Semiconductor Bonding Market

Semiconductor Bonding Market by Type (Die Bonder, Wafer Bonder, and Flip Chip Bonder), Application (RF Devices, MEMS and Sensors, LED, 3D NAND and CMOS Image Sensors), Process Type, Technology and Region - Global Forecast to 2026

Report Code: SE 7972 Sep, 2021, by marketsandmarkets.com

[205 Pages Report] The global semiconductor bonding market size is projected to grow from USD 887 million in 2021 to USD 1,059 million by 2026; it is expected to grow at a CAGR of 3.6% from 2021 to 2026. Factors such as growing demand for MEMs and surge in demand for electric vehicle are driving the growth of the market during the forecast period.

Semiconductor Bonding Market

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COVID-19 Impact on the Global Semiconductor bonding market

With the increasing spread of COVID-19, there is a rise in the number of healthcare facilities to accommodate the growing number of patients globally. This has increased the demand for energy-efficient LED lighting technologies in healthcare facilities, which is expected to drive the demand for semiconductor bonding equipment.

LED is anticipated to be the fastest-growing application segment of the semiconductor bonding market with a CAGR of 5.1% between 2021 and 2026. This segment has witnessed a lower impact compared with other segments, due to the growing penetration of LEDs in several sectors, such as consumer electronics, automotive, commercial, residential, and architectural. LEDs are widely used in commercial and industrial spaces, as LED lighting offers various benefits, including energy efficiency, lower heat emission, cost-effectiveness, and nanosecond switching capability. The use of thin wafers in LED devices offers various benefits, such as high efficiency and low power consumption. The increasing demand for LED components in the healthcare sector propelled the market growth after the COVID-19 pandemic.

Semiconductor bonding Market Dynamics

Driver: Increasing adoption of stacked die technology in IoT devices

The increasing adoption of stacked die technology in IoT devices is driving the growth of the semiconductor bonding market. Stacked die refers to attaching one bare die on top of each other within a single semiconductor package; it is used to utilize the same placement area on a substrate for multiple functionalities. Die stacking leads to better electrical performance of devices, as the shorter routing of interconnections between circuits results in faster signal generation. Original equipment manufacturers (OEMs) in the semiconductor industry are focusing on leveraging the benefits of IoT beyond connectivity. IoT devices and technologies such as sensors, RFID tags, smart meters, smart beacons, and distribution control systems are increasingly being deployed in applications such as building and home automation, smart manufacturing, connected logistics, smart retail, smart mobility and transportation, etc. Semiconductor bonding techniques are used in IoT devices to attach multi-stacked dies on substrates using minimum space.

Restraint: High cost of ownership

Semiconductor bonding equipment are sophisticated machines that require high input power to perform die attach operations. The power consumed by these equipment varies from hundreds to thousands of watts. The manufacturing cost of semiconductor bonding equipment is also very high due to the implementation of complex expensive components. The assembly of different big and small parts, such as screen, bonding hand, vacuum, sensors, and the heat source, is also costly. Thus, the overall production and ownership costs of semiconductor bonding equipment for die bonder equipment are relatively high. Additionally, the exorbitant cost of semiconductor wafers increases the operating cost of the semiconductor bonding, thereby hindering the market’s growth.

Opportunity: Expanding IC industry in China

The growing demand for thin wafers in the semiconductor industry is a major reason for the growth of the wafer bonding market. The advancements in thin wafers have helped overcome many traditional fabrication processes. With benefits such as ultra-low power consumption and ultra-high electrical performance, the thin wafer industry is attracting Chinese IC manufacturers looking to leverage this technology. At present, the need for thin chips for high performance at a low operating voltage and low cost is the main motive of many IC suppliers in China. Therefore, thin wafer technologies, including wafer bonding, are gaining popularity among Chinese IC manufacturers such as Hisilicon Technologies, Co., Ltd. (China), Spreadtrum Communications (China), and RDA Microelectronics (China).

For instance, in June 2020, GlobalWafers Co., Ltd. invested NTD 10 billion (USD 339 million) in its Taisil (Taiwan) branch to boost the 300-mm silicon wafer capacity. The increased production capacity is expected to meet the growing demand for high-quality silicon wafers. Such expansions in the country are driving the demand for wafer bonding equipment.

Challenge: Mechanical unbalance of moving parts and thin wafers being volatile and susceptible to damage caused by pressure or stress

Die bonder equipment use mechanical movements to pick and place the die for the bonding process. The equipment have many moving parts that require precise movement to accurately attach the die to the substrate. However, sometimes, the moving parts can vibrate due to several issues, such as instability and abnormal movement of mechanical joints. The vibration in die bonders can result in misplacement or cracking of the die. The vibration of mechanical parts has become a major challenge for semiconductor bonding equipment manufacturers, which needs to be overcome.

Thin wafers are volatile and susceptible to damage from pressure or stress. A thin wafer is highly flexible and faces breakage issues even due to little pressure or stress. Dies made from thin wafers can break easily during the internal process of wafer thinning. Companies operating in the market are working toward overcoming this challenge by developing support systems to handle a thin wafer through various processes, such as wafer bonding and debonding. Also, companies are using a high-quality adhesive in carriers that handle thin wafers.

APAC held the largest market for the semiconductor bonding market in 2026

APAC is expected to register the highest CAGR in the overall semiconductor bonding market during the forecast period. More than 60% of OSAT players present across the world have their headquarters in APAC. These OSAT companies use die bonding equipment in the semiconductor fabrication process. The increasing number of IDMs in the region is expected to boost the semiconductor bonding market growth in the near future. Similarly, the mass production of electronic products such as smartphones, wearables, and white goods in China and Taiwan is also likely to accelerate the market’s growth in APAC.

Semiconductor Bonding Market by Region

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Key Market Players

The semiconductor bonding market is dominated by a few globally established players such as Intel Corporation (US), Google. Inc (US), NVIDIA Corporation (US), Xilinx Inc. (US), IBM Corporation (US), Advanced Micro Devices, Inc (US), Marvell Technology (Hamilton), and Qualcomm Technology (US).

Scope of the report

Report Metric

Scope

Market size available for years

2018–2026

Base year considered

2020

Forecast period

2021–2026

Forecast units

Value (USD Million) and Volume (Million Units)

Segments covered

By Process Type, Technology, By Type, By Application

Geographies covered

Asia Pacific, Europe, the Americas (North America, South America), and Rest of World

Companies covered

The key players operating in the semiconductor bonding market are BE Semiconductor Industries N.V.(Netherland), ASM Pacific Technology Ltd.(Singapore), Kulicke & Soffa(Singapore), Panasonic(Japan), Fuji Corporation(Japan), Yamaha Motor Robotics Corporation Co.(Japan), SUSS MicroTech SE(Germany), and Shiaura Mechatronics(Japan).

The study categorizes the semiconductor bonding market based on process type, technology, type, application, technology at the regional and global levels.

By Type

  • Die Bonder
  • Wafer Bonder
  • Flip Chip Bonder

By Proces Type

  • Die-To-Die Bonding
  • Die-To Wafer Bonding
  • Wafer-To-Wafer Bonding

By Bonding Technology

  • Die Bonding Technology
    • Eutectic Die Bonding
    • Epoxy Die Bonding
    • Flip Chip Attachment
    • Hybrid Bonding (For 3d-Nand)

Wafer Bonding Technology

  • Direct Wafer Bonding
  • Anodic Wafer Bonding
  • Tcb Wafer Bonding
  • Hybrid Bonding
  • Others

By Application

  • RF Devices
  • Mems And Sensors
  • Cmos Image Sensors
  • LED
  • 3D NAND

Recent Developments

  • In April 2021, ASM Pacific Technology launched three new manufacturing systems with X-Celeprint’s Micro Transfer Printing and ASM AMICRA’s high precision die bonding technology to enable high volume heterogeneous integration of ultra-thin dies up to 300 mm base wafer.
  • In January 2021, ASM Pacific Technology partnered with the EV Group (Austria) to enable ultra-precision die-to-wafer hybrid bonding solutions for 3D-IC heterogeneous integration.
  • In September 2020, Palomar® Technologies launched its new, fully automated, thermosonic, high-speed wire bonder, incorporating the latest technology.

Frequently Asked Questions (FAQ):

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TABLE OF CONTENTS

1 INTRODUCTION (Page No. - 24)
    1.1 STUDY OBJECTIVES
    1.2 MARKET DEFINITION AND SCOPE
           1.2.1 INCLUSIONS AND EXCLUSIONS
    1.3 SCOPE
           1.3.1 MARKETS COVERED
           1.3.2 YEARS CONSIDERED
    1.4 CURRENCY
    1.5 LIMITATIONS
    1.6 STAKEHOLDERS

2 RESEARCH METHODOLOGY (Page No. - 28)
    2.1 RESEARCH DATA
           FIGURE 1 SEMICONDUCTOR BONDING EQUIPMENT MARKET: RESEARCH DESIGN
           2.1.1 SECONDARY DATA
                    2.1.1.1 Secondary sources
           2.1.2 PRIMARY DATA
                    2.1.2.1 Primary sources
                    2.1.2.2 Breakdown of primary interviews
    2.2 MARKET SIZE ESTIMATION
           FIGURE 2 MARKET SIZE ESTIMATION METHODOLOGY: APPROACH 3—BOTTOM-UP MARKET ESTIMATION FOR SEMICONDUCTOR BONDING EQUIPMENT, BY TYPE
           2.2.1 BOTTOM-UP APPROACH
                    2.2.1.1 Approach for estimating market size by bottom-up approach (demand side)
                               FIGURE 3 MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH
           2.2.2 TOP-DOWN APPROACH
                    2.2.2.1 Approach for estimating market size by top-down approach (supply side)
                               FIGURE 4 MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH
    2.3 MARKET BREAKDOWN AND DATA TRIANGULATION
           FIGURE 5 DATA TRIANGULATION
    2.4 ASSUMPTIONS
           FIGURE 6 ASSUMPTIONS FOR THE RESEARCH STUDY
    2.5 RISK ASSESSMENT
    2.6 LIMITATIONS
    2.7 PRIMARY INSIGHTS
           TABLE 1 MARKET FORECASTING METHODOLOGY ADOPTED FROM 2019 TO 2026

3 EXECUTIVE SUMMARY (Page No. - 37)
    FIGURE 7 MARKET FOR WAFER BONDER TO GROW AT HIGHEST CAGR DURING 2021–2026
    FIGURE 8 SEMICONDUCTOR BONDING MARKET FOR LED TO GROW AT HIGHEST CAGR DURING 2021–2026
    FIGURE 9 APAC TO BE FASTEST-GROWING REGIONAL MARKET FOR SEMICONDUCTOR BONDING DURING FORECAST PERIOD
    3.1 IMPACT OF COVID-19 ON SEMICONDUCTOR BONDING MARKET
           FIGURE 10 IMPACT OF COVID-19 ON SEMICONDUCTOR BONDING MARKET, 2018–2026 (USD MILLION)
    3.2 PRE-COVID-19
    3.3 PESSIMISTIC SCENARIO (POST-COVID-19)
    3.4 OPTIMISTIC SCENARIO (POST-COVID-19)
    3.5 REALISTIC SCENARIO (POST-COVID-19)

4 PREMIUM INSIGHTS (Page No. - 43)
    4.1 ATTRACTIVE OPPORTUNITIES IN SEMICONDUCTOR BONDING MARKET
           FIGURE 11 RISING NEED FOR 3D CHIPS IS ACTING AS POTENTIAL OPPORTUNITY FOR MARKET
    4.2 SEMICONDUCTOR BONDING MARKET, BY TYPE
           FIGURE 12 MARKET FOR WAFER BONDER TO GROW AT HIGHER CAGR DURING FORECAST PERIOD
    4.3 MARKET FOR CLOUD SEMICONDUCTOR BONDING, BY COUNTRY
           FIGURE 13 SEMICONDUCTOR BONDING MARKET IN JAPAN TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
    4.4 SEMICONDUCTOR BONDING MARKET IN APAC IN 2026, BY COUNTRY & APPLICATION
           FIGURE 14 LED TO HOLD LARGEST SHARE OF SEMICONDUCTOR BONDING MARKET IN APAC IN 2026
    4.5 SEMICONDUCTOR BONDING MARKET, BY APPLICATION
           FIGURE 15 MARKET FOR LED TO GROW AT HIGHEST CAGR BETWEEN 2021 AND 2026

5 MARKET OVERVIEW (Page No. - 46)
    5.1 INTRODUCTION
    5.2 MARKET DYNAMICS
           FIGURE 16 GROWING DEMAND FOR MINIATURIZATION OF ELECTRONIC DEVICES TO DRIVE SEMICONDUCTOR BONDING MARKET
           5.2.1 DRIVERS
                    5.2.1.1 Growing demand for miniature electronic components
                               FIGURE 17 MEMS MARKET, 2017–2020 (USD MILLION)
                    5.2.1.2 Increasing adoption of stacked die technology in IoT devices
                               FIGURE 18 INDUSTRIAL IOT MARKET, BY DEVICE AND TECHNOLOGY, 2017–2020 (USD BILLION)
                    5.2.1.3 Rising demand for electric and hybrid vehicles
                               FIGURE 19 ELECTRIC VEHICLE SALES, 2013–2018 (MILLION UNITS)
                               FIGURE 20 SEMICONDUCTOR BONDING MARKET DRIVERS AND THEIR IMPACT
           5.2.2 RESTRAINTS
                    5.2.2.1 High cost of ownership
                               FIGURE 21 SEMICONDUCTOR BONDING MARKET RESTRAINTS AND THEIR IMPACT
           5.2.3 OPPORTUNITIES
                    5.2.3.1 Increasing demand for 3D semiconductor assembly and packaging
                               TABLE 2 SEMICONDUCTOR MANUFACTURING EQUIPMENT MARKET FOR 3D ICS, 2020–2025 (USD MILLION)
                    5.2.3.2 Expanding IC industry in China
                               TABLE 3 CHINA'S PROVINCES HAVE SIGNIFICANT INVESTMENT IN CHIP FUNDS (AS OF JUNE 2020)
                    5.2.3.3 Growing adoption of IoT and AI in automotive sector
                               FIGURE 22 PROJECTED IOT CONNECTIONS BY 2025 (BILLION)
                               FIGURE 23 SEMICONDUCTOR BONDING MARKET OPPORTUNITIES AND THEIR IMPACT
           5.2.4 CHALLENGES
                    5.2.4.1 Mechanical unbalance of moving parts and thin wafers being volatile and susceptible to damage caused by pressure or stress
                    5.2.4.2 Increased complexities related to miniaturized structures of circuits
                               FIGURE 24 SEMICONDUCTOR BONDING MARKET CHALLENGES AND THEIR IMPACT
    5.3 VALUE CHAIN ANALYSIS
           5.3.1 SEMICONDUCTOR BONDING VALUE CHAIN
                    FIGURE 25 VALUE CHAIN OF SEMICONDUCTOR BONDING MARKET: MAJOR VALUE IS ADDED BY SEMICONDUCTOR BONDING EQUIPMENT PROVIDERS
           5.3.2 ASP ANALYSIS
                    TABLE 4 AVERAGE SELLING PRICES OF DIFFERENT TYPES OF BONDING MACHINES
           5.3.3 REGULATIONS
           5.3.4 EXPORTS–IMPORTS REGULATIONS
           5.3.5 RESTRICTION OF HAZARDOUS SUBSTANCES (ROHS) AND WASTE ELECTRICAL AND ELECTRONIC EQUIPMENT (WEEE)
           5.3.6 REGISTRATION, EVALUATION, AUTHORIZATION, AND RESTRICTION OF CHEMICALS (REACH)
    5.4 ECOSYSTEM
           TABLE 5 ECOSYSTEM PLAYERS
    5.5 TECHNOLOGY ANALYSIS
           5.5.1 MEMS AND MOEMS
           5.5.2 WAFER BONDING
           5.5.3 DIE BONDING
           5.5.4 SOFT SOLDER
    5.6 CASE STUDIES
           5.6.1 LATEST DIE BONDING SOLUTIONS FOR PHOTONICS MANUFACTURING
           5.6.2 MRSI SOLVES ONE OF GREATEST CHALLENGES IN MODERN PHOTONICS MANUFACTURING
           5.6.3 QUICK SETTING RFID TAG BONDING – GLUTAG BONDING
           5.6.4 WORLD'S FIRST 300 MM COMPATIBLE 3D-INTEGRATED LSI ROOM TEMPERATURE WAFER BONDING DEVICE
    5.7 PATENTS ANALYSIS
           FIGURE 26 KEY PATENT HOLDERS DURING 2010–2020
           TABLE 6 LIST OF PATENTS
    5.8 PORTER’S FIVE FORCES ANALYSIS
           TABLE 7 SEMICONDUCTOR BONDING MARKET: PORTER’S FIVE FORCES ANALYSIS
           5.8.1 BARGAINING POWER OF SUPPLIERS
           5.8.2 BARGAINING POWER OF BUYERS
           5.8.3 THREAT OF NEW ENTRANTS
           5.8.4 THREAT OF SUBSTITUTES
           5.8.5 INTENSITY OF COMPETITIVE RIVALRY
                    TABLE 8 IMPACT OF EACH FORCE ON MARKET, 2020 VS. 2026
    5.9 TRENDS/DISRUPTIONS IMPACTING CUSTOMER’S BUSINESS
           FIGURE 27 REVENUE SHIFT FOR SEMICONDUCTOR BONDING MARKET
    5.10 TRADE ANALYSIS
           TABLE 9 IMPORTS DATA FOR MACHINES AND APPARATUSES USED FOR MANUFACTURING SEMICONDUCTOR DEVICES OR ELECTRONIC INTEGRATED CIRCUITS, BY COUNTRY, 2015– 2019 (USD MILLION)
           TABLE 10 EXPORTS DATA OF MACHINES AND APPARATUSES USED FOR MANUFACTURING SEMICONDUCTOR DEVICES OR ELECTRONIC INTEGRATED CIRCUITS, BY COUNTRY, 2015– 2019 (USD MILLION)

6 SEMICONDUCTOR BONDING MARKET, BY PROCESS TYPE (Page No. - 73)
    6.1 INTRODUCTION
           FIGURE 28 DIE-TO-WAFER BONDING IS EXPECTED TO GROW AT HIGHEST RATE BETWEEN 2021 AND 2026
           TABLE 11 SEMICONDUCTOR BONDING MARKET SIZE, BY PROCESS TYPE, 2018–2020 (USD MILLION)
           TABLE 12 SEMICONDUCTOR BONDING MARKET SIZE, BY PROCESS TYPE, 2021–2026 (USD MILLION)
    6.2 DIE-TO-DIE BONDING
           6.2.1 DIE-TO-DIE BONDING SEGMENT IS EXPECTED TO GROW AT 4.3% CAGR
                    TABLE 13 SEMICONDUCTOR BONDING MARKET SIZE FOR DIE-TO-DIE BONDING, BY REGION, 2018–2020 (USD MILLION)
                    TABLE 14 SEMICONDUCTOR BONDING MARKET SIZE FOR DIE-TO-DIE BONDING, BY REGION, 2021–2026 (USD MILLION)
    6.3 DIE-TO-WAFER BONDING
           6.3.1 SEVERAL DIFFERENT DIE-TO-WAFER BONDING APPROACHES ARE BEING CONSIDERED FOR HETEROGENEOUS INTEGRATION
                    TABLE 15 TYPES OF DIE-TO-WAFER BONDING
                    TABLE 16 SEMICONDUCTOR BONDING MARKET SIZE FOR DIE-TO-WAFER BONDING, BY REGION, 2018–2020 (USD MILLION)
                    TABLE 17 SEMICONDUCTOR BONDING MARKET SIZE FOR DIE-TO-WAFER BONDING,  BY REGION, 2021–2026 (USD MILLION)
    6.4 WAFER-TO-WAFER BONDING
           6.4.1 WAFER-TO-WAFER IS USED FOR APPLICATIONS SUCH AS CMOS IMAGE SENSORS AND VARIOUS MEMORY AND LOGIC TECHNOLOGIES
                    TABLE 18 SEMICONDUCTOR BONDING MARKET SIZE FOR WAFER-TO-WAFER BONDING, BY REGION, 2018–2020 (USD MILLION)
                    TABLE 19 SEMICONDUCTOR BONDING MARKET SIZE FOR WAFER-TO-WAFER BONDING, BY REGION, 2021–2026 (USD MILLION)

7 SEMICONDUCTOR BONDING MARKET, BY TECHNOLOGY (Page No. - 80)
    7.1 INTRODUCTION
    7.2 DIE BONDING
           FIGURE 29 EPOXY DIE BONDING TECHNOLOGY IS PROJECTED TO HOLD LARGEST MARKET SHARE DURING FORECAST PERIOD
           TABLE 20 DIE BONDING MARKET, BY TECHNOLOGY, 2018–2020 (USD MILLION)
           TABLE 21 DIE BONDING MARKET, BY TECHNOLOGY, 2021–2026 (USD MILLION)
           7.2.1 EPOXY DIE BONDING
                    7.2.1.1 Epoxy bonding to account for largest share of die bonder equipment market due to low cost and low curing temperature
           7.2.2 EUTECTIC DIE BONDING
                    7.2.2.1 Eutectic die bonding is primarily used for fabrication of electronic components
           7.2.3 FLIP CHIP ATTACHMENT
                    7.2.3.1 Flip chip attachment method is used for making electrical connections to chips
           7.2.4 HYBRID BONDING (FOR 3D NAND)
                    7.2.4.1 Main application of hybrid bonding is in advanced 3D device stacking
    7.3 WAFER BONDING
           FIGURE 30 MARKET FOR HYBRID BONDING TECHNOLOGY TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
           TABLE 22 WAFER BONDING MARKET, BY TECHNOLOGY, 2018–2020 (USD MILLION)
           TABLE 23 WAFER BONDING MARKET, BY TECHNOLOGY, 2021–2026 (USD MILLION)
           7.3.1 DIRECT WAFER BONDING
                    7.3.1.1 Direct wafer bonding offers strong connection due to covalent forces
                               FIGURE 31 DIRECT WAFER BONDING PROCESS FLOW
           7.3.2 ANODIC WAFER BONDING
                    7.3.2.1 Anodic wafer bonding offers advantage of wide process window, which helps in MEMS fabrication
                               FIGURE 32 ANODIC WAFER BONDING PROCESS FLOW
                               TABLE 24 DIFFERENCES BETWEEN DIRECT WAFER BONDING AND ANODIC WAFER BONDING
           7.3.3 TCB WAFER BONDING
                    7.3.3.1 Metals such as Au, Cu, or Al are used for metal thermocompression bonding
                               FIGURE 33 METAL THERMOCOMPRESSION WAFER BONDING PROCESS FLOW
           7.3.4 HYBRID BONDING
                    7.3.4.1 Xperi has developed new version of its hybrid bonding technology

8 SEMICONDUCTOR BONDING MARKET, BY TYPE (Page No. - 94)
    8.1 INTRODUCTION
           FIGURE 34 WAFER BONDER SEGMENT IS EXPECTED TO GROW AT HIGHEST CAGR BETWEEN 2021 AND 2026
           TABLE 25 SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018–2020 (MILLION UNIT)
           TABLE 26 SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2021–2026 (MILLION UNITS)
           TABLE 27 SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2018–2020 (USD MILLION)
           TABLE 28 SEMICONDUCTOR BONDING MARKET SIZE, BY TYPE, 2021–2026 (USD MILLION)
    8.2 DIE BONDER
           8.2.1 MANUAL DIE BONDERS
                    8.2.1.1 Manual die bonders play significant role in R&D, testing, and prototyping applications
           8.2.2 SEMIAUTOMATIC DIE BONDERS
                    8.2.2.1 Semiautomatic die bonders are flexible and easy to use
           8.2.3 FULLY AUTOMATIC DIE BONDERS
                    8.2.3.1 Fully automatic die bonders are expected to gain more market traction
                               TABLE 29 SEMICONDUCTOR BONDING MARKET SIZE FOR DIE BONDER, BY REGION, 2018–2020 (USD MILLION)
                               TABLE 30 SEMICONDUCTOR BONDING MARKET SIZE FOR DIE BONDER, BY REGION, 2021–2026 (USD MILLION)
    8.3 WAFER BONDER
           8.3.1 UV-RELEASE ADHESIVES, THERMAL-RELEASE ADHESIVES, AND SOLVENT-RELEASE ADHESIVES ARE USED IN WAFER BONDING
                    TABLE 31 SEMICONDUCTOR BONDING MARKET SIZE FOR WAFER BONDER, BY REGION, 2018–2020 (USD MILLION)
                    TABLE 32 SEMICONDUCTOR BONDING MARKET SIZE FOR WAFER BONDER, BY REGION, 2021–2026 (USD MILLION)
    8.4 FLIP CHIP BONDER
           8.4.1 FLIP CHIP BONDING CAN OFFER SEVERAL ADVANTAGES OVER OTHER INTERCONNECTION PROCESSES
                    TABLE 33 SEMICONDUCTOR BONDING MARKET SIZE FOR FLIP CHIP BONDER, BY REGION, 2018–2020 (USD MILLION)
                    TABLE 34 SEMICONDUCTOR BONDING MARKET SIZE FOR FLIP CHIP BONDER, BY REGION, 2021–2026 (USD MILLION)

9 SEMICONDUCTOR BONDING MARKET, BY APPLICATION (Page No. - 102)
    9.1 INTRODUCTION
           FIGURE 35 LED APPLICATION SEGMENT TO GROW AT HIGHEST RATE BETWEEN 2021 AND 2026
           TABLE 35 SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2018–2020 (USD MILLION)
           TABLE 36 SEMICONDUCTOR BONDING MARKET SIZE, BY APPLICATION, 2021–2026 (USD MILLION)
    9.2 MEMS AND SENSORS
           9.2.1 GROWTH IS DRIVEN BY HIGH DEMAND FROM CONSUMER ELECTRONICS MANUFACTURERS AND ADOPTION OF PATIENT MONITORING SOLUTIONS DURING COVID-19 PANDEMIC
                    TABLE 37 SEMICONDUCTOR BONDING MARKET SIZE FOR MEMS AND SENSORS, BY REGION, 2018–2020 (USD MILLION)
                    TABLE 38 SEMICONDUCTOR BONDING MARKET SIZE FOR MEMS AND SENSORS, BY REGION, 2021–2026 (USD MILLION)
    9.3 CMOS IMAGE SENSORS (CIS)
           9.3.1 INCREASING DEMAND FROM AUTOMOTIVE VERTICAL IS EXPECTED TO DRIVE DEMAND FOR CIS
                    TABLE 39 SEMICONDUCTOR BONDING MARKET SIZE FOR CIS, BY REGION, 2018–2020 (USD MILLION)
                    TABLE 40 SEMICONDUCTOR BONDING MARKET SIZE FOR CIS, BY REGION, 2021–2026 (USD MILLION)
    9.4 RADIOFREQUENCY (RF) DEVICES
           9.4.1 INCREASING DEMAND FOR RF DEVICES FOR SMARTPHONES TO DRIVE SEMICONDUCTOR BONDING MARKET
                    TABLE 41 SEMICONDUCTOR BONDING MARKET SIZE FOR RF DEVICES, BY REGION, 2018–2020 (USD MILLION)
                    TABLE 42 SEMICONDUCTOR BONDING MARKET SIZE FOR RF DEVICES, BY REGION, 2021–2026 (USD MILLION)
    9.5 LED
           9.5.1 INCREASING DEMAND FOR LED COMPONENTS IN HOME AND INFRASTRUCTURE MARKET TO AUGMENT GROWTH DURING FORECAST PERIOD
                    TABLE 43 SEMICONDUCTOR BONDING MARKET SIZE FOR LED, BY REGION, 2018–2020 (USD MILLION)
                    TABLE 44 SEMICONDUCTOR BONDING MARKET SIZE FOR LED, BY REGION, 2021–2026 (USD MILLION)
    9.6 3D NAND
           TABLE 45 SEMICONDUCTOR BONDING MARKET SIZE FOR 3D NAND, BY REGION, 2018–2020 (USD MILLION)
           TABLE 46 SEMICONDUCTOR BONDING MARKET SIZE FOR 3D NAND, BY REGION, 2021–2026 (USD MILLION)

10 GEOGRAPHIC ANALYSIS (Page No. - 112)
     10.1 INTRODUCTION
               FIGURE 36 SEMICONDUCTOR BONDING IN APAC TO GROW AT HIGHEST CAGR DURING FORECAST PERIOD
               TABLE 47 SEMICONDUCTOR BONDING MARKET, BY REGION, 2018–2020 (USD MILLION)
               TABLE 48 SEMICONDUCTOR BONDING MARKET, BY REGION, 2021–2026 (USD MILLION)
     10.2 APAC
               FIGURE 37 APAC: SEMICONDUCTOR BONDING MARKET SNAPSHOT
               TABLE 49 SEMICONDUCTOR BONDING MARKET IN APAC, BY TYPE, 2018–2020 (USD MILLION)
               TABLE 50 SEMICONDUCTOR BONDING MARKET IN APAC, BY TYPE, 2021–2026 (USD MILLION)
               TABLE 51 SEMICONDUCTOR BONDING MARKET IN APAC, BY PROCESS TYPE,  2018–2020 (USD MILLION)
               TABLE 52 SEMICONDUCTOR BONDING MARKET IN APAC, BY PROCESS TYPE, 2021–2026 (USD MILLION)
               TABLE 53 SEMICONDUCTOR BONDING MARKET IN APAC, BY APPLICATION, 2018–2020 (USD MILLION)
               TABLE 54 SEMICONDUCTOR BONDING MARKET IN APAC, BY APPLICATION, 2021–2026 (USD MILLION)
               TABLE 55 SEMICONDUCTOR BONDING MARKET IN APAC, BY DIE BONDING TECHNOLOGY, 2018–2020 (USD MILLION)
               TABLE 56 SEMICONDUCTOR BONDING MARKET IN APAC, BY DIE BONDING TECHNOLOGY, 2021–2026 (USD MILLION)
               TABLE 57 SEMICONDUCTOR BONDING MARKET IN APAC, BY WAFER BONDING TECHNOLOGY, 2018–2020 (USD MILLION)
               TABLE 58 SEMICONDUCTOR BONDING MARKET IN APAC, BY WAFER BONDING TECHNOLOGY, 2021–2026 (USD MILLION)
               TABLE 59 SEMICONDUCTOR BONDING MARKET IN APAC, BY COUNTRY, 2018–2020 (USD MILLION)
               TABLE 60 SEMICONDUCTOR BONDING MARKET IN APAC, BY COUNTRY, 2021–2026 (USD MILLION)
             10.2.1 TAIWAN
                       10.2.1.1 Presence of many key OSAT companies drives market growth in Taiwan
             10.2.2 CHINA
                       10.2.2.1 Growing trend of miniaturization of consumer electronic products spurs market growth in China
             10.2.3 JAPAN
                       10.2.3.1 Increasing demand for passenger cars and commercial vehicles and expanding presence of market players in country fuel market growth in Japan
             10.2.4 SOUTH KOREA
                       10.2.4.1 South Korea to continue to account for largest market size in APAC during 2021–2026
             10.2.5 REST OF APAC
                       10.2.5.1 Strong presence of semiconductor bonding manufacturers accelerates market growth in Rest of APAC
     10.3 AMERICAS
               FIGURE 38 AMERICAS: SEMICONDUCTOR BONDING MARKET SNAPSHOT
               TABLE 61 SEMICONDUCTOR BONDING MARKET IN AMERICAS, BY TYPE, 2018–2020 (USD MILLION)
               TABLE 62 SEMICONDUCTOR BONDING MARKET IN AMERICAS, BY TYPE, 2021–2026 (USD MILLION)
               TABLE 63 SEMICONDUCTOR BONDING MARKET IN AMERICAS, BY PROCESS TYPE, 2018–2020 (USD MILLION)
               TABLE 64 SEMICONDUCTOR BONDING MARKET IN AMERICAS, BY PROCESS TYPE, 2021–2026 (USD MILLION)
               TABLE 65 SEMICONDUCTOR BONDING MARKET IN AMERICAS, BY APPLICATION, 2018–2020 (USD MILLION)
               TABLE 66 SEMICONDUCTOR BONDING MARKET IN AMERICAS, BY APPLICATION, 2021–2026 (USD MILLION)
               TABLE 67 SEMICONDUCTOR BONDING MARKET IN AMERICAS, BY DIE BONDING TECHNOLOGY, 2018–2020 (USD MILLION)
               TABLE 68 SEMICONDUCTOR BONDING MARKET IN AMERICAS, BY DIE BONDING TECHNOLOGY, 2021–2026 (USD MILLION)
               TABLE 69 SEMICONDUCTOR BONDING MARKET IN AMERICAS, BY WAFER BONDING TECHNOLOGY, 2018–2020 (USD MILLION)
               TABLE 70 SEMICONDUCTOR BONDING MARKET IN AMERICAS, BY WAFER BONDING TECHNOLOGY, 2021–2026 (USD MILLION)
               TABLE 71 SEMICONDUCTOR BONDING MARKET IN AMERICAS, BY COUNTRY, 2018–2020 (USD MILLION)
               TABLE 72 SEMICONDUCTOR BONDING MARKET IN AMERICAS, BY COUNTRY, 2021–2026 (USD MILLION)
             10.3.1 US
                       10.3.1.1 US to continue to lead semiconductor bonding market in Americas during 2021–2026
             10.3.2 CANADA
                       10.3.2.1 Ongoing government initiatives toward development of electric vehicle infrastructure to create market opportunities in near future
             10.3.3 REST OF AMERICAS
                       10.3.3.1 Increasing demand for IoT and 5G is boosting demand for die bonding equipment in Rest of Americas
     10.4 EUROPE
               FIGURE 39 EUROPE: SEMICONDUCTOR BONDING MARKET SNAPSHOT
               TABLE 73 SEMICONDUCTOR BONDING MARKET IN EUROPE, BY TYPE, 2018–2020 (USD MILLION)
               TABLE 74 SEMICONDUCTOR BONDING MARKET IN EUROPE, BY TYPE, 2021–2026 (USD MILLION)
               TABLE 75 SEMICONDUCTOR BONDING MARKET IN EUROPE, BY PROCESS TYPE, 2018–2020 (USD MILLION)
               TABLE 76 SEMICONDUCTOR BONDING MARKET IN EUROPE, BY PROCESS TYPE, 2021–2026 (USD MILLION)
               TABLE 77 SEMICONDUCTOR BONDING MARKET IN EUROPE, BY APPLICATION, 2018–2020 (USD MILLION)
               TABLE 78 SEMICONDUCTOR BONDING MARKET IN EUROPE, BY APPLICATION, 2021–2026 (USD MILLION)
               TABLE 79 SEMICONDUCTOR BONDING MARKET IN EUROPE, BY DIE BONDING TECHNOLOGY, 2018–2020 (USD MILLION)
               TABLE 80 SEMICONDUCTOR BONDING MARKET IN EUROPE, BY DIE BONDING TECHNOLOGY, 2021–2026 (USD MILLION)
               TABLE 81 SEMICONDUCTOR BONDING MARKET IN EUROPE, BY WAFER BONDING TECHNOLOGY, 2018–2020 (USD MILLION)
               TABLE 82 SEMICONDUCTOR BONDING MARKET IN EUROPE, BY WAFER BONDING TECHNOLOGY, 2021–2026 (USD MILLION)
               TABLE 83 SEMICONDUCTOR BONDING MARKET IN EUROPE, BY COUNTRY, 2018–2020 (USD MILLION)
               TABLE 84 SEMICONDUCTOR BONDING MARKET IN EUROPE, BY COUNTRY, 2021–2026 (USD MILLION)
             10.4.1 GERMANY
                       10.4.1.1 Adoption of smart homes and connected cars to spur demand in Germany
             10.4.2 UK
                       10.4.2.1 Deployment of 5G infrastructure is fueling market growth in UK
             10.4.3 FRANCE
                       10.4.3.1 Developed communication network has prompted market growth in France
             10.4.4 IRELAND
                       10.4.4.1 Presence of Intel’s fab primarily drives market growth in Ireland
             10.4.5 ITALY
                       10.4.5.1 Technology enhancements by players such as STMicroelectronics surge growth of semiconductor manufacturing equipment market in Italy
             10.4.6 REST OF EUROPE
                       10.4.6.1 Initiatives of semiconductor bonding manufacturers to propel market growth in Rest of Europe
     10.5 ROW
               TABLE 85 SEMICONDUCTOR BONDING MARKET IN ROW, BY TYPE, 2018–2020 (USD MILLION)
               TABLE 86 SEMICONDUCTOR BONDING MARKET IN ROW, BY TYPE, 2021–2026 (USD MILLION)
               TABLE 87 SEMICONDUCTOR BONDING MARKET IN ROW, BY PROCESS TYPE, 2018–2020 (USD MILLION)
               TABLE 88 SEMICONDUCTOR BONDING MARKET IN ROW, BY PROCESS TYPE, 2021–2026 (USD MILLION)
               TABLE 89 SEMICONDUCTOR BONDING MARKET IN ROW, BY APPLICATION, 2018–2020 (USD MILLION)
               TABLE 90 SEMICONDUCTOR BONDING MARKET IN ROW, BY APPLICATION, 2021–2026 (USD MILLION)
               TABLE 91 SEMICONDUCTOR BONDING MARKET IN ROW, BY DIE BONDING TECHNOLOGY, 2018–2020 (USD MILLION)
               TABLE 92 SEMICONDUCTOR BONDING MARKET IN ROW, BY DIE BONDING TECHNOLOGY, 2021–2026 (USD MILLION)
               TABLE 93 SEMICONDUCTOR BONDING MARKET IN ROW, BY WAFER BONDING TECHNOLOGY, 2018–2020 (USD MILLION)
               TABLE 94 SEMICONDUCTOR BONDING MARKET IN ROW, BY WAFER BONDING TECHNOLOGY, 2021–2026 (USD MILLION)
               TABLE 95 SEMICONDUCTOR BONDING MARKET IN ROW, BY REGION, 2018–2020 (USD MILLION)
               TABLE 96 SEMICONDUCTOR BONDING MARKET IN ROW, BY REGION, 2021–2026 (USD MILLION)

11 COMPETITIVE LANDSCAPE (Page No. - 141)
     11.1 INTRODUCTION
     11.2 REVENUE ANALYSIS
               FIGURE 40 REVENUE ANALYSIS OF TOP THREE COMPANIES, 2020
     11.3 MARKET SHARE ANALYSIS, 2020
               TABLE 97 SEMICONDUCTOR BONDING MARKET: MARKET SHARE ANALYSIS (2020)
     11.4 KEY PLAYER STRATEGIES/RIGHT TO WIN
             11.4.1 OVERVIEW OF STRATEGIES DEPLOYED BY KEY SEMICONDUCTOR BONDING COMPANIES
     11.5 COMPETITIVE LEADERSHIP MAPPING
             11.5.1 STAR
             11.5.2 EMERGING LEADER
             11.5.3 PERVASIVE
             11.5.4 PARTICIPANT
                       FIGURE 41 SEMICONDUCTOR BONDING MARKET: COMPETITIVE LEADERSHIP MAPPING, 2020
             11.5.5 SEMICONDUCTOR BONDING MARKET: TYPE FOOTPRINT
                       TABLE 98 COMPANY FOOTPRINT
                       TABLE 99 APPLICATION FOOTPRINT OF COMPANIES
                       TABLE 100 REGIONAL FOOTPRINT OF COMPANIES
     11.6 COMPETITIVE SITUATIONS AND TRENDS
             11.6.1 SEMICONDUCTOR BONDING MARKET: PRODUCT LAUNCHES, JANUARY 2018–APRIL 2021
             11.6.2 SEMICONDUCTOR BONDING MARKET: DEALS, JANUARY 2018–APRIL 2021

12 COMPANY PROFILES (Page No. - 151)
(Business Overview, Products/services Offered, Recent Developments, and MnM View (Key strengths/Right to Win, Strategic Choices Made, and Weaknesses and Competitive Threats))*
     12.1 INTRODUCTION
     12.2 KEY PLAYERS
             12.2.1 ASM PACIFIC TECHNOLOGY
                       FIGURE 42 ASM PACIFIC TECHNOLOGY: COMPANY SNAPSHOT
             12.2.2 BESI
                       FIGURE 43 BESI: COMPANY SNAPSHOT
             12.2.3 PANASONIC
                       FIGURE 44 PANASONIC: COMPANY SNAPSHOT
             12.2.4 FASFORD TECHNOLOGY
                       FIGURE 45 FUJI CORPORATION: COMPANY SNAPSHOT
             12.2.5 SHINKAWA LTD
                       FIGURE 46 YAMAHA MOTOR ROBOTICS HOLDING CO.: COMPANY SNAPSHOT
             12.2.6 EV GROUP (EVG)
             12.2.7 SUSS MICROTECH SE
                       FIGURE 47 SUSS MICROTECH SE: COMPANY SNAPSHOT
             12.2.8 KULICKE & SOFFA INDUSTRIES
                       FIGURE 48 KULICKE & SOFFA INDUSTRIES: COMPANY SNAPSHOT
             12.2.9 PALOMAR TECHNOLOGIES
             12.2.10 SHIBAURA MECHATRONICS
                                   FIGURE 49 SHIBAURA MECHATRONICS: COMPANY SNAPSHOT
     12.3 OTHER KEY PLAYERS
             12.3.1 TDK CORPORATION
             12.3.2 TOKYO ELECTRON LIMITED
             12.3.3 MITSUBISHI HEAVY INDUSTRIES MACHINE TOOLS
             12.3.4 MYCRONIC GROUP
             12.3.5 INTEL
             12.3.6 SAMSUNG
             12.3.7 CANON ANELVA CORPORATION
             12.3.8 FINETECH
             12.3.9 DR. TRESKY
             12.3.10 SET CORPORATION SA
             12.3.11 TOKYO OHKA KOYGO
             12.3.12 BONDTECH
             12.3.13 AYUMI INDUSTRIES
             12.3.14 APPLIED MICROENGINEERING LIMITED
             12.3.15 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY (TSMC)
             12.3.16 TORAY ENGINEERING

*Details on Business Overview, Products/services Offered, Recent Developments, and MnM View (Key strengths/Right to Win, Strategic Choices Made, and Weaknesses and Competitive Threats) might not be captured in case of unlisted companies.

13 APPENDIX (Page No. - 198)
     13.1 INSIGHTS OF INDUSTRY EXPERTS
     13.2 DISCUSSION GUIDE
     13.3 KNOWLEDGE STORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL
     13.4 AVAILABLE CUSTOMIZATIONS
     13.5 RELATED REPORTS
     13.6 AUTHOR DETAILS

The study involved four major activities in estimating the size of the semiconductor bonding market. Exhaustive secondary research has been done to collect information on the market, peer market, and parent market. Validation of these findings, assumptions, and sizing with industry experts across the value chain through primary research has been the next step. Both top-down and bottom-up approaches have been employed to estimate the global market size. After that, market breakdown and data triangulation have been used to estimate the market sizes of segments and subsegments.

Secondary Research

The secondary sources referred to for this research study includes TechCrunch News, Semiconductor bonding, Fraunhofer Data, and Photonics Articles.

In the semiconductor bonding market report, both top-down and bottom-up approaches have been used to estimate and validate the size of the semiconductor bonding market, along with other dependent submarkets. The key players in the semiconductor bonding market have been identified through secondary research, and their market presence has been determined through primary and secondary research. All percentage shares, splits, and breakdowns have been determined using secondary sources and verified through primary sources.

Primary Research

Extensive primary research has been conducted after acquiring an understanding of the semiconductor bonding market scenario through secondary research. Several primary interviews have been conducted with market experts from both the demand- (consumers, industries, healthcare) and supply-side (semiconductor bonding product manufacturers) players across four major regions, namely, Americas, Europe, Asia Pacific, and Rest of the World (the Middle East & Africa). Approximately 70% and 30% of primary interviews have been conducted from the supply and demand side, respectively. Primary data has been collected through questionnaires, emails, and telephonic interviews. In the canvassing of primaries, various departments within organizations, such as sales, operations, and administration, were covered to provide a holistic viewpoint in our report.

After interacting with industry experts, brief sessions were conducted with highly experienced independent consultants to reinforce the findings from our primaries. This, along with the in-house subject matter experts’ opinions, has led us to the findings as described in the remainder of this report.

Semiconductor Bonding Market  Size, and Share

Market Size Estimation

Both top-down and bottom-up approaches have been used to estimate and validate the total size of the semiconductor bonding market. These methods have also been extensively used to estimate the sizes of various market subsegments. The research methodology used to estimate the market sizes includes the following:

  • Identifying market for semiconductor bonding-based type(Wafer bonder, Die bonder and Flip Chip bonder) in each country
  • Identifying the major applications of semiconductor bonding-related products
  • Estimating the size of the market in each region by adding the sizes of country-wise markets
  • Tracking the ongoing and upcoming implementation of semiconductor bonding projects by various companies in each region and forecasting the size of the semiconductor bonding market based on these developments and other critical parameters, including COVID-19 related impacts
  • Arriving at the size of the global market by adding the sizes of region-wise markets

Market Size Estimation Methodology-Bottom-up approach

Semiconductor Bonding Market  Size, and Share

To know about the assumptions considered for the study, Request for Free Sample Report

Data Triangulation

After arriving at the overall market size using the market size estimation processes explained above—the market has been split into several segments and subsegments. To complete the overall market engineering process and arrive at the exact statistics of each market segment and subsegment, data triangulation, and market breakdown procedures have been employed, wherever applicable. The data has been triangulated by studying various factors and trends from both the demand and supply sides.

The main objectives of this study are as follows:

  • To define, describe, and forecast the semiconductor bonding market, in terms of value and volume, by process type, technology, application, type, and region
  • To forecast the market, for various segments with respect to four main regions—the North Americas, Europe, Asia Pacific (APAC), and Rest of the World (RoW), in terms of value
  • To strategically analyze micromarkets1 with respect to individual growth trends, prospects, and contribution to the overall semiconductor bonding market
  • To provide detailed information regarding the major factors (drivers, restraints, opportunities, and challenges) influencing the semiconductor bonding market growth
  • To analyze opportunities in the market for various stakeholders by identifying the high-growth segments of the semiconductor bonding market
  • To study the complete value chain and allied industry segments, and perform a value chain analysis of the semiconductor bonding market landscape
  • To map competitive intelligence based on company profiles, key player strategies, and key developments
  • To strategically profile key players and comprehensively analyze their market ranking and core competencies2
  • To track and analyze competitive developments such as joint ventures, mergers and acquisitions, product developments, and research and development (R&D) in the semiconductor bonding market

Available Customizations:

MarketsandMarkets offers the following customizations for this market report:

  • Additional country-level analysis of semiconductor bonding market
  • Profiling of additional market players (up to 5)
  • Country-level analysis of component, and system type Segment
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