The 3D stacking market is estimated to be worth USD 1.2 billion in 2023 and is projected to reach USD 3.1 billion by 2028, at a CAGR of 20.4% during the forecast period. The increasing usage of heterogeneous integration and component optimization to improve manufacturing of electronic components is a major factor driving the growth of 3D stacking market globally. Moreover, growing adoption 3D stacking technology to provide shorter interconnect and reduced power consumption is also key factor contributing to the market growth.
Taiwan Semiconductor Manufacturing Company Limited (Taiwan), Intel Corporation (US), Samsung (South Korea), Advanced Micro Devices, Inc. (US), ASE (Taiwan), GlobalFoundries Inc. (US), United Microelectronics Corporation (Taiwan), Jiangsu Changdian Technology Co., Ltd. (China), SK HYNIX INC. (South Korea), Powertech Technologies Inc. (Taiwan) and, Tokyo Electron Limited (Japan) and many more. These market players have adopted various strategies such as development of advanced products, partnerships, collaborations, agreements, joint ventures, and acquisitions to strengthen their position in the 3D stacking market. The organic and inorganic strategies have helped the market players to expand themselves globally by providing advanced solutions for 3D stacking.
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Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan)
Taiwan Semiconductor Manufacturing Company (TSMC) is one of the world's leading semiconductor foundries, and it offers a variety of advanced packaging and stacking technologies to meet the needs of its customers. TSMC's SoIC technologies include Chip-on-Wafer (CoW) and Wafer-on-Wafer (WoW) die stacking. Backend 3D stacking technologies, such as CoWoS® (Chip-on-Wafer-on-Substrate), allow for the stacking of dies on a substrate. This can be used to create chips in packages that are smaller and more energy efficient. TSMC's 3DFabric technologies are used in a wide range of products, including smartphones, tablets, laptops, servers, and supercomputers. TSMC's 3D IC packaging solutions are designed to optimize power consumption, performance, and form factor, making them well-suited for high-performance computing applications. They are also used in emerging applications such as artificial intelligence, machine learning, and the IoT.
Samsung (South Korea)
Samsung is one of the leading semiconductor manufacturers and offers a range of advanced packaging technologies, including 3D stacking. Samsung has been actively researching and implementing 3D stacking technology in various electronic components like DRAM, HBM memory, processors, and NAND flash memory. This approach involves vertically stacking multiple layers of circuitry to improve performance, increase memory capacities, and reduce power consumption in devices like smartphones, data centers, and SSDs. Samsung's X-Cube is a 3D IC packaging technology that uses through-silicon vias (TSVs) to stack dies vertically. X-Cube can be used to create chips with more cores, more memory, or specialized functionality. Samsung Foundry's 3D stacking technologies are used in a wide range of products, including smartphones, tablets, laptops, servers, and supercomputers.
Intel Corporation (US)
Intel is a leading technology company specializing in 3D stacking, a revolutionary approach to integrated circuits. They employ advanced vertical stacking techniques, allowing for higher component density in microchips. This innovation enhances the functionality and performance of their semiconductor products, making them highly competitive in the industry. With a strong commitment to research and development, Intel continues to push the boundaries of 3D IC technology, driving progress in computing and electronics. Their expertise in 3D stacking positions them as a key player in the ever-evolving semiconductor market.
SK HYNIX INC. (South Korea)
SK Hynix is a South Korean semiconductor company that specializes in memory chips. It is the world's second-largest supplier of DRAM chips and a supplier of NAND flash chips. SK Hynix is also a leader in 3D stacking technology. The company offers a comprehensive portfolio of 3D stacking solutions, including 3DS and CMOS-under-array. CMOS-under-array is a 3D stacking technology that allows for the stacking of logic and memory chips on a single wafer. This can lead to significant performance and power efficiency improvements.
Amkor Technology (US)
Amkor Technology, a well-known company in the semiconductor packaging market, is renowned for its knowledge of 3D stacking techniques. They specialise in cutting-edge packaging options that enable increased component densities, boosting integrated circuit performance and usefulness. Amkor is dedicated to innovation, and as a result, it plays a crucial role in advancing 3D IC technology and the advancement of electronics and computing. They have cemented their place as a major participant in the semiconductor packaging business by providing cutting-edge packaging solutions to a variety of sectors.
3D Stacking Market by Method (Die-to-Die, Die-to-Wafer, Wafer-to-Wafer, Chip-to-Chip, Chip-to-Wafer), Technology (Through-Silicon Via, Hybrid Bonding, Monolithic 3D Integration), Device (Logic ICs, Optoelectronics, Memory, MEMS) - Global Forecast to 2028
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