Chiplet Market

The chiplet market is expected to grow from USD 51.94 billion in 2025 to USD 157.23 billion by 2030, at a CAGR of 24.8% during the forecast period.

The growth of the chiplet market is fueled by the rapid expansion of 5G infrastructure and the adoption of advanced packaging technologies. Main strategies used by players in the chiplet market ecosystem to boost their product offerings, increase market share, and grow their presence include launching new products, collaborating, forming partnerships, and making acquisitions.

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Major Chiplet Companies Include:

• Intel Corporation (US)
• Advanced Micro Devices, Inc. (US)
• Apple Inc. (US)
• IBM (US)
• Marvell (US)
• MediaTek Inc. (Taiwan)
• NVIDIA Corporation (US)
• Achronix Semiconductor Corporation (US)
• Ranovus (Canada)
• ASE Technology Holding Co., Ltd. (Taiwan)

Major vendors in the chiplet market include Intel Corporation (US), Advanced Micro Devices, Inc. (US), Apple Inc. (US), IBM (US), Marvell (US), MediaTek Inc. (Taiwan), NVIDIA Corporation (US), Achronix Semiconductor Corporation (US), Ranovus (Canada), and ASE Technology Holding Co., Ltd. (Taiwan). Key strategies adopted by the players in the chiplet market ecosystem to enhance their product portfolios, increase their market share, and expand their presence mainly include new product launches, partnerships, and acquisitions.

In September 2025, NVIDIA announced an investment in Intel, signaling a significant collaboration between the two companies to co-develop CPUs and GPU chiplet-integrated SoCs connected via NVLink. As part of this partnership, Intel will design x86 SoCs that incorporate NVIDIA RTX GPU chiplets, effectively combining Intel’s CPU capabilities with NVIDIA’s GPU power in a single package. For the data center segment, Intel will also create custom x86 CPUs tailored to NVIDIA’s AI infrastructure.

In June 2025, Advanced Micro Devices, Inc. acquired Enosemi, a startup focused on silicon photonics and photonic integrated circuits. The goal is to accelerate development of photonics and co-packaged optics (CPO) for next-generation AI systems and high-bandwidth interconnects. This complements chiplet designs by enabling very high-bandwidth optical interconnects—rather than purely electronic ones—between chiplets or packages.

Intel Corporation (US)

Intel’s strategy in the chiplet market emphasizes heterogeneous integration and advanced packaging innovation to improve performance, scalability, and manufacturing flexibility. Its core strengths include semiconductor process technology, chip design, and packaging innovations such as Foveros 3D stacking and EMIB (Embedded Multi-die Interconnect Bridge). Intel actively seeks partnerships and acquisitions to bolster its ecosystem, including collaborations with foundries and packaging experts to expand its chiplet manufacturing capabilities. The company also advances vertical integration by managing both design and fabrication internally to maintain quality and drive innovation. These efforts position Intel as a leader in next-generation chip architectures for computing, AI, and data center applications.

Advanced Micro Devices, Inc. (US)

AMD’s chiplet market strategy focuses on modular architecture and cost-effective scalability, enabling it to deliver high-performance computing solutions for both consumer and enterprise sectors. Its main strengths include chiplet design, interconnect innovation via Infinity Fabric, and expertise in CPU-GPU integration. AMD has pursued key initiatives such as acquiring Xilinx to boost its adaptive computing capabilities and merging with Pensando Systems to strengthen its data center offerings. The company adopts a largely horizontal integration approach, partnering with foundries like TSMC for manufacturing while concentrating on design and innovation. Through this strategy, AMD continues to expand its market share and lead in performance-oriented, energy-efficient chiplet-based solutions.

Market Ranking

Major players in the chiplet market include Intel Corporation, Advanced Micro Devices (AMD), Apple Inc., IBM, and Marvell Technology, all based in the US. These companies lead innovation through advanced packaging, heterogeneous integration, and modular design architectures. Intel and AMD are developing chiplet-based processors for high-performance computing and data centers, while Apple uses custom chiplet designs to improve efficiency in its devices. IBM and Marvell focus on AI, cloud infrastructure, and networking solutions, further strengthening US dominance in chiplet technology. Intel Corporation (US), Advanced Micro Devices, Inc. (US), Apple Inc. (US), IBM (US), and Marvell (US) are among the key companies in the chiplet market. Together, they hold an estimated 75–87% share of the overall market.

Related Reports:

Chiplet Market by Processor (Field-Programmable Gate Array (FPGA), Central Processing Unit (CPU), Graphics Processing Unit (GPU), SOC, AI ASIC Co-Processor), Packaging Technology (SiP, FCCSP, FCBGA,2.5D/3D, WLCSP, Fan-Out) - Global Forecast to 2030

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