Chiplet Market

Chiplet Market by Processor (Field-Programmable Gate Array (FPGA), Central Processing Unit (CPU), Graphics Processing Unit (GPU), APU, AI ASIC Co-Processor), Packaging Technology (SiP, FCCSP, FCBGA, 2.5D/3D, WLCSP, Fan-Out) Global Forecast to 2028

Report Code: SE 8811 Oct, 2023, by marketsandmarkets.com

Updated on : October 27, 2023

 The chiplet market was valued at USD 6.5 billion in 2023 and is estimated to reach USD 148.0 billion by 2028, registering a CAGR of 86.7% during the forecast period.

The growth of the chiplet market is driven by adoption of high-performance computing (HPC) servers in various sectors, proliferation of data centers worldwide, and adoption of advanced packaging technologies.

Chiplet Market

Chiplet Market

Chiplet Market Forecast to 2028

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Market Dynamics:

Drivers: Adoption of high-performance computing (HPC) servers in various sectors

High-performance computing (HPC) servers are utilized across various fields, including research, finance, manufacturing, weather forecasting, pharmaceuticals, entertainment, government, energy, automotive, space exploration, e-commerce, telecommunications, and environmental research. These HPCs power complex computations and simulations, supporting innovation and decision-making in diverse fields, from scientific research to national defense. These HPCs utilize chiplet-based architectures, which allow for the efficient integration of specialized processing units, memory, and accelerators, enabling HPC servers to deliver unprecedented levels of performance while maintaining energy efficiency and scalability, which are crucial for handling complex simulations, scientific research, and AI workloads. Chiplets enable HPC server manufacturers to enhance scalability and performance. Chiplet-based HPC servers overcome the limitations of Moore's law and allow for the integration of multiple specialized chips on a single server board. According to MarketsandMarkets’ analysis, the high-performance computing (HPC) market is expected to grow from USD 36.0 billion in 2022 to USD 49.9 billion by 2027, at a CAGR of 6.7%. This growth is intrinsically linked to the burgeoning demand for applications that rely heavily on HPC capabilities, thus indicating a parallel surge in demand for chiplets as these modular components become increasingly integral to HPC server architecture.

Restraint: Heat management issues

Heat management emerges as a restraining factor for the chiplet market. The ever-increasing power density and the relentless drive for semiconductor miniaturization have led to a surge in heat generation. This, compounded by the close integration of multiple chiplets on a single package, amplifies the thermal challenges. The imperative for effective heat dissipation and precise temperature control has become paramount to maintaining the optimal functioning of chiplets. The compact size of chiplets renders efficient heat dissipation a formidable task. Moreover, the densely interconnected configurations of chiplets exacerbate heat generation, compounding the problem. The diverse thermal properties of chiplet materials and the variability in their operating conditions further complicate the design of effective, standardized thermal management solutions.

Opportunities: Rapid expansion of 5G infrastructure

Chiplets are vital components within the 5G infrastructure, strategically embedded in key network elements. They play a crucial role in base stations, where they are integrated into radio frequency (RF) transceivers. This placement empowers base stations to efficiently process high-frequency signals, perform beamforming, and manage intricate modulation schemes essential for 5G's massive multiple-input multiple-output (MIMO) systems. Additionally, chiplets enhance the computational prowess of central processing units (CPUs) in base stations, enabling real-time data processing, protocol handling, and sophisticated algorithms. They also feature in accelerators, offloading tasks such as error correction and encryption, ensuring high-throughput processing for low-latency, reliable communication. Moreover, chiplets find utility in front and backhaul equipment, optimizing data transmission and synchronization. Their role extends to edge computing nodes, facilitating rapid data processing at the network's edge, enhancing the responsiveness of critical applications like autonomous vehicles and augmented reality. Chiplets are instrumental in fortifying 5G infrastructure, enhancing its capacity to manage high-frequency signals, complex computations, low-latency communication, and edge computing demands.

The increasing adoption of 5G technology, driven by the deployment of new networks and the affordability of 5G devices, presents a significant opportunity for the chiplet market. According to the statistics of GSM Association, as of January 2023, there were 229 operational 5G networks globally, and the market had seen the introduction of over 700 5G smartphone models, including more than 200 in 2022 alone. This rapid expansion of 5G infrastructure creates a growing ecosystem for chiplets in the telecommunications sector, as chiplets play a vital role in enhancing the performance of 5G devices and base stations. Furthermore, the declining usage of legacy networks like 2G and 3G, with operators planning to shut down 96 2G networks and 107 3G networks worldwide, underscores the importance of chiplet-based solutions for upgrading and optimizing the connectivity and processing capabilities of 4G and 5G networks. Chiplets enable operators to enhance the efficiency and capabilities of network equipment and devices, making them well-suited to meet the evolving demands of 5G technology. Thus, the expanding 5G landscape not only signifies a significant growth opportunity for chiplets but also emphasizes their critical role in supporting the continued evolution of telecommunications networks.

Challenge: related to intellectual property (IP) protection and licensing

The chiplet market faces a formidable challenge rooted in intellectual property (IP) concerns. At its core, relentless patent disputes cast a long shadow over innovation, demanding substantial financial and human resources for resolution. This industry's intense competition has given rise to a multitude of patents covering various chiplet technologies, leading to frequent allegations of patent infringement. Compounding this issue is the inherent complexity of semiconductor patents, intricately linked to the advanced nature of the technology itself. Navigating these disputes consumes considerable resources, potentially stifling the pace of innovation and depleting financial reserves.

Simultaneously, the chiplet market grapples with the vulnerability of closely guarded trade secrets. The need to protect proprietary chiplet designs and manufacturing processes is paramount due to their intrinsic competitive value. However, in a globally interconnected supply chain, preserving the confidentiality of these trade secrets becomes increasingly challenging. Unauthorized access or leaks can result in IP theft, posing a threat to a company's unique advantage and market standing. These dual IP challenges—patent disputes and trade secrets vulnerability—underscore the critical importance of effectively managing and safeguarding intellectual property assets within the chiplet industry. Overcoming these hurdles is pivotal for sustained growth and innovation in this dynamic and competitive market.

Chiplet Ecosystem

Chiplet Market by Ecosystem

Central Processing Unit (CPU) segment to hold larger market share during the forecast period.

The CPU segment is expected to grow substantially due to its critical role in powering a wide range of computing devices. As the demand for higher processing power, energy efficiency, and scalability surge, chiplet-based CPU designs are expected to gain popularity. Chiplets enable CPU manufacturers to optimize and modularize their designs, incorporating specialized chiplets for various functions like cores, cache, and memory controllers. This approach enhances overall CPU performance, efficiency, and adaptability, catering to diverse applications from consumer electronics to data centers. Moreover, the trend toward heterogeneous computing, driven by emerging workloads in artificial intelligence and data analytics, further propels the CPU segment’s growth. As chiplet-based CPUs continue to provide a competitive edge in the rapidly evolving semiconductor landscape, their demand is expected to be high to meet the evolving demands of modern computing ecosystems.

2.5D/3D segment account for the largest share of the chiplet market for during the forecast period

2.5D/3D packaging has emerged as a transformative technology reshaping the chiplet landscape. By enabling vertical stacking of chiplets, 2.5D/3D packaging guarantees high performance, bandwidth, and miniaturization. 2.5D/3D is a packaging methodology that enables the inclusion of multiple ICs into the same package. In a 2.5D structure, two or more active semiconductor chips are placed side-by-side on a silicon interposer to achieve extremely high die-to-die interconnect density. In a 3D structure, active chips are integrated by die stacking for the shortest interconnect and smallest package footprint. In recent years, 2.5D and 3D have gained momentum as the ideal chiplet integration platforms due to their merits in achieving extremely high packaging density and energy efficiency.

Enterprise Electronics segment to exhibit highest growth in terms of chiplet market during the forecast period

Chiplets are revolutionizing various enterprise electronics applications, including data center servers, AI accelerators, high-performance computing (HPC) systems, network equipment, and storage systems. They offer superior performance, efficiency, cost-effectiveness, and scalability compared with traditional monolithic chips. Chiplets’ interconnectivity creates more powerful and specialized chips, reducing power consumption and manufacturing costs. As chiplet technology advances, its demand in enterprise electronics is likely to increase to enhance capabilities.

Chiplet market in Asia Pacific estimated to grow at the fastest rate during the forecast period

Due to several compelling factors, such as the booming technology sector, research and development investments, government-led digital transformation initiatives, rising disposable income, and a favorable regulatory environment, the Asia Pacific chiplet market is projected to grow substantially. The semiconductor industry in the region boasts a powerful network of foundries, manufacturers, and technology innovators, driving significant advancements in chiplet-based designs. The region is also witnessing high demand for advanced electronic devices, particularly in populous countries such as China and India, making it a prime target for chiplet technology. Moreover, the rapid rollout of 5G networks across the region drives the need for efficient, high-performance computing, aligning seamlessly with chiplet capabilities in power efficiency and heterogeneous integration. Asia Pacific governments’ substantial investments in research and development, notably in South Korea, Taiwan, and Singapore, underscore their commitment to fostering innovation.

Chiplet Market by Region

Chiplet Market by Region

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Top Chiplet Companies - Key Market Players:

Major vendors in the chiplet companies include Intel Corporation (US), Advanced Micro Devices, Inc. (US), Apple Inc. (US), IBM (US), Marvell (US), MediaTek Inc. (Taiwan), NVIDIA Corporation (us), Achronix Semiconductor Corporation (US), Ranovus (Canada), and ASE Technology Holding Co., Ltd. (Taiwan). Apart from this, Netronome (US), Cadence Design Systems, Inc. (US), and Synopsys, Inc. (US), SiFive, Inc. (US), ALPHAWAVE SEMI (UK), Eliyan (US), Ayar Labs, Inc. (US), Tachyum (US), X-Celeprint (Ireland), Kandou Bus SA (Switzerland), NHanced Semiconductors (US), Tenstorrent (Canada), Chipuller (China) and Rain Neuromorphics (US) are among a few emerging companies in the chiplet market.

Chiplet Market Report Scope :

Report Metric

Details

Estimated Market Size USD 6.5 billion in 2023
Projected Market Size USD 148.0 billion by 2028
Growth Rate CAGR of  86.7%

Market size available for years

2019—2028

Base year

2022

Forecast period

2023—2028

Segments covered

  • By Processor,
  • By Packaging Technology,
  • By End-use Application and
  • By Region

Geographic regions covered

  • North America,
  • Europe,
  • Asia Pacific, and
  • RoW

Companies covered

The major players include Intel Corporation (US), Advanced Micro Devices, Inc. (US), Apple Inc. (US), IBM (US), Marvell (US), MediaTek Inc. (Taiwan), NVIDIA Corporation (us), Achronix Semiconductor Corporation (US), Ranovus (Canada), and ASE Technology Holding Co., Ltd. (Taiwan) and Others- total 25 players have been covered.

Chiplet Market Highlights

This research report categorizes the chiplet market based on processor, packaging technology, end-use application, and region.

Segment

Subsegment

By Processor:

  • Field-Programmable Gate Array (FPGA)
  • Graphics Processing Unit (GPU)
  • Central Processing Unit (CPU)
  • Application Processing Unit (APU)
  • Artificial Intelligence Application-specific Integrated Circuit (AI ASIC) Coprocessor

By Packaging Technology:

  • System-in-Package (SiP)
  • Flip Chip Chip Scale Package (FCCSP)
  • Flip Chip Ball Grid Array (FCBGA)
  • 2.5D/3D
  • Wafer-Level Chip Scale Package (WLCSP)
  • Fan-Out (FO)

By End-use Application:

  • Enterprise Electronics
  • Consumer Electronics
  • Automotive
  • Industrial Automation
  • Healthcare
  • Military & Aerospace
  • Others

By Region:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • France
    • Rest of Europe
  • Asia Pacific
    • China
    • Japan
    • South Korea
    • Rest of Asia Pacific
  • Rest of the World (RoW)
    • South America
    • Middle East & Africa

Recent Developments

  • In August 2023,  Google Cloud (US) and NVIDIA Corporation (US) collaborated to offer advanced AI infrastructure and software for deploying large generative AI models and accelerating data science tasks. This partnership streamlines AI supercomputer deployment via Google Cloud's NVIDIA-powered solutions, leveraging the same technology utilized by Google DeepMind and research teams. The integration optimizes PaxML, Google's LLM framework, for NVIDIA, accelerated computing, enhancing experimentation and scalability with H100 and A100 Tensor Core GPUs.
  • In June 2023, Intel Corporation (US) announced a partnership with Taiwan Semiconductor Manufacturing Company Limited (Taiwan) to manufacture chips for Intel's high-performance computing and graphics products. The partnership would help Intel reduce its reliance on external foundries.
  • In June 2023, Advanced Micro Devices Inc. (US) and Hewlett Packard Enterprise Co. (HPE) (US) collaborated on various initiatives emphasizing sustainability in technology. AMD's approach to energy efficiency involves chip design, notably utilizing chiplets to enhance efficiency and drive innovation for a more sustainable future. This innovation promises significant strides in sustainability.

Key Questions Addressed in the Report

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TABLE OF CONTENTS
 
1 INTRODUCTION (Page No. - 25)
    1.1 STUDY OBJECTIVES 
    1.2 MARKET DEFINITION 
    1.3 STUDY SCOPE 
           1.3.1 MARKETS COVERED
                    FIGURE 1 CHIPLET MARKET SEGMENTATION
           1.3.2 REGIONAL SCOPE
           1.3.3 INCLUSIONS AND EXCLUSIONS
           1.3.4 YEARS CONSIDERED
           1.3.5 CURRENCY CONSIDERED
    1.4 LIMITATIONS 
    1.5 STAKEHOLDERS 
    1.6 RECESSION IMPACT 
           FIGURE 2 GDP GROWTH PROJECTION UNTIL 2023 FOR MAJOR ECONOMIES
 
2 RESEARCH METHODOLOGY (Page No. - 31)
    2.1 RESEARCH DATA 
           FIGURE 3 CHIPLET MARKET: RESEARCH DESIGN
           2.1.1 SECONDARY DATA
                    2.1.1.1 Major secondary sources
                    2.1.1.2 Key data from secondary sources
           2.1.2 PRIMARY DATA
                    2.1.2.1 Participants and key opinion leaders for primary interviews
                    2.1.2.2 Breakdown of primaries
                    2.1.2.3 Key data from primary sources
           2.1.3 SECONDARY AND PRIMARY RESEARCH
                    2.1.3.1 Key industry insights
    2.2 MARKET SIZE ESTIMATION 
           FIGURE 4 RESEARCH FLOW FOR MARKET SIZE ESTIMATION
           2.2.1 BOTTOM-UP APPROACH
                    2.2.1.1 Approach to derive market size using bottom-up analysis (demand side)
                               FIGURE 5 MARKET SIZE ESTIMATION METHODOLOGY: BOTTOM-UP APPROACH
           2.2.2 TOP-DOWN APPROACH
                    2.2.2.1 Approach to derive market size using top-down analysis (supply side)
                               FIGURE 6 MARKET SIZE ESTIMATION METHODOLOGY: TOP-DOWN APPROACH
                    2.2.2.2 Supply-side analysis
                               FIGURE 7 MARKET SIZE ESTIMATION METHODOLOGY: SUPPLY-SIDE ANALYSIS
    2.3 MARKET BREAKDOWN AND DATA TRIANGULATION 
           FIGURE 8 DATA TRIANGULATION
    2.4 RESEARCH ASSUMPTIONS 
           FIGURE 9 ASSUMPTIONS
    2.5 APPROACH TO ANALYZE IMPACT OF RECESSION ON CHIPLET MARKET 
    2.6 RISK ASSESSMENT 
           TABLE 1 RISK ASSESSMENT
    2.7 RESEARCH LIMITATIONS 
 
3 EXECUTIVE SUMMARY (Page No. - 42)
    3.1 GROWTH RATE ASSUMPTIONS/FORECAST 
           FIGURE 10 CPU SEGMENT TO HOLD LARGEST MARKET SHARE IN 2028
           FIGURE 11 2.5D/3D SEGMENT TO HOLD LARGEST MARKET SHARE IN 2028
           FIGURE 12 ENTERPRISE ELECTRONICS SEGMENT TO HOLD LARGEST MARKET SHARE IN 2028
           FIGURE 13 ASIA PACIFIC HELD LARGEST SHARE OF CHIPLET MARKET IN 2022
 
4 PREMIUM INSIGHTS (Page No. - 46)
    4.1 ATTRACTIVE OPPORTUNITIES FOR PLAYERS IN CHIPLET MARKET 
           FIGURE 14 RISING NUMBER OF DATA CENTERS WORLDWIDE
    4.2 CHIPLET MARKET, BY PROCESSOR 
           FIGURE 15 CPU SEGMENT TO DOMINATE CHIPLET MARKET DURING FORECAST PERIOD
    4.3 CHIPLET MARKET, BY PACKAGING TECHNOLOGY AND END-USE APPLICATION 
           FIGURE 16 2.5D/3D AND ENTERPRISE ELECTRONICS SEGMENTS TO HOLD LARGEST MARKET SHARES IN 2023
    4.4 CHIPLET MARKET, BY REGION 
           FIGURE 17 ASIA PACIFIC TO HOLD LARGEST MARKET SHARE IN 2023
    4.5 CHIPLET MARKET, BY COUNTRY 
           FIGURE 18 CHINA TO REGISTER HIGHEST CAGR IN CHIPLET MARKET FROM 2023 TO 2028
 
5 MARKET OVERVIEW (Page No. - 49)
    5.1 INTRODUCTION 
    5.2 MARKET DYNAMICS 
           FIGURE 19 CHIPLET MARKET: DRIVERS, RESTRAINTS, OPPORTUNITIES, AND CHALLENGES
           5.2.1 DRIVERS
                    5.2.1.1 Adoption of high-performance computing (HPC) servers in various sectors
                    5.2.1.2 Proliferation of data centers worldwide
                               FIGURE 20 NUMBER OF DATA CENTERS WORLDWIDE
                    5.2.1.3 Adoption of advanced packaging technologies
                               FIGURE 21 ANALYSIS OF IMPACT OF DRIVERS ON CHIPLET MARKET
           5.2.2 RESTRAINTS
                    5.2.2.1 Heat management issues
                    5.2.2.2 Lack of industry-wide interoperability standards
                               FIGURE 22 ANALYSIS OF IMPACT OF RESTRAINTS ON CHIPLET MARKET
           5.2.3 OPPORTUNITIES
                    5.2.3.1 Development of quantum chiplets
                    5.2.3.2 Rapid expansion of 5G infrastructure
                    5.2.3.3 Rising incorporation of high-performance and power-efficient chiplets into medical devices
                    5.2.3.4 Adoption of chiplets in AI and edge computing applications
                    5.2.3.5 Increasing investments in autonomous vehicles
                               FIGURE 23 ANALYSIS OF IMPACT OF OPPORTUNITIES ON CHIPLET MARKET
           5.2.4 CHALLENGES
                    5.2.4.1 Challenges related to intellectual property (IP) protection and licensing
                    5.2.4.2 Cybersecurity and vulnerability issues associated with chiplet-based systems
                               FIGURE 24 ANALYSIS OF IMPACT OF OPPORTUNITIES ON CHIPLET MARKET
    5.3 TECHNOLOGY ANALYSIS 
    5.4 VALUE CHAIN ANALYSIS 
           FIGURE 25 CHIPLET MARKET: VALUE CHAIN ANALYSIS
    5.5 ECOSYSTEM MAPPING 
           TABLE 2 CHIPLET MARKET: ROLE OF KEY PLAYERS IN ECOSYSTEM
           FIGURE 26 KEY PLAYERS IN CHIPLET ECOSYSTEM
    5.6 TRENDS AND DISRUPTIONS IMPACTING CUSTOMERS’ BUSINESSES 
           FIGURE 27 REVENUE SHIFTS AND NEW REVENUE POCKETS FOR PLAYERS IN CHIPLET MARKET
    5.7 PORTER’S FIVE FORCES ANALYSIS 
           TABLE 3 CHIPLET MARKET: PORTER’S FIVE FORCES ANALYSIS
           FIGURE 28 PORTER’S FIVE FORCES ANALYSIS
           5.7.1 THREAT OF NEW ENTRANTS
           5.7.2 THREAT OF SUBSTITUTES
           5.7.3 BARGAINING POWER OF SUPPLIERS
           5.7.4 BARGAINING POWER OF BUYERS
           5.7.5 INTENSITY OF COMPETITIVE RIVALRY
    5.8 PRICING ANALYSIS 
           5.8.1 INDICATIVE PRICING ANALYSIS FOR CHIPLET SOLUTIONS
                    TABLE 4 INDICATIVE PRICING ANALYSIS, BY KEY PLAYER (USD)
                    TABLE 5 INDICATIVE PRICING ANALYSIS, BY PROCESSOR (USD)
                    TABLE 6 INDICATIVE PRICING ANALYSIS, BY APPLICATION (USD)
    5.9 CASE STUDY ANALYSIS 
           5.9.1 INTEL AND SIEMENS HEALTHINEERS DEVELOPED STATE-OF-THE-ART AI-POWERED IMAGING SOLUTIONS USING CHIPLETS
           5.9.2 ACHRONIX’S EMBEDDED FPGAS (EFPGAS) EMPOWERED HETEROGENEOUS CHIPLET INTEGRATION
           5.9.3 ELIYAN PARTNERED WITH TMSC TO ADVANCE CHIPLET INTEGRATION
    5.10 TRADE ANALYSIS 
           FIGURE 29 IMPORT DATA FOR PRODUCTS COVERED UNDER HS CODE 854231, BY COUNTRY, 2018–2022 (USD MILLION)
           FIGURE 30 EXPORT DATA FOR PRODUCTS COVERED UNDER HS CODE 854231, BY COUNTRY, 2018–2022 (USD MILLION)
    5.11 TARIFF ANALYSIS 
           TABLE 7 MFN TARIFF FOR HS CODE 854231-COMPLIANT PRODUCTS EXPORTED BY CHINA
           TABLE 8 MFN TARIFF FOR HS CODE 854231-COMPLIANT PRODUCTS EXPORTED BY US
           TABLE 9 MFN TARIFF FOR HS CODE 854231-COMPLIANT PRODUCTS EXPORTED BY GERMANY
    5.12 PATENT ANALYSIS 
           FIGURE 31 NUMBER OF PATENTS GRANTED RELATED TO CHIPLETS PUBLISHED FROM 2012 TO 2023
           FIGURE 32 TOP 10 PATENT APPLICANTS, 2012–2023
           TABLE 10 TOP 20 PATENT OWNERS, 2012–2023
           TABLE 11 PATENT REGISTRATIONS, 2019–2023
    5.13 KEY CONFERENCES AND EVENTS, 2023–2024 
           TABLE 12 CHIPLET MARKET: KEY CONFERENCES AND EVENTS, 2023–2024
    5.14 STANDARDS AND REGULATORY LANDSCAPE 
           5.14.1 REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
                    TABLE 13 NORTH AMERICA: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
                    TABLE 14 EUROPE: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
                    TABLE 15 ASIA PACIFIC: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
                    TABLE 16 ROW: REGULATORY BODIES, GOVERNMENT AGENCIES, AND OTHER ORGANIZATIONS
           5.14.2 STANDARDS
           5.14.3 GOVERNMENT REGULATIONS
    5.15 KEY STAKEHOLDERS AND BUYING CRITERIA 
           5.15.1 KEY STAKEHOLDERS IN BUYING PROCESS
                    FIGURE 33 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP 3 END-USE APPLICATIONS
                    TABLE 17 INFLUENCE OF STAKEHOLDERS ON BUYING PROCESS FOR TOP 3 END-USE APPLICATIONS (%)
           5.15.2 BUYING CRITERIA
                    FIGURE 34 KEY BUYING CRITERIA FOR TOP 3 END-USE APPLICATIONS
                    TABLE 18 KEY BUYING CRITERIA FOR TOP 3 END-USE APPLICATIONS
 
6 CHIPLET MARKET, BY PROCESSOR (Page No. - 91)
    6.1 INTRODUCTION 
           FIGURE 35 CPU SEGMENT TO HOLD LARGEST SHARE OF CHIPLET MARKET IN 2028
           TABLE 19 CHIPLET MARKET, BY PROCESSOR, 2019–2022 (USD MILLION)
           TABLE 20 CHIPLET MARKET, BY PROCESSOR, 2023–2028 (USD MILLION)
    6.2 FIELD PROGRAMMABLE GATE ARRAY (FPGA) 
           6.2.1 RE-PROGRAMMABILITY, FLEXIBILITY, SCALABILITY, IMPROVED PERFORMANCE, AND POWER EFFICIENCY FEATURES TO FUEL DEMAND
                    TABLE 21 FPGA: MARKET, BY END-USE APPLICATION, 2019–2022 (USD MILLION)
                    TABLE 22 FPGA: MARKET, BY END-USE APPLICATION, 2023–2028 (USD MILLION)
                    TABLE 23 FPGA: MARKET, BY REGION, 2019–2022 (USD MILLION)
                    TABLE 24 FPGA: CHIPLET MARKET, BY REGION, 2023–2028 (USD MILLION)
    6.3 GRAPHICS PROCESSING UNIT (GPU) 
           6.3.1 HIGHER BANDWIDTH THAN CPUS AND EXPANDING AI, MACHINE LEARNING, AND DATA CENTER MARKETS TO DRIVE DEMAND
                    TABLE 25 GPU: CHIPLET MARKET, BY END-USE APPLICATION, 2019–2022 (USD MILLION)
                    TABLE 26 GPU:  MARKET, BY END-USE APPLICATION, 2023–2028 (USD MILLION)
                    TABLE 27 GPU: MARKET, BY REGION, 2019–2022 (USD MILLION)
                    TABLE 28 GPU: MARKET, BY REGION, 2023–2028 (USD MILLION)
    6.4 CENTRAL PROCESSING UNIT (CPU) 
           6.4.1 COST-EFFECTIVENESS AND ABILITY TO HANDLE CERTAIN AI ALGORITHMS TO FUEL DEMAND
                    TABLE 29 CPU: CHIPLET MARKET, BY END-USE APPLICATION, 2019–2022 (USD MILLION)
                    TABLE 30 CPU: MARKET, BY END-USE APPLICATION, 2023–2028 (USD MILLION)
                    TABLE 31 CPU: MARKET, BY REGION, 2019–2022 (USD MILLION)
                    TABLE 32 CPU: MARKET, BY REGION, 2023–2028 (USD MILLION)
    6.5 APPLICATION PROCESSING UNIT (APU) 
           6.5.1 EXCELLENT PERFORMANCE AND EFFICIENT THERMAL MANAGEMENT FEATURES TO DRIVE DEMAND
                    TABLE 33 APU: CHIPLET MARKET, BY END-USE APPLICATION, 2019–2022 (USD MILLION)
                    TABLE 34 APU: MARKET, BY END-USE APPLICATION, 2023–2028 (USD MILLION)
                    TABLE 35 APU: MARKET, BY REGION, 2019–2022 (USD MILLION)
                    TABLE 36 APU: MARKET, BY REGION, 2023–2028 (USD MILLION)
    6.6 ARTIFICIAL INTELLIGENCE APPLICATION-SPECIFIC INTEGRATED CIRCUIT (AI ASIC) COPROCESSOR 
           6.6.1 GROWING NEED FOR USER-SPECIFIC CUSTOMIZED SOLUTIONS TO DRIVE MARKET
                    TABLE 37 AI ASIC COPROCESSOR: MARKET, BY END-USE APPLICATION, 2019–2022 (USD MILLION)
                    TABLE 38 AI ASIC COPROCESSOR: MARKET, BY END-USE APPLICATION, 2023–2028 (USD MILLION)
                    TABLE 39 AI ASIC COPROCESSOR: MARKET, BY REGION, 2019–2022 (USD MILLION)
                    TABLE 40 AI ASIC COPROCESSOR: MARKET, BY REGION, 2023–2028 (USD MILLION)
 
7 CHIPLET MARKET, BY PACKAGING TECHNOLOGY (Page No. - 105)
    7.1 INTRODUCTION 
           FIGURE 36 2.5D/3D PACKAGING SEGMENT TO DOMINATE CHIPLET MARKET DURING FORECAST PERIOD
           TABLE 41 CHIPLET MARKET, BY PACKAGING TECHNOLOGY, 2019–2022 (USD MILLION)
           TABLE 42 CHIPLET MARKET, BY PACKAGING TECHNOLOGY, 2023–2028 (USD MILLION)
    7.2 SYSTEM-IN-PACKAGE (SIP) 
           7.2.1 ABILITY OF SYSTEM-IN-PACKAGE (SIP) TECHNOLOGY TO SEAMLESSLY INTEGRATE MULTIPLE HETEROGENEOUS CHIPLETS INTO SINGLE, COMPACT MODULE TO FUEL DEMAND
    7.3 FLIP CHIP CHIP SCALE PACKAGE (FCCSP) 
           7.3.1 EXCEPTIONAL ELECTRICAL PERFORMANCE OF FLIP CHIP CHIP SCALE PACKAGE (FCCSP) TECHNOLOGY TO FUEL DEMAND
    7.4 FLIP CHIP BALL GRID ARRAY (FCBGA) 
           7.4.1 STRONG ELECTRICAL CONNECTION AND EFFICIENT HEAT DISSIPATION FEATURES OF FLIP CHIP BALL GRID ARRAY (FCBGA) TECHNOLOGY TO DRIVE MARKET
    7.5 2.5D/3D 
           7.5.1 ABILITY OF 2.5D/3D PACKAGING TECHNOLOGY TO DELIVER SUPERIOR PERFORMANCE AND HIGH BANDWIDTH THROUGH VERTICAL STACKING TO PROPEL DEMAND
    7.6 WAFER-LEVEL CHIP SCALE PACKAGE (WLCSP) 
           7.6.1 CAPABILITY OF WAFER-LEVEL CHIP SCALE PACKAGING (WLCSP) TECHNOLOGY TO ELIMINATE NEED FOR TRADITIONAL PACKAGING SUBSTRATES AND COMPATIBILITY WITH HIGH-VOLUME MANUFACTURING PROCESSES TO SUPPORT MARKET GROWTH
    7.7 FAN-OUT (FO) 
           7.7.1 POTENTIALITY OF FAN-OUT (FO) PACKAGING TECHNOLOGY TO SUPPORT DIFFERENT CHIPLET CONFIGURATIONS TO FUEL ADOPTION
 
8 CHIPLET MARKET, BY END-USE APPLICATION (Page No. - 111)
    8.1 INTRODUCTION 
           FIGURE 37 ENTERPRISE ELECTRONICS SEGMENT TO DOMINATE CHIPLET MARKET DURING FORECAST PERIOD
           TABLE 43 CHIPLET MARKET, BY END-USE APPLICATION, 2019–2022 (USD MILLION)
           TABLE 44 CHIPLET MARKET, BY END-USE APPLICATION, 2023–2028 (USD MILLION)
    8.2 ENTERPRISE ELECTRONICS 
           8.2.1 INCREASING DEMAND FOR ENERGY EFFICIENCY IN ORGANIZATIONAL OPERATIONS TO DRIVE SEGMENTAL GROWTH
                    TABLE 45 ENTERPRISE ELECTRONICS: MARKET, BY PROCESSOR, 2019–2022 (USD MILLION)
                    TABLE 46 ENTERPRISE ELECTRONICS: MARKET, BY PROCESSOR, 2023–2028 (USD MILLION)
    8.3 CONSUMER ELECTRONICS 
           8.3.1 TECHNOLOGICAL ADVANCEMENTS IN CONSUMER ELECTRONICS TO FUEL ADOPTION OF MICROPROCESSORS FOR FAST DATA PROCESSING
                    TABLE 47 CONSUMER ELECTRONICS: MARKET, BY PROCESSOR, 2019–2022 (USD MILLION)
                    TABLE 48 CONSUMER ELECTRONICS: MARKET, BY PROCESSOR, 2023–2028 (USD MILLION)
    8.4 AUTOMOTIVE 
           8.4.1 ADVANCEMENTS IN ADAS AND AUTONOMOUS DRIVING TECHNOLOGIES TO SUPPORT SEGMENTAL GROWTH
                    TABLE 49 AUTOMOTIVE: MARKET, BY PROCESSOR, 2019–2022 (USD MILLION)
                    TABLE 50 AUTOMOTIVE: MARKET, BY PROCESSOR, 2023–2028 (USD MILLION)
    8.5 INDUSTRIAL AUTOMATION 
           8.5.1 INCREASING DEPLOYMENT OF ROBOTICS AND AUTOMATION ACROSS INDUSTRIAL PLANTS AND FACILITIES TO DRIVE DEMAND
                    TABLE 51 INDUSTRIAL AUTOMATION: MARKET, BY PROCESSOR, 2019–2022 (USD MILLION)
                    TABLE 52 INDUSTRIAL AUTOMATION: MARKET, BY PROCESSOR, 2023–2028 (USD MILLION)
    8.6 HEALTHCARE 
           8.6.1 RISING NEED FOR WEARABLES AND IMPLANTABLE DEVICES TO FUEL MARKET GROWTH
                    TABLE 53 HEALTHCARE: MARKET, BY PROCESSOR, 2019–2022 (USD MILLION)
                    TABLE 54 HEALTHCARE: MARKET, BY PROCESSOR, 2023–2028 (USD MILLION)
    8.7 MILITARY & AEROSPACE 
           8.7.1 GROWING NEED FOR RELIABILITY AND EXCEPTIONAL PERFORMANCE IN MILITARY & AEROSPACE SECTOR TO BOOST ADOPTION
                    TABLE 55 MILITARY & AEROSPACE: MARKET, BY PROCESSOR, 2019–2022 (USD MILLION)
                    TABLE 56 MILITARY & AEROSPACE: MARKET, BY PROCESSOR, 2023–2028 (USD MILLION)
    8.8 OTHERS 
           TABLE 57 OTHERS: CHIPLET MARKET, BY PROCESSOR, 2019–2022 (USD MILLION)
           TABLE 58 OTHERS: CHIPLET MARKET, BY PROCESSOR, 2023–2028 (USD MILLION)
 
9 CHIPLET MARKET, BY REGION (Page No. - 122)
    9.1 INTRODUCTION 
           FIGURE 38 ASIA PACIFIC TO DOMINATE CHIPLET MARKET DURING FORECAST PERIOD
           TABLE 59 CHIPLET MARKET, BY REGION, 2019–2022 (USD MILLION)
           TABLE 60 CHIPLET MARKET, BY REGION, 2023–2028 (USD MILLION)
    9.2 NORTH AMERICA 
           9.2.1 NORTH AMERICA: RECESSION IMPACT
                    FIGURE 39 NORTH AMERICA: CHIPLET MARKET SNAPSHOT
                    FIGURE 40 US TO DOMINATE NORTH AMERICAN CHIPLET MARKET DURING FORECAST PERIOD
                    TABLE 61 NORTH AMERICA: MARKET, BY COUNTRY, 2019–2022 (USD MILLION)
                    TABLE 62 NORTH AMERICA: MARKET, BY COUNTRY, 2023–2028 (USD MILLION)
                    TABLE 63 NORTH AMERICA: MARKET, BY PROCESSOR, 2019–2022 (USD MILLION)
                    TABLE 64 NORTH AMERICA: MARKET, BY PROCESSOR, 2023–2028 (USD MILLION)
           9.2.2 US
                    9.2.2.1 Rising demand for chiplets in data centers and presence of stringent environmental policies to fuel market growth
           9.2.3 CANADA
                    9.2.3.1 Government-led initiatives for boosting domestic semiconductor industry to drive demand
           9.2.4 MEXICO
                    9.2.4.1 Growing automotive industry to fuel market growth
    9.3 EUROPE 
           9.3.1 EUROPE: RECESSION IMPACT
                    FIGURE 41 EUROPE: CHIPLET MARKET SNAPSHOT
                    FIGURE 42 GERMANY TO DOMINATE EUROPEAN CHIPLET MARKET DURING FORECAST PERIOD
                    TABLE 65 EUROPE: MARKET, BY COUNTRY, 2019–2022 (USD MILLION)
                    TABLE 66 EUROPE: MARKET, BY COUNTRY, 2023–2028 (USD MILLION)
                    TABLE 67 EUROPE: MARKET, BY PROCESSOR, 2019–2022 (USD MILLION)
                    TABLE 68 EUROPE: CHIPLET MARKET, BY PROCESSOR, 2023–2028 (USD MILLION)
           9.3.2 GERMANY
                    9.3.2.1 Government-led investments in semiconductor industry to fuel market growth
           9.3.3 UK
                    9.3.3.1 Government-led focus on developing telecommunications industry to drive demand
           9.3.4 FRANCE
                    9.3.4.1 Strategic investments in semiconductor manufacturing to support market growth
           9.3.5 REST OF EUROPE
    9.4 ASIA PACIFIC 
           9.4.1 ASIA PACIFIC: RECESSION IMPACT
                    FIGURE 43 ASIA PACIFIC: CHIPLET MARKET SNAPSHOT
                    FIGURE 44 CHINA TO DOMINATE ASIA PACIFIC CHIPLET MARKET DURING FORECAST PERIOD
                    TABLE 69 ASIA PACIFIC: MARKET, BY COUNTRY, 2019–2022 (USD MILLION)
                    TABLE 70 ASIA PACIFIC: MARKET, BY COUNTRY, 2023–2028 (USD MILLION)
                    TABLE 71 ASIA PACIFIC: MARKET, BY PROCESSOR, 2019–2022 (USD MILLION)
                    TABLE 72 ASIA PACIFIC: MARKET, BY PROCESSOR, 2023–2028 (USD MILLION)
           9.4.2 CHINA
                    9.4.2.1 Government-led efforts for enhancing semiconductor capabilities to drive demand
           9.4.3 JAPAN
                    9.4.3.1 Technological advancements in automotive sector to accelerate market growth
           9.4.4 SOUTH KOREA
                    9.4.4.1 Booming consumer electronics industry to drive demand
           9.4.5 REST OF ASIA PACIFIC
    9.5 ROW 
           9.5.1 ROW: RECESSION IMPACT
                    TABLE 73 ROW: MARKET, BY REGION, 2019–2022 (USD MILLION)
                    TABLE 74 ROW: MARKET, BY REGION, 2023–2028 (USD MILLION)
                    TABLE 75 ROW: MARKET, BY PROCESSOR, 2019–2022 (USD MILLION)
                    TABLE 76 ROW: MARKET, BY PROCESSOR, 2023–2028 (USD MILLION)
           9.5.2 SOUTH AMERICA
                    9.5.2.1 Increased need for data centers to drive market growth
           9.5.3 MIDDLE EAST & AFRICA
                    9.5.3.1 Government funding for development of healthcare infrastructure to boost market growth
 
10 COMPETITIVE LANDSCAPE (Page No. - 146)
     10.1 OVERVIEW 
     10.2 KEY STRATEGIES ADOPTED BY MAJOR PLAYERS 
             TABLE 77 CHIPLET MARKET: OVERVIEW OF STRATEGIES ADOPTED BY KEY PLAYERS
     10.3 REVENUE ANALYSIS, 2020–2022 
             FIGURE 45 REVENUE ANALYSIS OF TOP FIVE MARKET PLAYERS, 2020–2022
     10.4 MARKET SHARE ANALYSIS, 2022 
             FIGURE 46 CHIPLET MARKET SHARE ANALYSIS, 2022
             TABLE 78 CHIPLET MARKET SHARE ANALYSIS, 2022
     10.5 EVALUATION MATRIX OF KEY COMPANIES, 2022 
             10.5.1 STARS
             10.5.2 EMERGING LEADERS
             10.5.3 PERVASIVE PLAYERS
             10.5.4 PARTICIPANTS
                        FIGURE 47 CHIPLET MARKET: EVALUATION MATRIX OF KEY COMPANIES, 2022
     10.6 EVALUATION MATRIX OF STARTUPS/SMALL AND MEDIUM-SIZED ENTERPRISES (SMES), 2022 
             10.6.1 PROGRESSIVE COMPANIES
             10.6.2 RESPONSIVE COMPANIES
             10.6.3 DYNAMIC COMPANIES
             10.6.4 STARTING BLOCKS
                        FIGURE 48 CHIPLET MARKET: EVALUATION MATRIX OF STARTUPS/SMES, 2022
     10.7 LIST OF STARTUPS/SMES 
             TABLE 79 CHIPLET MARKET: LIST OF KEY STARTUPS/SMES
     10.8 COMPETITIVE BENCHMARKING 
             TABLE 80 STARTUP/SME: COMPANY FOOTPRINT
             TABLE 81 OVERALL COMPANY FOOTPRINT
             TABLE 82 PROCESSOR: COMPANY FOOTPRINT
             TABLE 83 END-USE APPLICATION: COMPANY FOOTPRINT
             TABLE 84 REGION: COMPANY FOOTPRINT
     10.9 COMPETITIVE SCENARIOS AND TRENDS 
             10.9.1 PRODUCT LAUNCHES
                        TABLE 85 CHIPLET MARKET: PRODUCT LAUNCHES, 2019–2023
             10.9.2 DEALS
                        TABLE 86 CHIPLET MARKET: DEALS, 2019–2023
 
11 COMPANY PROFILES (Page No. - 176)
(Business overview, Products/Solutions/Services offered, Recent Developments, MNM view)*  
     11.1 KEY PLAYERS 
             11.1.1 INTEL CORPORATION
                        TABLE 87 INTEL CORPORATION: COMPANY OVERVIEW
                        FIGURE 49 INTEL CORPORATION: COMPANY SNAPSHOT
                        TABLE 88 INTEL CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED
                        TABLE 89 INTEL CORPORATION: PRODUCT LAUNCHES
                        TABLE 90 INTEL CORPORATION: DEALS
             11.1.2 ADVANCED MICRO DEVICES, INC.
                        TABLE 91 ADVANCED MICRO DEVICES, INC.: COMPANY OVERVIEW
                        FIGURE 50 ADVANCED MICRO DEVICES, INC.: COMPANY SNAPSHOT
                        TABLE 92 ADVANCED MICRO DEVICES, INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
                        TABLE 93 ADVANCED MICRO DEVICES, INC.: PRODUCT LAUNCHES
                        TABLE 94 ADVANCED MICRO DEVICES, INC.: DEALS
             11.1.3 APPLE INC.
                        TABLE 95 APPLE INC.: COMPANY OVERVIEW
                        FIGURE 51 APPLE INC.: COMPANY SNAPSHOT
                        TABLE 96 APPLE INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
                        TABLE 97 APPLE INC.: PRODUCT LAUNCHES
                        TABLE 98 APPLE INC.: DEALS
             11.1.4 IBM
                        TABLE 99 IBM: COMPANY OVERVIEW
                        FIGURE 52 IBM: COMPANY SNAPSHOT
                        TABLE 100 IBM: PRODUCTS/SOLUTIONS/SERVICES OFFERED
                        TABLE 101 IBM: PRODUCT LAUNCHES
                        TABLE 102 IBM: DEALS
             11.1.5 MARVELL
                        TABLE 103 MARVELL: COMPANY OVERVIEW
                        FIGURE 53 MARVELL: COMPANY SNAPSHOT
                        TABLE 104 MARVELL: PRODUCTS/SOLUTIONS/SERVICES OFFERED
                        TABLE 105 MARVELL: PRODUCT LAUNCHES
                        TABLE 106 MARVELL: DEALS
             11.1.6 MEDIATEK INC.
                        TABLE 107 MEDIATEK INC.: COMPANY OVERVIEW
                        FIGURE 54 MEDIATEK INC.: COMPANY SNAPSHOT
                        TABLE 108 MEDIATEK, INC.: PRODUCTS/SOLUTIONS/SERVICES OFFERED
                        TABLE 109 MEDIATEK, INC.: PRODUCT LAUNCHES
                        TABLE 110 MEDIATEK, INC.: DEALS
             11.1.7 NVIDIA CORPORATION
                        TABLE 111 NVIDIA CORPORATION: COMPANY OVERVIEW
                        FIGURE 55 NVIDIA CORPORATION: COMPANY SNAPSHOT
                        TABLE 112 NVIDIA CORPORATION: PRODUCTS/SOLUTIONS/SERVICES OFFERED
                        TABLE 113 NVIDIA CORPORATION: PRODUCT LAUNCHES
                        TABLE 114 NVIDIA CORPORATION: DEALS
             11.1.8 ACHRONIX SEMICONDUCTOR CORPORATION
                        TABLE 115 ACHRONIX SEMICONDUCTOR CORPORATION: COMPANY OVERVIEW
                        TABLE 116 ACHRONIX SEMICONDUCTOR CORPORATION: PRODUCTS/SOLUTIONS/ SERVICES OFFERED
                        TABLE 117 ACHRONIX SEMICONDUCTOR CORPORATION: PRODUCT LAUNCHES
                        TABLE 118 ACHRONIX SEMICONDUCTOR CORPORATION: DEALS
             11.1.9 RANOVUS
                        TABLE 119 RANOVUS: COMPANY OVERVIEW
                        TABLE 120 RANOVUS: PRODUCTS/SOLUTIONS/SERVICES OFFERED
                        TABLE 121 RANOVUS: PRODUCT LAUNCHES
                        TABLE 122 RANOVUS: DEALS
             11.1.10 ASE
                        TABLE 123 ASE: COMPANY OVERVIEW
                        FIGURE 56 ASE: COMPANY SNAPSHOT
                        TABLE 124 ASE: PRODUCTS/SOLUTIONS/SERVICES OFFERED
                        TABLE 125 ASE: PRODUCT LAUNCHES
                        TABLE 126 ASE: DEALS
     11.2 OTHER PLAYERS 
             11.2.1 CADENCE DESIGN SYSTEMS, INC.
             11.2.2 SYNOPSYS, INC.
             11.2.3 ALPHAWAVE SEMI
             11.2.4 ELIYAN
             11.2.5 NETRONOME
             11.2.6 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
             11.2.7 NHANCED SEMICONDUCTORS
             11.2.8 CHIPULLER
             11.2.9 SIFIVE, INC.
             11.2.10 RAMBUS
             11.2.11 AYAR LABS, INC.
             11.2.12 TACHYUM
             11.2.13 X-CELEPRINT
             11.2.14 KANDOU BUS SA
             11.2.15 RAIN NEUROMORPHICS
             11.2.16 TENSTORRENT
*Details on Business overview, Products/Solutions/Services offered, Recent Developments, MNM view might not be captured in case of unlisted companies.  
 
12 APPENDIX (Page No. - 240)
     12.1 DISCUSSION GUIDE 
     12.2 KNOWLEDGESTORE: MARKETSANDMARKETS’ SUBSCRIPTION PORTAL 
     12.3 CUSTOMIZATION OPTIONS 
     12.4 RELATED REPORTS 
     12.5 AUTHOR DETAILS 
 

The study involved four major activities in estimating the size for chiplet market. Exhaustive secondary research was done to collect information on the market, peer market, and parent market. The next step was to validate these findings, assumptions, and sizing with industry experts across value chains through primary research. The bottom-up approach was employed to estimate the overall market size. After that, market breakdown and data triangulation were used to estimate the market size of segments and subsegments.

Secondary Research

In the secondary research process, sources such as annual reports, press releases, investor presentations of companies, white papers, and articles by recognized authors were referred to. Secondary research was done to obtain key information about the market’s supply chain, the market's value chain, the pool of key market players, and market segmentation according to industry trends, region, and developments from both market and technology perspectives.

Primary Research

Extensive primary research has been conducted after understanding and analyzing the chiplet market scenario through secondary research. Several primary interviews have been conducted with key opinion leaders from both demand- and supply-side vendors across four major regions—North America, Europe, Asia Pacific, and RoW. Approximately 25% of primary interviews have been conducted with the demand side and 75% with the supply side. These primary data have been collected through telephonic interviews, questionnaires, and emails.

Chiplet Market Size, and Share

To know about the assumptions considered for the study, download the pdf brochure

Market Size Estimation

In the complete market engineering process, top-down and bottom-up approaches and several data triangulation methods have been used to estimate and forecast the market size for the overall market segments and subsegments listed in this report. Extensive qualitative and quantitative analyses have been performed on the complete market engineering process to list the key information/insights throughout the report.

The key players in the market have been identified through secondary research, and their market shares in the respective regions have been determined through primary and secondary research. This entire procedure includes the study of annual and financial reports of the top players as well as extensive interviews with industry experts (such as CEOs, VPs, directors, and marketing executives) for key insights (both quantitative and qualitative) on the chiplet market. All percentage shares, splits, and breakdowns have been determined using secondary sources and verified through primary sources. All the possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data. This data has been consolidated and supplemented with detailed inputs and analysis from MarketsandMarkets and presented in this report.

Chiplet Market: Bottom-Up Approach

Chiplet Market Size, and Bottom-Up Approach

The bottom-up approach has been employed to arrive at the overall size of the chiplet market from the revenues of key players and their share in the market.

Chiplet Market: Top-Down Approach

Chiplet Market Size, and Top-Down Approach

In the top-down approach, the overall market size has been used to estimate the size of the individual markets (mentioned in the market segmentation) through percentage splits from secondary and primary research. For the calculation of specific market segments, the most appropriate immediate parent market size has been used to implement the top-down approach. The bottom-up approach has also been implemented for the data obtained from the secondary research to validate the market size of various segments. Each company’s market share has been estimated to verify the revenue shares used earlier in the bottom-up approach. With the data triangulation procedure and validation of the data through primaries, the overall parent market size and each individual market size have been determined and confirmed in this study.

Data Triangulation

After arriving at the overall market size through the above process, the overall market has been split into several segments. To complete the overall market engineering process and arrive at the exact statistics for all the segments, market breakdown, and data triangulation procedures have been employed, wherever applicable. The data has been triangulated by studying various factors and trends from both the demand and supply sides. The market has also been validated using both top-down and bottom-up approaches.

Definition

A chiplet is a discrete hardware component integrated into a heterogeneous integrated circuit (IC). Its role is to enhance the functionality of the final IC, ensuring it matches or exceeds the capabilities of a monolithic die, typically by optimizing specific functions economically or physically. Chiplets represent a fundamental shift in semiconductor design and manufacturing, departing from the traditional monolithic approach where all semiconductor device components are integrated into a single monolithic die.

Key Stakeholders

  • Chiplet manufacturers
  • Semiconductor foundries
  • Original equipment manufacturers (OEMs)
  • Fabless semiconductor companies
  • Electronic design automation (EDA) providers
  • Packaging and interconnect suppliers
  • Material suppliers
  • Test and inspection equipment manufacturers
  • Industry associations and standards bodies
  • Research and development institutions
  • Government regulatory bodies
  • Investors and financial institutions
  • Competitive analysis firms

Report Objectives

  • To describe and forecast the chiplet market based on processor, packaging technology, end-use application, and region
  • To forecast the size of the market segments for major regions—North America, Europe, Asia Pacific, and the Rest of the World (RoW)
  • To provide detailed information regarding the major factors influencing the growth of the market (drivers, restraints, opportunities, and challenges)
  • To provide an ecosystem analysis, case study analysis, patent analysis, technology analysis, indicative pricing analysis, Porter’s Five Forces analysis, and regulatory landscape pertaining to the chiplet market
  • To provide a detailed overview of the value chain of the chiplet market
  • To strategically analyze micromarkets1 with respect to individual growth trends, prospects, and contributions to the total market
  • To strategically profile the key players and comprehensively analyze their market shares and core competencies2
  • To analyze the opportunities in the market for stakeholders and describe the competitive landscape of the market
  • To analyze competitive developments such as collaborations, agreements, partnerships, product developments, and research & development (R&D) in the market
  • To analyze the impact of the recession on the chiplet market

Available Customizations

With the given market data, MarketsandMarkets offers customizations according to the company’s specific needs. The following customization options are available for the report:

Company Information

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Custom Market Research Services

We will customize the research for you, in case the report listed above does not meet with your exact requirements. Our custom research will comprehensively cover the business information you require to help you arrive at strategic and profitable business decisions.

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