Others

By Dimension:

  • 2D
  • 2.5D
  • 3D

By Geography

  • North America
  • Europe
  • Asia Pacific (APAC)

Critical questions which the report answers

  • What are the major regions for semiconductor equipment manufacturers to explore?
  • Which are the key players in the market and how intense is the competition?

Available Customizations:

Based on the given market data, MarketsandMarkets offers customizations in the reports as per the client’s specific requirements. The available customization options are as follows:

Geographic Analysis

  • Detailed analysis and profiling of additional market players (up to 10)

The overall semiconductor manufacturing equipment market is expected to grow from USD 42.03 billion in 2017 to USD 62.56 billion by 2023 at a CAGR of 6.86%. Progress in research and development facilities, increasing demand for electric and hybrid vehicles, growing consumer electronics market and increasing in the number of foundries are the key factors driving the growth of semiconductor manufacturing equipment market.

The semiconductor production equipment mainly consists of two types: front-end and back-end process equipment. Front-end equipment performs various functions such as lithography, wafer surface conditioning, and cleaning process.  Whereas, Back-end equipment includes assembly and packaging equipment, dicing equipment, bonding equipment, metrology equipment, and testing equipment. In this, the front-end equipment comprises advanced technology and integration, which require heavy investment. Though expensive, front-end equipment is profitable and adds more value to the final product. Thus, frontend equipment holds a major share in the market compared with back-end equipment.

The semiconductor manufacturing equipment market has been segmented, on the basis of dimension, into 2D, 2.5D, and 3D. The market for 3D dimension is expected to grow at the highest CAGR between 2017 and 2023. This growth is attributed to the growing demand for new and more advanced electronic products with a smaller form factor, higher functionality, and high performance with a lower cost.

The semiconductor manufacturing equipment market in APAC is expected to grow at the highest CAGR during the forecast period. APAC has been a game changer for the semiconductor equipment market for the last 45 years. The growth of Silicon Valley in California from the 1970s is mainly attributed to the support it has received from the players of APAC. The development of semiconductor devices in Asian economies such as China, Japan, South Korea, and Taiwan drives the semiconductor equipment market. The semiconductor manufacturing equipment market in APAC held the largest share owing to low-cost labor in China, Taiwanese innovation and advancement in fabrication plants, and Japanese semiconductor equipment manufacturing capabilities, which are some of the cutting-edge advantages for the Asian semiconductor industry.

Semiconductor Manufacturing Equipment Market

The semiconductor manufacturing equipment market by fab facility has been segmented on the basis of automation, chemical control equipment, gas control equipment, and others.

Automation

Semiconductor wafer fabrication is perhaps the most complex of all manufacturing processes. In recent years, the importance of sustainable manufacturing is increasing. Considering this, factory automation is helpful in numerous ways, as it decreases idle time, eliminates pointless processes, waste, and inventory. Many times, customers’ demands keep changing, which causes a huge impact on manufacturing capacity and factory-floor demands, thereby producing waste. Thus, factory automation systems help resolve complexities such as minimization of waste, reduction in cost, ideal planning, and proper utilization of resources. It is a significant strategy used by equipment manufacturers to achieve viable semiconductor manufacturing.

Chemical Control Equipment

Chemical control equipment is designed for repeated and reliable delivery of chemicals during the semiconductor manufacturing processes. It is also important to consider the chemical purity factor while delivering chemicals in semiconductor manufacturing process. By specifying the purity levels of the chemicals delivered, the semiconductor manufacturing process can be significantly controlled.

Gas Control Equipment

A gas control equipment provides precise control and mixing of industrial process gases used in the semiconductor manufacturing industry. This equipment delivers gas during semiconductor manufacturing processes. Nitrogen is the most common gas in semiconductor fabrication. There are various pressure regulators that are specially designed to control the pressure of gases to be supplied during the semiconductor manufacturing processes.

Others

The other fab facility equipment includes probers and liquid control system.

The quality of semiconductor devices can be confirmed using the probing machines that perform electrical tests of each chip on a wafer. The wafer probing technologies help enhance the overall efficiency of wafer and device testing processes. Electroglas Inc. (US) is one of the suppliers of wafer probers.

The liquid control system controls the temperature of liquids that are supplied during the semiconductor fabrication process. One of the players called Laird develops custom cooling and temperature control systems for semiconductor fabrication equipment.

Critical questions the report answers:

  • Where will all these developments take the semiconductor equipment manufacturer in the mid to long term?
  • What are the major trends in semiconductor manufacturing equipment market?

Semiconductor manufacturing devices are expensive depending upon its function and for the process it is used. New companies entering this industry face the cost hurdle because R&D cost and capital requirement are high. As operations performed by tools used in front-end wafer fabrication are complex, their cost becomes high. For instance, photolithography is one of the most complex processes. In 2015, ASML Holdings (Netherlands) received an order for 15 EUV lithography systems from Intel Corporation (US), and this order was worth USD 75 million. Sometimes, it becomes difficult to maintain older parts of machines, as they are no longer produced by original equipment manufacturers (OEMs). Thus, the equipment is often used beyond its lifespan. The unavailability of parts of older systems and difficulties in the maintenance of the equipment become constraints to the semiconductor device manufacturers in high-volume production.

Key players in the market include Tokyo Electron Limited (Japan), ASML Holdings N.V.  (Netherlands), Applied Materials Inc. (US), KLA-Tencor Corporation (US), LAM RESEARCH Corporation (US), Screen Holdings Co., Ltd (Japan), Teradyne Inc. (US), Advancement Corporation (Japan), Hitachi High-Technologies Corporation (Japan), and Plasma-Therm (US). These players are increasingly undertaking mergers and acquisitions, and product launches to develop and introduce new technologies and products in the market.

To speak to our analyst for a discussion on the above findings, click Speak to Analyst

Table of Contents

1 Introduction (Page No. - 14)
    1.1 Objectives of the Study
    1.2 Market Definition
    1.3 Scope of the Study
           1.3.1 Markets Covered
           1.3.2 Years Considered for the Study
    1.4 Currency
    1.5 Package and Size
    1.6 Limitations
    1.7 Stakeholders

2 Research Methodology (Page No. - 17)
    2.1 Research Data
           2.1.1 Secondary Data
                    2.1.1.1 Key Data From Secondary Sources
           2.1.2 Primary Data
                    2.1.2.1 Key Data From Primary Sources
                    2.1.2.2 Key Industry Insights
                    2.1.2.3 Breakdown of Primaries
    2.2 Market Size Estimation
           2.2.1 Bottom-Up Approach
           2.2.2 Top-Down Approach
    2.3 Market Breakdown and Data Triangulation
    2.4 Research Assumptions

3 Executive Summary (Page No. - 25)

4 Premium Insights (Page No. - 30)
    4.1 Attractive Growth Opportunities in the Semiconductor Manufacturing Equipment Market
    4.2 Semiconductor Manufacturing Equipment Market, By Front-End
    4.3 Semiconductor Manufacturing Equipment Market in APAC
    4.4 Growth Rate of the Leading Countries in Semiconductor Manufacturing Equipment, 2016
    4.5 Semiconductor Manufacturing Equipment Market, By Dimension

5 Market Overview (Page No. - 34)
    5.1 Value Chain Analysis
    5.2 Market Dynamics
           5.2.1 Drivers
                    5.2.1.1 Progress in Research and Development Facilities
                    5.2.1.2 Increasing Demand for Electric and Hybrid Vehicles
                    5.2.1.3 Growing Consumer Electronics Market and Increase in the Number of Foundries
           5.2.2 Restraints
                    5.2.2.1 High Costs and Maintenance of the Equipment
                    5.2.2.2 Complexity of Pattern and Functional Defects in Manufacturing Process
           5.2.3 Opportunities
                    5.2.3.1 Rise in Demand for Silicon-Based Sensors in Iot
                    5.2.3.2 Expanding Chip Industry in China
                    5.2.3.3 Growing Number of Data Centers and Servers
           5.2.4 Challenges
                    5.2.4.1 Technical Problems Faced During Fabrication Process
                    5.2.4.2 Increased Complexities Related to Miniaturized Structures of Circuit

6 Semiconductor Manufacturing Market, By Front-End Equipment (Page No. - 43)
    6.1 Introduction
    6.2 Lithography
           6.2.1 DUV
           6.2.2 EUV
    6.3 Wafer Surface Conditioning Equipment
           6.3.1 Etching
           6.3.2 Chemical Mechanical Planarization
    6.4 Cleaning Process
           6.4.1 Single-Wafer Spray System
           6.4.2 Single-Wafer Cryogenic System
           6.4.3 Batch Immersion Cleaning System
           6.4.4 Batch Spray Cleaning System
           6.4.5 Scrubber
    6.5 Others
           6.5.1 CVD

7 Semiconductor Manufacturing Equipment Market, By Back-End (Page No. - 56)
    7.1 Introduction
    7.2 Back-End Processes
           7.2.1 Assembly and Packaging
                    7.2.1.1 Assembly
                    7.2.1.2 Packaging Equipment
           7.2.2 Dicing Equipment
           7.2.3 Bonding Equipment
           7.2.4 Metrology Equipment
           7.2.5 Test Equipment

8 Semiconductor Manufacturing Equipment Market, By Fab Facility (Page No. - 64)
    8.1 Introduction
    8.2 Automation
    8.3 Chemical Control Equipment
    8.4 Gas Control Equipment
    8.5 Others

9 Semiconductor Manufacturing Equipment Market, By Dimension (Page No. - 67)
    9.1 Introduction
    9.2 2D
    9.3 2.5D
    9.4 3D

10 Semiconductor Manufacturing Equipment Market, By Geography (Page No. - 71)
     10.1 Introduction
     10.2 North America
             10.2.1 US
                        10.2.1.1 Some of the Major Semiconductor Device Manufacturers Belong to the US
             10.2.2 Canada
             10.2.3 Mexico
     10.3 Europe
             10.3.1 UK
                        10.3.1.1 Effort to Increase the Growth of Semiconductor Manufacturing Equipment
             10.3.2 Italy
                        10.3.2.1 One of the Leading Countries of Europe
             10.3.3 Ireland
                        10.3.3.1 High Experience in Semiconductor Market
             10.3.4 France
                        10.3.4.1 One of the Largest Electronic Market in Europe
             10.3.5 Rest of Europe
     10.4 Asia Pacific
             10.4.1 China
                        10.4.1.1 Semiconductor Manufacturing Equipment Market for China in APAC is Expected to Grow at A High Rate
             10.4.2 Japan
                        10.4.2.1 Presence of Major Players in Japan
             10.4.3 Taiwan
                        10.4.3.1 Taiwan Being A Major Semiconductor Manufacturer Hub is Expected to Boost the Demand for Semiconductor Manufacturing Equipment
             10.4.4 South Korea
                        10.4.4.1 Second Largest Semiconductor Industry in the World
             10.4.5 Rest of APAC

11 Competitive Landscape (Page No. - 104)
     11.1 Overview
     11.2 Market Ranking Analysis for Semiconductor Manufacturing Equipment Market
     11.3 Semiconductor Manufacturing Equipment Market Dive Chart
             11.3.1 Vanguards
             11.3.2 Dynamic
             11.3.3 Innovators
             11.3.4 Emerging
             11.3.5 Micro Quadrant
                        11.3.5.1 Product Offering Parameters
                        11.3.5.2 Business Strategy Parameters
*Top 25 Companies Analyzed for This Study are -ASML Holdings N.V., Nikon, Canon, Jeol, Nuflare Technology, Ultratech, Rudolph Technology, EV Group, Screen Semiconductor Solutions Co., Ltd, Toshiba, Tokyo Ohka Kogyo Co., Ltd, Adams Lithographing , Am Lithography Corporation, Vistec Electron Beam GmbH, Qoniac GmbH, S-Cubed, Inc., Inpria, Zeiss, Mapper Lithography, Raith GmbH, Gigaphoton Inc, Energetiq Technology, Inc, Suss Microtech Ag, Nil Technology
     11.4 Competitive Situations and Trends
             11.4.1 Product Launches
             11.4.2 Contracts, Partnership, Agreements, and Collaborations
             11.4.3 Merger & Acquisition
             11.4.4 Expansions and Awards

12 Company Profile (Page No. - 115)
     12.1 Introduction
(Overview, Strength of Product Portfolio, Business Strategy Excellence, Recent Developments, Key Relationships)*
     12.2 Tokyo Electron Limited
     12.3 LAM Research Corporation
     12.4 ASML Holdings N.V.
     12.5 Applied Materials Inc.
     12.6 KLA-Tencor Corporation.
     12.7 Screen Holdings Co., Ltd.
     12.8 Teradyne Inc.
     12.9 Advantest Corporation
     12.10 Hitachi High-Technologies Corporation.
     12.11 Plasma-Therm.
     12.12 Rudolph Technologies, Inc
     12.13 Startup Ecosystem

*Details on Overview, Strength of Product Portfolio, Business Strategy Excellence, Recent Developments, Key Relationships Might Not Be Captured in Case of Unlisted Companies.

13 Appendix (Page No. - 151)
     13.1 Insights of Industry Experts
     13.2 Discussion Guide:
     13.3 Knowledge Store: Marketsandmarkets’ Subscription Portal
     13.4 Introducing RT: Real-Time Market Intelligence
     13.5 Available Customization
     13.6 Related Reports
     13.7 Author Details


List of Tables (66 Tables)

Table 1 Front-End Equipment Shipment Unit, 2014-2023
Table 2 Presence of Domestic Companies in Different Semiconductor Manufacturing Equipment
Table 3 Front-End Semiconductor Manufacturing Equipment Market, By Type, 2014–2023 (USD Billion)
Table 4 Front-End Semiconductor Manufacturing Equipment Market, By Geography 2014–2023 (USD Billion)
Table 5 Front-End Lithography Equipment Market, By Geography, 2014–2023 (USD Billion)
Table 6 Front-End Wafer Surface Conditioning Equipment Market, By Type, 2014–2023 (USD Billion)
Table 7 Front-End Wafer Conditioning Equipment Market, By Geography, 2014–2023 (USD Billion)
Table 8 Etching Wafer Conditioning Equipment Market, By Geography, 2014–2023 (USD Billion)
Table 9 CMP Wafer Conditioning Equipment Market, By Geography, 2014–2023 (USD Billion)
Table 10 Wafer Cleaning Equipment Market, By Geography, 2014–2023 (USD Billion)
Table 11 Other Wafer Processing Equipment Market, By Geography, 2014–2023 (USD Billion)
Table 12 Back-End Semiconductor Manufacturing Equipment Market, By Type, 2014–2023 (USD Billion)
Table 13 Back-End Semiconductor Manufacturing Equipment Market, By Geography, 2014–2023 (USD Billion)
Table 14 Back-End Assembly and Packaging Equipment Market, By Geography, 2014–2023 (USD Billion)
Table 15 Back-End Dicing Equipment Market, By Geography, 2014–2023 (USD Billion)
Table 16 Back-End Bonding Equipment Market, By Geography, 2014–2023 (USD Billion)
Table 17 Back-End Metrology Equipment Market, By Geography, 2014–2023 (USD Billion)
Table 18 Back-End Wafer Testing Equipment Market, By Geography, 2014–2023 (USD Billion)
Table 19 Semiconductor Manufacturing Equipment Market, By Fab Facility, 2014–2023 (USD Billion)
Table 20 Market, By Dimension, 2014–2023 (USD Billion)
Table 21 Comparison Between 2D, 2.5D, and 3D Ic Technology
Table 22 Semiconductor Manufacturing Equipment Market, By Geography 2014–2023 (USD Billion)
Table 23 North America Market, By Country, 2014–2023 (USD Billion)
Table 24 North America Market, By Type, 2014–2023 (USD Billion)
Table 25 Lithography Equipment Market in North America, By Country, 2014–2023 (USD Billion)
Table 26 Etching Equipment Market in North America, By Country, 2014–2023 (USD Billion)
Table 27 CMP Equipment Market in North America, By Country, 2014–2023 (USD Billion)
Table 28 Wafer Cleaning Equipment Market in North America, By Country, 2014–2023 (USD Billion)
Table 29 Other Wafer Processing Equipment Market in North America, By Country, 2014–2023 (USD Billion)
Table 30 Assembly and Packaging Equipment Market in North America, By Country, 2014–2023 (USD Billion)
Table 31 Dicing Equipment Market in North America, By Country, 2014–2023 (USD Billion)
Table 32 Bonding Equipment Market in North America By Country, 2014–2023 (USD Billion)
Table 33 Metrology Equipment Market in North America, By Country, 2014–2023 (USD Billion)
Table 34 Wafer Testing Equipment Market in North America, By Country, 2014–2023 (USD Billion)
Table 35 Semiconductor Manufacturing Equipment Market in North America, By Dimension, 2014–2023 (USD Billion)
Table 36 Semiconductor Manufacturing Equipment Market in Europe, By Country, 2014–2023 (USD Billion)
Table 37 Europe Market, By Type, 2014–2023 (USD Billion)
Table 38 Lithography Equipment Market in Europe, By Country, 2014–2023 (USD Billion)
Table 39 Etching Equipment Market in Europe, By Country, 2014–2023 (USD Billion)
Table 40 Europe: CMP Equipment Market in Europe, By Country, 2014–2023 (USD Billion)
Table 41 Wafer Cleaning Equipment Market in Europe, By Country, 2014–2023 (USD Billion)
Table 42 Europe: Other Wafer Processing Equipment Market in Europe, By Country, 2014–2023 (USD Billion)
Table 43 Assembly and Packaging Equipment Market in Europe, By Country, 2014–2023 (USD Billion)
Table 44 Wafer Dicing Equipment Market in Europe, By Country, 2014–2023 (USD Million)
Table 45 Bonding Equipment Market in Europe, By Country, 2014–2023 (USD Million)
Table 46 Metrology Equipment Market in Europe, By Country, 2014–2023 (USD Billion)
Table 47 Wafer Testing Equipment Market in Europe, By Country, 2014–2023 (USD Billion)
Table 48 Semiconductor Manufacturing Equipment Market in Europe, By Dimension, 2014–2023 (USD Billion)
Table 49 Semiconductor Manufacturing Equipment Market in APAC, By Country, 2014–2023 (USD Billion)
Table 50 APAC Market, By Type, 2014–2023 (USD Billion)
Table 51 Lithography Equipment Market in APAC, By Country, 2014–2023 (USD Billion)
Table 52 Etching Equipment Market in APAC, By Country, 2014–2023 (USD Billion)
Table 53 CMP Equipment Market in APAC, By Country, 2014–2023 (USD Billion)
Table 54 Wafer Cleaning Equipment Market in APAC, By Country, 2014–2023 (USD Billion)
Table 55 Other Wafer Processing Equipment Market in APAC, By Country, 2014–2023 (USD Billion)
Table 56 Assembly and Packaging Equipment Market in APAC, By Country, 2014–2023 (USD Billion)
Table 57 Wafer Dicing Equipment Market in APAC, By Country, 2014–2023 (USD Billion)
Table 58 Wafer Bonding Equipment Market in APAC, By Country, 2014–2023 (USD Billion)
Table 59 Metrology Equipment Market in APAC, By Country, 2014–2023 (USD Billion)
Table 60 Wafer Testing Equipment Market in APAC, By Country, 2014–2023 (USD Billion)
Table 61 Semiconductor Manufacturing Equipment Market in APAC, By Dimension, 2014–2023 (USD Billion)
Table 62 Ranking of Top 5 Players: Power Bank Market, 2016
Table 63 Product Launches, 2015–2017
Table 64 Contracts, Agreements, and Collaborations, 2015-2017
Table 65 Merger and Acquisition, 2015-2017
Table 66 Expansions and Awards, 2015-2017


List of Figures (50 Figures)

Figure 1 Semiconductor Manufacturing Equipment Markets Covered
Figure 2 Semiconductor Manufacturing Equipment Market Research Design
Figure 3 Market Size Estimation Methodology: Bottom-Up Approach
Figure 4 Market Size Estimation Methodology: Top-Down Approach
Figure 5 Data Triangulation
Figure 6 Assumptions of the Research Study
Figure 7 in North America 3D Segment is Expected to Grow at the Highest CAGR During the Forecast Period
Figure 8 APAC to Grow at the Highest Rate in the Semiconductor Manufacturing Equipment Market During the Forecast Period
Figure 9 Lithography Equipment to Hold Large Demand in the Semiconductor Manufacturing Equipment Market During the Forecast Period
Figure 10 Bonding Equipment is Expected to Witness the Highest Growth Between 2017 and 2023
Figure 11 APAC Held the Largest Market Share in 2016
Figure 12 Growing Consumer Electronics Market and Increase in the Number of Foundries are Driving the Market
Figure 13 Lithography Equipment is Expected to Hold the Largest Market Share for Semiconductor Manufacturing Equipment During the Forecast Period
Figure 14 Taiwan Held the Largest Share of the Semiconductor Manufacturing Equipment Market in APAC in 2016
Figure 15 APAC is Expected to Grow at A Highest CAGR During the Forecast Period
Figure 16 3D is Expected to Hold the Highest Share Between 2017 and 2023
Figure 17 Value Chain Analysis: Semiconductor Manufacturing Equipment
Figure 18 Value Chain Analysis (Front-End Manufacturing Equipment)
Figure 19 Value Chain Analysis (Back-End Manufacturing Equipment)
Figure 20 Growing Demand for Consumer Electronics and Electric-Based Automobiles are the Major Drivers for the Market
Figure 21 Increasing Sales of Electric Vehicles Between 2011 and 2014
Figure 22 Lithography Equipment Accounts for the Largest Market Share Among All Equipment Types in 2017
Figure 23 CMP Market is Expected to Grow With the Highest CAGR During the Forecast Period
Figure 24 APAC Market is Expected to Grow With the Highest CAGR During the Forecast Period
Figure 25 Semiconductor Manufacturing Equipment Market, By Geography
Figure 26 China Expected to Register the Highest Growth Rate in the Semiconductor Manufacturing Equipment Market During the Forecast Period
Figure 27 APAC Holds the Largest Semiconductor Manufacturing Equipment Market in Market in 2017
Figure 28 North America, Geographic Snapshot, 2016
Figure 29 Market in the US is Expected to Grow With the Highest CAGR During the Forecast Period
Figure 30 3D Market in North America is Expected to Grow at the Highest CAGR During the Forecast Period
Figure 31 Germany is Expected to Grow With the Highest CAGR Between 2017 and 2023
Figure 32 Germany Accounts for Largest Market in Assembly and Packaging Market in 2017
Figure 33 Among All Dimensions 3D Market in Europe is Expected to Grow at the Highest CAGR During the Forecast Period
Figure 34 APAC, Geographic Snapshot, 2016
Figure 35 Taiwan Holds Largest Market Share Among All APAC Countries in 2017
Figure 36 Taiwan Holds Largest Market for APAC Wafer Cleaning Equipment Market
Figure 37 3D Market in APAC is Expected to Grow at the Highest CAGR During the Forecast Period
Figure 38 Companies Adopted Product Launches as Key Growth Strategy Between 2014 and 2017
Figure 39 Dive Chart
Figure 40 Battle for Market Share: Product Launches Was the Key Strategy Between 2014 and 2017
Figure 41 Tokyo Electron Limited: Company Snapshot
Figure 42 LAM Research Corporation: Company Snapshot
Figure 43 ASML Holdings N.V.: Company Snapshot
Figure 44 Applied Materials Inc.: Company Snapshot
Figure 45 KLA-Tencore Corporation: Company Snapshot
Figure 46 Screen Holdings Co., Ltd.: Company Snapshot
Figure 47 Teradyne Inc.: Company Snapshot
Figure 48 Advantest Corporation: Company Snapshot
Figure 49 Hitachi High-Technologies Corporation: Company Snapshot
Figure 50 Rudolph Technologies, Inc: Company Snapshot


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