3D Stacking Market

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3D Stacking Market by Method (Die-to-Die, Die-to-Wafer, Wafer-to-Wafer, Chip-to-Chip, Chip-to-Wafer), Technology (Through-Silicon Via, Hybrid Bonding, Monolithic 3D Integration), Device (Logic ICs, Optoelectronics, Memory, MEMS) - Global Forecast to 2028

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Report Code: SE 8803 Sep, 2023, by marketsandmarkets.com

[244 Pages Report] The 3D stacking market size is estimated to be worth USD 1.2 billion in 2023 and is projected to reach USD 3.1 billion by 2028, at a CAGR of 20.4% during the forecast period. Rapid expansion of semiconductor applications across various industries and integration of advanced electronics within the automotive industry the major opportunities that lie ahead for the 3D stacking market.

3D Stacking Market

3D Stacking Market Forecast to 2028

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3D Stacking Market Dynamics

Driver: Heterogeneous integration and component optimization to improve manufacturing of electronic components

3D stacking technology facilitates heterogeneous integration by allowing the creation of circuit layers with different processes and on different types of wafers. This exceptional flexibility empowers manufacturers to optimize individual components to a remarkable degree compared to traditional single-wafer fabrication. In practical terms, it means that electronic components can be fine-tuned to meet specific requirements with a level of precision and customization that was previously unattainable.

Restraint: High cost of 3D stacking technology to limit adoption

One of the most significant hurdles in the 3D stacking market is the substantial financial commitment required for implementing 3D stacking technology. This transformative technology demands considerable investments in specialized equipment, materials, and expertise. The costs associated with acquiring and setting up the necessary machinery, including advanced semiconductor manufacturing equipment and precision tools for vertical stacking, can be exorbitant. Moreover, specialized materials required for 3D stacking often come at a premium. These initial expenses can be particularly daunting for smaller manufacturers or startups operating with limited financial resources.

Opportunity: Rapid expansion of semiconductor applications across various industries

Surge in semiconductor use is driven by emerging technologies such as Artificial Intelligence (AI), the Internet of Things (IoT), 5G telecommunications, and high-performance computing. These technologies demand increasingly powerful and efficient semiconductor solutions. As the capabilities of these applications continue to evolve, there is an escalating need for innovative approaches to enhance semiconductor performance and functionality. The 3D stacking technology offers a compelling solution to meet these escalating demands. It enables the creation of vertically integrated components, allowing for improved performance, reduced power consumption, and enhanced functionality.

Challenge: Maintaining effective supply chain in 3D stacking

The challenge of ensuring an effective supply chain in the 3D stacking market is magnified by the specialized nature of materials and equipment required. These include unique semiconductor substrates, precision tools, and adhesives necessary for the 3D stacking process. Disruptions or shortages in the supply chain for these critical components can lead to production delays and increased costs, hampering market growth. Moreover, the global reach of the supply chain, involving numerous suppliers and manufacturers across different regions, introduces complexity and logistical challenges, with customs regulations and export controls adding to the intricacy.

3D Stacking Market Ecosystem

The 3D stacking market is marked by the presence of a few tier-1 companies, such as Samsung Electronics Co. Ltd (South Korea), Taiwan Semiconductor Manufacturing Company Limited (Taiwan), Intel Corporation (US), ASE Technology Holding Co., Ltd. (Taiwan), Amkor Technology (US), Broadcom (US), and many more. These companies have created a competitive ecosystem by investing in research and development activities to launch highly efficient and reliable 3D stacking solutions.

3D Stacking Market by Ecosystem

Consumer electronics to hold largest market share in 3D stacking market during forecast period

3D stacking addresses this demand by enabling the integration of diverse functionalities and components in a compact three-dimensional structure. This integration results in more efficient devices with optimized power consumption, faster processing, and improved thermal management. As a result, manufacturers in the consumer electronics industry are increasingly turning to 3D stacking to meet consumer expectations for advanced, yet portable and energy-efficient, electronic products.

Memory Devices to hold largest market share by Device Type

Memory devices in the context of 3D stacking refer to electronic components responsible for data storage and retrieval. The memory devices market is experiencing sustained growth due to the rising need for high-performance memory and storage in various applications, such as artificial intelligence, machine learning, and storage processing. 3D stacking is also used in memory applications in specialized AI and ML hardware, such as graphics processing units (GPUs) and tensor processing units (TPUs).

3D TSV to hold larget market during forecast period

Through-Silicon Via (TSV) technology is at the forefront of the 3D chip stacking revolution, serving as a crucial process for achieving vertical integration in semiconductor devices. TSVs act as a vertical interconnect technique, enabling the creation of 3D packages and integrated circuits. They are employed in building 3D packages that house multiple semiconductor dies, eliminating the need for traditional edge wiring or wirebonding that was previously utilized in stacked packages on organic substrates. TSVs are highly favored in the development of advanced 3D ICs and interposer stacks.

Asia Pacific held to register highest CAGR and market share in the 3D stacking market during forecast period

Asia Pacific is expected to hold the largest share of the 3D stacking market owing to the availability of low-cost labor in China, innovations and advancements by fabrications plants in Taiwan, manufacturing capabilities of Japanese companies, and the establishment of new fabs in China, Taiwan, Japan, and South Korea. These factors are some of the cutting-edge advantages for the Asian semiconductor industry.

3D Stacking Market by Region

3D Stacking Market by Region

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3D Stacking Market Key Players

The major players in the 3D stacking companies include key players such as Taiwan Semiconductor Manufacturing Company Limited (Taiwan), Intel Corporation (US), Samsung (South Korea), Advanced Micro Devices, Inc. (US), ASE (Taiwan), and many more. These companies have used both organic and inorganic growth strategies such as product launches, acquisitions, and partnerships to strengthen their position in the market.

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Scope of the Report

Report Metric	Details
Estimated Value	USD 1.2 billion
Expected Value	USD 3.1 billion
Growth Rate	CAGR of 20.4%
Market size available for years	2019–2028
Base year considered	2022
Forecast period	2023–2028
Forecast units	Value (USD Million/Billion)
Segments covered	Method, Interconnecting Technology, Device Type, End User and Region
Geographies covered	North America, Europe, Asia Pacific, and Rest of World
Companies covered	The major players in the 3D stacking market are Taiwan Semiconductor Manufacturing Company Limited (Taiwan), Intel Corporation (US), Samsung (South Korea), Advanced Micro Devices, Inc. (US), ASE (Taiwan), GlobalFoundries Inc. (US) and many more.

3D Stacking Market Highlights

Segment	Subsegment
By Method	Die-to-Die Die-to-Wafer Wafer-to-Wafer Chip-to-Chip Chip-to-Wafer
By Interconnecting Technology	3D Hybrid Bonding 3D TSV (Through-Silicon Via) Monolithic 3D Integration
By Device Type	Logic ICs Imaging & Optoelectronics Memory Devices MEMS/Sensors LEDs Others (RF, photonics, analog & mixed signals, and power devices)
By End User Industry	Consumer Electronics Manufacturing Communications (Telecommunication, Data Centers & HPC) Automotive Medical Devices/Healthcare Others (Military & Defence, Aviation
By Region	North America Europe Asia Pacific Rest of the World

Recent Developments

In June 2023, Cadence Design Systems, Inc. has expanded its collaboration with Samsung Foundry to accelerate 3D-IC design development for emerging technologies like hyperscale computing, 5G, AI, IoT, and mobile applications. This partnership enhances multi-die planning and implementation through reference flows and package design kits based on the Cadence Integrity 3D-IC platform, which uniquely integrates system planning, packaging, and system-level analysis.
In February 2023, UMC (Taiwan) and Cadence (US) collaborated on 3D-IC Hybrid Bonding Reference Flow. This technology supports the integration across a broad range of technology nodes suitable for edge AI, image processing, and wireless communication applications. Cost-effectiveness and design reliability are the pillars of UMC’s hybrid bonding technologies, and this collaboration with Cadence provides mutual customers with both, helping them reap the benefits of 3D structures while also accelerating the time needed to complete their integrated designs.
In February 2022, Advanced Micro Devices, Inc. (US) has completed acquisition of Xilinx, This union establishes a powerhouse in high-performance and adaptive computing, boasting an expanded product portfolio covering computing, graphics, and adaptive System-on-Chip products. The acquisition is projected to enhance non-GAAP margins, non-GAAP EPS, and free cash flow generation in the first year, while also bolstering AMD’s prowess in advanced technology domains such as die stacking, chiplet technology, AI, and software platforms..

Frequently Asked Questions (FAQs):

What is the current size of the global 3D stacking market?

The 3D stacking market is estimated to be worth USD 1.1 billion in 2022 and is projected to reach USD 3.1 billion by 2028, at a CAGR of 20.4% during the forecast period.

Who are the winners in the global 3D stacking market?

Samsung (South Korea), SK HYNIX INC. (South Korea), Intel Corporation (US), ASE Technology Holding Co., Ltd. (Taiwan), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), and Amkor Technology (US) are the star companies in the 3D stacking market.

Which region is expected to hold the highest market share?

Asia Pacific is expected to dominate the 3D stacking market during forecast period owing to the manufacturing capabilities of Japanese companies, innovations and advancements by fabrications plants in Taiwan, availability of low-cost labor in China, and the establishment of new fabs in China, Taiwan, Japan, and South Korea.

What are the major opportunities related to 3D stacking market?

Growing adoption of high-bandwidth memory (HBM) devices; Rapid expansion of semiconductor applications across various industries; integration of advanced electronics within the automotive industry are major opportunities related to 3D stacking market.

What are the major strategies adopted by market players?

The key players have adopted acquisitions, product launches, and partnerships to strengthen their position in the 3D stacking market.

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TABLE OF CONTENTS

1 INTRODUCTION (Page No. - 31)

1.1 STUDY OBJECTIVES

1.2 MARKET DEFINITION

1.2.1 INCLUSIONS AND EXCLUSIONS

1.3 STUDY SCOPE

FIGURE 1 3D STACKING MARKET: MARKET SEGMENTATION

1.3.1 REGIONAL SCOPE

1.3.2 YEARS CONSIDERED

1.4 CURRENCY CONSIDERED

1.5 LIMITATIONS

1.6 STAKEHOLDERS

1.7 RECESSION IMPACT

2 RESEARCH METHODOLOGY (Page No. - 35)

2.1 RESEARCH DATA

FIGURE 2 3D STACKING MARKET: RESEARCH DESIGN

2.1.1 SECONDARY & PRIMARY RESEARCH

2.1.2 SECONDARY DATA

2.1.2.1 Major secondary sources

2.1.2.2 Secondary sources

2.1.3 PRIMARY DATA

2.1.4 BREAKDOWN OF PRIMARIES

2.1.4.1 Key data from primary sources

2.2 MARKET SIZE ESTIMATION

FIGURE 3 PROCESS FLOW OF MARKET SIZE ESTIMATION

2.2.1 BOTTOM-UP APPROACH

2.2.1.1 Approach to estimate market share by bottom-up analysis (demand side)

FIGURE 4 MARKET SIZE ESTIMATION: BOTTOM-UP APPROACH

2.2.2 TOP-DOWN APPROACH

2.2.2.1 Approach to estimate market share by top-down analysis (supply side)

FIGURE 5 MARKET SIZE ESTIMATION: TOP-DOWN APPROACH

FIGURE 6 MARKET SIZE ESTIMATION: TOP-DOWN APPROACH (SUPPLY SIDE)—REVENUE GENERATED FROM 3D STACKING SOLUTIONS AND SERVICES

2.3 DATA TRIANGULATION

FIGURE 7 DATA TRIANGULATION

2.4 RESEARCH ASSUMPTIONS

TABLE 1 RESEARCH ASSUMPTIONS

2.5 RISK ASSESSMENT

2.6 RECESSION IMPACT ANALYSIS: PARAMETERS CONSIDERED

3 EXECUTIVE SUMMARY (Page No. - 46)

FIGURE 8 CONSUMER ELECTRONICS SEGMENT TO CAPTURE LARGEST SHARE OF MARKET IN 2028

FIGURE 9 MEMORY DEVICES SEGMENT TO HOLD LARGEST SHARE OF MARKET IN 2028

FIGURE 10 3D TSV SEGMENT TO LEAD MARKET DURING FORECAST PERIOD

FIGURE 11 3D STACKING MARKET TO EXHIBIT HIGHEST CAGR IN ASIA PACIFIC DURING FORECAST PERIOD

4 PREMIUM INSIGHTS (Page No. - 50)

4.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN MARKET

FIGURE 12 INCREASING FOCUS ON MINIATURIZATION AND EFFICIENT SPACE UTILIZATION IN ELECTRONIC DEVICES TO BOOST MARKET GROWTH

4.2 3D STACKING MARKET, BY METHOD

FIGURE 13 DIE-TO-DIE SEGMENT TO HOLD LARGEST SHARE OF MARKET IN 2028

4.3 3D STACKING MARKET, BY END USER

FIGURE 14 AUTOMOTIVE SEGMENT TO REGISTER HIGHEST CAGR FROM 2023 TO 2028

4.4 MARKET, BY PACKAGING TECHNOLOGY

FIGURE 15 3D TSV SEGMENT TO ACCOUNT FOR LARGEST SHARE OF MARKET FROM 2023 TO 2028

4.5 MARKET, BY DEVICE TYPE

FIGURE 16 MEMORY DEVICES SEGMENT TO HOLD LARGEST SHARE OF MARKET FROM 2023 TO 2028

4.6 ASIA PACIFIC: MARKET, BY END USER AND COUNTRY

FIGURE 17 CONSUMER ELECTRONICS SEGMENT AND CHINA HELD LARGEST SHARE OF MARKET IN ASIA PACIFIC IN 2022

4.7 3D STACKING MARKET, BY COUNTRY

FIGURE 18 TAIWAN TO BE FASTEST-GROWING COUNTRY-LEVEL MARKET FOR 3D STACKING DURING FORECAST PERIOD

5 MARKET OVERVIEW (Page No. - 54)

5.1 INTRODUCTION

5.2 MARKET DYNAMICS

FIGURE 19 3D STACKING MARKET: DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES

5.2.1 DRIVERS

FIGURE 20 ANALYSIS OF IMPACT OF DRIVERS ON 3D STACKING MARKET

5.2.1.1 Increasing focus on miniaturization and efficient space utilization in electronic devices

5.2.1.2 Cost advantage offered by 3D stacking technology

5.2.1.3 Growing demand for consumer electronics and gaming devices

FIGURE 21 NUMBER OF SMARTPHONE AND MOBILE PHONE USERS GLOBALLY, 2020–2025

5.2.1.4 Unparalleled flexibility and customization benefits offered by 3D stacking in electronic component manufacturing

5.2.1.5 Reduced power consumption and operational costs over 2D stacking

5.2.2 RESTRAINTS

FIGURE 22 ANALYSIS OF IMPACT OF RESTRAINTS ON MARKET

5.2.2.1 Need for substantial upfront investment

5.2.2.2 Lack of standardization governing 3D stacking technology

5.2.3 OPPORTUNITIES

FIGURE 23 ANALYSIS OF IMPACT OF OPPORTUNITIES ON MARKET

5.2.3.1 Growing adoption of high-bandwidth memory (HBM) devices

5.2.3.2 Rapid expansion of semiconductor applications across various industries

5.2.3.3 Integration of advanced electronics into automobiles

5.2.4 CHALLENGES

FIGURE 24 ANALYSIS OF IMPACT OF CHALLENGES ON 3D STACKING MARKET

5.2.4.1 Maintaining effective supply chain in 3D stacking

5.2.4.2 Designing complexities associated with 3D stacking technology

5.3 SUPPLY CHAIN ANALYSIS

FIGURE 25 3D STACKING MARKET: SUPPLY CHAIN ANALYSIS

5.4 ECOSYSTEM MAPPING

FIGURE 26 3D STACKING ECOSYSTEM

5.5 TRENDS/DISRUPTIONS IMPACTING CUSTOMER BUSINESS

FIGURE 27 REVENUE SHIFTS AND NEW REVENUE POCKETS FOR PLAYERS IN MARKET

5.6 PRICING ANALYSIS

TABLE 2 AVERAGE SELLING PRICE OF 12-INCH EQUIVALENT WAFERS, 2022 (USD)

5.6.1 AVERAGE SELLING PRICE OF 12-INCH EQUIVALENT WAFERS OFFERED BY KEY PLAYERS

FIGURE 28 AVERAGE SELLING PRICE OF 12-INCH WAFERS EQUIVALENT OFFERED BY KEY PLAYERS

5.6.2 AVERAGE SELLING PRICE TREND

TABLE 3 AVERAGE SELLING PRICE OF 12-INCH EQUIVALENT WAFERS, 2018–2022 (USD/THOUSAND UNITS)

FIGURE 29 AVERAGE SELLING PRICE OF WAFERS, 2018–2022

5.7 TECHNOLOGY TRENDS

5.7.1 FAN-OUT WAFER-LEVEL PACKAGING

5.7.2 FAN-OUT PANEL-LEVEL PACKAGING

5.7.3 ADVANCED MATERIALS

5.7.4 MONOLITHIC 3D INTEGRATION

5.8 PORTER’S FIVE FORCES ANALYSIS

TABLE 4 3D STACKING MARKET: PORTER’S FIVE FORCES ANALYSIS

FIGURE 30 PORTER’S FIVE FORCES ANALYSIS

5.8.1 THREAT OF NEW ENTRANTS

5.8.2 THREAT OF SUBSTITUTES

5.8.3 BARGAINING POWER OF SUPPLIERS

5.8.4 BARGAINING POWER OF BUYERS

5.8.5 INTENSITY OF COMPETITIVE RIVALRY

5.9 KEY STAKEHOLDERS AND BUYING CRITERIA

5.9.1 KEY STAKEHOLDERS IN BUYING PROCESS

FIGURE 31 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP THREE END USERS

TABLE 5 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS, BY END USER (%)

5.9.2 BUYING CRITERIA

FIGURE 32 KEY BUYING CRITERIA FOR TOP THREE END USERS

TABLE 6 KEY BUYING CRITERIA, BY END USER

5.10 CASE STUDY ANALYSIS

5.10.1 SEMICONDUCTOR WAFER PRODUCER REDUCED WAFER REJECTIONS THROUGH CLOSED-LOOP MONITORING

5.10.2 SPTS’S DRIE TECHNOLOGY STRENGTHENED IMEC’S SILICON ETCH PLATFORM

5.11 TRADE ANALYSIS

5.11.1 IMPORT SCENARIO

TABLE 7 IMPORT DATA FOR PRODUCTS COVERED UNDER HS CODE 381800, BY COUNTRY, 2018–2022 (USD MILLION)

5.11.2 EXPORT SCENARIO

TABLE 8 EXPORT DATA FOR PRODUCTS COVERED UNDER HS CODE 381800, BY COUNTRY, 2018–2022 (USD MILLION)

5.12 PATENT ANALYSIS

TABLE 9 PATENTS RELATED TO 3D STACKING MARKET, 2020–2023

FIGURE 33 NUMBER OF PATENTS GRANTED PER YEAR FROM 2013 TO 2022

TABLE 10 NUMBER OF PATENTS RELATED TO 3D STACKING REGISTERED IN LAST 10 YEARS

FIGURE 34 TOP 10 COMPANIES WITH HIGHEST NUMBER OF PATENT APPLICATIONS IN LAST 10 YEARS

5.13 KEY CONFERENCES AND EVENTS, 2023–2025

TABLE 11 3D STACKING MARKET: DETAILED LIST OF CONFERENCES AND EVENTS

5.14 STANDARDS AND REGULATORY LANDSCAPE

5.14.1 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS

TABLE 12 NORTH AMERICA: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS

TABLE 13 EUROPE: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS

TABLE 14 ASIA PACIFIC: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS

5.14.2 KEY REGULATIONS AND STANDARDS

5.14.2.1 Regulations

5.14.2.2 Standards

6 3D STACKING MARKET, BY PACKAGING METHODOLOGY (Page No. - 84)

6.1 INTRODUCTION

6.2 3D PACKAGE-ON-PACKAGE (POP)

6.2.1 GROWING DEMAND FOR COMPACT AND FEATURE-RICH ELECTRONIC DEVICES TO PROPEL SEGMENTAL GROWTH

6.3 3D SYSTEM-IN-PACKAGE (SIP)

6.3.1 NEED FOR MINIATURIZED AND POWER-EFFICIENT DEVICES ACROSS DIVERSE APPLICATIONS TO DRIVE SEGMENT

6.4 3D CHIP-ON-CHIP (COC)

6.4.1 NEED FOR COMPACT SOLUTIONS IN HIGH-PERFORMANCE COMPUTING APPLICATIONS TO FUEL SEGMENTAL GROWTH

6.5 WAFER LEVEL CHIP SCALE PACKAGING (WLCSP)

6.5.1 NEED TO REDUCE CONSUMPTION OF PACKAGING MATERIAL TO PROPEL ADOPTION OF WLCSP TECHNOLOGY

7 3D STACKING MARKET, BY METHOD (Page No. - 86)

7.1 INTRODUCTION

FIGURE 35 WAFER-TO-CHIP SEGMENT TO REGISTER HIGHEST CAGR IN MARKET DURING FORECAST PERIOD

TABLE 15 MARKET, BY METHOD, 2019–2022 (USD MILLION)

TABLE 16 MARKET, BY METHOD, 2023–2028 (USD MILLION)

7.2 DIE-TO-DIE

7.2.1 RISING NEED FOR COMPACT AND EFFICIENT DEVICE STRUCTURES TO BOOST ADOPTION OF DIE-TO-DIE STACKING

TABLE 17 DIE-TO-DIE: MARKET, BY INTERCONNECTING TECHNOLOGY, 2019–2022 (USD MILLION)

TABLE 18 DIE-TO-DIE: MARKET, BY INTERCONNECTING TECHNOLOGY, 2023–2028 (USD MILLION)

7.3 DIE-TO-WAFER

7.3.1 INCREASING FOCUS ON DEVICE PERFORMANCE ENHANCEMENT TO FUEL ADOPTION OF DIE-TO-WAFER INTEGRATION IN 3D STACKING

TABLE 19 DIE-TO-WAFER: MARKET, BY INTERCONNECTING TECHNOLOGY, 2019–2022 (USD MILLION)

TABLE 20 DIE-TO-WAFER: MARKET, BY INTERCONNECTING TECHNOLOGY, 2023–2028 (USD MILLION)

7.4 WAFER-TO-WAFER

7.4.1 GROWING DEMAND FOR ADVANCED COMPACT PACKAGING SOLUTIONS TO FUEL SEGMENTAL GROWTH

TABLE 21 WAFER-TO-WAFER: MARKET, BY INTERCONNECTING TECHNOLOGY, 2019–2022 (USD MILLION)

TABLE 22 WAFER-TO-WAFER: MARKET, BY INTERCONNECTING TECHNOLOGY, 2023–2028 (USD MILLION)

7.5 WAFER-TO-CHIP

7.5.1 RISING NEED FOR COMPACT AND EFFICIENT PACKAGING SOLUTIONS IN AUTOMOTIVE ELECTRONICS TO DRIVE SEGMENT

TABLE 23 WAFER-TO-CHIP: MARKET, BY INTERCONNECTING TECHNOLOGY, 2019–2022 (USD MILLION)

TABLE 24 WAFER-TO-CHIP: MARKET, BY INTERCONNECTING TECHNOLOGY, 2023–2028 (USD MILLION)

7.6 CHIP-TO-CHIP

7.6.1 GROWING NEED FOR HIGH-PERFORMANCE AND POWER-EFFICIENT ELECTRONIC DEVICES TO PROPEL SEGMENTAL GROWTH

TABLE 25 CHIP-TO-CHIP: MARKET, BY INTERCONNECTING TECHNOLOGY, 2019–2022 (USD MILLION)

TABLE 26 CHIP-TO-CHIP: 3D STACKING MARKET, BY INTERCONNECTING TECHNOLOGY, 2023–2028 (USD MILLION)

8 3D STACKING MARKET, BY INTERCONNECTING TECHNOLOGY (Page No. - 93)

8.1 INTRODUCTION

FIGURE 36 3D TSV SEGMENT TO CAPTURE LARGEST SHARE OF MARKET DURING FORECAST PERIOD

TABLE 27 MARKET, BY INTERCONNECTING TECHNOLOGY, 2019–2022 (USD MILLION)

TABLE 28 MARKET, BY INTERCONNECTING TECHNOLOGY, 2023–2028 (USD MILLION)

8.2 3D HYBRID BONDING

8.2.1 ADOPTION OF 3D HYBRID BONDING IN HIGH-PERFORMANCE COMPUTING AND DATA-INTENSIVE APPLICATIONS TO DRIVE MARKET

TABLE 29 3D HYBRID BONDING: MARKET, BY METHOD, 2019–2022 (USD MILLION)

TABLE 30 3D HYBRID BONDING: 3D STACKING MARKET, BY METHOD, 2023–2028 (USD MILLION)

8.3 3D THROUGH-SILICON VIA (TSV)

TABLE 31 3D TSV: MARKET, BY METHOD, 2019–2022 (USD MILLION)

TABLE 32 3D TSV: MARKET, BY METHOD, 2023–2028 (USD MILLION)

8.3.1 VIA-FIRST TSV

8.3.1.1 Increasing adoption of via-first TSV in applications requiring early-stage integration to drive market

8.3.2 VIA-MIDDLE TSV

8.3.2.1 Need for flexibility in vertical connections in semiconductor design to increase demand for via-middle TSV technology

8.3.3 VIA-LAST TSV

8.3.3.1 Growing adoption of via-last TSV technology in applications requiring late-stage interconnection to drive market

8.3.4 HYBRID TSV

8.3.4.1 Ability to meet specific design and performance requirements to fuel adoption of hybrid TSV

8.3.5 DEEP TRENCH TSV

8.3.5.1 Rising demand for enhanced electrical performance in advanced microprocessors and memory devices to drive market

8.3.6 MICROBUMP TSV

8.3.6.1 Rising demand for miniaturized and densely interconnected semiconductor devices to fuel market growth

8.3.7 THROUGH GLASS VIA (TGV)

8.3.7.1 Rising adoption of TGV technique in applications requiring transparent and hermetic packaging to drive market

8.4 MONOLITHIC 3D

8.4.1 ABILITY TO ADDRESS LIMITATIONS OF ADVANCED CMOS SCALING TO FUEL DEMAND FOR MONOLITHIC 3D INTEGRATION

TABLE 33 MONOLITHIC 3D INTEGRATION: MARKET, BY METHOD, 2019–2022 (USD MILLION)

TABLE 34 MONOLITHIC 3D INTEGRATION: MARKET, BY METHOD, 2023–2028 (USD MILLION)

9 3D STACKING MARKET, BY DEVICE TYPE (Page No. - 101)

9.1 INTRODUCTION

FIGURE 37 MEMS/SENSORS SEGMENT TO REGISTER HIGHEST CAGR IN 3D STACKING MARKET DURING FORECAST PERIOD

TABLE 35 MARKET, BY DEVICE TYPE, 2019–2022 (USD MILLION)

TABLE 36 MARKET, BY DEVICE TYPE, 2023–2028 (USD MILLION)

9.2 LOGIC ICS

9.2.1 RISING NEED FOR HIGH COMPUTATIONAL EFFICIENCY TO INDUCE DEMAND FOR LOGIC ICS

TABLE 37 LOGIC ICS: MARKET, BY END USER, 2019–2022 (USD MILLION)

TABLE 38 LOGIC ICS: MARKET, BY END USER, 2023–2028 (USD MILLION)

9.3 IMAGING & OPTOELECTRONICS

9.3.1 POTENTIAL TO IMPROVE IMAGE PROCESSING AND OPTICAL FUNCTIONALITIES TO SPUR ADOPTION OF 3D STACKING

TABLE 39 IMAGING & OPTOELECTRONICS: MARKET, BY END USER, 2019–2022 (USD MILLION)

TABLE 40 IMAGING & OPTOELECTRONICS: MARKET, BY END USER, 2023–2028 (USD MILLION)

9.4 MEMORY DEVICES

9.4.1 SURGING DEMAND FOR HIGH-BANDWIDTH MEMORY TO FOSTER MARKET GROWTH

TABLE 41 MEMORY DEVICES: MARKET, BY END USER, 2019–2022 (USD MILLION)

TABLE 42 MEMORY DEVICES: MARKET, BY END USER, 2023–2028 (USD MILLION)

9.5 MEMS/SENSORS

9.5.1 GROWING REQUIREMENT FOR COMPACT AND ACCURATE SENSING TECHNOLOGIES TO FUEL UPTAKE OF 3D STACKING

TABLE 43 MEMS/SENSORS: MARKET, BY END USER, 2019–2022 (USD MILLION)

TABLE 44 MEMS/SENSORS: MARKET, BY END USER, 2023–2028 (USD MILLION)

9.6 LIGHT EMITTING DIODES (LEDS)

9.6.1 RISING DEMAND FOR INNOVATIVE DESIGNS AND IMPROVED LUMINOSITY IN LEDS TO FUEL SEGMENTAL GROWTH

TABLE 45 LEDS: MARKET, BY END USER, 2019–2022 (USD MILLION)

TABLE 46 LEDS: MARKET, BY END USER, 2023–2028 (USD MILLION)

9.7 OTHERS

TABLE 47 OTHERS: MARKET, BY END USER, 2019–2022 (USD MILLION)

TABLE 48 OTHERS: MARKET, BY END USER, 2023–2028 (USD MILLION)

10 3D STACKING MARKET, BY END USER (Page No. - 111)

10.1 INTRODUCTION

FIGURE 38 AUTOMOTIVE SEGMENT TO RECORD HIGHEST CAGR IN MARKET DURING FORECAST PERIOD

TABLE 49 MARKET, BY END USER, 2019–2022 (USD MILLION)

TABLE 50 MARKET, BY END USER, 2023–2028 (USD MILLION)

10.2 CONSUMER ELECTRONICS

10.2.1 INCREASING TECHNOLOGICAL ADVANCEMENTS IN CONSUMER ELECTRONICS TO DRIVE ADOPTION OF 3D STACKING

TABLE 51 CONSUMER ELECTRONICS: 3D STACKING MARKET, BY DEVICE TYPE, 2019–2022 (USD MILLION)

TABLE 52 CONSUMER ELECTRONICS: MARKET, BY DEVICE TYPE, 2023–2028 (USD MILLION)

TABLE 53 CONSUMER ELECTRONICS: MARKET, BY REGION, 2019–2022 (USD MILLION)

TABLE 54 CONSUMER ELECTRONICS: MARKET, BY REGION, 2023–2028 (USD MILLION)

10.3 MANUFACTURING

10.3.1 INCREASING SHIFT TOWARD SMART FACTORIES AND INDUSTRY 4.0 TO FUEL ADOPTION OF 3D STACKING

TABLE 55 MANUFACTURING: 3D STACKING MARKET, BY DEVICE TYPE, 2019–2022 (USD MILLION)

TABLE 56 MANUFACTURING: MARKET, BY DEVICE TYPE, 2023–2028 (USD MILLION)

TABLE 57 MANUFACTURING: MARKET, BY REGION, 2019–2022 (USD MILLION)

TABLE 58 MANUFACTURING: MARKET, BY REGION, 2023–2028 (USD MILLION)

10.4 COMMUNICATIONS

10.4.1 INTEGRATION OF ADVANCED FUNCTIONALITIES IN HIGH-PERFORMANCE COMPUTING APPLICATIONS TO DRIVE MARKET

TABLE 59 COMMUNICATIONS: MARKET, BY DEVICE TYPE, 2019–2022 (USD MILLION)

TABLE 60 COMMUNICATIONS: MARKET, BY DEVICE TYPE, 2023–2028 (USD MILLION)

TABLE 61 COMMUNICATIONS: MARKET, BY REGION, 2019–2022 (USD MILLION)

TABLE 62 COMMUNICATIONS: MARKET, BY REGION, 2023–2028 (USD MILLION)

10.5 AUTOMOTIVE

10.5.1 RISING DEMAND FOR COMPACT AND POWERFUL AUTOMOTIVE ELECTRONIC SYSTEMS TO PROPEL MARKET GROWTH

TABLE 63 AUTOMOTIVE: MARKET, BY DEVICE TYPE, 2019–2022 (USD MILLION)

TABLE 64 AUTOMOTIVE: MARKET, BY DEVICE TYPE, 2023–2028 (USD MILLION)

TABLE 65 AUTOMOTIVE: MARKET, BY REGION, 2019–2022 (USD MILLION)

TABLE 66 AUTOMOTIVE: MARKET, BY REGION, 2023–2028 (USD MILLION)

10.6 HEALTHCARE

10.6.1 SURGING DEMAND FOR ADVANCED MEDICAL EQUIPMENT FOR HIGH PERFORMANCE AND EFFICIENCY TO FUEL MARKET GROWTH

TABLE 67 HEALTHCARE: MARKET, BY DEVICE TYPE, 2019–2022 (USD MILLION)

TABLE 68 HEALTHCARE: MARKET, BY DEVICE TYPE, 2023–2028 (USD MILLION)

TABLE 69 HEALTHCARE: MARKET, BY REGION, 2019–2022 (USD MILLION)

TABLE 70 HEALTHCARE: 3D STACKING MARKET, BY REGION, 2023–2028 (USD MILLION)

10.7 OTHERS

TABLE 71 OTHERS: 3D STACKING MARKET, BY DEVICE TYPE, 2019–2022 (USD MILLION)

TABLE 72 OTHERS: MARKET, BY DEVICE TYPE, 2023–2028 (USD MILLION)

TABLE 73 OTHERS: MARKET, BY REGION, 2019–2022 (USD MILLION)

TABLE 74 OTHERS: MARKET, BY REGION, 2023–2028 (USD MILLION)

11 3D STACKING MARKET, BY REGION (Page No. - 125)

11.1 INTRODUCTION

FIGURE 39 ASIA PACIFIC TO RECORD HIGHEST CAGR IN MARKET DURING FORECAST PERIOD

TABLE 75 MARKET, BY REGION, 2019–2022 (USD MILLION)

TABLE 76 MARKET, BY REGION, 2023–2028 (USD MILLION)

11.2 NORTH AMERICA

FIGURE 40 NORTH AMERICA: 3D STACKING MARKET SNAPSHOT

TABLE 77 NORTH AMERICA: MARKET, BY COUNTRY, 2019–2022 (USD MILLION)

TABLE 78 NORTH AMERICA: MARKET, BY COUNTRY, 2023–2028 (USD MILLION)

TABLE 79 NORTH AMERICA: MARKET, BY END USER, 2019–2022 (USD MILLION)

TABLE 80 NORTH AMERICA: MARKET, BY END USER, 2023–2028 (USD MILLION)

11.2.1 US

11.2.1.1 Presence of fabrication business giants to support market growth

TABLE 81 US: MARKET, BY END USER, 2019–2022 (USD MILLION)

TABLE 82 US: MARKET, BY END USER, 2023–2028 (USD MILLION)

11.2.2 CANADA

11.2.2.1 Increasing focus on innovation and technological advancements to foster market growth

TABLE 83 CANADA: MARKET, BY END USER, 2019–2022 (USD MILLION)

TABLE 84 CANADA: MARKET, BY END USER, 2023–2028 (USD MILLION)

11.2.3 MEXICO

11.2.3.1 Government-led initiatives to develop semiconductor industry to fuel market growth

TABLE 85 MEXICO: MARKET, BY END USER, 2019–2022 (USD MILLION)

TABLE 86 MEXICO: MARKET, BY END USER, 2023–2028 (USD MILLION)

11.2.4 NORTH AMERICA: RECESSION IMPACT

11.3 EUROPE

FIGURE 41 EUROPE: 3D STACKING MARKET SNAPSHOT

TABLE 87 EUROPE: MARKET, BY COUNTRY, 2019–2022 (USD MILLION)

TABLE 88 EUROPE: MARKET, BY COUNTRY, 2023–2028 (USD MILLION)

TABLE 89 EUROPE: MARKET, BY END USER, 2019–2022 (USD MILLION)

TABLE 90 EUROPE: MARKET, BY END USER, 2023–2028 (USD MILLION)

11.3.1 GERMANY

11.3.1.1 Growing production of automobiles to create demand for 3D stacking

TABLE 91 GERMANY: MARKET, BY END USER, 2019–2022 (USD MILLION)

TABLE 92 GERMANY: MARKET, BY END USER, 2023–2028 (USD MILLION)

11.3.2 FRANCE

11.3.2.1 Increasing R&D in 3D stacking to drive market

TABLE 93 FRANCE: MARKET, BY END USER, 2019–2022 (USD MILLION)

TABLE 94 FRANCE: MARKET, BY END USER, 2023–2028 (USD MILLION)

11.3.3 UK

11.3.3.1 5G implementation to create conducive environment for market growth

TABLE 95 UK: MARKET, BY END USER, 2019–2022 (USD MILLION)

TABLE 96 UK: MARKET, BY END USER, 2023–2028 (USD MILLION)

11.3.4 REST OF EUROPE

TABLE 97 REST OF EUROPE: MARKET, BY END USER, 2019–2022 (USD MILLION)

TABLE 98 REST OF EUROPE: MARKET, BY END USER, 2023–2028 (USD MILLION)

11.3.5 EUROPE: RECESSION IMPACT

11.4 ASIA PACIFIC

FIGURE 42 ASIA PACIFIC: 3D STACKING MARKET SNAPSHOT

TABLE 99 ASIA PACIFIC: MARKET, BY COUNTRY, 2019–2022 (USD MILLION)

TABLE 100 ASIA PACIFIC: MARKET, BY COUNTRY, 2023–2028 (USD MILLION)

TABLE 101 ASIA PACIFIC: MARKET, BY END USER, 2019–2022 (USD MILLION)

TABLE 102 ASIA PACIFIC: MARKET, BY END USER, 2023–2028 (USD MILLION)

11.4.1 CHINA

11.4.1.1 Increasing investments in semiconductor industry to drive market

TABLE 103 CHINA: MARKET, BY END USER, 2019–2022 (USD MILLION)

TABLE 104 CHINA: MARKET, BY END USER, 2023–2028 (USD MILLION)

11.4.2 JAPAN

11.4.2.1 Increasing focus on precision engineering to boost adoption of 3D stacking

TABLE 105 JAPAN: MARKET, BY END USER, 2019–2022 (USD MILLION)

TABLE 106 JAPAN: MARKET, BY END USER, 2023–2028 (USD MILLION)

11.4.3 SOUTH KOREA

11.4.3.1 Growing focus on innovation and research to contribute to market growth

TABLE 107 SOUTH KOREA: MARKET, BY END USER, 2019–2022 (USD MILLION)

TABLE 108 SOUTH KOREA: MARKET, BY END USER, 2023–2028 (USD MILLION)

11.4.4 TAIWAN

11.4.4.1 Rising demand for compact, efficient, and high-performing chips to support market growth

TABLE 109 TAIWAN: MARKET, BY END USER, 2019–2022 (USD MILLION)

TABLE 110 TAIWAN: MARKET, BY END USER, 2023–2028 (USD MILLION)

11.4.5 REST OF ASIA PACIFIC

TABLE 111 REST OF ASIA PACIFIC: MARKET, BY END USER, 2019–2022 (USD MILLION)

TABLE 112 REST OF ASIA PACIFIC: MARKET, BY END USER, 2023–2028 (USD MILLION)

11.4.6 ASIA PACIFIC: RECESSION IMPACT

11.5 REST OF THE WORLD (ROW)

TABLE 113 ROW: 3D STACKING MARKET, BY REGION, 2019–2022 (USD MILLION)

TABLE 114 ROW: MARKET, BY REGION, 2023–2028 (USD MILLION)

TABLE 115 ROW: MARKET, BY END USER, 2019–2022 (USD MILLION)

TABLE 116 ROW: MARKET, BY END USER, 2023–2028 (USD MILLION)

11.5.1 MIDDLE EAST & AFRICA

11.5.1.1 Government initiatives to strengthen semiconductor industry to favor market growth

TABLE 117 MIDDLE EAST & AFRICA: MARKET, BY END USER, 2019–2022 (USD MILLION)

TABLE 118 MIDDLE EAST & AFRICA: MARKET, BY END USER, 2023–2028 (USD MILLION)

11.5.2 SOUTH AMERICA

11.5.2.1 Growing demand for advanced architecture and high-end computing to contribute to market growth

TABLE 119 SOUTH AMERICA: MARKET, BY END USER, 2019–2022 (USD MILLION)

TABLE 120 SOUTH AMERICA: MARKET, BY END USER, 2023–2028 (USD MILLION)

11.5.3 ROW: RECESSION IMPACT

12 COMPETITIVE LANDSCAPE (Page No. - 155)

12.1 INTRODUCTION

12.2 STRATEGIES ADOPTED BY KEY PLAYERS

TABLE 121 OVERVIEW OF STRATEGIES ADOPTED BY KEY PLAYERS IN 3D STACKING MARKET

12.2.1 PRODUCT PORTFOLIO

12.2.2 REGIONAL FOCUS

12.2.3 ORGANIC/INORGANIC GROWTH STRATEGIES

12.3 MARKET SHARE ANALYSIS, 2022

TABLE 122 3D STACKING MARKET: MARKET SHARE ANALYSIS, 2022

12.4 REVENUE ANALYSIS OF KEY PLAYERS IN 3D STACKING MARKET

FIGURE 43 FIVE-YEAR REVENUE ANALYSIS OF KEY PLAYERS IN 3D STACKING MARKET

12.5 KEY COMPANY EVALUATION MATRIX, 2022

12.5.1 STARS

12.5.2 PERVASIVE PLAYERS

12.5.3 EMERGING LEADERS

12.5.4 PARTICIPANTS

FIGURE 44 3D STACKING MARKET (GLOBAL): KEY COMPANY EVALUATION MATRIX, 2022

12.6 COMPETITIVE BENCHMARKING

12.6.1 COMPANY FOOTPRINT, BY INTERCONNECTING METHOD

12.6.2 COMPANY FOOTPRINT, BY DEVICE TYPE

12.6.3 COMPANY FOOTPRINT, BY END USER

12.6.4 COMPANY FOOTPRINT, BY REGION

12.6.5 OVERALL COMPANY FOOTPRINT

12.7 STARTUPS/SMALL AND MEDIUM-SIZED ENTERPRISES (SMES) EVALUATION MATRIX, 2022

TABLE 123 3D STACKING MARKET: DETAILED LIST OF KEY STARTUPS/SMES

12.7.1 COMPETITIVE BENCHMARKING OF KEY STARTUPS/SMES

TABLE 124 COMPANY FOOTPRINT, BY INTERCONNECTING METHODS

TABLE 125 COMPANY FOOTPRINT, BY DEVICE TYPE

TABLE 126 COMPANY FOOTPRINT, BY END USER INDUSTRY

TABLE 127 COMPANY FOOTPRINT, BY REGION

12.7.2 PROGRESSIVE COMPANIES

12.7.3 RESPONSIVE COMPANIES

12.7.4 DYNAMIC COMPANIES

12.7.5 STARTING BLOCKS

FIGURE 45 3D STACKING MARKET (GLOBAL): STARTUPS/SMES EVALUATION MATRIX, 2022

12.8 COMPETITIVE SCENARIOS AND TRENDS

12.8.1 PRODUCT LAUNCHES & DEVELOPMENTS

TABLE 128 3D STACKING MARKET: PRODUCT LAUNCHES/DEVELOPMENTS, 2020–2023

12.8.2 DEALS

TABLE 129 3D STACKING MARKET: DEALS, 2020–2023

13 COMPANY PROFILES (Page No. - 175)

13.1 INTRODUCTION

13.2 KEY PLAYERS

(Business overview, Products/Solutions/Services offered, Recent developments, Product launches, Deals, MnM view, Key strengths/Right to win, Strategic choices, and Weaknesses/Competitive threats)*

13.2.1 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED

TABLE 130 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: COMPANY OVERVIEW

FIGURE 46 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD: COMPANY SNAPSHOT

TABLE 131 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: PRODUCTS/SERVICES/SOLUTIONS OFFERED

TABLE 132 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: PRODUCT LAUNCHES

TABLE 133 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: DEALS

TABLE 134 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: OTHERS

13.2.2 SAMSUNG

TABLE 135 SAMSUNG: COMPANY OVERVIEW

FIGURE 47 SAMSUNG: COMPANY SNAPSHOT

TABLE 136 SAMSUNG: PRODUCTS/SERVICES/SOLUTIONS OFFERED

TABLE 137 SAMSUNG: PRODUCT LAUNCHES

TABLE 138 SAMSUNG: DEALS

13.2.3 INTEL CORPORATION

TABLE 139 INTEL CORPORATION: COMPANY OVERVIEW

FIGURE 48 INTEL CORPORATION: COMPANY SNAPSHOT

TABLE 140 INTEL CORPORATION: PRODUCTS/SERVICES/SOLUTIONS OFFERED

13.2.4 SK HYNIX INC.

TABLE 141 SK HYNIX INC.: COMPANY OVERVIEW

FIGURE 49 SK HYNIX INC.: COMPANY SNAPSHOT

TABLE 142 SK HYNIX INC.: PRODUCTS/SERVICES/SOLUTIONS OFFERED

TABLE 143 SK HYNIX INC.: DEALS

13.2.5 ADVANCED MICRO DEVICES, INC.

TABLE 144 ADVANCED MICRO DEVICES, INC.: COMPANY OVERVIEW

FIGURE 50 ADVANCED MICRO DEVICES, INC.: COMPANY SNAPSHOT

TABLE 145 ADVANCED MICRO DEVICES, INC.: PRODUCTS/SERVICES/SOLUTIONS OFFERED

TABLE 146 ADVANCED MICRO DEVICES, INC.: DEALS

13.2.6 ASE TECHNOLOGY HOLDING CO., LTD.

TABLE 147 ASE TECHNOLOGY HOLDING CO., LTD.: COMPANY OVERVIEW

FIGURE 51 ASE TECHNOLOGY HOLDING CO., LTD.: COMPANY SNAPSHOT

TABLE 148 ASE TECHNOLOGY HOLDING CO., LTD.: PRODUCTS/SERVICES/SOLUTIONS OFFERED

TABLE 149 ASE TECHNOLOGY HOLDING CO., LTD.: PRODUCT LAUNCHES

13.2.7 AMKOR TECHNOLOGY

TABLE 150 AMKOR TECHNOLOGY: COMPANY OVERVIEW

FIGURE 52 AMKOR TECHNOLOGY: COMPANY SNAPSHOT

TABLE 151 AMKOR TECHNOLOGY: PRODUCTS/SERVICES/SOLUTIONS OFFERED

TABLE 152 AMKOR TECHNOLOGY: DEALS

13.2.8 JIANGSU CHANGDIAN TECHNOLOGY CO., LTD.

TABLE 153 JIANGSU CHANGDIAN TECHNOLOGY CO., LTD.: COMPANY OVERVIEW

FIGURE 53 JIANGSU CHANGDIAN TECHNOLOGY CO., LTD.: COMPANY SNAPSHOT

TABLE 154 JIANGSU CHANGDIAN TECHNOLOGY CO., LTD.: PRODUCTS/SERVICES/SOLUTIONS OFFERED

TABLE 155 JIANGSU CHANGDIAN TECHNOLOGY CO., LTD.: PRODUCT LAUNCHES

TABLE 156 JIANGSU CHANGDIAN TECHNOLOGY CO., LTD.: DEALS

13.2.9 TEXAS INSTRUMENTS INCORPORATED

TABLE 157 TEXAS INSTRUMENTS INCORPORATED: COMPANY OVERVIEW

FIGURE 54 TEXAS INSTRUMENTS INCORPORATED: COMPANY SNAPSHOT

TABLE 158 TEXAS INSTRUMENTS INCORPORATED: PRODUCTS/SERVICES/SOLUTIONS OFFERED

TABLE 159 TEXAS INSTRUMENTS INCORPORATED: DEALS

13.2.10 UNITED MICROELECTRONICS CORPORATION

TABLE 160 UNITED MICROELECTRONICS CORPORATION: COMPANY OVERVIEW

FIGURE 55 UNITED MICROELECTRONICS CORPORATION: COMPANY SNAPSHOT

TABLE 161 UNITED MICROELECTRONICS CORPORATION: PRODUCTS/SERVICES/SOLUTIONS OFFERED

TABLE 162 UNITED MICROELECTRONICS CORPORATION: DEALS

13.2.11 POWERTECH TECHNOLOGY INC

TABLE 163 POWERTECH TECHNOLOGY INC: COMPANY OVERVIEW

FIGURE 56 POWERTECH TECHNOLOGY INC: COMPANY SNAPSHOT

TABLE 164 POWERTECH TECHNOLOGY INC: PRODUCTS/SERVICES/SOLUTIONS OFFERED

13.2.12 CADENCE DESIGN SYSTEMS, INC.

TABLE 165 CADENCE DESIGN SYSTEMS, INC.: COMPANY OVERVIEW

FIGURE 57 CADENCE DESIGN SYSTEMS, INC.: COMPANY SNAPSHOT

TABLE 166 CADENCE DESIGN SYSTEMS, INC.: PRODUCTS/SERVICES/SOLUTIONS OFFERED

TABLE 167 CADENCE DESIGN SYSTEMS, INC.: DEALS

13.2.13 BROADCOM

TABLE 168 BROADCOM: COMPANY OVERVIEW

FIGURE 58 BROADCOM: COMPANY SNAPSHOT

TABLE 169 BROADCOM: PRODUCTS/SERVICES/SOLUTIONS OFFERED

TABLE 170 BROADCOM: DEALS

13.2.14 TOWER SEMICONDUCTOR

TABLE 171 TOWER SEMICONDUCTOR: COMPANY OVERVIEW

FIGURE 59 TOWER SEMICONDUCTOR: COMPANY SNAPSHOT

TABLE 172 TOWER SEMICONDUCTOR: PRODUCTS/SERVICES/SOLUTIONS OFFERED

TABLE 173 TOWER SEMICONDUCTOR: DEALS

13.2.15 IBM

TABLE 174 IBM: COMPANY OVERVIEW

FIGURE 60 IBM: COMPANY SNAPSHOT

TABLE 175 IBM: PRODUCTS/SERVICES/SOLUTIONS OFFERED

TABLE 176 IBM: PRODUCT LAUNCHES

13.2.16 TOKYO ELECTRON LIMITED

TABLE 177 TOKYO ELECTRON LIMITED: COMPANY OVERVIEW

FIGURE 61 TOKYO ELECTRON LIMITED: COMPANY SNAPSHOT

TABLE 178 TOKYO ELECTRON LIMITED: PRODUCTS/SERVICES/SOLUTIONS OFFERED

TABLE 179 TOKYO ELECTRON LIMITED: PRODUCT LAUNCHES

13.2.17 CEA-LETI

TABLE 180 CEA-LETI: COMPANY OVERVIEW

TABLE 181 CEA-LETI: PRODUCTS/SERVICES/SOLUTIONS OFFERED

*Details on Business overview, Products/Solutions/Services offered, Recent developments, Product launches, Deals, MnM view, Key strengths/Right to win, Strategic choices, and Weaknesses/Competitive threats might not be captured in case of unlisted companies.

13.3 OTHER PLAYERS

13.3.1 SILICONWARE PRECISION INDUSTRIES CO., LTD.

13.3.2 GLOBALFOUNDRIES INC.

13.3.3 NHANCED SEMICONDUCTORS

13.3.4 DECA TECHNOLOGIES

13.3.5 TEZZARON

13.3.6 TELEDYNE TECHNOLOGIES INCORPORATED

13.3.7 HUAWEI TECHNOLOGIES CO. LTD.

13.3.8 QUALCOMM TECHNOLOGIES, INC.

13.3.9 3M

13.3.10 AYAR LABS, INC.

13.3.11 APPLIED MATERIALS, INC.

13.3.12 MONOLITHIC 3D INC.

13.3.13 MOLDEX3D

13.3.14 CEREBRAS

13.3.15 XPERI INC.

14 APPENDIX (Page No. - 238)

14.1 DISCUSSION GUIDE

14.2 KNOWLEDGESTORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL

14.3 CUSTOMIZATION OPTIONS

14.4 RELATED REPORTS

14.5 AUTHOR DETAILS

The research study involved 4 major activities in estimating the size of the 3D stacking market. Exhaustive secondary research has been done to collect important information about the market and peer markets. The validation of these findings, assumptions, and sizing with the help of primary research with industry experts across the value chain has been the next step. Both top-down and bottom-up approaches have been used to estimate the market size. Post which the market breakdown and data triangulation have been adopted to estimate the market sizes of segments and sub-segments.

Secondary Research

In the secondary research process, various secondary sources were referred to for identifying and collecting information required for this study. The secondary sources include annual reports, press releases, and investor presentations of companies, white papers, and articles from recognized authors. Secondary research was mainly done to obtain key information about the market’s value chain, the pool of key market players, market segmentation according to industry trends, and regional outlook and developments from both market and technology perspectives.

Primary Research

In the primary research, various primary sources from both supply and demand sides were interviewed to obtain qualitative and quantitative insights required for this report. Primary sources from the supply side include experts such as CEOs, vice presidents, marketing directors, equipment manufacturers, technology and innovation directors, end users, and related executives from multiple key companies and organizations operating in the 3D stacking market ecosystem.

3D Stacking Market Size, and Share

To know about the assumptions considered for the study, download the pdf brochure

Market Size Estimation

In the complete market engineering process, both top-down and bottom-up approaches were used along with several data triangulation methods to estimate and forecast the overall market segments and subsegments listed in this report.

Estimating market size by bottom-up approach (demand side)

Identifying the entities in the semiconductor value chain influencing the entire 3D stacking industry
Analyzing each type of entity along with related major companies identifying service providers for the implementation of products and services
Estimating the market for these 3D stacking end users
Understanding the demand generated by the semiconductor industry-related companies
Tracking ongoing and upcoming implementation of 3D stacking developments by various companies and forecasting the market based on these developments and other critical parameters
Arriving at the market size by analyzing 3D stacking companies based on their countries, and then combining it to get the market estimate by region
Verifying estimates and crosschecking them by a discussion with key opinion leaders, which include CXOs, directors, and operation managers
Studying various paid and unpaid sources of information, such as annual reports, press releases, white papers, databases, and so on

Market Size Estimation Methodology-Bottom-up Approach

3D Stacking Market Size, and Bottom-up approach

Data Triangulation

After arriving at the overall market size from the market size estimation process explained in the previous section, the total market was split into several segments and subsegments. Data triangulation procedure was employed, wherever applicable, to complete the overall market engineering process and arrive at the exact statistics for all segments and subsegments. The data was triangulated by studying various factors and trends from the demand and supply sides, and the market size was validated using top-down and bottom-up approaches.

Market Definition

3D stacking is a process of stacking multiple chips, dies or wafers on top of each other and interconnecting them vertically. This can be done using a variety of methods, including through-silicon vias (TSVs), hybrid bonding or monolithic 3D integration. Vertical stacking of components in 3D ICs enables a significantly greater component density compared to conventional 2D ICs. This results in the ability to fit more components into a smaller space, thereby enhancing functionality and improving performance within a given form factor.

Stakeholders

Suppliers of Raw Materials and Manufacturing Equipment
Providers and Manufacturers of Components
Providers of Software Solutions
Manufacturers and Providers of Semiconductor Devices
Original Equipment Manufacturers (OEMs)
ODM and OEM Technology Solution Providers
Suppliers and Distributors of Semiconductor Manufacturing Devices
System Integrators
Middleware Providers
Assembly, Testing, and Packaging Vendors
Market Research and Consulting Firms
Associations, Organizations, Forums, and Alliances Related to the Semiconductor Packaging
Technology Investors
Governments, Regulatory Bodies, and Financial Institutions
Venture Capitalists, Private Equity Firms, and Startups
End Users

The main objectives of this study are as follows:

To define, describe, and forecast the 3D stacking market, in terms of value, based on method, interconnecting technology, device type and end user
To forecast the market size, in terms of value, for various segments with respect to four regions, namely, North America, Europe, Asia Pacific, and Rest of the World
To provide detailed information regarding the major factors influencing the growth of the market (drivers, restraints, opportunities, and challenges)
To strategically analyze the micromarkets1 with respect to individual growth trends, future prospects, and contributions to the total market
To analyze opportunities in the market for stakeholders by identifying high-growth segments of the 3D stacking market
To provide a detailed overview of the value chain of the market and analyze market trends with Porter’s five forces analytical framework
To strategically profile the key players and comprehensively analyze their market position in terms of ranking and core competencies2 along with detailing the competitive landscape for market leaders
To analyze strategic developments such as product launches and related developments, acquisitions, expansions, and agreements in the 3D stacking market
To track and analyze competitive developments, such as partnerships, collaborations, agreements, joint ventures, mergers and acquisitions, expansions, product launches, and other developments in the market

Available Customizations:

With the given market data, MarketsandMarkets offers customizations according to the specific requirements of companies. The following customization options are available for the report:

Country-wise Information:

Analysis for additional countries (up to five)

Company Information:

Detailed analysis and profiling of additional market players (up to five)

Custom Market Research Services

We will customize the research for you, in case the report listed above does not meet with your exact requirements. Our custom research will comprehensively cover the business information you require to help you arrive at strategic and profitable business decisions.