HOME Top Market Reports Hermetic Packaging Market by Configuration (Multilayer Ceramic Packages, Metal Can Packages, Pressed Ceramic Packages), Type (Ceramic-Metal Sealing, Glass-Metal Sealing), Application, Industry, and Geography - Global Forecast to 2023

Hermetic Packaging Market by Configuration (Multilayer Ceramic Packages, Metal Can Packages, Pressed Ceramic Packages), Type (Ceramic-Metal Sealing, Glass-Metal Sealing), Application, Industry, and Geography - Global Forecast to 2023

By: marketsandmarkets.com
Publishing Date: February 2018
Report Code: SE 4788

 

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The overall hermetic packaging market was valued at USD 3.06 Billion in 2017 and is expected to reach USD 4.52 Billion by 2023, at a CAGR of 6.80% during the forecast period. The base year considered for the study is 2017, and the market size forecast is provided for the period between 2018 and 2023.  This report provides the market size and growth potential of the market across different segments such as configuration, type, application, industry, and geography. The study identifies and analyzes the market dynamics such as drivers, restraints, opportunities, and challenges for the market. It also profiles the key players operating in the market. Factors such as adoption of hermetic packaging for protecting highly sensitive electronic components and growing demand from industries such as automobile electronics and aerospace are expected to propel the growth of the overall market.

The research methodology used to estimate and forecast the hermetic packaging market begins with capturing data on key vendor revenues through secondary research. The secondary sources include annual reports, press releases, and investor presentations of companies; white papers, journals, and certified publications; and articles from recognized authors, websites, directories, and databases such as Hoovers, Bloomberg Businessweek, Factiva, and OneSource. The vendor offerings have also been taken into consideration to determine the market segmentation. The bottom-up procedure has been employed to arrive at the overall size of the market from the revenue of the key players in the market. After arriving at the overall market size, the total market is split into several segments and subsegments that have been verified through primary research by conducting extensive interviews with key industry experts such as CEOs, VPs, directors, and executives. The data triangulation and market breakdown procedures have been employed to complete the overall market engineering process and arrive at exact statistics for all segments and subsegments. The breakdown of the profiles of primary respondents is depicted in the figure below.

Hermetic Packaging Market

To know about the assumptions considered for the study, download the pdf brochure

Teledyne Microelectronics (US), SCHOTT AG (Germany), AMETEK (US), Amkor Technology (US), Texas Instruments (US), Micross Components (US), Legacy Technologies Inc. (US), KYOCERA Corporation (Japan), Materion Corporation (US), and Willow Technologies (UK) are the hermetic packaging manufacturers offering hermetic packages to end users.

Key Target Audience

  • Original design manufacturers (ODMs)
  • Component suppliers
  • Research organizations and consulting companies
  • Application providers
  • Subcomponent manufacturers
  • Maintenance and service providers
  • Technology providers
  • Associations, organizations, forums, and alliances related to hermetic packaging

Scope of the Report

The hermetic packaging market has been covered in detail in this report. To provide a holistic picture, the current market demand and forecasts have also been included in the report. The market has been segmented as follows

By Configuration

  • Multilayer ceramic packages
  • Metal can packages
  • Pressed ceramic packages

By Type

  • Ceramic-metal sealing (CERTM)
  • Glass-metal sealing (GTMS)
  • Passivation glass
  • Transponder glass
  • Reed glass

By Application

  • Transistors
  • Sensors
  • Lasers
  • Photo diodes
  • Airbag ignitors
  • Oscillating crystals
  • MEMS switches
  • Others

By Industry:

  • Military & defense
  • Aeronautics and space
  • Automotive
  • Energy and nuclear safety
  • Medical
  • Telecommunications
  • Consumer electronics
  • Others

Geographic Analysis:

  • North America
  • Europe
  • Asia Pacific (APAC)
  • Rest of the World (RoW)

Available Customizations

With the given market data, MarketsandMarkets offers customizations according to the company’s specific needs. The following customization options are available for the report:

  • Market size for 2020 and 2022 for segments such as configuration, type, application, industry, and geography
  • Company information: Detailed analysis and profiling of additional market players (up to 5)

Table of Contents

1 Introduction (Page No. - 14)
    1.1 Objectives of the Study
    1.2 Definition
    1.3 Study Scope
    1.4 Years Considered for the Study
    1.5 Currency
    1.6 Limitations
    1.7 Stakeholders

2 Research Methodology (Page No. - 18)
    2.1 Research Data
           2.1.1 Secondary Data
                    2.1.1.1 Secondary Sources
           2.1.2 Primary Data
                    2.1.2.1 Primary Interviews With Experts
                    2.1.2.2 Key Data From Primary Sources
                    2.1.2.3 Key Industry Insights
                    2.1.2.4 Breakdown of Primaries
           2.1.3 Secondary and Primary Research
    2.2 Market Size Estimation
           2.2.1 Bottom-Up Approach
           2.2.2 Top-Down Approach
    2.3 Market Breakdown and Data Triangulation
    2.4 Assumptions

3 Executive Summary (Page No. - 28)

4 Premium Insights (Page No. - 33)
    4.1 Attractive Opportunities in the Hermetic Packaging Market
    4.2 Packaging Market, By Configuration
    4.3 Packaging Market, By Type
    4.4 Packaging Market, By Industry
    4.5 Packaging Market, By Application and Country
    4.6 Packaging Market, By Country

5 Market Overview (Page No. - 37)
    5.1 Introduction
    5.2 Market Dynamics
           5.2.1 Drivers
                    5.2.1.1 Adoption of Hermetic Packaging for Protecting Highly Sensitive Electronic Components
                    5.2.1.2 Growing Demand From Industries Such as Automobile Electronics and Aerospace
           5.2.2 Restraint
                    5.2.2.1 Stringent Standards for Hermetic Packaging
           5.2.3 Opportunities
                    5.2.3.1 Increasing Adoption of Hermetic Packaging for Protection of Electronic Implantable Medical Devices
                    5.2.3.2 Rising Demand From APAC Countries for Hermetically Packaged Components and Ics for Myriad Applications
           5.2.4 Challenge
                    5.2.4.1 High Infrastructure Cost Incurred By Controlled and Regulated Packaging Environment
                    5.2.4.2 Competition From Near-Hermetic Packaging
    5.3 Value Chain Analysis

6 Hermetic Packaging Market, By Configuration (Page No. - 43)
    6.1 Introduction
    6.2 Multilayer Ceramic Packages
    6.3 Pressed Ceramic Packages
    6.4 Metal Can Packages

7 Hermetic Packaging Market, By Type (Page No. - 48)
    7.1 Introduction
    7.2 Passivation Glass
    7.3 Reed Glass
    7.4 Transponder Glass
    7.5 Glass–Metal Sealing (GTMS)
    7.6 Ceramic–Metal (CERTM) Sealing

8 Hermetic Packaging Market, By Application (Page No. - 56)
    8.1 Introduction
    8.2 Transistors
    8.3 Sensors
    8.4 Lasers
    8.5 Photodiodes
    8.6 Airbag Ignitors
    8.7 Oscillating Crystals
    8.8 MEMS Switches
    8.9 Others

9 Hermetic Packaging Market, By Industry (Page No. - 64)
    9.1 Introduction
    9.2 Military & Defense
    9.3 Aeronautics and Space
    9.4 Automotive
           9.4.1 Airbag Initiation
           9.4.2 Battery Protection
           9.4.3 Rfid Transponder Operation
    9.5 Energy and Nuclear Safety
           9.5.1 Electrical Penetration Control
           9.5.2 Oil & Gas Applications
           9.5.3 Fuel Cell Manufacturing
    9.6 Medical
           9.6.1 Dental Applications
           9.6.2 Veterinary Applications
    9.7 Telecommunications
    9.8 Consumer Electronics
    9.9 Others

10 Geographic Analysis (Page No. - 95)
     10.1 Introduction
     10.2 North America
             10.2.1 US
             10.2.2 Canada
             10.2.3 Mexico
     10.3 Europe
             10.3.1 Germany
             10.3.2 France
             10.3.3 Italy
             10.3.4 UK
             10.3.5 Spain
             10.3.6 Rest of Europe
     10.4 APAC
             10.4.1 China
             10.4.2 Japan
             10.4.3 South Korea
             10.4.4 Taiwan
             10.4.5 India
             10.4.6 Rest of APAC
     10.5 RoW
             10.5.1 South America
             10.5.2 Middle East and Africa

11 Competitive Landscape (Page No. - 107)
     11.1 Overview
     11.2 Ranking of Players, 2017
     11.3 Competitive Scenario
             11.3.1 Product Launches
             11.3.2 Agreements, Partnerships, Collaborations, Contracts, & Joint Ventures
             11.3.3 Mergers & Acquisitions

12 Company Profile (Page No. - 111)
(Business Overview, Products Offered, Recent Developments, SWOT Analysis, and MnM View)*
     12.1 Key Players
             12.1.1 Schott
             12.1.2 Ametek
             12.1.3 Amkor
             12.1.4 Texas Instruments
             12.1.5 Teledyne Microelectronics
             12.1.6 Kyocera
             12.1.7 Materion
             12.1.8 Egide
             12.1.9 Micross Components
             12.1.10 Legacy Technologies
             12.1.11 Willow Technologies
             12.1.12 Intersil
             12.1.13 SGA Technologies
             12.1.14 Complete Hermetics
             12.1.15 SHP
     12.2 Other Companies
             12.2.1 Primoceler
             12.2.2 Coat-X
             12.2.3 Hermetic Solutions Group
             12.2.4 Stratedge
             12.2.5 CHI

*Details on Business Overview, Products Offered, Recent Developments, SWOT Analysis, and MnM View Might Not Be Captured in Case of Unlisted Companies.

13 Appendix (Page No. - 146)
     13.1 Insights of Industry Experts
     13.2 Discussion Guide
     13.3 Knowledge Store: Marketsandmarkets’ Subscription Portal
     13.4 Introducing RT: Real-Time Market Intelligence
     13.5 Available Customizations
     13.6 Related Reports
     13.7 Author Details


List of Tables (66 Tables)

Table 1 Hermetic Packaging Market, By Configuration, 2015–2023 (USD Million)
Table 2 Market for Multilayer Ceramic Packages, By Industry, 2015–2023 (USD Million)
Table 3 Market for Pressed Ceramic Packages, By Industry, 2015–2023 (USD Million)
Table 4 Market for Metal Can Packages, By Industry, 2015–2023 (USD Million)
Table 5 Market, By Type, 2015–2023 (USD Million)
Table 6 Market for Passivation Glass, By Application, 2015–2023 (USD Million)
Table 7 Market for Reed Glass, By Application, 2015–2023 (USD Million)
Table 8 Hermetic Packaging Market for Transponder Glass, By Application, 2015–2023 (USD Million)
Table 9 Packaging Market for Glass–Metal Sealing (GTMS), By Application, 2015–2023 (USD Million)
Table 10 Market for Ceramic–Metal (CERTM) Sealing, By Application, 2015–2023 (USD Million)
Table 11 Market, By Application, 2015–2023 (USD Million)
Table 12 Market for Transistors, By Configuration, 2015–2023 (USD Million)
Table 13 Market for Sensors, By Configuration, 2015–2023 (USD Million)
Table 14 Hermetic Packaging Market for Lasers, By Configuration, 2015–2023 (USD Million)
Table 15 Market for Photodiodes, By Configuration, 2015–2023 (USD Million)
Table 16 Market for Airbag Ignitors, By Configuration, 2015–2023 (USD Million)
Table 17 Market for Oscillating Crystals, By Configuration, 2015–2023 (USD Million)
Table 18 Market for MEMS Switches, By Configuration, 2015–2023 (USD Million)
Table 19 Market for Other Applications, By Configuration, 2015–2023 (USD Million)
Table 20 Hermetic Packaging Market, By Industry, 2015–2023 (USD Million)
Table 21 Market for Military & Defense Industry, By Region, 2015–2023 (USD Million)
Table 22 Market for Military & Defense Industry in North America, By Country, 2015–2023 (USD Million)
Table 23 Market for Military & Defense Industry in Europe, By Country, 2015–2023 (USD Million)
Table 24 Market for Military & Defense Industry in APAC, By Country, 2015–2023 (USD Million)
Table 25 Hermetic Packaging Market for Military & Defense Industry in RoW, By Region, 2015–2023 (USD Million)
Table 26 Market for Aeronautics and Space Industry, By Region, 2015–2023 (USD Million)
Table 27 Market for Aeronautics and Space Industry in North America, By Country, 2015–2023 (USD Million)
Table 28 Market for Aeronautics and Space Industry in Europe, By Country, 2015–2023 (USD Million)
Table 29 Market for Aeronautics and Space Industry in APAC, By Country, 2015–2023 (USD Million)
Table 30 Market for Aeronautics and Space Industry in RoW, By Region, 2015–2023 (USD Million)
Table 31 Hermetic Packaging Market for Automotive Industry, By Region, 2015–2023 (USD Million)
Table 32 Market for Automotive Industry in North America, By Country, 2015–2023 (USD Million)
Table 33 Market for Automotive Industry in Europe, By Country, 2015–2023 (USD Million)
Table 34 Market for Automotive Industry in APAC, By Country, 2015–2023 (USD Million)
Table 35 Market for Automotive Industry in RoW, By Region, 2015–2023 (USD Million)
Table 36 Market for Energy and Nuclear Safety Industry, By Region, 2015–2023 (USD Million)
Table 37 Market for Energy and Nuclear Safety Industry in North America, By Country, 2015–2023 (USD Million)
Table 38 Market for Energy and Nuclear Safety Industry in Europe, By Country, 2015–2023 (USD Million)
Table 39 Market for Energy and Nuclear Safety Industry in APAC, By Country, 2015–2023 (USD Million)
Table 40 Market for Energy and Nuclear Safety Industry in RoW, By Region, 2015–2023 (USD Million)
Table 41 Hermetic Packaging Market for Medical Industry, By Region, 2015–2023 (USD Million)
Table 42 Market for Medical Industry in North America, By Country, 2015–2023 (USD Million)
Table 43 Market for Medical Industry in Europe, By Country, 2015–2023 (USD Million)
Table 44 Market for Medical Industry in APAC, By Country, 2015–2023 (USD Million)
Table 45 Market for Medical Industry in RoW, By Region, 2015–2023 (USD Million)
Table 46 Market for Telecommunications Industry, By Region, 2015–2023 (USD Million)
Table 47 Market for Telecommunications Industry in North America, By Country, 2015–2023 (USD Million)
Table 48 Market for Telecommunications Industry in Europe, By Country, 2015–2023 (USD Million)
Table 49 Hermetic Packaging Market for Telecommunications Industry in APAC, By Country, 2015–2023 (USD Million)
Table 50 Market for Telecommunications Industry in RoW, By Region, 2015–2023 (USD Million)
Table 51 Market for Consumer Electronics Industry, By Region, 2015–2023 (USD Million)
Table 52 Market for Consumer Electronics Industry in North America, By Country, 2015–2023 (USD Million)
Table 53 Market for Consumer Electronics Industry in Europe, By Country, 2015–2023 (USD Million)
Table 54 Market for Consumer Electronics Industry in APAC, By Country, 2015–2023 (USD Million)
Table 55 Market for Consumer Electronics Industry in RoW, By Region, 2015–2023 (USD Million)
Table 56 Hermetic Packaging Market for Other Industries, By Region, 2015–2023 (USD Million)
Table 57 Market for Other Industries in North America, By Country, 2015–2023 (USD Million)
Table 58 Market for Other Industries in Europe, By Country, 2015–2023 (USD Million)
Table 59 Market for Other Industries in APAC, By Country, 2015–2023 (USD Million)
Table 60 Market for Other Industries in RoW, By Region, 2015–2023 (USD Million)
Table 61 Market, By Region, 2015–2023 (USD Million)
Table 62 Market in North America, By Country, 2015–2023 (USD Million)
Table 63 Market in Europe, By Country, 2015–2023 (USD Million)
Table 64 Market in APAC, By Country, 2015–2023 (USD Million)
Table 65 Hermetic Packaging Market in RoW, By Region, 2015–2023 (USD Million)
Table 66 Ranking Analysis of Hermetic Packaging Market Players, 2017


List of Figures (47 Figures)

Figure 1 Markets Covered
Figure 2 Process Flow of Market Size Estimation
Figure 3 Research Design
Figure 4 Data Triangulation
Figure 5 Hermetic Packaging Market (2015–2023)
Figure 6 Multilayer Ceramic Packages Expected to Dominate the Packaging Market During the Forecast Period
Figure 7 Ceramic–Metal Sealing Expected to Dominate the Packaging Market During the Forecast Period
Figure 8 Hermetic Packaging Market for MEMS Switches Expected to Grow at the Highest Rate CAGR During the Forecast Period
Figure 9 Market for Aeronautics and Space Expected to Grow at the Highest Rate CAGR During the Forecast Period
Figure 10 APAC Held the Largest Share of the Market in 2017
Figure 11 Market Expected to Grow at A Significant Rate During the Forecast Period Owing to Increasing Demand From APAC
Figure 12 Multilayer Ceramic Packages Expected to Lead the Market By 2023
Figure 13 Market for Ceramic-Metal Sealing Expected to Grow at the Highest CAGR During the Forecast Period
Figure 14 Aeronautics and Space Industry Expected to Hold the Largest Size of the Market By 2023
Figure 15 Transistors Application Expected to Hold the Largest Share of the Market During the Forecast Period
Figure 16 India Expected to Grow at the Highest CAGR During the Forecast Period
Figure 17 Market Dynamics: Overview
Figure 18 Multilayer Ceramic Packages Expected to Dominate the Market During the Forecast Period
Figure 19 Aeronautics and Space Industry Expected to Dominate Market for Multilayer Ceramic Packages During the Forecast Period
Figure 20 Ceramic–Metal Sealing Expected to Dominate the Market During the Forecast Period
Figure 21 Glass–Metal Sealing (GTMS) for MEMS Switches Expected to Grow at the Highest CAGR During the Forecast Period
Figure 22 Ceramic–Metal (CERTM) Sealing Market for Sensors Expected to Grow at the Highest CAGR During the Forecast Period
Figure 23 Market for MEMS Switches Expected to Grow at the Highest CAGR During the Forecast Period
Figure 24 Multilayer Ceramic Packaged Photodiode Expected to Lead the Market During the Forecast Period
Figure 25 Multilayer Ceramic Packages Expected to Lead the Market During the Forecast Period
Figure 26 Aeronautics and Space Industry Expected to Dominate the Market During the Forecast Period
Figure 27 APAC Expected to Lead the Market for Military & Defense Industry During the Forecast Period
Figure 28 APAC Expected to Dominate the Market for Aeronautics and Space Industry During the Forecast Period
Figure 29 APAC Expected to Dominate the Packaging Market for Automotive Industry During the Forecast Period
Figure 30 APAC Expected to Lead the Market for Energy and Nuclear Safety Industry During the Forecast Period
Figure 31 APAC Expected to Dominate the Market for Medical Industry During the Forecast Period
Figure 32 APAC Expected to Dominate the Market for Telecommunications Industry During the Forecast Period
Figure 33 APAC Expected to Dominate the Packaging Market for Consumer Electronics Industry During the Forecast Period
Figure 34 APAC Expected to Dominate the Hermetic Packaging Market for Other Industries During the Forecast Period
Figure 35 Geographic Snapshot (2017): India and China are Expected to Witness Significant Growth During Forecast Period
Figure 36 APAC Expected to Dominate the Market During the Forecast Period
Figure 37 North America: Snapshot of Market
Figure 38 Europe: Snapshot of Hermetic Packaging Market
Figure 39 APAC: Snapshot of Hermetic Packaging Market
Figure 40 Key Development Launches in Packaging Market, 2017
Figure 41 Schott: Company Snapshot
Figure 42 Ametek: Company Snapshot
Figure 43 Amkor: Company Snapshot
Figure 44 Texas Instruments: Company Snapshot
Figure 45 Kyocera: Company Snapshot
Figure 46 Materion: Company Snapshot
Figure 47 Egide: Company Snapshot

According to the forecast provided by MarketsandMarkets, the overall hermetic packaging market is estimated at USD 3.25 Billion in 2018 and is expected to reach USD 4.52 Billion by 2023, growing at a CAGR of 6.80% between 2018 and 2023. The key factors driving this market is growing need of protecting highly sensitive electronic components from extraneous particles, such as moisture, atmospheric pressure, and soil/grime; and strong demand for hermetically packaged components from the industries such as automotive, electronics, and aeronautics.

This report segments the hermetic packaging market on the basis of configuration, type, application, industry, and geography. The market, on the basis of configuration, is driven by high adoption rate of the multilayer ceramic packages for high frequency applications such as data communication, wireless communication, and optical communication, as multilayer ceramic packages offer better hermeticity than other configurations for high-frequency applications, and also enable a large number of electrical feedthroughs within small spaces.

The hermetic market for ceramic-metal (CERTM) sealing is expected to hold a major share and grow at the highest CAGR between 2018 and 2023. Growing demand for thermal shock-resistant and low-porosity type of hermetic packaging material is the key factor that propels the growth of the said market. The CERTM sealed sensors, such as heating-ventilation-air conditioning (HVAC) sensors, chassis level sensors, and differential non-contacting sensors, are finding potential applications in the automotive industry as they assure the safety of the passengers while offering failure-free operation.

Based on application, the market for transistors is expected to hold a major share during the forecast period. The hermetically sealed transistors are mainly used for designing telecommunication circuits and home appliances. This is a key driving factor for the said market. However, the market for microelectromechanical system (MEMS) switches is expected to grow at the highest rate during the forecast period.

Hermetic Packaging Market

The market in APAC is expected to hold the largest market share and also projected to grow at the highest CAGR between 2018 and 2022. Increasing energy needs (backed by the high GDP growth rates) in developing countries, such as China and India, is creating huge opportunities for manufacturers of hermetically packaged electronic components in APAC. China, Japan, and India, among others, are now stepping up in space research activities, such as satellite launches and space exploration missions, which is expected to add to the high growth of the hermetic packaging market in APAC during the forecast period.

The major challenges for the companies in the market are the high infrastructure cost incurred by controlled and regulated packaging environment and competition from near-hermetic packaging. SCHOTT AG (Germany), AMETEK (US), Amkor Technology (US), Texas Instruments (US), Teledyne Microelectronics (US), Kyocera Corporation (Japan), Materion Corporation (Japan), Egide (France), Micross Components (US), Legacy Technologies Inc. (US) are the major players that adopt various strategies such as new product developments; mergers and acquisitions; partnerships, agreements, and collaborations to cater to the needs of customers.

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