Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) Market - Forecast to (2025 - 2035)

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Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) Market by Memory Type (HMC and HBM), Product type (GPU, CPU, APU, FPGA, ASIC), Application (Graphics, High-performance Computing, Networking, Data Centers), and Geography - Global Forecast to (2025 - 2035)

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Report Code: SE 4220 Jan, 2026, by marketsandmarkets.com

Hybrid Memory Cube and High Bandwidth Memory Market Overview 2025 to 2035

The global hybrid memory cube and high-bandwidth memory market was valued at USD 4.55 billion in 2024 and is estimated to reach USD 44.06 billion by 2035, at a CAGR of 23.2% between 2025 and 2035.

The global Hybrid Memory Cube and High Bandwidth Memory market is witnessing rapid transformation driven by the exponential growth of data-centric technologies, artificial intelligence, high-performance computing, and cloud infrastructure. As traditional memory technologies struggle to meet the increasing bandwidth and energy efficiency demands, next-generation memory architectures such as HMC and HBM are revolutionizing how data is stored, accessed, and processed. Between 2025 and 2035, the market is expected to grow significantly, driven by advancements in semiconductor manufacturing, rising adoption of GPUs and AI accelerators, and the expansion of hyperscale data centers worldwide.

Market Dynamics and Growth Drivers

The primary growth driver for the Hybrid Memory Cube and High Bandwidth Memory market is the surging demand for faster and more efficient memory technologies. With the rise of machine learning, artificial intelligence, and large-scale data analytics, memory performance has become a bottleneck for computing systems. HMC and HBM overcome this by offering high bandwidth, low latency, and exceptional energy efficiency compared to conventional DDR memory.

High Bandwidth Memory integrates vertically stacked DRAM dies connected using through-silicon vias (TSVs), enabling wide interfaces and faster data transfer rates. Similarly, Hybrid Memory Cube employs a 3D architecture where multiple DRAM layers are stacked on a logic layer, enhancing data communication speed and reducing power consumption.

Another major driver is the evolution of GPUs and AI accelerators used in deep learning, data training, and cloud workloads. Modern graphics processors from companies like NVIDIA, AMD, and Intel rely heavily on HBM for achieving higher computational performance. Additionally, the growth of edge computing, 5G networks, and the Internet of Things has created new data processing challenges, further fueling demand for high-performance memory solutions.

Key Market Palyers

Samsung (South Korea), Micron (US), SK Hynix (South Korea), Intel (US), and AMD (US) are the major players included in the report with ranking analysis. The report also covers various major contributors involved in the HMC and HBM market. Fujitsu (Japan), Xilinx (US), NVIDIA (US), IBM (US), and Open-Silicon (US) are the other important key companies in the HMC and HBM market. In addition, Arira (US), Cadence (US), Marvell (US), Cray (US), ARM (UK), and Rambus (China) are a few other companies involved in the market.

Challenges and Restraints

Despite promising growth prospects, the market faces several challenges. The high cost of development and manufacturing of HMC and HBM is a major restraint. The integration of TSVs and 3D stacking requires advanced fabrication techniques, increasing production costs. Furthermore, compatibility issues between memory and processor architectures limit widespread adoption.

Another restraint is the limited number of manufacturers producing these advanced memory types. Currently, only a few major semiconductor companies have the capability to produce HBM and HMC at scale. Supply chain disruptions or production delays could impact market stability.

Moreover, as demand for computing power grows, thermal management in high-bandwidth memory modules has become a critical issue. Efficient heat dissipation is essential for maintaining system reliability, particularly in high-performance computing environments.

Market Segmentation by Memory Type

The market is segmented into two major memory types: Hybrid Memory Cube (HMC) and High Bandwidth Memory (HBM).

Hybrid Memory Cube (HMC)
HMC technology is designed for applications that require ultra-fast data transfer and high computational capacity. It uses multiple layers of DRAM interconnected with a logic base via TSVs, delivering superior bandwidth compared to traditional memory. HMC is particularly suited for high-performance computing and networking applications where speed and efficiency are critical.

HMC is gaining traction in supercomputing, aerospace, defense, and networking systems due to its ability to handle massive data volumes at lower power consumption. With the growing focus on quantum computing and edge AI applications, HMC is expected to experience strong adoption in specialized industrial and scientific applications by 2035.

High Bandwidth Memory (HBM)
HBM has gained more commercial success than HMC due to its integration in GPUs and AI accelerators. HBM technology has evolved through multiple generations, from HBM to HBM3 and beyond, each iteration delivering higher bandwidth and improved energy efficiency.

HBM’s ability to deliver multi-terabyte per second data transfer rates makes it indispensable for AI training, scientific simulations, and rendering-intensive tasks. Data centers, gaming systems, and autonomous vehicles are increasingly adopting HBM-equipped devices to achieve superior performance. The growing demand for AI chips and data processing systems will continue to drive the adoption of HBM technology through 2035.

Market Segmentation by Product Type

The market for Hybrid Memory Cube and High Bandwidth Memory is further categorized based on product type, including GPU, CPU, APU, FPGA, and ASIC.

GPU (Graphics Processing Unit)
GPUs represent the largest market share for HBM integration. Modern GPUs require extremely high memory bandwidth to handle complex computations used in gaming, machine learning, and scientific modeling. Companies like NVIDIA and AMD are leading adopters of HBM technology in their flagship GPU products. The increasing use of GPUs in cloud computing, generative AI, and metaverse applications is projected to sustain market growth.

CPU (Central Processing Unit)
Although CPUs traditionally use DDR memory, there is a growing trend of integrating high-bandwidth memory to improve system performance in enterprise and data-intensive workloads. Advanced CPU architectures are being designed to utilize HBM to meet the demands of AI-driven workloads and reduce latency.

APU (Accelerated Processing Unit)
APUs combine CPU and GPU functionalities on a single chip, creating a need for faster data access and shared memory. The adoption of HBM in APUs enables efficient data flow between computational units, improving graphics rendering and parallel computing efficiency. APUs equipped with HBM are increasingly being deployed in gaming consoles and compact computing systems.

FPGA (Field Programmable Gate Array)
FPGAs are used for specialized computing applications, including network processing, image recognition, and encryption. Integrating HBM with FPGA accelerates performance in data-intensive operations while maintaining flexibility. This combination is being used in edge computing and defense electronics where customization and speed are equally critical.

ASIC (Application Specific Integrated Circuit)
ASICs are optimized for specific tasks such as cryptocurrency mining, AI inference, or networking. When paired with HBM, ASICs achieve higher throughput and energy efficiency, making them ideal for high-frequency trading, blockchain, and telecommunications infrastructure.

Market Segmentation by Application

The Hybrid Memory Cube and High Bandwidth Memory market is categorized by applications such as graphics, high-performance computing, networking, and data centers.

Graphics
Graphics processing remains one of the primary applications for high-bandwidth memory. With the rapid advancement of gaming, visual effects, and 3D rendering technologies, GPU manufacturers are continuously integrating HBM to meet the performance requirements of modern graphics systems. Esports, VR, and augmented reality applications are key growth contributors in this segment.

High Performance Computing (HPC)
HPC applications demand exceptional processing capabilities and fast data access. HMC and HBM technologies are essential in supercomputers, scientific research systems, and complex simulations used in weather forecasting, oil exploration, and defense research. National laboratories and research institutions are rapidly transitioning to HBM-based systems to achieve petaflop and exaflop performance levels.

Networking
The networking segment is adopting HMC and HBM for routers, switches, and network processors. These technologies enable faster packet processing, efficient bandwidth management, and lower power consumption in next-generation network infrastructure. The ongoing rollout of 5G and the development of 6G networks are expected to boost the adoption of high-bandwidth memory in networking equipment.

Data Centers
Data centers represent a critical market for HBM and HMC technologies. The growing reliance on cloud computing, AI workloads, and large-scale analytics has created immense demand for memory solutions that offer both speed and efficiency. HBM’s high throughput and compact design make it an ideal choice for data center servers and AI accelerators. The expansion of hyperscale data centers across North America, Europe, and Asia Pacific will remain a key market growth factor through 2035.

Regional Analysis

North America
North America dominates the Hybrid Memory Cube and High Bandwidth Memory market, driven by the presence of major technology companies, semiconductor manufacturers, and AI research centers. The United States is a hub for innovation in advanced computing and data center development. Growing investments in AI infrastructure, autonomous vehicles, and cloud computing platforms are fueling market growth in the region.

Europe
Europe is emerging as a strong market for high-bandwidth memory technologies, particularly in the fields of automotive electronics, industrial automation, and research computing. Countries like Germany, the UK, and France are focusing on advanced chip design and AI adoption, further boosting the demand for HBM and HMC-based solutions.

Asia Pacific
Asia Pacific is expected to witness the fastest growth in this market. The region houses leading semiconductor manufacturers and consumer electronics giants in countries like Japan, South Korea, Taiwan, and China. High investments in semiconductor fabrication facilities, coupled with growing demand for gaming consoles, AI devices, and cloud services, are key factors driving market expansion.

Rest of the World
Regions such as the Middle East, Africa, and Latin America are gradually adopting HBM and HMC technologies as part of their growing data center and telecommunications infrastructure. While adoption rates remain lower compared to developed markets, increasing digitization initiatives and government support for technology innovation are expected to provide future growth opportunities.

Future Outlook 2025 to 2035

Between 2025 and 2035, the Hybrid Memory Cube and High Bandwidth Memory market will continue to evolve as new generations of memory technologies are developed. HBM4 and beyond are expected to achieve even higher bandwidths, while innovations in packaging and cooling solutions will improve thermal performance and cost efficiency.

The convergence of AI, 5G, and quantum computing will drive unprecedented demand for memory architectures that can handle extreme data loads efficiently. As semiconductor manufacturing processes advance, production costs will gradually decrease, enabling broader adoption across industries.

Sustainability will also play a role in shaping the market’s future. Manufacturers are focusing on energy-efficient memory technologies to support green data centers and eco-friendly computing infrastructure.

The global Hybrid Memory Cube and High Bandwidth Memory market is entering a transformative era characterized by rapid technological innovation, strong demand from AI-driven industries, and expansion across key application areas. While challenges related to cost and production remain, the long-term outlook is highly promising.

By 2035, HBM and HMC are expected to become foundational technologies in high-performance computing, data analytics, and advanced digital infrastructure. Companies investing in these next-generation memory architectures will be well positioned to lead the digital transformation revolution of the next decade.

 
 

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Table of Contents

1 Introduction (Page No. - 13)
    1.1 Study Objectives
    1.2 Definition
    1.3 Study Scope
           1.3.1 Markets Covered
           1.3.2 Geographic Scope
           1.3.3 Years Considered for the Study
    1.4 Currency
    1.5 Limitations
    1.6 Stakeholders

2 Research Methodology (Page No. - 16)
    2.1 Research Data
           2.1.1 Secondary Data
                    2.1.1.1 Secondary Sources
           2.1.2 Primary Data
                    2.1.2.1 Primary Sources
                    2.1.2.2 Key Industry Insights
                    2.1.2.3 Breakdown of Primary Interviews
           2.1.3 Secondary and Primary Research
    2.2 Market Size Estimation
           2.2.1 Bottom-Up Approach
                    2.2.1.1 Approach for Capturing the Market Size By Bottom-Up Analysis (Demand Side)
           2.2.2 Top-Down Approach
                    2.2.2.1 Approach for Capturing the Market Share By Top-Down Analysis (Supply Side)
    2.3 Data Triangulation
    2.4 Assumptions

3 Executive Summary (Page No. - 26)

4 Premium Insights (Page No. - 31)
    4.1 HMC and HBM Market Overview
    4.2 HMC Market, By Application
    4.3 HMC and HBM Market in APAC
    4.4 Geographic Snapshot of the HMC and HBM Market
    4.5 HMC and HBM Market in APAC, By Country

5 Market Overview (Page No. - 34)
    5.1 Introduction
    5.2 Market Dynamics
           5.2.1 Drivers
                    5.2.1.1 Growing Need for High-Bandwidth, Low Power Consuming, and Highly Scalable Memories
                    5.2.1.2 Increasing Adoption of Artificial Intelligence
                    5.2.1.3 Rising Trend of Miniaturization of Electronic Devices
           5.2.2 Restraints
                    5.2.2.1 Thermal Issues Caused By High Levels of Integration
           5.2.3 Opportunities
                    5.2.3.1 High Demand for Cloud-Based Services
                    5.2.3.2 Growing Big Data
           5.2.4 Challenges
                    5.2.4.1 Design Complexities Associated With HMC and HBM
                    5.2.4.2 Ecosystem Development
    5.3 Value Chain Analysis

6 HMC and HBM Market, By Memory Type (Page No. - 41)
    6.1 Introduction
    6.2 Hybrid Memory Cube (HMC)
    6.3 High-Bandwidth Memory (HBM)

7 HMC and HBM Market, By Product Type (Page No. - 46)
    7.1 Introduction
    7.2 Central Processing Unit
    7.3 Field-Programmable Gate Array
    7.4 Graphics Processing Unit
    7.5 Application-Specific Integrated Circuit
    7.6 Accelerated Processing Unit

8 HMC and HBM Market, By Application (Page No. - 55)
    8.1 Introduction
    8.2 High-Performance Computing (HPC)
    8.3 Networking
    8.4 Data Centers
    8.5 Graphics

9 Geographic Analysis (Page No. - 63)
    9.1 Introduction
    9.2 North America
           9.2.1 US
           9.2.2 Canada
           9.2.3 Mexico
    9.3 Europe
           9.3.1 UK
           9.3.2 Germany
           9.3.3 France
           9.3.4 Rest of Europe
    9.4 APAC
           9.4.1 China
           9.4.2 Japan
           9.4.3 South Korea
           9.4.4 Taiwan
           9.4.5 Rest of APAC
    9.5 RoW
           9.5.1 Middle East and Africa
           9.5.2 South America

10 Competitive Landscape (Page No. - 91)
     10.1 Overview
     10.2 Ranking Analysis
     10.3 Competitive Scenario
             10.3.1 Product Developments and Launches
             10.3.2 Partnerships, Agreements, and Collaborations
             10.3.3 Acquisitions
             10.3.4 Investments and Expansions

11 Company Profiles (Page No. - 97)
(Business Overview, Products Offered, Recent Developments, SWOT Analysis, and MnM View)*
     11.1 Key Players
             11.1.1 Micron
             11.1.2 Samsung
             11.1.3 SK Hynix
             11.1.4 Advanced Micro Devices
             11.1.5 Intel
             11.1.6 Xilinx
             11.1.7 Fujitsu
             11.1.8 Nvidia
             11.1.9 IBM
             11.1.10 Open-Silicon
     11.2 Other Key Companies
             11.2.1 Arira
             11.2.2 Cadence
             11.2.3 Marvell
             11.2.4 Cray
             11.2.5 Rambus
             11.2.6 Arm

*Details on Business Overview, Products Offered, Recent Developments, SWOT Analysis, and MnM View Might Not Be Captured in Case of Unlisted Companies.

12 Appendix (Page No. - 125)
     12.1 Insights of Industry Experts
     12.2 Discussion Guide
     12.3 Knowledge Store: Marketsandmarkets’ Subscription Portal
     12.4 Introducing RT: Real-Time Market Intelligence
     12.5 Available Customizations
     12.6 Related Reports
     12.7 Author Details


List of Tables (72 Tables)

Table 1 HMC and HBM Market, By Memory Type, 2016–2023 (USD Million)
Table 2 HBM2 vs HMC (Gen3)
Table 3 HMC Market, By Application, 2016–2023 (USD Million)
Table 4 HBM Market, By Application, 2016–2023 (USD Million)
Table 5 HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 6 HMC and HBM Market for Central Processing Unit, By Application, 2016–2023 (USD Million)
Table 7 HMC and HBM Market for Central Processing Unit, By Region, 2016–2023 (USD Million)
Table 8 HMC and HBM Market for Field-Programmable Gate Array, By Application, 2016–2023 (USD Million)
Table 9 HMC and HBM Market for Field-Programmable Gate Array, By Region, 2016–2023 (USD Million)
Table 10 HMC and HBM Market for Graphics Processing Unit, By Application, 2016–2023 (USD Million)
Table 11 HMC and HBM Market for Graphics Processing Unit Market, By Region, 2016–2023 (USD Million)
Table 12 HMC and HBM Market for Application-Specific Integrated Circuit, By Application, 2016–2023 (USD Million)
Table 13 HMC and HBM, Market for Application-Specific Integrated Circuit, By Region, 2016–2023 (USD Million)
Table 14 HMC and HBM Market for Accelerated Processing Unit Market, By Application, 2016–2023 (USD Million)
Table 15 HMC and HBM Market for Accelerated Processing Unit, By Region, 2016–2023 (USD Million)
Table 16 HMC and HBM Market, By Application, 2016–2023 (USD Million)
Table 17 HMC and HBM Market for High-Performance Computing, By Memory Type, 2016–2023 (USD Million)
Table 18 HMC and HBM Market for High-Performance Computing, By Product Type, 2016–2023 (USD Million)
Table 19 HMC and HBM Market for Networking Applications, By Memory Type, 2016–2023 (USD Million)
Table 20 HMC and HBM Market for Networking, By Product Type, 2016–2023 (USD Million)
Table 21 HMC and HBM Market for Data Center Applications, By Memory Type, 2016–2023 (USD Million)
Table 22 HMC and HBM Market for Data Center Applications, By Product Type, 2016–2023 (USD Million)
Table 23 HMC and HBM Market for Graphics, By Memory Type, 2016–2023 (USD Million)
Table 24 HMC and HBM Market for Graphics, By Product Type, 2016–2023 (USD Million)
Table 25 HMC and HBM Market, By Region, 2016–2023 (USD Million)
Table 26 North America: HMC and HBM Market, By Country, 2016–2023 (USD Million)
Table 27 North America: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 28 North America: Graphics Processing Unit Market, By Country, 2016–2023 (USD Million)
Table 29 North America: Central Processing Unit Market, By Country, 2016–2023 (USD Million)
Table 30 North America: Accelerated Processing Unit Market, By Country, 2016–2023 (USD Million)
Table 31 North America: Field-Programmable Gate Array Market, By Country, 2016–2023 (USD Million)
Table 32 North America: Application-Specific Integrated Circuit Market, By Country, 2016–2023 (USD Million)
Table 33 US: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 34 Canada: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 35 Mexico: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 36 Europe: HMC and HBM Market, By Country, 2016–2023 (USD Million)
Table 37 Europe: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 38 Europe: Graphics Processing Unit Market, By Country, 2016–2023 (USD Million)
Table 39 Europe: Central Processing Unit Market, By Country, 2016–2023 (USD Million)
Table 40 Europe: Accelerated Processing Unit Market, By Country, 2016–2023 (USD Million)
Table 41 Europe: Field-Programmable Gate Array Market, By Country, 2016–2023 (USD Million)
Table 42 Europe: Application-Specific Integrated Circuit Market, By Country, 2016–2023 (USD Million)
Table 43 UK: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 44 Germany: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 45 France: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 46 RoE: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 47 APAC: HMC and HBM Market, By Country, 2016–2023 (USD Million)
Table 48 APAC: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 49 APAC: Graphics Processing Units Market, By Country, 2016–2023 (USD Million)
Table 50 APAC: Central Processing Units Market, By Country, 2016–2023 (USD Million)
Table 51 APAC: Accelerated Processing Units Market, By Country, 2016–2023 (USD Million)
Table 52 APAC: Field-Programmable Gate Arrays Market, By Country, 2016–2023 (USD Million)
Table 53 APAC: Application-Specific Integrated Circuits Market, By Country, 2016–2023 (USD Million)
Table 54 China: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 55 Japan: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 56 South Korea: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 57 Taiwan: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 58 RoA: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 59 RoW: HMC and HBM Market, By Region, 2016–2023 (USD Million)
Table 60 RoW: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 61 RoW: Graphics Processing Units Market, By Region, 2016–2023 (USD Million)
Table 62 RoW: Central Processing Units Market, By Region, 2016–2023 (USD Million)
Table 63 RoW: Accelerated Processing Units Market, By Region, 2016–2023 (USD Million)
Table 64 RoW: Field-Programmable Gate Arrays Market, By Region, 2016–2023 (USD Million)
Table 65 RoW: Application-Specific Integrated Circuits Market, By Region, 2016–2023 (USD Million)
Table 66 Middle East and Africa: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 67 South America: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 68 Ranking Analysis of the Top 5 Players in the HMC and HBM Market
Table 69 Product Developments and Launches, 2016–2017
Table 70 Partnerships, Agreements, and Collaborations, 2015–2017
Table 71 Acquisitions, 2015
Table 72 Investments and Expansions, 2013–2014


List of Figures (43 Figures)

Figure 1 HMC and HBM Market Segmentation
Figure 2 Research Flow
Figure 3 HMC and HBM Market: Research Design
Figure 4 Bottom-Up Approach
Figure 5 Top-Down Approach
Figure 6 Data Triangulation
Figure 7 HBM to Register the Higher CAGR in the HMC & HBM Market During the Forecast Period
Figure 8 Market for APU to Grow at the Highest CAGR During the Forecast Period
Figure 9 CPU Market for High-Performance Computing to Account for the Largest Market Share During the Forecast Period
Figure 10 HMC and HBM Market for Graphics Applications to Grow at the Highest CAGR During 2018–2023
Figure 11 North America to Account for the Largest Market Share in 2017
Figure 12 High-Performance Computing Applications to Drive the Market for HMC and HBM
Figure 13 HMC Market for Graphics Applications to Grow at the Highest CAGR During the Forecast Period
Figure 14 CPU Segment Held the Largest Share of the HMC and HBM Market in APAC in 2017
Figure 15 HMC and HBM Market in APAC to Grow at the Highest CAGR During the Forecast Period
Figure 16 HMC and HBM Market in South Korea to Grow at the Highest CAGR During the Forecast Period
Figure 17 Growing Need for High-Bandwidth, Low Power Consuming, and Highly Scalable Memories is Driving the Growth of the HMC and HBM Market
Figure 18 Big Data Volume, 2014–2020 (Zettabytes)
Figure 19 Value Chain: HMC and HBM Market, 2017
Figure 20 HBM to Register the Highest Growth Rate in the HMC & HBM Market During the Forecast Period
Figure 21 Accelerated Processing Unit Segment to Grow at the Highest CAGR in the HMC and HBM Market During the Forecast Period
Figure 22 High-Performance Computing, the Largest Application Segment in the Central Processing Unit Market
Figure 23 Market for APU in APAC to Grow at the Highest CAGR During the Forecast Period
Figure 24 HMC and HBM Market for Graphics to Grow at the Highest CAGR During the Forecast Period
Figure 25 APU HMC and HBM Market for High-Performance Computing to Grow at the Highest CAGR During the Forecast Period
Figure 26 Geographic Snapshot: APAC Countries to Register Highest Growth During the Forecast Period (2018–2023)
Figure 27 APAC Market to Grow at the Highest CAGR During the Forecast Period
Figure 28 Market Snapshot: North America
Figure 29 APU Segment to Grow at the Highest CAGR During the Forecast Period in the Us
Figure 30 Market Snapshot: Europe
Figure 31 Accelerated Processing Unit Segment to Grow at the Highest Rate in the RoE Market During the Forecast Period
Figure 32 Market Snapshot: APAC
Figure 33 Central Processing Units Segment to Hold Largest Share of the Market in China
Figure 34 Companies Adopted Product Developments and Launches as the Key Growth Strategy Over the Last Five Years (2013–2017)
Figure 35 Micron: Company Snapshot
Figure 36 Samsung: Company Snapshot
Figure 37 SK Hynix: Company Snapshot
Figure 38 AMD: Company Snapshot
Figure 39 Intel: Company Snapshot
Figure 40 Xilinx: Company Snapshot
Figure 41 Fujitsu: Company Snapshot
Figure 42 Nvidia: Company Snapshot
Figure 43 IBM: Company Snapshot


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