Semiconductor Manufacturing Equipment Market

Semiconductor Manufacturing Equipment Market by Front-end Equipment (Lithography, Wafer Surface Conditioning, Deposition), Back-end Equipment, Fab Facility Equipment, Product Type, Dimension, Supply Chain Participant, Region - Global Forecast to 2025

Report Code: SE 5344 Dec, 2019, by marketsandmarkets.com

The semiconductor manufacturing equipment market is projected to grow from USD 66.1 billion in 2020 to USD 103.5 billion by 2025, at a CAGR of 9.4%. Key factors fueling the growth of this market include the growing consumer electronics market, an increase in the number of foundries, and the trend of miniaturization and technology migration.

Semiconductor Manufacturing Equipment Market

Memory device accounted for largest share of semiconductor manufacturing equipment market in 2019

In 2019, equipment for memory devices accounted for the largest share of the market. Various memory devices such as dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), and Flash memory (NAND or NOR) are used in computers, laptops, digital music players, gaming devices, and mobile internet devices. In the current scenario, NAND Flash memory widely opts for mobile electronics. Companies have been trying to find a single universal memory that combines the benefits of Flash memory, DRAM, and SRAM. New technologies in memory devices, such as MRAM, ZRAM, PCRAM, and RRAM, are expected to replace most of the traditional technologies. This shift in the market has demanded the change in dynamics of manufacturing equipment, enforcing semiconductor manufacturing equipment providers to develop efficient designs for the device manufacturers

Lithography equipment accounted for largest share of front-end semiconductor manufacturing equipment market in 2019

Among the front-end equipment, the lithography equipment accounted for the largest share of the market in 2019. The major reason for the largest size of the lithography equipment market was the higher system cost, although the shipment is comparatively small in number. The market for lithography equipment has been experiencing a drastic technological shift. The adoption of lithography equipment has been increasing owing to the rising requirement for reducing the thickness of wafer to ~7 nm node, increasing production capacity, and developing multilayer designing.

Wafer testing equipment accounted for largest share of back-end semiconductor manufacturing equipment market in 2019

Among the back-end equipment, the wafer testing equipment accounted for the largest share of the market in 2019. Although the testing equipment is mostly focused on back-end processes, it is also used in front-end processes. These testing devices are vital for testing electronic devices for functionality and performance at different points during the semiconductor manufacturing process. With new technological development, there is an increase in the design complexities and development of new products. The increased investments in R&D and technological advancement in networking and communication devices has raised the demand for best-of-class ICs and SOCs. This need can be satisfied by enabling the investment in testing equipment for developing the best quality ICs.

Semiconductor Manufacturing Equipment Market

Semiconductor manufacturing equipment market in APAC accounted for largest share of market in 2019

APAC accounted for the largest share of the semiconductor manufacturing equipment's market in 2019, and a similar trend is likely to continue in the near future. An increasing number of IDMs in the region is expected to boost the market growth in the near future. Similarly, the mass production of electronic products such as smartphones, tablets, sensors, industrial equipment, wearables, and white goods, makes China and Taiwan, the largest manufacturer of consumer electronics. Taiwan and South Korea contribute to a large number of semiconductor foundries and OSAT companies, showcasing greater demand for equipment. The Chinese market contributes to cheap labor as compared to other regions owing to which companies find low-cost skilled labor for the manufacturing plant. These factors help the semiconductor manufacturing equipment's market to grow in the APAC region.

Key Market Players

Tokyo Electron (Japan), LAM Research (US), ASML (Netherlands), Applied Materials (US), KLA-Tencor (US), Screen Holdings (Japan), Teradyne (US), Advantest Corporation (Japan), Hitachi High-Technologies (Japan), Plasma-Therm (US) are a few major companies operating in the market. These companies have adopted both organic and inorganic growth strategies such as product launches, agreements, partnerships, collaborations, and acquisitions to strengthen their position in the market.

Scope of the Report:

Report Metrics

Details

Report Name

Semiconductor Manufacturing Equipment Market

Base year

2019

Forecast period

2020–2025

Forecast unit

Value (USD million/billion)

Segments covered

Front-end equipment, back-end equipment, fab facility equipment, product type, dimension, supply chain participant, and region

Geographic regions covered

APAC, Americas, and EMEA

Companies covered

Tokyo Electron (Japan), LAM Research (US), ASML (Netherlands), Applied Materials (US), KLA-Tencor (US), Screen Holdings (Japan), Teradyne (US), Advantest Corporation (Japan), Hitachi High-Technologies (Japan), and Plasma-Therm (US)

This report categorizes the semiconductor manufacturing equipment's market based on front-end equipment, back-end equipment, fab facility equipment, product type, dimension, supply chain participant, and region.

Semiconductor Manufacturing Equipment Market by Front-end Equipment:

  • Lithography
    • DUV
    • EUV
  • Wafer Surface Conditioning
    • Etching
    • Chemical-Mechanical Planarization (CMP)
  • Deposition
    • PVD
    • CVD
  • Cleaning
    • Single-Wafer Spray System
    • Single-Wafer Cryogenic Systems
    • Batch Immersion Cleaning Systems
    • Batch Spray Cleaning Systems
    • Scrubber
  • Other Equipment

Semiconductor Manufacturing Equipment Market, by Back-end Equipment:

  • Assembly and Packaging
  • Dicing Equipment
  • Bonding Equipment
  • Metrology
  • Testing

Semiconductor Manufacturing Equipment Market, by Fab Facility Equipment:

  • Factory Automation
  • Chemical Control Equipment
  • Gas Control Equipment
  • Others

Semiconductor Manufacturing Equipment Market, by Supply Chain Participant:

  • Foundry
  • OSAT Companies
  • IDM Firms

Semiconductor Manufacturing Equipment Market, by Product Type:

  • Memory
  • Foundry
  • Logic
  • MPU
  • Discrete
  • Analog, MEMS, and Other

Semiconductor Manufacturing Equipment Market, by Dimension:

  • 2D
  • 2.5D
  • 3D

Semiconductor Manufacturing Equipment Market, by Region:

  • Americas
    • US
    • Canada
    • Rest of Americas
  • Europe, the Middle East, and Africa (EMEA)
    • Germany
    • UK
    • Ireland
    • France
    • Italy
    • Rest of EMEA
  • Asia Pacific (APAC)
    • Taiwan
    • China
    • Japan
    • South Korea
    • Rest of APAC

Major Market Developments

  1. In October 2019, Plasma-Therm and Cornell NanoScale Science and Technology Facility (CNF) , a leading university research facility at Cornell University, Ithaca, NY, announced a joint development agreement (JDA) to advance atomic layer etching (ALE) for nanoscale device fabrication. Under this agreement, Plasma-Therm will provide a state-of-the-art ALE system, while CNF will provide ALE process and device development on a wide range of materials serving a broad research community.
  2. In September 2019, Tokyo Electron (TEL) announced to merge its 2 subsidiaries, TEL FSI, Inc. (US), and TEL Epion Inc. (US), which are subsidiaries of Tokyo Electron U.S. Holdings, Inc. The merger is expected to optimize manufacturing functions in the US region and improve operational efficiency.
  3. In July 2019, Applied Materials introduced innovative, high-volume manufacturing solutions aimed at accelerating industry adoption of new memory technologies targeting the Internet of Things (IoT) and cloud computing. The new Endura Clover MRAM PVD platform is made up of nine unique wafer processing chambers, all integrated into pristine, high-vacuum conditions. It is the industry’s first 300-millimeter MRAM system capable of individually depositing up to five different materials per chamber.
  4. In July 2019, KLA-Tencor announced the 392x and 295x optical defect inspection systems and the eDR7380 e-beam defect review system. The new inspection systems featured advancements in the speed and sensitivity that define optical inspection. The portfolio accelerated time-to-market for leading-edge 3D NAND, DRAM, and logic integrated circuits (ICs) throughout their product lifecycle.

Key Questions Addressed by the Report

  • Where will all these developments take the industry in the mid-to-long term?
  • What are the upcoming trends in the semiconductor manufacturing equipment market?
  • What are the opportunities for the existing players and for those who are planning to enter various stages of the semiconductor manufacturing equipment value chain?
  • How will inorganic growth strategies implemented by key players impact the growth of the market, and who will have the undue advantage?
  • What are the emerging applications of semiconductor manufacturing equipment?

To speak to our analyst for a discussion on the above findings, click Speak to Analyst

Table of Contents

1 Introduction (Page No. - 20)
    1.1 Study Objectives
    1.2 Definition
           1.2.1 Inclusions and Exclusions
    1.3 Scope
           1.3.1 Markets Covered
           1.3.2 Years Considered
    1.4 Currency
    1.5 Limitations
    1.6 Market Stakeholders

2 Research Methodology (Page No. - 24)
    2.1 Research Data
           2.1.1 Secondary Data
                    2.1.1.1 Secondary Sources
           2.1.2 Primary Data
                    2.1.2.1 Breakdown of Primary Interviews
                    2.1.2.2 Key Data From Primary Sources
                    2.1.2.3 Key Industry Insights
    2.2 Market Size Estimation
           2.2.1 Bottom-Up Approach
                    2.2.1.1 Approach for Capturing Market Size By Bottom-Up Analysis (Demand Side)
           2.2.2 Top-Down Approach
                    2.2.2.1 Approach for Capturing Market Size By Top-Down Analysis (Supply Side)
    2.3 Market Breakdown and Data Triangulation
    2.4 Research Assumptions

3 Executive Summary (Page No. - 37)

4 Premium Insights (Page No. - 42)
    4.1 Attractive Growth Opportunities in Semiconductor Manufacturing Equipment Market
    4.2 Market for Semiconductor Manufacturing Equipment, By Country
    4.3 Market for Semiconductor Manufacturing Equipment, By Product Type
    4.4 Front-End Market for Semiconductor Manufacturing Equipment, By Equipment Type and Region

5 Market Overview (Page No. - 44)
    5.1 Introduction
    5.2 Market Dynamics
           5.2.1 Drivers
                    5.2.1.1 Increasing Investments in R&D Facilities
                    5.2.1.2 Increasing Demand for Electric and Hybrid Vehicles
                    5.2.1.3 Growing Consumer Electronics Market and Increasing Number of Foundries
                    5.2.1.4 Trend of Miniaturization and Technology Migration
                    5.2.1.5 High Demand for Chips to Provide Computation Power and Connectivity for AI Applications
           5.2.2 Restraints
                    5.2.2.1 High Purchase and Maintenance Costs
                    5.2.2.2 Complexity of Patterns and Functional Defects in Manufacturing Process
           5.2.3 Opportunities
                    5.2.3.1 Rising Demand for Silicon-Based Sensors for IoT Devices
                    5.2.3.2 Expanding Chip Industry in China
                    5.2.3.3 Growing Number of Data Centers and Servers
                    5.2.3.4 Developing Market for Advanced Packaging Products
           5.2.4 Challenges
                    5.2.4.1 Technical Problems Faced During Fabrication Process
                    5.2.4.2 Increased Complexities Related to Miniaturized Structures of Circuits
    5.3 Value Chain Analysis

6 Semiconductor Manufacturing Equipment Market, By Front-End Equipment (Page No. - 61)
    6.1 Introduction
    6.2 Lithography
           6.2.1 DUV Lithography
                    6.2.1.1 I-Line, KRF, ARF Dry, and ARFI are Some of the Key Sources Used in DUV Lithography
           6.2.2 Euv Lithography
                    6.2.2.1 Euvl Designs Triple or Even Quadruple Patterning at 10 NM and 7 NM Nodes And Is Expected To Achieve 5 NM Nodes
    6.3 Wafer Surface Conditioning
           6.3.1 Etching
                    6.3.1.1 Piranha Etch, Potassium Hydroxide (Koh)Etch, and Silicon Nitride Etch are Some of the Key Wet Etching Techniques
           6.3.2 Chemical Mechanical Planarization
                    6.3.2.1 CMP Plays a Crucial Role in Removing Unwanted Conductive or Dielectric Materials on Silicon Wafers
    6.4 Wafer Cleaning
           6.4.1 Single-Wafer Spray System
                    6.4.1.1 Single-Wafer Spray System is an Effective Cleaning Technique With Minimal Damage
           6.4.2 Single-Wafer Cryogenic System
                    6.4.2.1 Single-Wafer Cryogenic System is an Effective Technique in Post–Chemical Mechanical Polishing (CMP) Cleaning Processes
           6.4.3 Batch Immersion Cleaning System
                    6.4.3.1 Batch Immersion Cleaning System is the Most Cost-Effective and Time-Saving Systems
           6.4.4 Batch Spray Cleaning System
                    6.4.4.1 Batch Spray Cleaning System Can Process Large Batches With High Throughput or Small Batches With Short Cycle Times
           6.4.5 Scrubber
                    6.4.5.1 Scrubbers are One of the Most Commonly Used Tools for Mechanical Cleaning of Wafers
    6.5 Deposition
           6.5.1 Pvd
                    6.5.1.1 PVD is a Commonly Used Deposition Technique for Low Accuracy Films
           6.5.2 CVD
                    6.5.2.1 CVD is the Key Technique Used for Production of Thin Films and Complex Layered Micro- and Nano-Structures
    6.6 Other Front-End Equipment

7 Semiconductor Manufacturing Equipment Market, By Back-End Equipment (Page No. - 83)
    7.1 Introduction
    7.2 Assembly and Packaging
           7.2.1 OSAT Companies are Contributing Significantly to the Growth of Assembly and Packaging Equipment Segment
    7.3 Dicing
           7.3.1 Plasma Dicing is Better Than Conventional Blade and Laser Dicing
    7.4 Metrology
           7.4.1 Growth in Automation has Led to Increased Penetration of Metrology Equipment to Reduce Defects
    7.5 Bonding
           7.5.1 3D Semiconductor Assembly and Packaging are Key Growth Factors for Bonding Equipment Segment
    7.6 Wafer Testing
           7.6.1 Rising Demand for High-Quality Electronic Products has Raised the Need for Testing Equipment During Fabrication and Assembly

8 Semiconductor Manufacturing Equipment Market, By Fab Facility (Page No. - 101)
    8.1 Introduction
    8.2 Automation
           8.2.1 Automation Equipment Help in Resolving Complexities in Processes, Minimizing Waste, Reducing Costs, and Planning and Utilizing Resources Optimally
    8.3 Chemical Control
           8.3.1 Chemical Control Equipment Provide Controlled, Repeated, and Reliable Delivery of Chemicals in Semiconductor Manufacturing Process
    8.4 Gas Control
           8.4.1 Gas Control Equipment Play a Key Role in Providing Precisely Controlled Mix of Gases in Wafer Manufacturing Process
    8.5 Others
           8.5.1 Probing Machines are Majorly Used to Perform Electric Tests of Chips

9 Semiconductor Manufacturing Equipment Market, By Product Type (Page No. - 107)
    9.1 Introduction
    9.2 Memory
           9.2.1 Shift in Memory Market Leads to Demand for Advanced Semiconductor Manufacturing Equipment
    9.3 Foundry
           9.3.1 Pure-Play Foundries Expected to Witness Strong Growth Due to Contracts From Fabless Players
    9.4 Logic
           9.4.1 Logic Devices are Critical Components in Electronic Circuits That Operate as Per Defined Programs
    9.5 MPU
           9.5.1 Extensive use of MPUs in Many Consumer Electronics Expected to Boost Their Demand During Forecast Period
    9.6 Discrete
           9.6.1 Demand for Discrete Components is Driven By Their Role of Being a Base of Any Electronic Circuit
    9.7 Analog, MEMS, and Other
           9.7.1 Growth of MEMS is Attributed to Demand From Consumer Electronics

10 Semiconductor Manufacturing Equipment Market, By Dimension (Page No. - 119)
     10.1 Introduction
     10.2 2D
             10.2.1 2D IC Technology is Used in Several Conventional High-End Applications Such as Smartphones and Tablets
     10.3 2.5D
             10.3.1 Use of Silicon Interposers on 2.5D ICS is an Incremental Step to Increase Capacity and Performance of Semiconductor Devices
     10.4 3D
             10.4.1 Need for Improved Electrical Performance Expected to Increase Demand for 3D ICS

11 Semiconductor Manufacturing Equipment Market, By Supply Chain Participant (Page No. - 125)
     11.1 Introduction
     11.2 IDM Firms
             11.2.1 IDM Firms Rapidly Adopt Innovative Technologies and are Expected to Lead Market During Forecast Period
     11.3 OSAT Companies
             11.3.1 OSAT Companies to Play Significant Role Owing to Challenges Faced By Foundries Related to Assembly and Packaging
     11.4 Foundries
             11.4.1 Foundries Have Dominance in APAC Region Owing to Presence of Major Players

12 Semiconductor Manufacturing Equipment Market, By Region (Page No. - 130)
     12.1 Introduction
     12.2 Americas
             12.2.1 US
                       12.2.1.1 US Expected to Lead Market in Americas
             12.2.2 Canada
                       12.2.2.1 Government Initiatives in the Country are Expected to Drive Market
             12.2.3 Rest of Americas
                       12.2.3.1 Increasing Demand for IoT and 5g Surges the Need for Semiconductor Manufacturing Equipment in Rest of Americas
     12.3 EMEA
             12.3.1 Germany
                       12.3.1.1 Growth in Smart Homes and Connected Cars to Boost Demand for Semiconductor Manufacturing Equipment in Germany
             12.3.2 UK
                       12.3.2.1 Growth in Communication Network and Increasing Collaboration to Spur Market in UK
             12.3.3 Ireland
                       12.3.3.1 Presence of Intel Fab is the Key Reason for Market Growth in Ireland
             12.3.4 France
                       12.3.4.1 Developed Communication Network has Prompted Market Growth in France
             12.3.5 Italy
                       12.3.5.1 Enhancements in Technologies By Players Such as Stmicroelectronics Surge the Growth of Market in Italy
             12.3.6 Rest of EMEA
                       12.3.6.1 Rest of EMEA is Home to Giant Players for Advanced Lithography and Next-Generation Packaging Equipment
     12.4 APAC
             12.4.1 South Korea
                       12.4.1.1 High Manufacturing Capability to Drive South Korean Market
             12.4.2 China
                       12.4.2.1 Market in China to Grow at Highest Rate in APAC
             12.4.3 Taiwan
                       12.4.3.1 Presence of Many Key OSAT Companies Drives Market Growth
            in Taiwan
             12.4.4 Japan
                       12.4.4.1 Increasing Demand for Vehicles and Consumer Electronics and Expanding Presence of Market Players in Country Fuel Market Growth in Japan
             12.4.5 Rest of APAC
                       12.4.5.1 Presence of Fabrication Plants and Rising Consumer Electronics Demand to Drive Market in Rest of APAC

13 Competitive Landscape (Page No. - 151)
     13.1 Overview
     13.2 Key Players in Semiconductor Manufacturing Equipment Market
     13.3 Competitive Leadership Mapping
             13.3.1 Visionary Leaders
             13.3.2 Innovators
             13.3.3 Dynamic Differentiators
             13.3.4 Emerging Companies
     13.4 Strength of Product Portfolio (25 Companies)
     13.5 Business Strategy Excellence (For 25 Companies)
     13.6 Competitive Scenario
             13.6.1 Product Launches & Developments
             13.6.2 Partnerships, Collaborations, and Agreements
             13.6.3 Mergers & Acquisitions and Expansions

14 Company Profiles (Page No. - 163)
     14.1 Introduction
     14.2 Key Players
             14.2.1 Tokyo Electron (TEL)
                       14.2.1.1 Business Overview
                       14.2.1.2 Products & Solutions Offered
                       14.2.1.3 Recent Developments
                       14.2.1.4 SWOT Analysis
                       14.2.1.5 MnM View
             14.2.2 LAM Research
                       14.2.2.1 Business Overview
                       14.2.2.2 Products & Solutions Offered
                       14.2.2.3 Recent Developments
                       14.2.2.4 SWOT Analysis
                       14.2.2.5 MnM View
             14.2.3 ASML
                       14.2.3.1 Business Overview
                       14.2.3.2 Products & Solutions Offered
                       14.2.3.3 Recent Developments
                       14.2.3.4 SWOT Analysis
                       14.2.3.5 MnM View
             14.2.4 Applied Materials
                       14.2.4.1 Business Overview
                       14.2.4.2 Products, Services, & Technologies Offered
                       14.2.4.3 Recent Developments
                       14.2.4.4 SWOT Analysis
                       14.2.4.5 MnM View
             14.2.5 KLA-Tencor
                       14.2.5.1 Business Overview
                       14.2.5.2 Products & Solutions Offered
                       14.2.5.3 Recent Developments
                       14.2.5.4 SWOT Analysis
                       14.2.5.5 MnM View
             14.2.6 Screen Holdings
                       14.2.6.1 Business Overview
                       14.2.6.2 Products & Solutions Offered
                       14.2.6.3 Recent Developments
             14.2.7 Teradyne
                       14.2.7.1 Business Overview
                       14.2.7.2 Products & Solutions Offered
                       14.2.7.3 Recent Developments
             14.2.8 Advantest
                       14.2.8.1 Business Overview
                       14.2.8.2 Products & Solutions Offered
                       14.2.8.3 Recent Developments
             14.2.9 Hitachi High-Technologies Corporation
                       14.2.9.1 Business Overview
                       14.2.9.2 Products & Solutions Offered
                       14.2.9.3 Recent Developments
             14.2.10 Plasma-Therm
                           14.2.10.1 Business Overview
                           14.2.10.2 Products & Solutions Offered
                           14.2.10.3 Recent Developments
     14.3 Right-To-Win (Key Market Players)
     14.4 Other Companies
             14.4.1 Rudolph Technologies
             14.4.2 Veeco Instruments
             14.4.3 EV Group
             14.4.4 Nanometrics
             14.4.5 Nordson
             14.4.6 Advanced Dicing Technologies
             14.4.7 Quik-Pak
             14.4.8 Evatec
             14.4.9 Noivion
             14.4.10 Semiconductor Equipment Corporation

15 Appendix (Page No. - 206)
     15.1 Discussion Guide
     15.2 Knowledge Store: Marketsandmarkets’ Subscription Portal
     15.3 Available Customizations
     15.4 Related Reports
     15.5 Author Details


List of Tables (106 Tables)

Table 1 Front-End Semiconductor Manufacturing Equipment Market, By Type, 2017–2025 (USD Billion)
Table 2 Front-End Market, By Region 2017–2025 (USD Billion)
Table 3 Front-End Market in Americas, By Country, 2017–2025 (USD Million)
Table 4 Front-End Market in EMEA, By Country, 2017–2025 (USD Million)
Table 5 Front-End Market in APAC, By Country, 2017–2025 (USD Billion)
Table 6 Front-End Market, By Product Type, 2017–2025 (USD Billion)
Table 7 Lithography Equipment Market, 2017–2025 (Million Units)
Table 8 Lithography Equipment Market, By Region, 2017–2025 (USD Billion)
Table 9 Lithography Equipment Market in Americas, By Country, 2017–2025 (USD Million)
Table 10 Lithography Equipment Market in EMEA, By Country, 2017–2025 (USD Million)
Table 11 Lithography Equipment Market in APAC, By Country, 2017–2025 (USD Million)
Table 12 Wafer Surface Conditioning Equipment Market, By Type, 2017–2025 (USD Million)
Table 13 Wafer Conditioning Equipment Market, By Region, 2017–2025 (USD Billion)
Table 14 Wafer Conditioning Equipment Market in Americas, By Country, 2017–2025 (USD Million)
Table 15 Wafer Conditioning Equipment Market in EMEA, By Country, 2017–2025 (USD Million)
Table 16 Wafer Conditioning Equipment Market, By APAC, 2017–2025 (USD Million)
Table 17 Etching Wafer Conditioning Equipment Market, By Region, 2017–2025 (USD Billion)
Table 18 CMP Wafer Conditioning Equipment Market, By Region, 2017–2025 (USD Billion)
Table 19 Wafer Cleaning Equipment Market, By Region, 2017–2025 (USD Million)
Table 20 Wafer Cleaning Equipment Market in Americas, By Country, 2017–2025 (USD Million)
Table 21 Wafer Cleaning Equipment Market in EMEA, By Country, 2017–2025 (USD Million)
Table 22 Wafer Cleaning Equipment Market in APAC, By Country, 2017–2025 (USD Million)
Table 23 Deposition Equipment Market, By Region, 2017–2025 (USD Billion)
Table 24 Deposition Equipment Market in Americas, By Country, 2017–2025 (USD Million)
Table 25 Deposition Equipment Market in EMEA, By Country, 2017–2025 (USD Million)
Table 26 Deposition Equipment Market in APAC, By Country, 2017–2025 (USD Million)
Table 27 Other Front-End Equipment Market, By Region, 2017–2025 (USD Billion)
Table 28 Other Front-End Equipment Market in Americas, By Country, 2017–2025 (USD Million)
Table 29 Other Front-End Equipment Market in EMEA, By Country, 2017–2025 (USD Million)
Table 30 Other Front-End Equipment Market in APAC, By Country, 2017–2025 (USD Million)
Table 31 Back-End Market, By Type, 2017–2025 (USD Million)
Table 32 Back-End Market, By Region, 2017–2025 (USD Billion)
Table 33 Back-End Market in Americas, By Country, 2017–2025 (USD Million)
Table 34 Back-End Market in EMEA, By Country, 2017–2025 (USD Million)
Table 35 Back-End Market in APAC, By Country, 2017–2025 (USD Million)
Table 36 Back-End Market, By Product Type, 2017–2025 (USD Million)
Table 37 Assembly and Packaging Equipment Market, By Region, 2017–2025 (USD Million)
Table 38 Assembly and Packaging Equipment Market in Americas, By Country, 2017–2025 (USD Million)
Table 39 Assembly and Packaging Equipment Market in EMEA, By Country, 2017–2025 (USD Million)
Table 40 Assembly and Packaging Equipment Market in APAC, By Country, 2017–2025 (USD Million)
Table 41 Dicing Equipment Market, By Region, 2017–2025 (USD Million)
Table 42 Dicing Equipment Market in Americas, By Country, 2017–2025 (USD Million)
Table 43 Dicing Equipment Market in EMEA, By Country, 2017–2025 (USD Million)
Table 44 Dicing Equipment Market in APAC, By Country, 2017–2025 (USD Million)
Table 45 Metrology Equipment Market, By Region, 2017–2025 (USD Million)
Table 46 Metrology Equipment Market in Americas, By Country, 2017–2025 (USD Million)
Table 47 Metrology Equipment Market in EMEA, By Country, 2017–2025 (USD Million)
Table 48 Metrology Equipment Market in APAC, By Country, 2017–2025 (USD Million)
Table 49 Bonding Equipment Market, By Region, 2017–2025 (USD Million)
Table 50 Bonding Equipment Market in Americas, By Country, 2017–2025 (USD Million)
Table 51 Bonding Equipment Market in EMEA, By Country, 2017–2025 (USD Million)
Table 52 Bonding Equipment Market in APAC, By Country, 2017–2025 (USD Million)
Table 53 Wafer Testing Equipment Market, By Region, 2017–2025 (USD Million)
Table 54 Wafer Testing Equipment Market in Americas, By Country, 2017–2025 (USD Million)
Table 55 Wafer Testing Equipment Market in EMEA, By Country, 2017–2025 (USD Million)
Table 56 Wafer Testing Equipment Market in APAC, By Country, 2017–2025 (USD Million)
Table 57 Market, By Fab Facility Equipment, 2017–2025 (USD Million)
Table 58 Fab Facility Equipment Market, By Region, 2017–2025 (USD Billion)
Table 59 Fab Facility Equipment Market in Americas, By Country, 2017–2025 (USD Million)
Table 60 Fab Facility Equipment Market in EMEA, By Country, 2017–2025 (USD Million)
Table 61 Fab Facility Equipment Market in APAC, By Country, 2017–2025 (USD Million)
Table 62 Fab Facility Equipment Market, By Product Type, 2017–2025 (USD Million)
Table 63 Semiconductor Manufacturing Equipment's Market, By Product, 2017–2025 (USD Billion)
Table 64 Market for Memory, By Equipment Type, 2017–2025 (USD Billion)
Table 65 Market for Memory, By Region, 2017–2025 (USD Billion)
Table 66 Market for Foundry, By Equipment Type, 2017–2025 (USD Billion)
Table 67 Market for Foundry, By Region, 2017–2025 (USD Billion)
Table 68 Market for Logic, By Equipment Type, 2017–2025 (USD Million)
Table 69 Market for Logic, By Region, 2017–2025 (USD Million)
Table 70 Market for MPU, By Equipment Type, 2017–2025 (USD Million)
Table 71 Market for MPU, By Region, 2017–2025 (USD Million)
Table 72 Market for Discrete Products, By Equipment Type, 2017–2025 (USD Million)
Table 73 Market for Discrete Products, By Region, 2017–2025 (USD Million)
Table 74 Market for Analog, MEMS, and Other Products, By Equipment Type, 2017–2025 (USD Million)
Table 75 Market for Analog, MEMS, and Other Products, By Region, 2017–2025 (USD Million)
Table 76 Market, By Dimension, 2017–2025 (USD Billion)
Table 77 Comparison Between 2D, 2.5D, and 3D IC Technologies
Table 78 Market for 2D IC, By Region, 2017–2025 (USD Billion)
Table 79 Market for 2.5D IC, By Region, 2017–2025 (USD Billion)
Table 80 Market for 3D IC, By Region, 2017–2025 (USD Million)
Table 81 Market, By Supply Chain Participant, 2017–2025 (USD Billion)
Table 82 Market for IDM Firms, By Region, 2017–2025 (USD Billion)
Table 83 Market for OSAT Companies, By Region, 2017–2025 (USD Billion)
Table 84 Market for Foundries, By Region, 2017–2025 (USD Billion)
Table 85 Market, By Region, 2017–2025 (USD Billion)
Table 86 Market in Americas, By Equipment, 2017–2025 (USD Billion)
Table 87 Market in Americas, By Front-End Equipment, 2017–2025 (USD Billion)
Table 88 Market in Americas, By Back-End Equipment, 2017–2025 (USD Million)
Table 89 Market in Americas, By Fab Facility Equipment, 2017–2025 (USD Million)
Table 90 Market in Americas, By Dimension, 2017–2025 (USD Million)
Table 91 Market in Americas, By Country, 2017–2025 (USD Million)
Table 92 Market in EMEA, By Equipment, 2017–2025 (USD Billion)
Table 93 Market in EMEA, By Front-End Equipment, 2017–2025 (USD Billion)
Table 94 Market in EMEA, By Back-End Equipment, 2017–2025 (USD Million)
Table 95 Market in EMEA, By Fab Facility Equipment, 2017–2025 (USD Million)
Table 96 Market in EMEA, By Dimension, 2017–2025 (USD Million)
Table 97 Market in EMEA, By Country, 2017–2025 (USD Million)
Table 98 Market in APAC, By Equipment, 2017–2025 (USD Billion)
Table 99 Market in APAC, By Front-End Equipment, 2017–2025 (USD Billion)
Table 100 Market in APAC, By Back-End Equipment, 2017–2025 (USD Million)
Table 101 Market in APAC, By Fab Facility Equipment, 2017–2025 (USD Million)
Table 102 Market in APAC, By Dimension, 2017–2025 (USD Billion)
Table 103 Market in APAC, By Country, 2017–2025 (USD Billion)
Table 104 Top 10 Product Launches & Developments, January 2015–October 2019
Table 105 Top 10 Partnerships, Collaborations, and Agreements, January 2015–October 2019
Table 106 Top 10 Mergers & Acquisitions and Expansions, January 2015–October 2019
 

List of Figures (68 Figures)
 
Figure 1 Semiconductor Manufacturing Equipment Market: Research Design
Figure 2 Market Size Estimation Methodology: Approach 1 (Supply Side)— Revenue of Companies in Semiconductor Manufacturing Equipment Market
Figure 3 Market Size Estimation Methodology: Approach 2 Bottom-Up (Supply Side)—Illustration of Revenue Estimation of Semiconductor Manufacturing Equipment Companies
Figure 4 Market Size Estimation Methodology: Approach 3 – Bottom-Up (Demand Side)—Supply Chain Participants Covered Under Semiconductor Manufacturing Equipment Market
Figure 5 Market Size Estimation Methodology: Approach 4—Bottom-Up Market Estimation for Semiconductor Manufacturing Equipment, By Type
Figure 6 Market Size Estimation Methodology: Bottom-Up Approach
Figure 7 Market Size Estimation Methodology: Top-Down Approach
Figure 8 Data Triangulation
Figure 9 3D Segment Expected to Grow at Highest CAGR During Forecast Period
Figure 10 IDM Firms to Grow at Highest Rate in Market During Forecast Period
Figure 11 Lithography Equipment to Witness Highest Demand in Market During Forecast Period
Figure 12 Wafer Testing Expected to Witness Highest Growth Between 2020 and 2025
Figure 13 APAC to Hold Largest Market Share in 2019
Figure 14 Increasing Demand for Miniaturized Devices in Consumer Electronics and Automotive Industries to Spur Market Growth During Forecast Period
Figure 15 China to Record Highest CAGR in Overall Market During Forecast Period
Figure 16 Memory to Account for Largest Share of Market Till 2025
Figure 17 Lithography and APAC Likely to be Largest Shareholders in Overall Front-End Market in 2025
Figure 18 Semiconductor Manufacturing Equipment's Market Dynamics
Figure 19 Electric Vehicle Sales, 2013–2018 (Million Units)
Figure 20 Comparison of Dram Processing Steps Per Layer, By Lithography Technology
Figure 21 Expanding Applications of Artificial Intelligence (AI)
Figure 22 Semiconductor Manufacturing Equipment's Market Drivers and Their Impact
Figure 23 Semiconductor Manufacturing Equipment's Market Restraints and Their Impact
Figure 24 Presence of Domestic Chinese Companies in Different Semiconductor Manufacturing Equipment
Figure 25 Semiconductor Manufacturing Equipment's Market Opportunities and Their Impact
Figure 26 Semiconductor Manufacturing Equipment's Market Challenges and Their Impact
Figure 27 Value Chain Analysis of Semiconductor Manufacturing Equipment Market
Figure 28 Value Chain Analysis of Front-End Semiconductor Manufacturing Equipment Ecosystem
Figure 29 Value Chain Analysis of Back-End Semiconductor Manufacturing Equipment Ecosystem
Figure 30 Lithography Equipment Accounts for Largest Market Share Among All Equipment Types
Figure 31 APAC Accounts for Largest Share of Lithography Equipment Market
Figure 32 CMP Market Expected to Grow at Highest CAGR During Forecast Period
Figure 33 APAC Market for Cleaning Equipment Expected to Grow at Highest CAGR During Forecast Period
Figure 34 APAC Market to Hold Largest Share of Deposition Equipment Market During Forecast Period
Figure 35 Wafer Testing is Expected to Hold Largest Share of Back-End Equipment Market During Forecast Period
Figure 36 APAC is Expected to Hold Largest Share of Assembly and Packaging Equipment Market During Forecast Period
Figure 37 Dicing Equipment Market in APAC to Grow at Highest CAGR During Forecast Period
Figure 38 APAC to Hold Largest Share of Metrology Equipment Market During Forecast Period
Figure 39 Bonding Equipment Market in APAC to Grow at Highest CAGR During Forecast Period
Figure 40 Wafer Testing Equipment Market in APAC to Grow at Highest CAGR During Forecast Period
Figure 41 Chemical Control Equipment to Grow at Highest CAGR During Forecast Period
Figure 42 Memory Accounts for Largest Share of Market Among All Product Types
Figure 43 APAC Accounts for Largest Share of Market for Memory
Figure 44 APAC Accounts for Largest Share of Market for Foundry
Figure 45 APAC Accounts for Largest Share of Market for Logic
Figure 46 APAC Accounts for Largest Share of Market for MPU
Figure 47 APAC Accounts for Largest Share of Market for Discrete Products
Figure 48 APAC Accounts for Largest Share of Market for Analog, MEMS, and Other Products Segment
Figure 49 Market for 3D ICS to Grow at Highest CAGR During Forecast Period
Figure 50 Semiconductor Manufacturing Equipment's Market, By Supply Chain Participant
Figure 51 IDM Firms Account for Largest Share of Semiconductor Manufacturing Equipment Market
Figure 52 Semiconductor Manufacturing Equipment's Market in APAC to Grow at Highest CAGR During Forecast Period
Figure 53 Americas: Semiconductor Manufacturing Equipment's Market Snapshot
Figure 54 EMEA: Semiconductor Manufacturing Equipment's Market Snapshot
Figure 55 APAC: Semiconductor Manufacturing Equipment's Market Snapshot
Figure 56 Companies Adopted Product Launches & Developments as Key Growth Strategy From January 2015 to October 2019
Figure 57 Semiconductor Manufacturing Equipment's Market: Company Ranking Analysis (2018)
Figure 58 Semiconductor Manufacturing Equipment's Market (Global) Competitive Leadership Mapping, 2018
Figure 59 Tokyo Electron: Company Snapshot
Figure 60 LAM Research: Company Snapshot
Figure 61 ASML: Company Snapshot
Figure 62 Applied Materials: Company Snapshot
Figure 63 KLA-Tencor: Company Snapshot
Figure 64 Screen Holdings: Company Snapshot
Figure 65 Teradyne: Company Snapshot
Figure 66 Advantest: Company Snapshot
Figure 67 Hitachi High-Technologies Corporation: Company Snapshot
Figure 68 Plasma-Therm: Company Snapshot

The study involved 4 major activities for estimating the size of the semiconductor manufacturing equipment market. Exhaustive secondary research has been carried out to collect information relevant to the market, the peer market, and the parent market. Primary research has been undertaken to validate these findings, assumptions, and sizing with the industry experts across the value chain of the semiconductor manufacturing equipment. Both top-down and bottom-up approaches have been employed to estimate the complete market size. After that, the market breakdown and data triangulation methods have been used to estimate the size of different segments and subsegments of the market.

Secondary Research

The research methodology used to estimate and forecast the size of the semiconductor manufacturing equipment market began with capturing data related to revenues of key vendors in the market through secondary research. This study involved the extensive use of secondary sources, directories, and databases (such as Hoovers, Bloomberg Businessweek, Factiva, and OneSource) to identify and collect information useful for a technical, market-oriented, and commercial study of the semiconductor manufacturing equipment market. Vendor offerings have been taken into consideration to determine the market segmentation. The entire research methodology included the study of annual reports, press releases, and investor presentations of companies; white papers; and certified publications and articles by recognized authors, directories, and databases.

Primary Research

The semiconductor manufacturing equipment market comprises several stakeholders, such as suppliers of standard components, equipment manufacturers, and original equipment manufacturers (OEMs). The demand side of this market is characterized by the IDM firms, foundry, and OSAT companies, as well as by the development and manufacturing of semiconductor-based devices. The supply side is characterized by advancements carried out in semiconductor manufacturing equipment and fab facility systems using different techniques and their diverse applications. Various primary sources from both the supply and demand sides of the market have been interviewed to obtain qualitative and quantitative information. Following is the breakdown of primary respondents.

Semiconductor Manufacturing Equipment Market

To know about the assumptions considered for the study, download the pdf brochure

Market Size Estimation

Both top-down and bottom-up approaches have been used to estimate and validate the size of the semiconductor manufacturing equipment market and its segments. The research methodology used to estimate the market size included the following:

  • Key players in the market have been identified through extensive secondary research.
  • The supply chain of the manufacturing industry and the size of the semiconductor manufacturing equipment market, in terms of value, have been determined through primary and secondary research processes.
  • All percentage shares, splits, and breakdowns have been determined using secondary sources and verified through primary sources.

Data Triangulation

After arriving at the overall market size—using the market size estimation process explained above—the market has been split into several segments and subsegments. Data triangulation and market breakdown procedures have been employed, wherever applicable, to complete the overall market engineering process and arrive at the exact statistics of each market segment and subsegment. The data has been triangulated by studying various factors and trends from both the demand and supply sides of the semiconductor manufacturing equipment market.

Research Objectives

  • To describe, segment, and forecast the overall size of the semiconductor manufacturing equipment market, by product type, front-end equipment, back-end equipment, fab facility equipment, dimension, supply chain participant, and region
  • To describe and forecast the market size for various segments with regard to 3 main regions—Asia Pacific (APAC), the Americas, and Europe and the Middle East & Africa (EMEA)
  • To provide detailed information regarding major factors such as drivers, restraints, opportunities, and challenges influencing the growth of the market
  • To describe the semiconductor manufacturing equipment value chain in brief
  • To analyze competitive developments such as product launches and developments, agreements, partnerships, acquisitions, expansions, and research and development (R&D) activities in the semiconductor manufacturing equipment market

Available Customizations:

Along with the market data, MarketsandMarkets offers customizations according to the specific requirements of companies. The following customization options are available for the report:

Company Information

  • Detailed analysis and profiling of additional market players (up to 5)

Critical Questions

  • What are new application areas being explored by the providers of semiconductor manufacturing equipment?
  • Who are the key players in the semiconductor manufacturing equipment market, and how intense is the competition in this market?
Report Code
SE 5344
Published ON
Dec, 2019
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