Next-Generation Memory Market

Next-Generation Memory Market by Technology (Volatile (HMC and HBM), and Nonvolatile (MRAM, FRAM, RERAM, 3D XPoint, NRAM)), Wafer Size (200 mm, 300 mm, and 450 mm), Application, and Geography - Global Forecast to 2023

Report Code: SE 3111 Nov, 2017, by marketsandmarkets.com
Updated date as on -

MarketsandMarkets forecasts the next-generation memory market to grow from USD 2.4 billion in 2017 to USD 6.7 million by 2023, at a Compound Annual Growth Rate (CAGR) of 26.5% during the forecast period. Some of the key factors driving this market are big data demand for universal memory devices; increasing demand  for enterprise storage application; and need for high bandwidth, low power consumption, and highly scalable memory device for technologies such as artificial intelligence (AI), Internet of Things (IoT), and Big Data. The objective of the report is to define, describe, and forecast the next-generation memory market size based on by technology, storage type, application, wafer size, and region.

Next Generation Memory Market

Enterprise storage holds the largest share of the next-generation memory market

The demand for enterprise storage is more owing to the growing date centers across the globe. Increasing need for data storage capabilities in cloud storage and data centers is also creating demand for NGM storage devices in enterprise storage.

The magneto-resistive random-access memory (MRAM) held a larger share of the next-generation non-volatile memory market

This growth can be attributed to its improved performance, higher endurance, lower power consumption, better scalability with extremely high write endurance, and much higher write speeds than other non-volatile memory technologies. Among the volatile memory storage devices, the hybrid memory cube (HMC) is expected to hold a larger share of the market due to its higher bandwidth, increased scalability, and better power efficiency, compared to HBM.

300mm wafer manufacturing holds the largest share of the next-generation memory market

Based on wafer size as it can accommodate twice as many dies per wafer as 200 mm wafers and ensure 2–4% lower IC cost/cm per year. Key players such as Micron technology, Samsung, and SK Hynix are currently manufacturing most of the memory technologies on 300mm wafer

The next-generation memory market for consumer electronics is expected to grow at a faster rate

The emerging memory technologies are mostly driven by connected and wearable devices. Smartphones, digital cameras, gaming devices, and other consumer electronic devices also need memory technologies in bulk. With increasing consumer electronics market, the demand for emerging memory technologies is also expected to increase.

APAC acquired the largest market for next-generation memory in 2016

APAC is one of the key markets for next-generation memory technologies owing to their tremendous scope in various applications. This can be mainly attributed to the large adoption of consumer electronics, especially smartphones, tablets, and laptops, in APAC, which makes it a high-potential market for consumer electronics products. The increasing demand for memory in consumer electronics products is driving the mass production of emerging memory technologies in APAC.

Next Generation Memory Market

Market Dynamics

Driver: Need for high bandwidth, low power consumption, and highly scalable memory device for technologies such as Artificial Intelligence (AI), Internet of Things (IoT), and Big Data

Increasingly, the Memory devices are increasingly becoming a bottleneck in the data storage and retrieval processes, and this has been which is limiting the performance of the data storage systems. To achieve a substantial improvement in the computation speed, scientists are racing making efforts to develop smaller and denser memory devices that operate operating with high speed and low power consumption.

With the advent of advanced technologies such as artificial intelligence (AI), big data and the internet of things (IoT), data centers are now required to process and store more information than ever before. Further, most businesses depend on a successful core data center infrastructure. A highly functioning data center has several requirements such as high performance, availability, scalability, and manageability. Moreover, the increasing demand for semiconductors are also expected to drive the next generation memory market. Key players are also investing in the memory technologies and semiconductor components deployed in technologies such as AI, IoT, and big data. As per Samsung Electronics (South Korea) article published in July 2017, the company is planning to invest USD 26 billion to expand its semiconductor fabrication capacity and mass produce memory for internet of things (IoT), artificial intelligence (AI), big data, and automotive technologies.

 Also, there is a strong need for memory with high efficiency and performance in the network system for data packet buffering, data packet processing, and storage applications beyond 100 Gb/s. Thus, Hybrid Memory Cube and High-Bandwidth Memory, which provide 160 Gb/s and 128Gb/sec, respectively, can efficiently replace DRAM, achieving competitive speeds at much lower power consumption. Thus, Hybrid Memory Cube and High-Bandwidth Memory that provides 160 Gb/s and 128Gb/sec respectively bandwidth memories can be a feasible DRAM replacement, achieving competitive speeds at much lower power consumption.

Low power consumption is another attribute characteristic of the emerging non-volatile memories. Reducing memory power consumption which can help can save up to 5% to 10% of the total power drawn. Therefore, memory power management is a very critical aspect when server configurations require a minimized power budget. Many of these new non-volatile memory technologies, such as 3D XPoint, STTMRAM, and NRAM, and so on are inherently more scalable and are suitable for the next generation of mobile computing and enterprise storage that would require high-capacity memories capable of storing and rapidly accessing videos and a large database without overburdening battery power sources.

Restraint: Lack of stability under extreme environmental conditions

Stability under high temperature and extreme environmental conditions are among the essential requirements for emerging memory technologies. The major advantage of traditional memories is their stability and performance under high temperature. Hence, they are used in multiple applications where they are exposed to extreme high and low temperatures in the range of −40°C to 150°C. However, certain scalability and stability issues are encountered in the operation of most next-generation memories in such extreme environmental conditions. The Hybrid Memory Cube operates in temperature ranges of 0°C to 95°C, while ReRAM operates between 40°C and 85°C. These shortcomings of the next-generation memory technologies restrain their adoption in the market. The impact of this restraint is high at present as most of the emerging memories are in the development stage. However, there is no standardized process been set for emerging memory technologies. However, in the future, the impact of this restraint will eventually decline with advancements in next-generation memories.

Opportunity: Growing demand for emerging nonvolatile memory in connected devices

The NAND memory is extensively used in smart devices with advancements in wireless technologies. Wearable and connected devices need a very high data transfer rate. These requirements can be fulfilled by next-generation memories that can provide higher memory capacity. Companies in this market such as Adesto Technologies (US) and Everspin Technologies (US) are focused on offering dedicated emerging memory solutions for IoT and wearable devices.

The development of the Internet of Things (IoT) with improved network connectivity and data transfers is expected to boost the next-generation memory market. The acceleration in the development of self-driving cars would also create new growth avenues for the next-generation memory market for the automotive industry.

Emerging nonvolatile memories are expected to be used widely in connected devices during the forecast period owing to their high endurance, lower power requirement, and high density. The impact of this driver is high at present on the next-generation memory market.

According to the article by National Cable & Telecommunications Association on “Growth in the Internet of Things” published in May 2016, the number of connected devices globally is expected to increase significantly. The figure below shows the growth in the market for connected devices worldwide between 2012 and 2020.

Challenge: Optimizing storage densities and capacities

High-density memories such as ReRAM, NVDIMM, etc. face numerous challenges related to poor scalability. Scalability refers to the ability of a product to function well even when there is a change in its size and capacity. These memories are incapable of adhering to the required levels of endurance, noise margin, and reliability. There is limited capacity for electron storage in high-density nonvolatile memories. Usually, higher density memory technologies are preferred in consumer electronics as they allow a greater volume of data to be stored in the same physical space. Optimized storage density will also enable the device to perform better. The impact of this challenge is high at present, but it is expected to reduce in the next few years.

Next Generation Memory Market

Scope of the Report

Report Metric

Details

Market size available for years

2015-2023

Base year considered

2016

Forecast period

2017-2023

Forecast units

Value (USD) in million

Segments covered

Technology, storage type, wafer size, application, and region

Geographies covered

North America, APAC, Europe, and RoW

Companies covered

Samsung Electronics (South Korea), Toshiba (Japan), Micron Technology (US), Intel (US), Western Digital (US), SK Hynix (South Korea), Fujitsu (Japan), Everspin Technologies (US), and Microchip Technology (US), Adesto Technologies (US), Advanced Micro Devices (US), Avalanche Technology (US), Cypress Semiconductor (US), IBM Corporation (US), NXP Semiconductor (Netherlands), Open-Silicon (US), Rambus Inc. (US), Spin Transfer Technologies (US), Texas Instruments (US), Viking Technology (US), 4DS Memory (Australia) Crossbar Inc. (US), Nantero (US), Kilopass Technology (US),

This research report categorizes the next-generation memory market based on technology, storage type, wafer size, application, and region.

Next-Generation Memory Market, by Technology

  • Non-volatile memory
  • Volatile memory

Next-Generation Memory Market, by Storage Type

  • Mass Storage
  • Embedded Storage
  • Others

Next-Generation Memory Market, by Wafer Size

  • 200 mm
  • 300 mm
  • 450 mm

Next-Generation Memory Market, by Application: 

  • Consumer Electronics
  • Enterprise Storage
  • Automotive and Transportation
  • Military and Aerospace
  • Industrial
  • Telecommunications
  • Energy and Power
  • Healthcare
  • Agriculture
  • Retail

By Geography

  • North America
  • Europe
  • Asia Pacific (APAC)
  • Rest of the World (RoW)

Key Market Players:

Key players in the solid state drive market include Samsung (South Korea), Toshiba (Japan), Micron Technology (US), Intel (US), Western Digital (US), SK Hynix (South Korea), Fujitsu (Japan), Everspin (US), and Microchip Technology (US), Adesto Technologies (US), Advanced Micro Devices (US), Avalanche Technology (US), Cypress Semiconductor (US), IBM (US), NXP Semiconductor (Netherlands), Open-Silicon (US), Rambus (US), Spin Transfer Technologies (US), Texas Instruments (US), Viking Technology (US), 4DS Memory (Australia) Crossbar (US), Nantero (US), Kilopass Technology (US). 

Samsung Electronics held the leading position in the global NGM market in 2016. The company is one of the world’s largest IT companies and a leading provider of next-generation memory solutions, such as computing DRAM, consumer DRAM, graphics DRAM, V-NAND, SSDs, foundry solutions, and mobile memory solutions. The company has a dedicated memory business unit that extensively works for the development of various DRAM and NAND products with higher densities.

The company focuses on both organic and inorganic growth strategies to expand its share in the NGM market. For instance, in 2017, Samsung acquired Harman for USD 8 billion. Through this acquisition, the company would accelerate the growth of the memory business in automotive and connected devices. Furthermore, the company’s strong brand image has contributed to its growth in the NGM market.

Recent Developments:

  • In August 2017, The company launched V-NAND (Vertical NAND) memory solutions and technologies, namely, 1Tb V-NAND chip, 16-terabyte (TB) NGSFF (next-generation small form factor) SSD, and Z-SSD technology to address requirements of next-generation storage systems and data processing.
  • In April 2017, SK Hynix launched the 2Znm 8Gb GDDR6 (Graphics DDR6) DRAM. It operates at a faster I/O data rate of 16 Gbps per pin than traditional memory technologies. The company also plans to mass-produce the memory solution with high-performance GDDR6 DRAMs by 2018.
  • In August 2016, Fujitsu Semiconductor and Mie Fujitsu Semiconductor Limited (Japan) signed an agreement with Nantero. Together, they will work for the joint development of NRAM and non-volatile RAM using carbon nanotubes based on 55 nm process technology.

Critical questions the report answers:

  • Where will all the developments take the industry in the mid to long term?
  • What are the emerging applications that are expected to drive the next-generation memory market?
  • What are the key strategies adopted by leading companies in the next-generation memory market?
  • What are the trends prevalent in the next-generation memory market?
  • What advanced technologies are expected to gain traction in the next-generation memory market?

To speak to our analyst for a discussion on the above findings, click Speak to Analyst

Table of Content

1 Introduction (Page No. - 20)
    1.1 Study Objectives
    1.2 Definition
    1.3 Market Scope
           1.3.1 Markets Covered
           1.3.2 Geographic Scope
           1.3.3 Years Considered for the Study
    1.4 Currency
    1.5 Limitations
    1.6 Market Stakeholders

2 Research Methodology (Page No. - 24)
    2.1 Research Data
           2.1.1 Secondary Data
                    2.1.1.1 List of Major Secondary Sources
                    2.1.1.2 Key Data From Secondary Sources
           2.1.2 Primary Data
                    2.1.2.1 Primary Interviews With Experts
                    2.1.2.2 Key Data From Primary Sources
                    2.1.2.3 Breakdown of Primaries
                    2.1.2.4 Key Industry Insights
           2.1.3 Secondary and Primary Research
    2.2 Market Size Estimation
           2.2.1 Bottom-Up Approach
                    2.2.1.1 Approach for Capturing the Market Share By Bottom-Up Analysis (Demand Side)
                    2.2.1.2 Approach for Capturing the Market Share of Demand Side With the Help of Various Players in the Value Chain of the NGM Market
           2.2.2 Top-Down Approach
                    2.2.2.1 Approach for Capturing the Market Share By Top-Down Analysis (Supply Side)
    2.3 Market Breakdown and Data Triangulation
    2.4 Research Assumptions

3 Executive Summary (Page No. - 34)

4 Premium Insights (Page No. - 39)
    4.1 Attractive Opportunities in Next-Generation Memory Market, 2017–2023
    4.2 Market for Consumer Electronics, By Technology
    4.3 Market for Nonvolatile Memory, By Region
    4.4 Market, By Country
    4.5 NGM Market, By Wafer Size

5 Market Overview (Page No. - 43)
    5.1 Introduction
    5.2 Market Dynamics
           5.2.1 Drivers
                    5.2.1.1 Need for High Bandwidth, Low Power Consumption, and Highly Scalable Memory Device for Technologies Such as Artificial Intelligence (Ai), Internet of Things (IoT), and Big Data
                    5.2.1.2 Demand for Universal Memory Devices
                    5.2.1.3 Increasing Demand for Enterprise Storage Applications
           5.2.2 Restraints
                    5.2.2.1 Issues With Storage in Niche Application and High Cost of Emerging Memory Technologies
                    5.2.2.2 Lack of Stability Under Extreme Environmental Conditions
           5.2.3 Opportunities
                    5.2.3.1 Growing Demand for Emerging Nonvolatile Memory in Connected Devices
                    5.2.3.2 Potential for Replacing Flash Memory
                    5.2.3.3 Growing Use of Nonvolatile Memory in Smartphones
           5.2.4 Challenges
                    5.2.4.1 Optimizing Storage Densities and Capacities
                    5.2.4.2 Higher Design Costs Due to Lack of Standardization
    5.3 Value Chain Analysis

6 Next-Generation Memory Market, By Technology (Page No. - 52)
    6.1 Introduction
    6.2 Nonvolatile Memory
           6.2.1 Magneto-Resistive Random-Access Memory (MRAM)
                    6.2.1.1 Spin-Transfer Torque Magnetic Random Access Memory (STT-MRAM)
                    6.2.1.2 Toggle Mode MRAM
           6.2.2 Ferroelectric RAM (FRAM)
           6.2.3 Resistive Random-Access Memory (RERAM)/ Conductive-Bridging RAM (CBRAM)
           6.2.4 3D XPoint (Quantx & Optane)
           6.2.5 Nano RAM (Nram)
           6.2.6 Others (Nano-Bridge, Quantum Dots, Millipede, Molecular, Transparent/Flexible)
    6.3 Volatile Memory
                    6.3.1.1 Hybrid Memory Cube (HMC)
                    6.3.1.2 High-Bandwidth Memory (HBM)

7 Next-Generation Memory Market, By Storage Type (Page No. - 76)
    7.1 Introduction
    7.2 Mass Storage
    7.3 Embedded Storage
    7.4 Others

8 Next-Generation Memory Market, By Application (Page No. - 78)
    8.1 Introduction
    8.2 Consumer Electronics
    8.3 Enterprise Storage
    8.4 Automotive and Transportation
    8.5 Military and Aerospace
    8.6 Industrial
    8.7 Telecommunications
    8.8 Energy and Power
    8.9 Healthcare
    8.10 Agriculture
    8.11 Retail

9 Next-Generation Memory Market, By Wafer Size (Page No. - 117)
    9.1 Introduction
    9.2 Nonvolatile Memory Market, By Wafer Size
    9.3 Volatile Memory Market, By Wafer Size
           9.3.1 200 mm
           9.3.2 300 mm
           9.3.3 450 mm

10 Geographic Analysis (Page No. - 130)
     10.1 Introduction
     10.2 Asia Pacific (APAC)
             10.2.1 China
             10.2.2 Japan
             10.2.3 South Korea
             10.2.4 India
             10.2.5 Rest of APAC
     10.3 North America
             10.3.1 US
             10.3.2 Canada
             10.3.3 Mexico
     10.4 Europe
             10.4.1 Germany
             10.4.2 France
             10.4.3 UK
             10.4.4 Rest of Europe
     10.5 Rest of the World (RoW)
             10.5.1 South America
             10.5.2 Middle East
             10.5.3 Africa

11 Competitive Landscape (Page No. - 154)
     11.1 Introduction
     11.2 Market Ranking Analysis: NGM Market
     11.3 Competitive Scenario
             11.3.1 Product Launches and New Product Developments
             11.3.2 Partnerships, Agreements, and Collaborations
             11.3.3 Investments and Expansions
             11.3.4 Acquisitions
     11.4 Competitive Leadership Mapping
             11.4.1 Visionary Leaders
             11.4.2 Dynamic Differentiators
             11.4.3 Innovators
             11.4.4 Emerging Companies
     11.5 Strength of Product Portfolio (25 Players)
     11.6 Business Strategy Excellence (25 Players)

12 Company Profiles (Page No. - 164)
     12.1 Key Players
             12.1.1 Samsung
                        12.1.1.1 Business Overview
                        12.1.1.2 Strength of Product Portfolio
                        12.1.1.3 Business Strategy Excellence
                        12.1.1.4 Recent Developments
                        12.1.1.5 Key Relationships
             12.1.2 Toshiba
                        12.1.2.1 Business Overview
                        12.1.2.2 Strength of Product Portfolio
                        12.1.2.3 Business Strategy Excellence
                        12.1.2.4 Recent Developments
                        12.1.2.5 Key Relationships
             12.1.3 Micron Technology
                        12.1.3.1 Business Overview
                        12.1.3.2 Strength of Product Portfolio
                        12.1.3.3 Business Strategy Excellence
                        12.1.3.4 Recent Developments
                        12.1.3.5 Key Relationships
             12.1.4 SK Hynix
                        12.1.4.1 Business Overview
                        12.1.4.2 Strength of Product Portfolio
                        12.1.4.3 Business Strategy Excellence
                        12.1.4.4 Recent Developments
                        12.1.4.5 Key Relationships
             12.1.5 Western Digital
                        12.1.5.1 Business Overview
                        12.1.5.2 Strength of Product Portfolio
                        12.1.5.3 Business Strategy Excellence
                        12.1.5.4 Recent Developments
                        12.1.5.5 Key Relationships
             12.1.6 Adesto Technologies
                        12.1.6.1 Business Overview
                        12.1.6.2 Strength of Product Portfolio
                        12.1.6.3 Business Strategy Excellence
                        12.1.6.4 Recent Developments
             12.1.7 Intel
                        12.1.7.1 Business Overview
                        12.1.7.2 Strength of Product Portfolio
                        12.1.7.3 Business Strategy Excellence
                        12.1.7.4 Recent Developments
                        12.1.7.5 Key Relationships
             12.1.8 Microchip Technology
                        12.1.8.1 Business Overview
                        12.1.8.2 Strength of Product Portfolio
                        12.1.8.3 Business Strategy Excellence
                        12.1.8.4 Recent Developments
                        12.1.8.5 Key Relationships
             12.1.9 Fujitsu
                        12.1.9.1 Business Overview
                        12.1.9.2 Strength of Product Portfolio
                        12.1.9.3 Business Strategy Excellence
                        12.1.9.4 Recent Developments
                        12.1.9.5 Key Relationships
             12.1.10 Everspin
                        12.1.10.1 Business Overview
                        12.1.10.2 Strength of Product Portfolio
                        12.1.10.3 Business Strategy Excellence
                        12.1.10.4 Recent Developments
                        12.1.10.5 Key Relationships
     12.2 Others Players
             12.2.1 Advanced Micro Devices
             12.2.2 Avalanche Technology
             12.2.3 Cypress Semiconductor
             12.2.4 IBM
             12.2.5 NXP Semiconductor
             12.2.6 Open-Silicon
             12.2.7 Rambus Inc
             12.2.8 Spin Transfer Technologies
             12.2.9 Texas Instruments
             12.2.10 Viking Technology
             12.2.11 4DS Memory
     12.3 Key Innovators
             12.3.1 Crossbar Inc.
             12.3.2 Nantero
             12.3.3 Kilopass Technology
             12.3.4 Sidense

13 Appendix (Page No. - 204)
     13.1 Insights From Industry Experts
     13.2 Discussion Guide
     13.3 Knowledge Store: Marketsandmarkets’ Subscription Portal
     13.4 Introducing RT: Real-Time Market Intelligence
     13.5 Available Customizations
     13.6 Related Reports
     13.7 Author Details


List of Tables (110 Tables)

Table 1 Next-Generation Memory Market, By Technology Type, 2015–2023 (USD Million)
Table 2 Market for Nonvolatile Technology, By Memory Type, 2015–2023 (USD Million)
Table 3 Market for Nonvolatile Technology, By Application, 2015–2023 (USD Million)
Table 4 Market for Nonvolatile Technology, By Region, 2015–2023 (USD Million)
Table 5 Market for MRAM, By Application, 2015–2023 (USD Million)
Table 6 Market for MRAM, By Region, 2015–2023 (USD Million)
Table 7 Market for FRAM, By Application, 2015–2023 (USD Million)
Table 8 Market for FRAM, By Region, 2015–2023 (USD Million)
Table 9 NGM Market for RERAM/CBRAM, By Application, 2015–2023 (USD Million)
Table 10 Market for RERAM/CBRAM, By Region, 2015–2023 (USD Million)
Table 11 Market for 3D XPoint, By Application, 2015–2023 (USD Million)
Table 12 Market for 3D XPoint, By Region, 2015–2023 (USD Million)
Table 13 Next-Generation Market for Nano RAM, By Application, 2015–2023 (USD Million)
Table 14 Next-Generation Market for Nano RAM, By Region, 2015–2023 (USD Million)
Table 15 Market for Others, By Application, 2015–2023 (USD Million)
Table 16 Market for Others, By Region, 2015–2023 (USD Million)
Table 17 Market for Volatile Memory Technology, By Memory Type, 2015–2023 (USD Million)
Table 18 Market for Volatile Memory Technology, By Application, 2015–2023 (USD Million)
Table 19 Market for Volatile Memory Technology, By Region, 2015–2023 (USD Million)
Table 20 NGM Market for HMC, By Application, 2015–2023 (USD Thousand)
Table 21 Market for HMC, By Region, 2015–2023 (USD Thousand)
Table 22 Market for HBM, By Application, 2015–2023 (USD Thousand)
Table 23 Market for HBM, By Region, 2015–2023 (USD Thousand)
Table 24 Market, By Storage Type, 2015–2023 (USD Million)
Table 25 Market for Mass Storage, By Application, 2015–2023 (USD Million)
Table 26 Market for Mass Storage, By Region, 2015–2023 (USD Million)
Table 27 Market for Embedded Storage, By Application, 2015–2023 (USD Million)
Table 28 Market for Embedded Storage, By Region, 2015–2023 (USD Million)
Table 29 Market for Other Storage, By Application, 2015–2023 (USD Million)
Table 30 Market for Other Storage, By Region, 2015–2023 (USD Million)
Table 31 NGM Market, By Application, 2015–2023 (USD Million)
Table 32 Next-Generation Volatile Memory Market, By Application, 2015–2023 (USD Thousand)
Table 33 Next-Generation Nonvolatile Memory Market, By Application, 2015–2023 (USD Million)
Table 34 Market for Consumer Electronics, By Technology, 2015–2023 (USD Million)
Table 35 Market for Consumer Electronics, By Nonvolatile Memory Technology, 2015–2023 (USD Million)
Table 36 Market for Consumer Electronics, By Volatile Memory Technology, 2015–2023 (USD Million)
Table 37 Market for Consumer Electronics, By Region, 2015–2023 (USD Million)
Table 38 Market for Enterprise Storage, By Technology, 2015–2023 (USD Million)
Table 39 Market for Enterprise Storage, By Nonvolatile Memory Technology, 2015–2023 (USD Million)
Table 40 Market for Enterprise Storage, By Volatile Memory Technology, 2015–2023 (USD Million)
Table 41 Market for Enterprise Storage, By Region, 2015–2023 (USD Million)
Table 42 Market for Automotive and Transportation, By Technology, 2015–2023 (USD Million)
Table 43 Market for Automotive and Transportation, By Nonvolatile Memory Technology, 2015–2023 (USD Million)
Table 44 Market for Automotive and Transportation, By Volatile Memory Technology, 2015–2023 (USD Million)
Table 45 Market for Automotive and Transportation, By Region, 2015–2023 (USD Million)
Table 46 Market for Military and Aerospace, By Technology, 2015–2023 (USD Million)
Table 47 Market for Military and Aerospace, By Nonvolatile Memory Technology, 2015–2023 (USD Million)
Table 48 Market for Military and Aerospace, By Volatile Memory Technology, 2015–2023 (USD Thousand)
Table 49 Market for Military and Aerospace, By Region, 2015–2023 (USD Million)
Table 50 NGM Market for Industrial, By Technology, 2015–2023 (USD Million)
Table 51 Market for Industrial, By Nonvolatile Memory Technology, 2015–2023 (USD Million)
Table 52 Market for Industrial, By Volatile Memory Technology, 2015–2023 (USD Million)
Table 53 Market for Industrial, By Region, 2015–2023 (USD Million)
Table 54 Market for Telecommunications, By Technology, 2015–2023 (USD Million)
Table 55 Market for Telecommunications, By Nonvolatile Memory Technology, 2015–2023 (USD Million)
Table 56 Market for Telecommunications, By Volatile Memory Technology, 2015–2023 (USD Million)
Table 57 Market for Telecommunications, By Region, 2015–2023 (USD Million)
Table 58 Market for Energy and Power, By Technology, 2015–2023 (USD Thousand)
Table 59 Market for Energy and Power, By Nonvolatile Memory Technology, 2015–2023 (USD Million)
Table 60 NGM Market for Energy and Power, By Volatile Memory Technology, 2015–2023 (USD Thousand)
Table 61 Market for Energy and Power, By Region, 2015–2023 (USD Thousand)
Table 62 Market for Healthcare, By Technology, 2015–2023 (USD Thousand)
Table 63 Market for Healthcare, By Nonvolatile Memory Technology, 2015–2023 (USD Thousand)
Table 64 Market for Healthcare, By Volatile Memory Technology, 2015–2023 (USD Thousand)
Table 65 Market for Healthcare, By Region, 2015–2023 (USD Thousand)
Table 66 Market for Agriculture, By Technology, 2015–2023 (USD Thousand)
Table 67 Market for Agriculture, By Nonvolatile Memory Technology, 2015–2023 (USD Million)
Table 68 Market for Agriculture, By Volatile Memory Technology, 2015–2023 (USD Thousand)
Table 69 Market for Agriculture, By Region, 2015–2023 (USD Thousand)
Table 70 Market for Retail, By Technology, 2015–2023 (USD Thousand)
Table 71 Market for Retail, By Nonvolatile Memory Technology, 2015–2023 (USD Thousand)
Table 72 Market for Retail, By Volatile Memory Technology, 2015–2023 (USD Thousand)
Table 73 Market for Retail, By Region, 2015–2023 (USD Thousand)
Table 74 Next-Generation Memory Market, By Wafer Size, 2015–2023 (USD Million)
Table 75 Market for MRAM, By Wafer Size, 2015–2023 (USD Million)
Table 76 Market for FRAM, By Wafer Size, 2015–2023 (USD Million)
Table 77 Market for RERAM, By Wafer Size, 2015–2023 (USD Thousand)
Table 78 Market for 3D XPoint, By Wafer Size, 2015–2023 (USD Million)
Table 79 Market for Nano RAM, By Wafer Size, 2015–2023 (USD Thousand)
Table 80 Market for Other Nonvolatile Memory Types, By Wafer Size, 2015–2023 (USD Thousand)
Table 81 Market for Hybrid Memory Cube, By Wafer Size, 2015–2023 (USD Million)
Table 82 Market for High-Bandwidth Memory, By Wafer Size, 2015–2023 (USD Million)
Table 83 NGM Market, By Region, 2015–2023 (USD Million)
Table 84 Market for Nonvolatile Memory Technology, By Region, 2015–2023 (USD Million)
Table 85 Next-Generation Market for Volatile Memory, By Region, 2015–2023 (USD Million)
Table 86 Market for Nonvolatile Memory Technology in APAC, By Country, 2015–2023 (USD Million)
Table 87 Market for Volatile Memory in APAC, By Country, 2015–2023 (USD Million)
Table 88 Market for in APAC, By Memory Technology, 2015–2023 (USD Million)
Table 89 Market for in APAC for Non-Volatile Memory, By Memory Type, 2015–2023 (USD Million)
Table 90 Market for in APAC for Volatile Memory, By Memory Type, 2015–2023 (USD Million)
Table 91 Market for Nonvolatile Memory Technology in North America, By Country, 2015–2023 (USD Million)
Table 92 Market for Volatile Memory in North America, By Country, 2015–2023 (USD Million)
Table 93 Market for in North America, By Memory Technology, 2015–2023 (USD Million)
Table 94 Market for in North America for Non-Volatile Memory, By Memory Type, 2015–2023 (USD Million)
Table 95 Market for in North America for Volatile Memory, By Memory Type, 2015–2023 (USD Million)
Table 96 Market for Nonvolatile Memory Technology in Europe, By Country, 2015–2023 (USD Million)
Table 97 Market for Volatile Memory in Europe, By Country, 2015–2023 (USD Million)
Table 98 Market for in Europe, By Memory Technology, 2015–2023 (USD Million)
Table 99 Market for in Europe, for Non-Volatile Memory, By Memory Type, 2015–2023 (USD Million)
Table 100 Market for in Europe, for Volatile Memory, By Memory Type, 2015–2023 (USD Million)
Table 101 Market for Nonvolatile Memory in RoW, By Region, 2015–2023 (USD Million)
Table 102 Market for Volatile Memory in RoW, By Region, 2015–2023 (USD Million)
Table 103 Market for in RoW, By Memory Technology, 2015–2023 (USD Million)
Table 104 Market for in RoW, for Non-Volatile Memory, By Memory Type, 2015–2023 (USD Million)
Table 105 Next-Generation Memory Market for in RoW, for Volatile Memory, By Memory Type, 2015–2023 (USD Million)
Table 106 Ranking of Top 5 Players in NGM Market
Table 107 Product Launches and New Product Developments (2015–2017)
Table 108 Partnerships, Agreements, and Collaborations (2015–2017)
Table 109 Investments and Expansions (2015–2017)
Table 110 Acquisitions (2015–2017)
 
 
List of Figures (51 Figures)
 
Figure 1 Next-Generation Memory Market: Research Design
Figure 2 Market Size Estimation Methodology: Bottom-Up Approach
Figure 3 Market Size Estimation Methodology: Top-Down Approach
Figure 4 Data Triangulation
Figure 5 Market for Volatile Memory to Grow at Higher CAGR Between 2017 and 2023
Figure 6 Enterprise Storage Application to Hold Largest Size of Market By 2023
Figure 7 NGM Market for 450 mm Wafer Size to Grow at Highest CAGR Between 2017 and 2023
Figure 8 APAC Held Largest Share of Market in 2016
Figure 9 Demand for NGM Technologies in Consumer Electronics, Enterprise Storage, Industrial, and Automotive and Transportation Driving NGM Market
Figure 10 Nonvolatile Memory to Hold Larger Size of Market for Consumer Electronics By 2023
Figure 11 APAC to Hold Largest Share of Market for Nonvolatile Memory Between 2017 and 2023
Figure 12 Most Countries in APAC Expected to Witness High Growth in Market During Forecast Period
Figure 13 MRAM Market for 450 mm Wafer Size to Grow at Highest CAGR Between 2017 and 2023
Figure 14 Growing Demand for Universal Memory Devices and Increasing Demand for Enterprise Application Drive the Market
Figure 15 Number of Connected Devices Globally, 2012–2020 (Billions)
Figure 16 Percentage Share of Various Memory Types in Professional Video Cameras
Figure 17 Value Chain: Nonvolatile Memory Market, 2017
Figure 18 Market for Volatile Memory to Grow at Higher CAGR Between 2017 and 2023
Figure 19 Market for 3D XPoint to Grow at Highest CAGR Between 2017 and 2023
Figure 20 Toggle MRAM Cell Structure
Figure 21 Basic Ferroelectric Memory Cell
Figure 22 Basic Structure of RERAM
Figure 23 3D XPoint NGM Market for Enterprise Storage to Grow at Higher CAGR Between 2017 and 2023
Figure 24 HBM NGM Market for Enterprise Storage to Hold A Higher Market Share By 2023
Figure 25 Enterprise Application to Hold Largest Share of Market By 2023
Figure 26 Market for Volatile Memory to Grow at Higher CAGR Between 2017 and 2023
Figure 27 Market for Volatile Memory to Grow at Higher CAGR Between 2017 and 2023
Figure 28 Market for Hybrid Memory Cube to Grow at Higher CAGR Between 2017 and 2023
Figure 29 Nonvolatile Memory to Hold Larger Share of Market for Energy and Power Between 2017 and 2023
Figure 30 Market for Nonvolatile Memory to Grow at Higher CAGR Between 2017 and 2023
Figure 31 Making of Silicon Wafer
Figure 32 300 mm Wafer to Hold Largest Share of Market for Hybrid Memory Cube Between 2017 and 2023
Figure 33 Geographic Snapshot of Market (2017–2023)
Figure 34 APAC to Hold Largest Size of Market for Nonvolatile Memory Technology Between 2017 and 2023
Figure 35 Snapshot: NGM Market in APAC
Figure 36 Snapshot: Next Generation Memory Market in North America
Figure 37 Europe: NGM Market Snapshot
Figure 38 Market for Nonvolatile Memory in Africa to Grow at Highest CAGR Between 2017 and 2023
Figure 39 Key Developments in Market (2014–2017)
Figure 40 Battle for Market Share: New Product Developments and Launches Were Major Strategies Adopted By Key Players in NGM Market
Figure 41 Next Generation Market (Global) Competitive Leadership Mapping, 2017
Figure 42 Samsung Electronics: Company Snapshot
Figure 43 Toshiba: Company Snapshot
Figure 44 Micron Technology: Business Overview
Figure 45 SK Hynix : Business Overview
Figure 46 Western Digital: Business Overview
Figure 47 Adesto Technologies: Business Overview
Figure 48 Intel: Business Overview
Figure 49 Microchip Technology: Business Overview
Figure 50 Fujitsu: Business Overview
Figure 51 Everspin Technologies: Business Overview

The study involved 4 major activities to estimate the current size of the next-generation memory market. Exhaustive secondary research was done to collect information on the market, including the peer market and parent market. The next step was to validate these findings, assumptions, and sizing with industry experts across the value chain through primary research. Both top-down and bottom-up approaches were employed to estimate the complete market size. After that, market breakdown and data triangulation procedures were used to estimate the market size of segments and subsegments.

Secondary Research

In the secondary research process, various secondary sources were referred to for the identification and collection of relevant information for next-generation memory study. Secondary sources included annual reports, press releases, and investor presentations of companies; white papers; journals and certified publications; and articles from recognized authors, websites, directories, and databases. Secondary research was conducted to obtain key information regarding the industry’s supply chain, market’s value chain, the total pool of key players, market segmentation according to industry trends (to the bottom-most level), geographic markets, and key developments from both, market- and technology-oriented perspectives. Secondary data was collected and analyzed to arrive at the overall market size, which was further validated by primary research.

Primary Research

In the primary research process, various primary sources from both supply and demand sides were interviewed to obtain qualitative and quantitative information relevant to this report. Several primary interviews were conducted with market experts from both the demand (product and component manufacturer across industries) and supply sides. This primary data was collected through questionnaires, emails, and telephonic interviews. Primary sources include industry experts such as CEOs, vice presidents, marketing directors, technology and innovation directors, and related executives from various key companies and organizations operating in the market. Approximately 30% and 70% of the primary interviews were conducted from the demand and supply sides, respectively.

Next Generation Memory Market

To know about the assumptions considered for the study, download the pdf brochure

Market Size Estimation

Top-down and bottom-up approaches were implemented to estimate and validate the total size of the next-generation memory (NGM) market. These methods were also used extensively to estimate the size of the markets based on various subsegments. The research methodology used to estimate the market size includes the following steps:

  • Key players in the industry were identified through extensive secondary research.
  • The industry’s supply chain and market size, in terms of value, were determined through primary and secondary research processes.
  • All percentage shares, splits, and breakdowns were determined using secondary sources and verified through primary sources.

Data Triangulation

After arriving at the overall market size—using the market size estimation processes as explained above—the market was split into several segments and subsegments. To complete the overall market engineering process and arrive at the exact statistics of each market segment and subsegment, the data triangulation and market breakdown procedures were employed, wherever applicable. The data was triangulated by studying various factors and trends from the demand and supply sides across different end-use applications.

Study Objectives

  • To define, describe, and forecast the overall next-generation memory (NGM) market, in terms of value, segmented on the basis of technology, wafer size, and end-use application
  • To forecast the market size for various segments with regard to 4 main regions: North America, Europe, Asia Pacific (APAC), and Rest of the World (RoW)
  • To provide detailed information regarding the major factors (drivers, restraints, opportunities, and challenges) influencing the growth of the NGM market
  • To provide the value chain analysis pertaining to the Next-Generation Memory Industry 
  • To strategically analyze the micromarkets with respect to individual growth trends, prospects, and contributions to the total market
  • To analyze opportunities in the overall NGM market for stakeholders by identifying the high-growth segments
  • To profile key players and comprehensively analyze their market position in terms of ranking and core competencies and provide details of the competitive landscape for the market leaders
  • To analyze competitive developments such as contracts, mergers and acquisitions, product developments, and research and development (R&D) in the overall Market

Available Customizations

With the given market data, MarketsandMarkets offers customizations according to the company's specific needs. The following customization options are available for this report:

  • Product Matrix that gives a detailed comparison of the product portfolio of each company
  • Further breakdown of the market in Rest of APAC into South Korea and Malaysia
  • Further breakdown of the market in RoW into Brazil and Argentina  
  • Detailed analysis and profiling of additional market players (up to 5)
Report Code
SE 3111
Published ON
Nov, 2017
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