Exhaustive secondary research was undertaken to obtain information on the aerospace PCB market, the peer market, and the parent market. The next step was to validate these findings, assumptions, and sizing by industry experts across the value chain through primary research. Both, top-down and bottom-up approaches were employed to estimate the complete market size. Thereafter, market breakdown and data triangulation were used to estimate the size of segments and subsegments.
In the secondary research process, various secondary sources, such as D&B Hoovers, Bloomberg, BusinessWeek, and different magazines were referred to identify and collect information for this study. Secondary sources also included annual reports, press releases & investor presentations of companies, certified publications, articles by recognized authors, and aircraft parts and component research papers.
The Aerospace PCB market comprises several stakeholders, such as OEMs, electronics hardware and software suppliers, electronics system integrators, PCB manufacturers and regulatory organizations in the supply chain. The demand-side of this market is characterized by various end users, such as component manufacturers as well as facility providers and OEMs. The supply-side is characterized by technology advancements in aerospace PCB. Various primary sources from both, the supply and demand sides of the market were interviewed to obtain qualitative and quantitative information. Following is the breakdown of primary respondents:
Both, the top-down and bottom-up approaches were used to estimate and validate the total size of the aerospace PCB market. These methods were also used extensively to estimate the size of various subsegments in the market. The research methodology used to estimate the market size includes the following:
After arriving at the overall market size—using the market size estimation process explained above—the market was split into several segments and subsegments. To complete the overall market engineering process and arrive at the exact statistics of each market segment and subsegment, data triangulation, and market breakdown procedures were employed, wherever applicable. The data was triangulated by studying various factors and trends from both, the demand and supply sides of the aircraft manufacturing industry.
Report Metric |
Details |
Market size available for years |
2017-2025 |
Base year considered |
2018 |
Forecast period |
2019-2025 |
Forecast units |
Value (USD) |
Segments covered |
By End-Use Industry, PCB Type, Function, Application, Point of Sale, and Region |
Geographies covered |
North America, Europe, Asia Pacific, the Middle East, and Rest of the World |
Companies covered |
Epec, LLC. (US), Amitron Corp. (US), TechnoTronix (US), Saline Lectronics (US), Advanced Circuits (US), Excello Circuits Inc (US), NexLogic Technologies Inc. (US), SCHMID Group (Germany), Corintech Ltd (UK) |
This research report categorizes the Aerospace PCB market based on End-Use Industry, PCB Type, Function, Application, Point of Sale and Region.
Along with the market data, MarketsandMarkets offers customizations according to a company’s specific needs.
Growth opportunities and latent adjacency in Aerospace PCB Market