Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) Market

Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) Market by Memory Type (HMC and HBM), Product type (GPU, CPU, APU, FPGA, ASIC), Application (Graphics, High-performance Computing, Networking, Data Centers), and Geography - Global Forecast to 2023

Report Code: SE 4220 Mar, 2018, by marketsandmarkets.com

[134 Pages Report]The overall HMC and HBM market is expected to increase from USD 567.3 Million in 2017 to USD 3,842.5 Million by 2023, at a CAGR of 33.02% during the forecast period. Major factors driving the growth of the HMC and HBM market include growing need for high-bandwidth, low power consuming, and highly scalable memories, increasing adoption of artificial intelligence, and rising trend of miniaturization of electronic devices.

Hybrid Memory Cube and High-Bandwidth Memory Market

By product type, market for APU to grow at the highest CAGR during the forecast period

The market for APUs is expected to grow at the highest rate during the forecast period. HBM-based APUs are a recent innovation by AMD (US) developed to meet the requirements of high-performance computing. APUs integrate both GPU and CPU capabilities on a single SoC. This further improves the overall energy efficiency of APUs by eliminating connections between chips. APUs can also be used for graphics applications. Moreover, AMD (US), the leading manufacturer of APUs, demonstrated an APU with integrated HBM and stacked non-volatile memory cells. This will also serve to drive the adoption of APUs in computing applications.

By application, HMC and HBM market for graphics applications to grow at the highest CAGR during the forecast period

The HMC and HBM market for graphics applications is expected to grow at the highest CAGR during the forecast period. A majority of the products available in the market with the HBM technology are GPU products. HBM was initially adopted in GPUs specifically for graphics applications. For instance, AMD (US) developed the HBM technology along with SK Hynix (South Korea) to be used in GPUs. Along with GPUs, APUs have also been introduced in the market that are increasingly being used for gaming applications. The increasing adoption of HMC and HBM in gaming is largely due to the increasing requirements to process vast amounts of pixels for larger screens and support higher compute rates for more stabilization to support high-end gaming.

North America to account for the largest market share during the forecast period

The high adoption of HMC and HBM memories in North America is largely due to the growth in high-performance computing (HPC) applications that require high-bandwidth memory solutions for fast data processing. The demand for HPC in North America is growing owing to the increasing market for AI, machine learning, and cloud computing. In addition, major HPC-based CPU and processor providers, such as Intel, are based in North American countries. Other key tech companies such as Google, Amazon, and Microsoft are also headquartered in the US and have served to drive the demand for high-performing CPUs in servers and supercomputers. The major drivers for the rapid growth of the HMC and HBM market in the APAC are the growing number of data centers and servers, increasing shipments of network equipment, and the rising number of manufacturing activities in the enterprise storage and consumer electronics sectors. The strong economic growth and growing demand for high-density memories are also expected to drive the HMC and HBM market in the APAC region.

Hybrid Memory Cube and High-Bandwidth Memory Market

Market Dynamics

Driver: Growing need for high-bandwidth, low power consuming, and highly scalable memories

The development of various 3D-stacked memories is mainly driven by the rising need for memories offering high bandwidth, low power consumption, and high scalability. With the emergence of Big Data, Internet of Things (IoT), and other data-intensive applications, there is a growing demand for technologies that can efficiently process and store more information. Also, there is a strong need for memories with high efficiency and performance in the network system for data packet buffering, data packet processing, and storage applications beyond 100 Gbps. HMC and HBM, which provide a bandwidth of more than 100 Gbps, can be a feasible replacement for DRAM as they achieve competitive speeds with much lower power consumption. Also, the market is witnessing continuous advancements in these technologies. For instance, HBM 2 provides 256 Gbps of bandwidth, which is a significant improvement over HBM 1 (128 Gbps of bandwidth).

It has also been observed that HMC and HBM consume about 70% less energy-per-bit than traditional DRAM-based memory technologies. For example, at 128 Gbps of bandwidth, HBM 1 consumes only 3.30 watts, which is considerably lower than DDR4 (its preceding memory technology) which consumes 4.48 watts at the same bandwidth. Considering these advantages, the demand for HBM and HMC is expected to increase in line with the growing demand for high-bandwidth, low power consuming, and highly scalable memories.

Restraint:Thermal issues caused by high levels of integration

HMC and HBM are a stack of DRAM chips that are connected internally to TSVs and externally to one or more chips using micro bumps and TSV. Even though these technologies offer several advantages, thermal issues caused by the high level of integration and their impact on the overall module present a major challenge to manufacturers. These technologies offer highly dense multi-level integration per unit footprint, which creates challenges for thermal management. Listed below are some of the major complications associated with these technologies:

  • The high level of integration leads to high on-chip temperatures
  • As the memory lies between the heat sink and the logic die, the heat generated from the logic die raises the temperature of the memory
  • Although the compact package offers a shorter route for a signal to travel, the heat generated in the module slows down the movement of the signal once it hits the thermal limit (in order to protect the circuitry)

A small change in temperature has a big impact on the lifespan of the circuit, as metal lines burn out as a result of the increased heat. The typical operating temperature for DRAMs is under 85°C. When the temperature exceeds 85°C, the performance of the memory starts reducing and it starts consuming more power than usual. Also, more pronounced thermal effects are because of higher power densities and greater thermal resistance along the heat dissipation paths. Therefore, thermal issues associated with the 3D integration of memories is a major factor restraining the growth of the HMC and HBM market.

Opportunity:Growing Big Data

The introduction of the Internet of Things has led to the generation of a large volume of data. Also, Big Data applications, such as business analytics, scientific computing, financial transactions, social networking, and search engines, are increasing rapidly. All these applications handle large datasets and require high-performance IT infrastructures to achieve fast-processing throughput. Based on the data provided at the National Association of Software and Services Companies’ (NASSCOM) Big Data and Analytics Summit 2016, about 2.5 quintillion bytes of data are created every day; 90% of the data globally has been created in the last 2 years. Also, according to the National Institute of Standards and Technology (NIST), a non-regulatory federal agency within the US Department of Commerce, about 45 zettabytes data is expected to be generated worldwide by 2020. HMC and HBM are well-suited for Big Data applications because they offer ultra-fast storage performance. These technologies also effectively address the performance, bandwidth, and endurance requirements of Big Data applications.

Challenge: Design complexities associated with HMC and HBM

HMC and HBM are still in the early commercialization stage. Currently, there are many manufacturing and fabrication challenges associated with these products, including the placement and routing of ICs. Also, there are new layout rules and layout layers (such as the back-side redistribution layer) as well as challenges associated with the wafer test for HBM and HMC. The power noise impact from HBM I/Os is one of the most critical design challenges. Although the power per pin is low, there are a large number of I/Os generating noise in parallel, which leads to significant power consumption. These testing and design complexities increase the cost of HMC and HBM memories. As a result, unless these memories are mass produced, their cost would continue to be higher as compared to the existing memories available in the market. The impact of this challenge is expected to be medium during the forecast period.

Hybrid Memory Cube and High-Bandwidth Memory Market

Scope of the Report

Report Metric

Details

Market size available for years

2016–2023

Base year considered

2017

Forecast period

2018–2023

Forecast units

Million  (USD)

Segments covered

Memory type, Product type, Application and Region

Geographies covered

North America, Europe, APAC, and RoW (Middle East, Africa and South America)

Companies covered

Samsung (South Korea), Micron (US), SK Hynix (South Korea), Intel (US), Advanced Micro Devices (AMD) (US), Xilinx (US), Fujitsu (Japan), NVIDIA (US), IBM (US), and Open-Silicon, Inc.(US)

The research report categorizes the HMC & HBM Market to forecast the revenues and analyze the trends in each of the following sub-segments:

By Memory Type

  • Hybrid Memory Cube (HMC)
  • High-bandwidth memory (HBM)

By Product Type

  • Graphics Processing Unit (GPU)
  • Central Processing Unit (CPU)
  • Accelerated Processing Unit (APU)
  • Field-programmable Gate Array (FPGA)
  • Application-specific Integrated Circuit (ASIC)

By Application:

  • Graphics
  • High-performance Computing
  • Networking
  • Data Centers

Geography

  • North America
  • Europe
  • APAC
  • RoW

Key Market Players

Samsung (South Korea), Micron (US), SK Hynix (South Korea), Intel (US), Advanced Micro Devices (AMD) (US), Xilinx (US), Fujitsu (Japan), NVIDIA (US), IBM (US), Open-Silicon, Inc. (US)

Micron is a leader and the only provider of the Hybrid Memory Cube in the market. Presently, it offers the Hybrid Memory Cube for networking and computing applications and expects this innovative technology to migrate to consumer applications within the next three to five years. For instance, the company’s short-reach HMC is used in ASICs, FPGAs, and CPUs. The company focuses on achieving cost-efficiency by streamlining the complex processes involved in the development of 3D memories. This includes working closely around the factors that significantly add to the manufacturing cost, such as the sophistication of manufacturing equipment, equipment utilization, process complexity, and cost of raw materials, labor productivity, and package type.

Micron focuses simultaneously on organic as well as inorganic growth strategies. The company’s major focus is on the development of new products addressing the future requirements and upgrading the existing products with higher specifications. The company is involved in intensive R&D efforts for the development of next-generation memories, such as 3DXpoint, 3D NAND, and Hybrid Memory Cube. The company aims to release the hybrid memory cube 3.0 Specification in 2018. To launch these products in the market, the company focuses on new collaborations with industry players who could use and integrate the HMC technology in their products. The company partnered with Intel Corporation (US) to design, develop, and manufacture the hybrid memory cube and certain emerging memory products. In March 2015, the company also collaborated with Juniper Networks (US), a leading provider of software-defined networking (SDN) solutions, to integrate the hybrid memory cube in Juniper’s Converged Supercore to expand SDN capabilities.

Recent Developments

  • In March 2015, Micron collaborated with Juniper Networks (US), a leading provider of software-defined networking (SDN) solutions, to integrate the hybrid memory cube in the SDN solution. Juniper Networks launched a new core routing platform—Converged Supercore that integrates the HMC solution to expand its SDN capabilities.
  • In July 2017, Samsung started the mass production of its 8-gigabyte (GB) HBM2. HBM2 offers 256 Gbps of memory bandwidth and meets the growing market requirements across a wide range of applications including artificial intelligence, high-performance computing, advanced graphics, network systems, and enterprise servers.
  • In August 2016, SK Hynix launched HBM2, a next-generation solution of HBM1. The memory offers high-performance solutions for graphics, servers, supercomputers, and networking applications.
  • In November 2017, AMD collaborated with Intel (US), a leading developer of advanced and integrated digital technology platforms, to integrate semi-custom GPUs with a multi-chip processor package.
  • In December 2017, Intel (US) launched the Stratix 10 MX FPGA, with integrated high-bandwidth memory HBM2. The product provides a maximum memory bandwidth of 512 gigabytes per second and targets high-end applications such as high-performance computing (HPC), network function virtualization (NFV), and broadcast applications.

Key Questions Answered

  • Where will all these developments take the industry in the long term?
  • What are the upcoming trends for the HMC and HBM market?
  • Which segment provides the most opportunity for growth?
  • Who are the leading vendors operating in this market?
  • What are the opportunities for new market entrants?

To speak to our analyst for a discussion on the above findings, click Speak to Analyst

Table of Contents

1 Introduction (Page No. - 13)
    1.1 Study Objectives
    1.2 Definition
    1.3 Study Scope
           1.3.1 Markets Covered
           1.3.2 Geographic Scope
           1.3.3 Years Considered for the Study
    1.4 Currency
    1.5 Limitations
    1.6 Stakeholders

2 Research Methodology (Page No. - 16)
    2.1 Research Data
           2.1.1 Secondary Data
                    2.1.1.1 Secondary Sources
           2.1.2 Primary Data
                    2.1.2.1 Primary Sources
                    2.1.2.2 Key Industry Insights
                    2.1.2.3 Breakdown of Primary Interviews
           2.1.3 Secondary and Primary Research
    2.2 Market Size Estimation
           2.2.1 Bottom-Up Approach
                    2.2.1.1 Approach for Capturing the Market Size By Bottom-Up Analysis (Demand Side)
           2.2.2 Top-Down Approach
                    2.2.2.1 Approach for Capturing the Market Share By Top-Down Analysis (Supply Side)
    2.3 Data Triangulation
    2.4 Assumptions

3 Executive Summary (Page No. - 26)

4 Premium Insights (Page No. - 31)
    4.1 HMC and HBM Market Overview
    4.2 HMC Market, By Application
    4.3 HMC and HBM Market in APAC
    4.4 Geographic Snapshot of the HMC and HBM Market
    4.5 HMC and HBM Market in APAC, By Country

5 Market Overview (Page No. - 34)
    5.1 Introduction
    5.2 Market Dynamics
           5.2.1 Drivers
                    5.2.1.1 Growing Need for High-Bandwidth, Low Power Consuming, and Highly Scalable Memories
                    5.2.1.2 Increasing Adoption of Artificial Intelligence
                    5.2.1.3 Rising Trend of Miniaturization of Electronic Devices
           5.2.2 Restraints
                    5.2.2.1 Thermal Issues Caused By High Levels of Integration
           5.2.3 Opportunities
                    5.2.3.1 High Demand for Cloud-Based Services
                    5.2.3.2 Growing Big Data
           5.2.4 Challenges
                    5.2.4.1 Design Complexities Associated With HMC and HBM
                    5.2.4.2 Ecosystem Development
    5.3 Value Chain Analysis

6 HMC and HBM Market, By Memory Type (Page No. - 41)
    6.1 Introduction
    6.2 Hybrid Memory Cube (HMC)
    6.3 High-Bandwidth Memory (HBM)

7 HMC and HBM Market, By Product Type (Page No. - 46)
    7.1 Introduction
    7.2 Central Processing Unit
    7.3 Field-Programmable Gate Array
    7.4 Graphics Processing Unit
    7.5 Application-Specific Integrated Circuit
    7.6 Accelerated Processing Unit

8 HMC and HBM Market, By Application (Page No. - 55)
    8.1 Introduction
    8.2 High-Performance Computing (HPC)
    8.3 Networking
    8.4 Data Centers
    8.5 Graphics

9 Geographic Analysis (Page No. - 63)
    9.1 Introduction
    9.2 North America
           9.2.1 US
           9.2.2 Canada
           9.2.3 Mexico
    9.3 Europe
           9.3.1 UK
           9.3.2 Germany
           9.3.3 France
           9.3.4 Rest of Europe
    9.4 APAC
           9.4.1 China
           9.4.2 Japan
           9.4.3 South Korea
           9.4.4 Taiwan
           9.4.5 Rest of APAC
    9.5 RoW
           9.5.1 Middle East and Africa
           9.5.2 South America

10 Competitive Landscape (Page No. - 91)
     10.1 Overview
     10.2 Ranking Analysis
     10.3 Competitive Scenario
             10.3.1 Product Developments and Launches
             10.3.2 Partnerships, Agreements, and Collaborations
             10.3.3 Acquisitions
             10.3.4 Investments and Expansions

11 Company Profiles (Page No. - 97)
(Business Overview, Products Offered, Recent Developments, SWOT Analysis, and MnM View)*
     11.1 Key Players
             11.1.1 Micron
             11.1.2 Samsung
             11.1.3 SK Hynix
             11.1.4 Advanced Micro Devices
             11.1.5 Intel
             11.1.6 Xilinx
             11.1.7 Fujitsu
             11.1.8 Nvidia
             11.1.9 IBM
             11.1.10 Open-Silicon
     11.2 Other Key Companies
             11.2.1 Arira
             11.2.2 Cadence
             11.2.3 Marvell
             11.2.4 Cray
             11.2.5 Rambus
             11.2.6 Arm

*Details on Business Overview, Products Offered, Recent Developments, SWOT Analysis, and MnM View Might Not Be Captured in Case of Unlisted Companies.

12 Appendix (Page No. - 125)
     12.1 Insights of Industry Experts
     12.2 Discussion Guide
     12.3 Knowledge Store: Marketsandmarkets’ Subscription Portal
     12.4 Introducing RT: Real-Time Market Intelligence
     12.5 Available Customizations
     12.6 Related Reports
     12.7 Author Details


List of Tables (72 Tables)

Table 1 HMC and HBM Market, By Memory Type, 2016–2023 (USD Million)
Table 2 HBM2 vs HMC (Gen3)
Table 3 HMC Market, By Application, 2016–2023 (USD Million)
Table 4 HBM Market, By Application, 2016–2023 (USD Million)
Table 5 HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 6 HMC and HBM Market for Central Processing Unit, By Application, 2016–2023 (USD Million)
Table 7 HMC and HBM Market for Central Processing Unit, By Region, 2016–2023 (USD Million)
Table 8 HMC and HBM Market for Field-Programmable Gate Array, By Application, 2016–2023 (USD Million)
Table 9 HMC and HBM Market for Field-Programmable Gate Array, By Region, 2016–2023 (USD Million)
Table 10 HMC and HBM Market for Graphics Processing Unit, By Application, 2016–2023 (USD Million)
Table 11 HMC and HBM Market for Graphics Processing Unit Market, By Region, 2016–2023 (USD Million)
Table 12 HMC and HBM Market for Application-Specific Integrated Circuit, By Application, 2016–2023 (USD Million)
Table 13 HMC and HBM, Market for Application-Specific Integrated Circuit, By Region, 2016–2023 (USD Million)
Table 14 HMC and HBM Market for Accelerated Processing Unit Market, By Application, 2016–2023 (USD Million)
Table 15 HMC and HBM Market for Accelerated Processing Unit, By Region, 2016–2023 (USD Million)
Table 16 HMC and HBM Market, By Application, 2016–2023 (USD Million)
Table 17 HMC and HBM Market for High-Performance Computing, By Memory Type, 2016–2023 (USD Million)
Table 18 HMC and HBM Market for High-Performance Computing, By Product Type, 2016–2023 (USD Million)
Table 19 HMC and HBM Market for Networking Applications, By Memory Type, 2016–2023 (USD Million)
Table 20 HMC and HBM Market for Networking, By Product Type, 2016–2023 (USD Million)
Table 21 HMC and HBM Market for Data Center Applications, By Memory Type, 2016–2023 (USD Million)
Table 22 HMC and HBM Market for Data Center Applications, By Product Type, 2016–2023 (USD Million)
Table 23 HMC and HBM Market for Graphics, By Memory Type, 2016–2023 (USD Million)
Table 24 HMC and HBM Market for Graphics, By Product Type, 2016–2023 (USD Million)
Table 25 HMC and HBM Market, By Region, 2016–2023 (USD Million)
Table 26 North America: HMC and HBM Market, By Country, 2016–2023 (USD Million)
Table 27 North America: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 28 North America: Graphics Processing Unit Market, By Country, 2016–2023 (USD Million)
Table 29 North America: Central Processing Unit Market, By Country, 2016–2023 (USD Million)
Table 30 North America: Accelerated Processing Unit Market, By Country, 2016–2023 (USD Million)
Table 31 North America: Field-Programmable Gate Array Market, By Country, 2016–2023 (USD Million)
Table 32 North America: Application-Specific Integrated Circuit Market, By Country, 2016–2023 (USD Million)
Table 33 US: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 34 Canada: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 35 Mexico: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 36 Europe: HMC and HBM Market, By Country, 2016–2023 (USD Million)
Table 37 Europe: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 38 Europe: Graphics Processing Unit Market, By Country, 2016–2023 (USD Million)
Table 39 Europe: Central Processing Unit Market, By Country, 2016–2023 (USD Million)
Table 40 Europe: Accelerated Processing Unit Market, By Country, 2016–2023 (USD Million)
Table 41 Europe: Field-Programmable Gate Array Market, By Country, 2016–2023 (USD Million)
Table 42 Europe: Application-Specific Integrated Circuit Market, By Country, 2016–2023 (USD Million)
Table 43 UK: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 44 Germany: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 45 France: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 46 RoE: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 47 APAC: HMC and HBM Market, By Country, 2016–2023 (USD Million)
Table 48 APAC: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 49 APAC: Graphics Processing Units Market, By Country, 2016–2023 (USD Million)
Table 50 APAC: Central Processing Units Market, By Country, 2016–2023 (USD Million)
Table 51 APAC: Accelerated Processing Units Market, By Country, 2016–2023 (USD Million)
Table 52 APAC: Field-Programmable Gate Arrays Market, By Country, 2016–2023 (USD Million)
Table 53 APAC: Application-Specific Integrated Circuits Market, By Country, 2016–2023 (USD Million)
Table 54 China: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 55 Japan: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 56 South Korea: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 57 Taiwan: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 58 RoA: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 59 RoW: HMC and HBM Market, By Region, 2016–2023 (USD Million)
Table 60 RoW: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 61 RoW: Graphics Processing Units Market, By Region, 2016–2023 (USD Million)
Table 62 RoW: Central Processing Units Market, By Region, 2016–2023 (USD Million)
Table 63 RoW: Accelerated Processing Units Market, By Region, 2016–2023 (USD Million)
Table 64 RoW: Field-Programmable Gate Arrays Market, By Region, 2016–2023 (USD Million)
Table 65 RoW: Application-Specific Integrated Circuits Market, By Region, 2016–2023 (USD Million)
Table 66 Middle East and Africa: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 67 South America: HMC and HBM Market, By Product Type, 2016–2023 (USD Million)
Table 68 Ranking Analysis of the Top 5 Players in the HMC and HBM Market
Table 69 Product Developments and Launches, 2016–2017
Table 70 Partnerships, Agreements, and Collaborations, 2015–2017
Table 71 Acquisitions, 2015
Table 72 Investments and Expansions, 2013–2014


List of Figures (43 Figures)

Figure 1 HMC and HBM Market Segmentation
Figure 2 Research Flow
Figure 3 HMC and HBM Market: Research Design
Figure 4 Bottom-Up Approach
Figure 5 Top-Down Approach
Figure 6 Data Triangulation
Figure 7 HBM to Register the Higher CAGR in the HMC & HBM Market During the Forecast Period
Figure 8 Market for APU to Grow at the Highest CAGR During the Forecast Period
Figure 9 CPU Market for High-Performance Computing to Account for the Largest Market Share During the Forecast Period
Figure 10 HMC and HBM Market for Graphics Applications to Grow at the Highest CAGR During 2018–2023
Figure 11 North America to Account for the Largest Market Share in 2017
Figure 12 High-Performance Computing Applications to Drive the Market for HMC and HBM
Figure 13 HMC Market for Graphics Applications to Grow at the Highest CAGR During the Forecast Period
Figure 14 CPU Segment Held the Largest Share of the HMC and HBM Market in APAC in 2017
Figure 15 HMC and HBM Market in APAC to Grow at the Highest CAGR During the Forecast Period
Figure 16 HMC and HBM Market in South Korea to Grow at the Highest CAGR During the Forecast Period
Figure 17 Growing Need for High-Bandwidth, Low Power Consuming, and Highly Scalable Memories is Driving the Growth of the HMC and HBM Market
Figure 18 Big Data Volume, 2014–2020 (Zettabytes)
Figure 19 Value Chain: HMC and HBM Market, 2017
Figure 20 HBM to Register the Highest Growth Rate in the HMC & HBM Market During the Forecast Period
Figure 21 Accelerated Processing Unit Segment to Grow at the Highest CAGR in the HMC and HBM Market During the Forecast Period
Figure 22 High-Performance Computing, the Largest Application Segment in the Central Processing Unit Market
Figure 23 Market for APU in APAC to Grow at the Highest CAGR During the Forecast Period
Figure 24 HMC and HBM Market for Graphics to Grow at the Highest CAGR During the Forecast Period
Figure 25 APU HMC and HBM Market for High-Performance Computing to Grow at the Highest CAGR During the Forecast Period
Figure 26 Geographic Snapshot: APAC Countries to Register Highest Growth During the Forecast Period (2018–2023)
Figure 27 APAC Market to Grow at the Highest CAGR During the Forecast Period
Figure 28 Market Snapshot: North America
Figure 29 APU Segment to Grow at the Highest CAGR During the Forecast Period in the Us
Figure 30 Market Snapshot: Europe
Figure 31 Accelerated Processing Unit Segment to Grow at the Highest Rate in the RoE Market During the Forecast Period
Figure 32 Market Snapshot: APAC
Figure 33 Central Processing Units Segment to Hold Largest Share of the Market in China
Figure 34 Companies Adopted Product Developments and Launches as the Key Growth Strategy Over the Last Five Years (2013–2017)
Figure 35 Micron: Company Snapshot
Figure 36 Samsung: Company Snapshot
Figure 37 SK Hynix: Company Snapshot
Figure 38 AMD: Company Snapshot
Figure 39 Intel: Company Snapshot
Figure 40 Xilinx: Company Snapshot
Figure 41 Fujitsu: Company Snapshot
Figure 42 Nvidia: Company Snapshot
Figure 43 IBM: Company Snapshot


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