The chiplet market is projected to grow from USD 6.5 billion in 2023 and is projected to reach USD 148.0 billion by 2028; it is expected to grow at a CAGR of 86.7% from 2023 to 2028.
The growth of the chiplet market is driven by rapid expansion of 5G infrastructure and adoption of advanced packaging technologies.
Key strategies adopted by the players in the chiplet market ecosystem to enhance their product portfolios, increase their market share and expand their presence in the market mainly include new product launches, collaborations, partnerships and acquisitions.
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For instance, in June 2023, Advanced Micro Devices, Inc. (US) introduced the Versal Premium VP1902 adaptive system-on-chip (SoC), the world's largest adaptive SoC. With twice the capacity of the previous generation, this chiplet-based device simplifies verification for intricate semiconductor designs, empowering designers to expedite the innovation and validation of ASICs and SoCs, accelerating the launch of next-gen technologies.
in March 2023, Intel Corporation (US) unveiled the Agilex 7 FPGAs featuring F-Tile technology, boasting the industry's fastest FPGA transceivers at up to 116 Gbps. They find applications in 400 Gbps to 1.6 Tbps optical networking, 25/50G passive optical networks, and broadcast standards like HDMI and SDI, catering to bandwidth-intensive environments such as data centers and high-speed networks.
Intel Corporation (US) designs, manufactures, and sells computer systems and products such as computing, networking, data storage, and communication components. Intel operates through the following segments: Client Computing Group (CCG), Data Center & AI (DCAI), Network and Edge (NEX), Mobileye, Accelerated Computing Systems and Graphics (AXG), Intel Foundry Services (IFS), and All Other. The company offers chiplet-based solutions through the Data Center & AI (DCAI) business segment, such as Intel Agilex 7 FPGA and SoC FPGA F-Series, Intel Agilex 7 FPGA and SoC FPGA I-Series, Intel Agilex 7 FPGA and SoC FPGA M-Series, Intel Agilex 9 SoC FPGA Direct RF-Series, Intel Stratix 10 FPGA and SoC FPGA.
Advanced Micro Devices, Inc.:
Advanced Micro Devices, Inc. (AMD) (US) is an American multinational semiconductor company that designs and manufactures a wide range of microprocessors, graphics processing units (GPUs), and other semiconductor products. The company operates its business through the following segments: Data Center, Client, Gaming, and Embedded. The product portfolio of the Data Center segment includes Central Processing Units (CPUs), Graphical Processing Units (GPUs), Data Processing Units (DPUs), Field-Programmable Gate Arrays (FPGAs), and System-on-chip (SoC) products that are specifically designed for data centers. On the other hand, the Client segment offers CPUs, Accelerated Processing Units (APUs), and chipsets for desktop and notebook personal computers. The Gaming segment provides discrete GPUs, semi-custom SoC products, and development services. Finally, the Embedded segment includes embedded CPUs, GPUs, APUs, FPGAs, and Adaptive SoC products that are intended for use in embedded systems.
AMD offers a wide range of chiplet-based products such as advanced graphics gaming cards, AMD Radeon Pro graphics cards, and AMD Ryzen 7000 series processors. The company provides various AI solutions for data centers and cloud, edge and endpoint, and developers. It also offers solutions for workloads, deployments, networks, infrastructure, storage, and resources in data centers and cloud. Additionally, it caters to multiple industries, including aerospace and defense, architecture, engineering and construction, automotive, broadcast and professional audio/visual, government, consumer electronics, design and manufacturing, education, emulation and prototyping, healthcare and sciences, industrial and vision, media and entertainment, robotics, software and sciences, supercomputing and research, telecom and networking, test and measurement, and wired and wireless communications.
Chiplet Market by Processor (Field-Programmable Gate Array (FPGA), Central Processing Unit (CPU), Graphics Processing Unit (GPU), APU, AI ASIC Co-Processor), Packaging Technology (SiP, FCCSP, FCBGA, 2.5D/3D, WLCSP, Fan-Out) - Global Forecast to 2028
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