Hermetic Packaging Market

Hermetic Packaging Market by Configuration (Multilayer Ceramic Packages, Metal Can Packages, Pressed Ceramic Packages), Type (Ceramic-Metal Sealing, Glass-Metal Sealing), Application, Industry, and Geography - Global Forecast to 2023

Report Code: SE 4788 Feb, 2018, by marketsandmarkets.com
Updated date -

The hermetic packaging market size is projected to reach USD 4,516 million by 2023 from an estimation of USD 3,250 million in 2017, at a CAGR of 6.8%. The key factors driving this market is growing need of protecting highly sensitive electronic components from extraneous particles, such as moisture, atmospheric pressure, and soil/grime; and strong demand for hermetically packaged components from the industries such as automotive, electronics, and aeronautics. Furthermore, underlying opportunities in this space include increasing adoption of hermetic packaging for protection of electronic implantable medical devices and rising demand from APAC countries for hermetically packaged components and ICs for myriad applications.

Hermetic Packaging Market

Hermetic Packaging Market Dynamics

Growing demand from industries such as automobile electronics and aerospace

Airbags and seat belt pretensioners are the most well-known automobile safety devices. Hermetic packaging reliably encapsulates some of the vital components—such as crash sensors and airbag initiators—to ensure its functioning at all times without any failure for several years. It is also used to protect a large variety of sensors that can be found in engine management, in-car climate modulation, energy technology, and vehicle stability control, such as tire pressure sensors; hermetic packaging makes these sensors extremely resistant to temperature fluctuations, pressure, and aggressive substances.

Owing to high quality standards and reliable performance of hermetically packaged components, hermetic packaging has been a trusted and dependable method for avoiding any mishaps in the avionics and space industry. In the aerospace industry, hermetically sealed terminals, headers, and connectors are mainly used to protect avionics within the black box and sensors in the fuel system as it prevents fuel leakage. Major requirements of safety and absolute reliability in industries, such as automobile, electronics, and aeronautics and space, are contributing to the rising demand for hermetic packaging, and have been propelling the growth of the same market.

Stringent standards for hermetic packaging

Every hermetically packaged electronic component or device used in the military & defense industry needs to meet the US military standards such as method 1014.13 of MIL-STD-883, method 1071 of MIL-STD-750, and appendix C of MIL-PRF-38534G. These standards focus on measurement of the hermeticity of a package and define the acceptable leak rate for hermetic packaging. According to these standards, the moisture level of 5,000 parts per million (ppm) at 100°C is acceptable for packages of internal volume smaller than 10 mm3 as well as a leak rate of ≤510−9cm3s−1 of dry air at 25°C.

Microelectronic components used in aerospace, military, and medical devices have the toughest regulation for hermetic packaging primarily because of their life-critical applications. Tightening of standards compels companies buying new leak test equipment as older ones no longer have the required test sensitivity to test according to the new standards. Market players need to adhere to such standards to increase their market share at the expense of increased expenditure. These stringent standards for hermetic packaging restrain the growth of the concern market.

Based on application, transistors to hold the largest market share of hermetic packaging market

Hermetically packaged transistors are mostly offered as single, dual, or quad channel. They are capable of operating at a military temperature range of −55°C to +125°C. Each channel of these transistors contains a gallium arsenide phosphide (GaAsP) light-emitting diode optically coupled to an integrated photon detector. Separate connections for photodiodes and output transistor collectors reduce the base-collector capacitance and lead to increase in the speed of operation of up to a hundred times over that of a conventional transistor or optocoupler. These hermetically packaged transistors can be used for applications such as the designing of telecommunication circuits and home appliances. Semelab plc. (UK), Texas Instruments Incorporated (US), and Agilent Technologies (US) are some of the companies that offer hermetically sealed transistors.

The hermetic packaging market for Ceramic-Metal Sealing (CERTM) is expected to be the largest shareholder of hermetic packaging in coming years

The hermetic packaging market  for Ceramic-Metal Sealing (CERTM) held the largest market share of the hermetic packaging market in 2017 owing to growing demand for thermal shock-resistant and low-porosity type of hermetic packaging material. Ceramic–metal seals are used in industries that entail high operating temperature, high voltage withstanding, biocompatibility, or special chemical resistance. For instance, owing to the need for high vacuum integrity and miniaturization of input or output terminals, infrared applications need high temperature cofired ceramic (HTCC) feedthroughs to provide design solutions for next-generation fiber-optic telecommunication packages, night vision seekers, and fire-control systems. Key manufacturers of bulk these modules are Schott (Germany), Ametek (US), and Amkor Technology (US).

Hermetic Packaging Market

APAC to account for the largest market size during the forecast period

Asia Pacific accounted for the largest share of the hermetic packaging market in 2017. The market in APAC has been segmented into China, Japan, South Korea, India, and Taiwan. Growing energy needs, emerging economies, and increasing defense spending are some of the factors driving the growth of this market in the region. In the last few years, the demand for hermetic packaging has significantly increased for the military & defense, aeronautics and space, automotive, and energy and nuclear safety industries. The rising military capabilities of developing countries, such as China, India and South Korea, in APAC are boosting the demand for hermetic packaging for sensitive electronic components.

Key Market Players

Schott (Germany), Teledyne Microelectronics (US), Ametek (US), Texas Instruments (US), and Amkor Technology (US). Other major players in the hermetic packaging market include Kyocera (Japan), Materion (Japan), Egide (France), Micross Components (US), Legacy Technologies (US), Willow Technologies (UK), Intersil (Japan), SGA Technologies (UK), Complete Hermetics (US), SHP (US), Primoceler (Finland), Coat-X (Switzerland), Hermetics Solutions Group (US), Stratedge (US), and CHI (China) are a few major players in the hermetic packaging market.

Report Scope

Report Metric

Details

Market size available for years

2018–2023

Base year considered

2017

Forecast period

2018–2023

Forecast units

Value, USD million/thousands

Segments covered

Configuration, Type, Application, Industry, and Region

Regions covered

North America, Europe, APAC, and RoW

Companies covered

Schott (Germany), Teledyne Microelectronics (US), Ametek (US), Texas Instruments (US), and Amkor Technology (US). Other major players in the hermetic packaging market include Kyocera (Japan), Materion (Japan), Egide (France), Micross Components (US), Legacy Technologies (US), Willow Technologies (UK), Intersil (Japan), SGA Technologies (UK), Complete Hermetics (US), SHP (US), Primoceler (Finland), Coat-X (Switzerland), Hermetics Solutions Group (US), Stratedge (US), and CHI (China) are a few major players in the hermetic packaging market.

Hermetic packaging market segmentation:

In this report, the hermetic packaging market is segmented into the following categories:

Hermetic packaging market, by Configuration:

  • Pressed Ceramic Packages
  • Multilayer Ceramic Packages
  • Metal Can Packages

Hermetic packaging market, by Type:

  • Ceramic-Metal Sealing (CERTM)
  • Glass-Metal Sealing (GTMS)
  • Passivation Glass
  • Transponder Glass
  • Reed Glass

Hermetic packaging market, by Application:

  • Transistors
  • Sensors
  • Lasers
  • Photodiodes
  • Airbag Initiators
  • Oscillating Crystals
  • MEMS Switches
  • Others (Fiber Optic Components and RF Connectors)

Hermetic packaging market, by Industry:

  • Military & Defense
  • Aeronautics and Space
  • Automotive (Airbag Initiation, Battery Protection, RFID Transponder Operation)
  • Energy and Nuclear Safety (Electrical Penetration Control, Oil & Gas Applications, Fuel Cell Manufacturing)
  • Medical (Dental Applications, Veterinary Applications)
  •  Telecommunications
  • Consumer Electronics
  • Others (Agriculture and Livestock Farming)

Hermetic packaging market, by Region:

  • North America
  • Europe
  • APAC
  • RoW

Recent Developments

  • In April 2017, Schott’s Eternnolac terminal header was launched with an integrated electric assembly.
  • In April 2016, Ametek launched the glass-to-fiber optic seal (GTFOS) method for hermetic packaging.
  • In May 2017, Amkor acquired Nanium to strengthen its position for providing wafer-level packaging for the following applications: smartphones and tablets.
  • In October 2015, Texas Instruments DLP chipset available in a 355-pin hermetic package is used for 3D printing and lithography-related applications.
  • In May 2017, Kyocera developed ceramic RFID package that has an embedded antenna having applications in automotive and mHealth.

Critical Questions the Report Answers:

  • Where will all these developments take the industry in the mid to long term?
  • What are emerging application areas that are expected to adopt hermetic packaging?
  • Which end-use application of in the hermetic packaging market is growing at the highest rate?
  • Which type of herematic packaging is expected to penetrate significantly during the forecast period?
  • What type of industry is the most opportunistic for hermetic packaging manufacturers in the coming years?

To speak to our analyst for a discussion on the above findings, click Speak to Analyst

Table of Contents

1 Introduction (Page No. - 14)
    1.1 Objectives of the Study
    1.2 Definition
    1.3 Study Scope
    1.4 Years Considered for the Study
    1.5 Currency
    1.6 Limitations
    1.7 Stakeholders

2 Research Methodology (Page No. - 18)
    2.1 Research Data
           2.1.1 Secondary Data
                    2.1.1.1 Secondary Sources
           2.1.2 Primary Data
                    2.1.2.1 Primary Interviews With Experts
                    2.1.2.2 Key Data From Primary Sources
                    2.1.2.3 Key Industry Insights
                    2.1.2.4 Breakdown of Primaries
           2.1.3 Secondary and Primary Research
    2.2 Market Size Estimation
           2.2.1 Bottom-Up Approach
           2.2.2 Top-Down Approach
    2.3 Market Breakdown and Data Triangulation
    2.4 Assumptions

3 Executive Summary (Page No. - 28)

4 Premium Insights (Page No. - 33)
    4.1 Attractive Opportunities in the Hermetic Packaging Market
    4.2 Packaging Market, By Configuration
    4.3 Packaging Market, By Type
    4.4 Packaging Market, By Industry
    4.5 Packaging Market, By Application and Country
    4.6 Packaging Market, By Country

5 Market Overview (Page No. - 37)
    5.1 Introduction
    5.2 Market Dynamics
           5.2.1 Drivers
                    5.2.1.1 Adoption of Hermetic Packaging for Protecting Highly Sensitive Electronic Components
                    5.2.1.2 Growing Demand From Industries Such as Automobile Electronics and Aerospace
           5.2.2 Restraint
                    5.2.2.1 Stringent Standards for Hermetic Packaging
           5.2.3 Opportunities
                    5.2.3.1 Increasing Adoption of Hermetic Packaging for Protection of Electronic Implantable Medical Devices
                    5.2.3.2 Rising Demand From APAC Countries for Hermetically Packaged Components and Ics for Myriad Applications
           5.2.4 Challenge
                    5.2.4.1 High Infrastructure Cost Incurred By Controlled and Regulated Packaging Environment
                    5.2.4.2 Competition From Near-Hermetic Packaging
    5.3 Value Chain Analysis

6 Market, By Configuration (Page No. - 43)
    6.1 Introduction
    6.2 Multilayer Ceramic Packages
    6.3 Pressed Ceramic Packages
    6.4 Metal Can Packages

7 Market, By Type (Page No. - 48)
    7.1 Introduction
    7.2 Passivation Glass
    7.3 Reed Glass
    7.4 Transponder Glass
    7.5 Glass–Metal Sealing (GTMS)
    7.6 Ceramic–Metal (CERTM) Sealing

8 Market, By Application (Page No. - 56)
    8.1 Introduction
    8.2 Transistors
    8.3 Sensors
    8.4 Lasers
    8.5 Photodiodes
    8.6 Airbag Ignitors
    8.7 Oscillating Crystals
    8.8 MEMS Switches
    8.9 Others

9 Market, By Industry (Page No. - 64)
    9.1 Introduction
    9.2 Military & Defense
    9.3 Aeronautics and Space
    9.4 Automotive
           9.4.1 Airbag Initiation
           9.4.2 Battery Protection
           9.4.3 Rfid Transponder Operation
    9.5 Energy and Nuclear Safety
           9.5.1 Electrical Penetration Control
           9.5.2 Oil & Gas Applications
           9.5.3 Fuel Cell Manufacturing
    9.6 Medical
           9.6.1 Dental Applications
           9.6.2 Veterinary Applications
    9.7 Telecommunications
    9.8 Consumer Electronics
    9.9 Others

10 Geographic Analysis (Page No. - 95)
     10.1 Introduction
     10.2 North America
             10.2.1 US
             10.2.2 Canada
             10.2.3 Mexico
     10.3 Europe
             10.3.1 Germany
             10.3.2 France
             10.3.3 Italy
             10.3.4 UK
             10.3.5 Spain
             10.3.6 Rest of Europe
     10.4 APAC
             10.4.1 China
             10.4.2 Japan
             10.4.3 South Korea
             10.4.4 Taiwan
             10.4.5 India
             10.4.6 Rest of APAC
     10.5 RoW
             10.5.1 South America
             10.5.2 Middle East and Africa

11 Competitive Landscape (Page No. - 107)
     11.1 Overview
     11.2 Ranking of Players, 2017
     11.3 Competitive Scenario
             11.3.1 Product Launches
             11.3.2 Agreements, Partnerships, Collaborations, Contracts, & Joint Ventures
             11.3.3 Mergers & Acquisitions

12 Company Profile (Page No. - 111)
(Business Overview, Products Offered, Recent Developments, SWOT Analysis, and MnM View)*
     12.1 Key Players
             12.1.1 Schott
             12.1.2 Ametek
             12.1.3 Amkor
             12.1.4 Texas Instruments
             12.1.5 Teledyne Microelectronics
             12.1.6 Kyocera
             12.1.7 Materion
             12.1.8 Egide
             12.1.9 Micross Components
             12.1.10 Legacy Technologies
             12.1.11 Willow Technologies
             12.1.12 Intersil
             12.1.13 SGA Technologies
             12.1.14 Complete Hermetics
             12.1.15 SHP
     12.2 Other Companies
             12.2.1 Primoceler
             12.2.2 Coat-X
             12.2.3 Hermetic Solutions Group
             12.2.4 Stratedge
             12.2.5 CHI

*Details on Business Overview, Products Offered, Recent Developments, SWOT Analysis, and MnM View Might Not Be Captured in Case of Unlisted Companies.

13 Appendix (Page No. - 146)
     13.1 Insights of Industry Experts
     13.2 Discussion Guide
     13.3 Knowledge Store: Marketsandmarkets’ Subscription Portal
     13.4 Introducing RT: Real-Time Market Intelligence
     13.5 Available Customizations
     13.6 Related Reports
     13.7 Author Details


List of Tables (66 Tables)

Table 1 Hermetic Packaging Market, By Configuration, 2015–2023 (USD Million)
Table 2 Market for Multilayer Ceramic Packages, By Industry, 2015–2023 (USD Million)
Table 3 Market for Pressed Ceramic Packages, By Industry, 2015–2023 (USD Million)
Table 4 Market for Metal Can Packages, By Industry, 2015–2023 (USD Million)
Table 5 Market, By Type, 2015–2023 (USD Million)
Table 6 Market for Passivation Glass, By Application, 2015–2023 (USD Million)
Table 7 Market for Reed Glass, By Application, 2015–2023 (USD Million)
Table 8 Market for Transponder Glass, By Application, 2015–2023 (USD Million)
Table 9 Packaging Market for Glass–Metal Sealing (GTMS), By Application, 2015–2023 (USD Million)
Table 10 Market for Ceramic–Metal (CERTM) Sealing, By Application, 2015–2023 (USD Million)
Table 11 Market, By Application, 2015–2023 (USD Million)
Table 12 Market for Transistors, By Configuration, 2015–2023 (USD Million)
Table 13 Market for Sensors, By Configuration, 2015–2023 (USD Million)
Table 14 Market for Lasers, By Configuration, 2015–2023 (USD Million)
Table 15 Market for Photodiodes, By Configuration, 2015–2023 (USD Million)
Table 16 Market for Airbag Ignitors, By Configuration, 2015–2023 (USD Million)
Table 17 Market for Oscillating Crystals, By Configuration, 2015–2023 (USD Million)
Table 18 Market for MEMS Switches, By Configuration, 2015–2023 (USD Million)
Table 19 Market for Other Applications, By Configuration, 2015–2023 (USD Million)
Table 20 Market, By Industry, 2015–2023 (USD Million)
Table 21 Market for Military & Defense Industry, By Region, 2015–2023 (USD Million)
Table 22 Market for Military & Defense Industry in North America, By Country, 2015–2023 (USD Million)
Table 23 Market for Military & Defense Industry in Europe, By Country, 2015–2023 (USD Million)
Table 24 Market for Military & Defense Industry in APAC, By Country, 2015–2023 (USD Million)
Table 25 Market for Military & Defense Industry in RoW, By Region, 2015–2023 (USD Million)
Table 26 Market for Aeronautics and Space Industry, By Region, 2015–2023 (USD Million)
Table 27 Market for Aeronautics and Space Industry in North America, By Country, 2015–2023 (USD Million)
Table 28 Market for Aeronautics and Space Industry in Europe, By Country, 2015–2023 (USD Million)
Table 29 Market for Aeronautics and Space Industry in APAC, By Country, 2015–2023 (USD Million)
Table 30 Market for Aeronautics and Space Industry in RoW, By Region, 2015–2023 (USD Million)
Table 31 Market for Automotive Industry, By Region, 2015–2023 (USD Million)
Table 32 Market for Automotive Industry in North America, By Country, 2015–2023 (USD Million)
Table 33 Market for Automotive Industry in Europe, By Country, 2015–2023 (USD Million)
Table 34 Market for Automotive Industry in APAC, By Country, 2015–2023 (USD Million)
Table 35 Market for Automotive Industry in RoW, By Region, 2015–2023 (USD Million)
Table 36 Market for Energy and Nuclear Safety Industry, By Region, 2015–2023 (USD Million)
Table 37 Market for Energy and Nuclear Safety Industry in North America, By Country, 2015–2023 (USD Million)
Table 38 Market for Energy and Nuclear Safety Industry in Europe, By Country, 2015–2023 (USD Million)
Table 39 Market for Energy and Nuclear Safety Industry in APAC, By Country, 2015–2023 (USD Million)
Table 40 Market for Energy and Nuclear Safety Industry in RoW, By Region, 2015–2023 (USD Million)
Table 41 Market for Medical Industry, By Region, 2015–2023 (USD Million)
Table 42 Market for Medical Industry in North America, By Country, 2015–2023 (USD Million)
Table 43 Market for Medical Industry in Europe, By Country, 2015–2023 (USD Million)
Table 44 Market for Medical Industry in APAC, By Country, 2015–2023 (USD Million)
Table 45 Market for Medical Industry in RoW, By Region, 2015–2023 (USD Million)
Table 46 Market for Telecommunications Industry, By Region, 2015–2023 (USD Million)
Table 47 Market for Telecommunications Industry in North America, By Country, 2015–2023 (USD Million)
Table 48 Market for Telecommunications Industry in Europe, By Country, 2015–2023 (USD Million)
Table 49 Market for Telecommunications Industry in APAC, By Country, 2015–2023 (USD Million)
Table 50 Market for Telecommunications Industry in RoW, By Region, 2015–2023 (USD Million)
Table 51 Market for Consumer Electronics Industry, By Region, 2015–2023 (USD Million)
Table 52 Market for Consumer Electronics Industry in North America, By Country, 2015–2023 (USD Million)
Table 53 Market for Consumer Electronics Industry in Europe, By Country, 2015–2023 (USD Million)
Table 54 Market for Consumer Electronics Industry in APAC, By Country, 2015–2023 (USD Million)
Table 55 Market for Consumer Electronics Industry in RoW, By Region, 2015–2023 (USD Million)
Table 56 Market for Other Industries, By Region, 2015–2023 (USD Million)
Table 57 Market for Other Industries in North America, By Country, 2015–2023 (USD Million)
Table 58 Market for Other Industries in Europe, By Country, 2015–2023 (USD Million)
Table 59 Market for Other Industries in APAC, By Country, 2015–2023 (USD Million)
Table 60 Market for Other Industries in RoW, By Region, 2015–2023 (USD Million)
Table 61 Market, By Region, 2015–2023 (USD Million)
Table 62 Market in North America, By Country, 2015–2023 (USD Million)
Table 63 Market in Europe, By Country, 2015–2023 (USD Million)
Table 64 Market in APAC, By Country, 2015–2023 (USD Million)
Table 65 Market in RoW, By Region, 2015–2023 (USD Million)
Table 66 Ranking Analysis of Market Players, 2017


List of Figures (47 Figures)

Figure 1 Markets Covered
Figure 2 Process Flow of Market Size Estimation
Figure 3 Research Design
Figure 4 Data Triangulation
Figure 5 Hermetic Packaging Market (2015–2023)
Figure 6 Multilayer Ceramic Packages Expected to Dominate the Packaging Market During the Forecast Period
Figure 7 Ceramic–Metal Sealing Expected to Dominate the Packaging Market During the Forecast Period
Figure 8 Market for MEMS Switches Expected to Grow at the Highest Rate CAGR During the Forecast Period
Figure 9 Market for Aeronautics and Space Expected to Grow at the Highest Rate CAGR During the Forecast Period
Figure 10 APAC Held the Largest Share of the Market in 2017
Figure 11 Market Expected to Grow at A Significant Rate During the Forecast Period Owing to Increasing Demand From APAC
Figure 12 Multilayer Ceramic Packages Expected to Lead the Market By 2023
Figure 13 Market for Ceramic-Metal Sealing Expected to Grow at the Highest CAGR During the Forecast Period
Figure 14 Aeronautics and Space Industry Expected to Hold the Largest Size of the Market By 2023
Figure 15 Transistors Application Expected to Hold the Largest Share of the Market During the Forecast Period
Figure 16 India Expected to Grow at the Highest CAGR During the Forecast Period
Figure 17 Market Dynamics: Overview
Figure 18 Multilayer Ceramic Packages Expected to Dominate the Market During the Forecast Period
Figure 19 Aeronautics and Space Industry Expected to Dominate Market for Multilayer Ceramic Packages During the Forecast Period
Figure 20 Ceramic–Metal Sealing Expected to Dominate the Market During the Forecast Period
Figure 21 Glass–Metal Sealing (GTMS) for MEMS Switches Expected to Grow at the Highest CAGR During the Forecast Period
Figure 22 Ceramic–Metal (CERTM) Sealing Market for Sensors Expected to Grow at the Highest CAGR During the Forecast Period
Figure 23 Market for MEMS Switches Expected to Grow at the Highest CAGR During the Forecast Period
Figure 24 Multilayer Ceramic Packaged Photodiode Expected to Lead the Market During the Forecast Period
Figure 25 Multilayer Ceramic Packages Expected to Lead the Market During the Forecast Period
Figure 26 Aeronautics and Space Industry Expected to Dominate the Market During the Forecast Period
Figure 27 APAC Expected to Lead the Market for Military & Defense Industry During the Forecast Period
Figure 28 APAC Expected to Dominate the Market for Aeronautics and Space Industry During the Forecast Period
Figure 29 APAC Expected to Dominate the Packaging Market for Automotive Industry During the Forecast Period
Figure 30 APAC Expected to Lead the Market for Energy and Nuclear Safety Industry During the Forecast Period
Figure 31 APAC Expected to Dominate the Market for Medical Industry During the Forecast Period
Figure 32 APAC Expected to Dominate the Market for Telecommunications Industry During the Forecast Period
Figure 33 APAC Expected to Dominate the Packaging Market for Consumer Electronics Industry During the Forecast Period
Figure 34 APAC Expected to Dominate the Market for Other Industries During the Forecast Period
Figure 35 Geographic Snapshot (2017): India and China are Expected to Witness Significant Growth During Forecast Period
Figure 36 APAC Expected to Dominate the Market During the Forecast Period
Figure 37 North America: Snapshot of Market
Figure 38 Europe: Snapshot of Market
Figure 39 APAC: Snapshot of Market
Figure 40 Key Development Launches in Packaging Market, 2017
Figure 41 Schott: Company Snapshot
Figure 42 Ametek: Company Snapshot
Figure 43 Amkor: Company Snapshot
Figure 44 Texas Instruments: Company Snapshot
Figure 45 Kyocera: Company Snapshot
Figure 46 Materion: Company Snapshot
Figure 47 Egide: Company Snapshot

The study involved 4 major activities in estimating the current size of the hermetic packaging market. Exhaustive secondary research was done to collect information on the market, the peer markets, and the parent market. The next step was to validate these findings, assumptions, and sizing with industry experts across the value chain through primary research. Both top-down and bottom-up approaches were employed to estimate the complete market size. Thereafter, market breakdown and data triangulation were used to estimate the market size of segments and subsegments.

Secondary Research

Secondary sources referred to in this research study include corporate filings (such as annual reports, investor presentations, and financial statements); trade, business, and professional associations; white papers, hermetic packaging-related journals, IEST publications; directories; and databases. The secondary data has been collected and analyzed to arrive at the overall market size estimations, which has been further validated by primary research.

Primary Research

In the primary research process, various primary sources from both supply and demand sides have been interviewed to obtain qualitative and quantitative information relevant to this report. Extensive primary research has been conducted after understanding and analyzing the hermetic packaging market through secondary research. Several primary interviews have been conducted with key opinion leaders from both demand- and supply-side vendors across 4 regions: Americas, Europe, Asia Pacific (APAC), and Rest of the World (RoW). RoW comprises Middle East and Africa. Approximately 25% of the primary interviews have been conducted with the demand side and 75% with the supply side. This primary data has been collected mainly through telephonic interviews, which accounted for 80% of the total primary interviews. Besides, questionnaires and emails were also used to collect the data.

Hermetic Packaging Market

To know about the assumptions considered for the study, download the pdf brochure

Market Size Estimation

Both top-down and bottom-up approaches were implemented to estimate and validate the total size of the hermetic packaging market. These methods were also used extensively to estimate the size of the markets based on various subsegments. The research methodology used to estimate the market size includes the following steps:

  • The key players in the industry and markets have been identified through extensive secondary research.
  • The industry’s supply chain and market size, in terms of value, have been determined through primary and secondary research processes.
  • All percentage shares, splits, and breakdowns have been determined using secondary sources and verified through primary sources.

Data Triangulation

After arriving at the overall market size—using the market size estimation processes as explained above—the market was split into several segments and subsegments. To complete the overall market engineering process and arrive at the exact statistics of each market segment and subsegment, data triangulation and market breakdown procedures were employed, wherever applicable. The data was triangulated by studying various factors and trends from the demand and supply sides across different end-use applications.

Study Objectives

  • To describe and forecast the hermetic packaging market, in terms of value, segmented on the basis of configuration, type, application, industry, and region
  • To describe and forecast the market size with respect to 4 main regions, namely, Americas, Europe, Asia Pacific (APAC), and Rest of the World (RoW)
  • To provide detailed information regarding the major factors such as drivers, restraints, opportunities, and challenges influencing the growth of the market
  • To strategically analyze micromarkets1 with respect to individual growth trends, prospects, and their contribution to the overall market
  • To analyze opportunities in the market for stakeholders and provide a detailed competitive landscape of the market
  • To strategically profile the key players in the market and comprehensively analyze their market ranking and core competencies2
  • To analyze competitive developments such as product launches/developments, partnerships, expansions, and Research & Development (R&D) activities carried out by players in the market

Available Customizations

With the given market data, MarketsandMarkets offers customizations according to a company's specific needs. The following customization options are available for this report:

Regional Analysis

  • Country-wise breakdown for different segments (By Configuration, Type and Functionality) in North America, Europe, Asia Pacific, and RoW

Company Information

  • Detailed analysis and profiling of additional market players (up to 5)
Report Code
SE 4788
Published ON
Feb, 2018
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