Thermal Management Market Size, Share, Industry Growth, Trends & Analysis by Material, Device (Conduction Cooling Devices, Convection Cooling Devices), Service (Installation & Calibration, Optimization & Post-sales Support), End-user Industry and Region – Global Forecast to 2028
Updated on : March 03, 2023
The global thermal management market Size, Share, Industry Growth, Trends & Analysis was valued at USD 10.7 billion in 2022 and is projected to reach USD 19.3 billion by 2028, registering a CAGR of 9.7% during the forecast period. The increasing need for advanced heat dissipation solutions and thermal management components in the consumer electronics industry and the rising focus on developing miniature electronic devices are the key factors driving the demand for thermal management industry solutions.
Thermal Management Market Forecast to 2027
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Market Dynamics:
Driver: Increasing need for advanced heat dissipation solutions
Thermal interface materials are specifically designed to transfer heat while exhibiting a compression force characteristic that accommodates the component creating the heat and the chassis or heat sink used to dissipate the heat. Electronic components produce heat when they operate. How these products manage their heat-generating and -cooling systems determine their functionality and reliability. When temperatures get too high, there needs to be a way to wick the heat away from the components to a heat-dissipating mechanism, such as a liquid cooling plate, chassis, or traditional heat sink. For instance, if a printed circuit board (PCB) does not have a way to transfer heat, the reliability and longevity of its components will be adversely affected. In extreme cases, they can even melt or get damaged. Owing to these factors, heat dissipation solutions are used as thermal management components.
Restraint: Design complexities related to components of cooling systems
Complexes such as strong property variations, complicated domains, conjugate mechanisms, chemical reactions, and intricate boundary conditions are often encountered in practical thermal processes and systems. Issues associated with the manufacturing of cooling systems are optimization of their designs to reduce their power consumption, weight, and cost and verification of designs of components used in them. Developing optimal airflow channels, selecting coolants, etc., are other problems faced while manufacturing cooling system components. Lowering the power requirements of cooling systems without compromising on their performance and reliability is another major problem faced while designing thermal components.
A sudden increase in temperature due to high power may be hazardous to devices as it often leads to internal short circuits, physical damage, and fire or explosions. Cells in battery packs are placed close to each other; hence, overheating of one cell impacts surrounding cells as well. This phenomenon is referred to as thermal runaway propagation, which, in worst cases, causes fire or explosions. Power dissipation is a critical factor in designing different electronic systems. Increasing clock rate and microprocessor transistor count lead to design complexities in components used in cooling systems, thereby acting as a restraint for the growth of the thermal management market.
Opportunity: Stringent emission regulations and standards
Increased focus on vehicular emission reduction can be viewed as one of the major factors driving the need for thermal management solutions. With the growing environmental concerns, the demand for thermal management systems is increasing as they help reduce vehicle emissions. The fuel consumption and emission levels can go drastically up due to inefficient cabin climate control, which may also cause safety hazards due to fogging and damage to the windshield. Additionally, by 2024, the California Air Resources Board (CARB) is scheduled to tighten the regulations to improve NOx emission technologies that quickly get heat into an after-treatment system and keep the system hot without hurting fuel consumption.
This system helps maintain the temperature in the internal combustion engine, which, in turn, facilitates fuel efficiency in vehicles.Thus, increasing focus on thermal management for curbing vehicular emissions is expected to propel market growth.
Challenge: High development costs of customized thermal management solutions and systems
Energy is typically a significant expense across all industries as most processes are technology powered. The more power these processes require, the greater the company’s overall investment and costs spent on energy consumption. Management of the heat generated by electronic devices such as computers, laptops, servers, switches, and other networking devices is a major challenge for thermal management solutions and systems providers. Components such as microprocessors and microcontrollers require increased power to meet high-power applications' functional and computational requirements. Operations at elevated temperatures (above 125°C) or exposure to highly localized temperatures may lead to the degradation or failure of these components. Thus, three fundamental methods of heat transfer—conduction, convection, and radiation—are deployed to ensure the effective performance and reliability of these electronic components. Heat sinks, heat spreaders, heat pipes, and thermal interface materials are the most commonly used solutions for passive thermal management, while forced air, forced liquids, and solid-state heat pumps are commonly used active thermal management technologies.
By material type, the adhesive materials segment is expected to witness the second-highest CAGR during the forecast period.
The adhesive materials segment is expected to record the second-highest CAGR of 6.0% during the forecast period. Adhesive materials are formulated to withstand severe impact and peel forces, provide high sheer strength, and offer excellent chemical and temperature resistance. The demand for adhesive materials is driven by the unwanted and potentially harmful heat generated by ever-shrinking electronic components and systems used in consumer electronics and healthcare applications.
By device, the conduction cooling devices segment is expected to register the second-highest CAGR during the forecast period.
The conduction cooling devices are expected to exhibit the second-highest CAGR of 11 .1% during the forecast period. Conduction is a way of transferring thermal/heat energy through physical contact. The two objects are connected so that the object with a lower temperature can absorb thermal energy from another hooter object. Conduction is known as one of the most effective approaches to thermal management because it requires a minimal surface area to do the energy transfer operation. Typical examples of conduction-based thermal management products include heat sinks, heat spreaders, etc.
Furthermore, conduction cooling removes heat from devices by transferring them from thermally conducting materials to other devices with low temperatures. Conduction cooling reduces thermal dissipation and lowers the thermal density of devices. The devices based on conduction cooling technology are generally called conduction cooling devices. One of the key benefits of conduction cooling solutions is that they are passive solutions that do not require moving components, providing features such as high reliability, less wear and tear, and low maintenance.
By service type, the market for installation & calibration services is expected to grow at the second-highest CAGR during the forecast period.
The market for installation & calibration services is expected to grow at the second-highest CAGR of 8.5% during the forecast period. These services are adopted for thermal material selection, equipment movement and placement, and piping installation for coolants or refrigerants. This helps understand the critical temperature and humidity level for each device. Hence, pre-installation checks are run to identify and select the appropriate solutions and systems for the thermal management of devices. Thereafter, the installation & calibration services are carried out to ensure increased efficiency and enhanced operational effectiveness of devices.
By end-user industry, the servers and data centers segment is expected to witness the second-highest CAGR during the forecast period.
The market for servers and data centers is expected to grow at the second-highest CAGR of 10.4% during the forecast period. Thermal management is crucial to ensure the optimum operation and performance of all electronic applications, regardless of complexity or scope. Data centers consist of thousands of data processing equipment, such as servers, switches, and routers, which radiate large quantities of energy and heat. The heat generated in these data centers must be properly dissipated to prevent a rise in their temperature and consequent degradation of their reliability and performance, which incurs additional maintenance costs. In data centers, thermal management is necessary to carry out smooth operations such as data placement, data migration, data replication, data access task distribution, and scheduling and controlling disk speeds. Moreover, efficient thermal management is necessary for the smooth conduct of different functions of data centers that include streaming videos, carrying out large-scale data analysis, and ensuring transaction processing to achieve the desired performance.
In 2028, Asia Pacific is projected to hold the largest share of the overall thermal management market.
Thermal Management Market by Region
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Asia Pacific is expected to exhibit the highest CAGR of 10.9% in the thermal management market during the forecast period. Flourishing chip manufacturing companies in countries such as China and South Korea contribute to the growth of the thermal management market in Asia Pacific. Additionally, the demand for consumer electronics and automobiles is increasing in this region. Also, technological and economic advancements in Asia Pacific are expected to drive the overall demand for thermal management systems.
Key Market Players
The thermal management companies such as Henkel (Germany), Honeywell International Inc. (US), Vertiv Co (US), Delta Electronics, Inc. (Taiwan), Parker Chomerics (US), TAT Technologies Ltd. (Israel), Autoneum Holding AG (Switzerland), Boyd (US), European Thermodynamics Ltd. (UK), and Laird Thermal Systems (US) are among a few key players in the thermal management market.
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Report Metric |
Details |
Market Size Availability for Years |
2019–2028 |
Base Year |
2022 |
Forecast Period |
2023–2028 |
Forecast Units |
Value (USD) |
Segments Covered |
By material, device, service type, end-user industry, and region |
Geographies Covered |
North America, Europe, Asia Pacific, and RoW |
Companies Covered |
Henkel (Germany), Honeywell International Inc. (US), Vertiv Co (US), Delta Electronics, Inc. (Taiwan), Parker Chomerics (US), TAT Technologies Ltd. (Israel), Autoneum Holding AG (Switzerland), Boyd (US), European Thermodynamics Ltd. (UK), and Laird Thermal Systems (US) are among the top thermal management solution providers in the studied market. |
Thermal Management Market Highlights
This research report categorizes the thermal management market based on material, device, service type, end-user industry, and region.
Aspect |
Details |
Thermal Management Market, by Material Type |
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Thermal Management Market, by Device |
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Thermal Management Market, by Service |
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Thermal Management Market, by End-User Industry |
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Thermal Management Market, by Region |
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Recent Developments
- In September 2022, Henkel acquired Thermexit, a thermal management materials business segment of Nanoramic Laboratories. With this acquisition, Henkel strengthened its position in the growing thermal interface material (TIM) market.
- In May 2022, the Nextreme Recirculating Chiller launched the platform featuring high-quality components, environmentally friendly refrigerants, low-noise components, and a user-friendly operator interface at a standard price. The new chiller utilizes high-performance variable speed motors for noise reduction, lower room heat input, and reduced energy consumption by up to 50% compared to conventional compressor-based systems.
- In October 2022, Limco Airepair, a wholly owned subsidiary of TAT, signed a contract expansion with Collins Aerospace, an aerospace and defense product supplier, to provide maintenance, repair, and overhaul (MRO) services for Boeing 777 thermal components. With this contract, Collins customers will benefit from TAT’s services.
- In August 2022, Honeywell International Inc. collaborated with Reaction Engines Limited, a British aerospace company, on developing thermal management technologies as a critical enabler to reduce aircraft emissions, regardless of the fuel type used in the aircraft. Honeywell and Reaction Engines will adapt the unique microtube heat exchanger technology from Reaction Engines and apply it across a broad range of Honeywell systems for sustainable aviation thermal management solutions. With this collaboration, Reaction Engines is expected to develop unique heat exchange technology that can reduce weight by more than 30%, which translates to less fuel consumption and longer range or higher aircraft capacity.
Frequently Asked Questions (FAQs):
Which are the major companies in the thermal management market? What strategies do they adopt to strengthen their market presence?
The major companies in the thermal management market are Henkel (Germany), Honeywell International Inc. (US), Vertiv Co (US), Delta Electronics, Inc. (Taiwan), Parker Chomerics (US), TAT Technologies Ltd. (Israel), Autoneum Holding AG (Switzerland), Boyd (US), European Thermodynamics Ltd. (UK), and Laird Thermal Systems (US) are some key players in the thermal management market. The major strategies adopted by these players are product launches.
Which region will provide lucrative opportunities for players in the thermal management market?
Asia Pacific is expected to dominate the thermal management market owing to the high demand for thermal management solutions by manufacturing companies in China and India.
Who are the winners in the global thermal management market?
Companies such as Henkel (Germany), Honeywell International Inc. (US), and Vertiv Co (US) have the right to win in this market. These companies meet the requirements of their customers by providing thermal management solutions. Moreover, these companies are adopting organic growth strategies to strengthen their market position and expand their customer base worldwide.
What are the drivers and opportunities pertaining to the thermal management market?
Factors such as the growing focus on the development of miniature electronic devices and the rising demand for thermal management solutions in EVs boost the growth of the thermal management market.
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The study involved four major activities in estimating the size of the thermal management market. Exhaustive secondary research has been conducted to collect information on the market, the peer markets, and the parent market. Both top-down and bottom-up approaches have been employed to estimate the total market size. Market breakdown and data triangulation methods have also been used to estimate the market for segments and subsegments.
Secondary Research
Revenues of companies offering thermal management solutions and services have been obtained from the secondary data available through paid and unpaid sources. The revenues have also been derived by analyzing the product portfolio of key companies, and these companies have been rated according to the performance and quality of their products.
In the secondary research process, various sources have been referred to for identifying and collecting information for this study on the thermal management market. Secondary sources considered for this research study include government sources; corporate filings; and trade, business, and professional associations. Secondary data has been collected and analyzed to determine the overall market size, which has been further validated through primary research.
Secondary research has been mainly used to obtain key information about the supply chain of thermal management to identify key players based on their products and prevailing industry trends in the thermal management market by material, device, service type, end-user industry, and region. Secondary research also helped obtain market information- and technology-oriented key developments undertaken by market players to expand their presence and increase their market share.
Primary Research
Extensive primary research has been conducted after understanding and analyzing the current scenario of the thermal management market through secondary research. Several primary interviews have been conducted with the key opinion leaders from the demand and supply sides across four main regions—North America, Europe, Asia Pacific, and Rest of the World. Approximately 25% of the primary interviews have been conducted with the demand-side respondents, while approximately 75% have been conducted with the supply-side respondents. The primary data has been collected through questionnaires, emails, and telephonic interviews.
After interacting with industry experts, brief sessions have been conducted with highly experienced independent consultants to reinforce the findings from our primaries. This, along with the in-house subject-matter experts’ opinions, has led us to the findings as described in the remainder of this report. The breakdown of primary respondents is as follows:
To know about the assumptions considered for the study, download the pdf brochure
Market Size Estimation
The bottom-up procedure has been employed to arrive at the overall size of the thermal management market.
- Identifying approximate revenues of companies involved in the thermal management ecosystem
- Identifying different thermal management solutions offered by key market players
- Analyzing the global penetration of each thermal management solution through secondary and primary research
- Conducting multiple discussion sessions with key opinion leaders to understand different thermal management solutions available in the market and their applications; analyzing the breakup of the work carried out by each key company
- Verifying and crosschecking estimates at every level with key opinion leaders, including chief executive officers (CEO), directors, and operation managers, and then finally, with the domain experts at MarketsandMarkets
- Studying various paid and unpaid sources of information such as press releases, white papers, and databases of the company- and region-specific developments undertaken in the thermal management solutions market
The Top-Down Approach has been used to Estimate and Validate the Total size of the Thermal Management Market.
- Focusing initially on the top-line investments and expenditures made in the thermal management ecosystem; further splitting into offering and listing key developments in key market areas
- Identifying a variety of thermal management solutions offered by all major players and verifying this data through secondary research and a brief discussion with industry experts
- Analyzing revenues, product mix, geographic presence, and thermal management solutions offered by all identified players to estimate and arrive at the percentage splits for all key segments
- Discussing these splits with industry experts to validate the information and identify key potential domains across all major segments
- Breaking down the total market based on verified splits and key growth domains across all segments
Data Triangulation
After arriving at the overall market size-using the market size estimation processes as explained above-the market has been split into several segments and subsegments. Data triangulation and market breakdown procedures have been employed, wherever applicable, to complete the entire market engineering process and arrive at the exact statistics of each market segment and subsegment. The data has been triangulated by studying various factors and trends from both the demand and supply sides in the thermal management market.
Report Objectives
- To describe and forecast the size of the thermal management market, by material type, device, service, and end-user industry, in terms of value
- To describe and forecast the market size of various segments across four key regions—North America, Europe, Asia Pacific, and Rest of the World (RoW), in terms of value
- To provide the overall thermal management market size, in terms of volume
- To provide detailed information regarding the drivers, restraints, opportunities, and challenges influencing the growth of the thermal management market
- To provide an overview of the value chain pertaining to the thermal management ecosystem, along with the average selling prices of thermal management solutions
- To strategically analyze the ecosystem, tariff and regulatory landscape, patent landscape, Porter’s five forces, regulations, import and export scenarios, trade landscape, and case studies pertaining to the market under study
- To strategically analyze micromarkets1 with regard to individual growth trends, prospects, and contributions to the overall market
- To analyze opportunities in the market for stakeholders by identifying high-growth segments
- To provide details of the competitive landscape for market leaders
- To analyze competitive developments such as product launches, expansions, partnerships, collaborations, agreements, contracts, and acquisitions in the thermal management market
- To profile key players in the thermal management market and comprehensively analyze their market ranking based on their revenue, market share, and core competencies2
- Updated market developments of profiled players: The current report includes the market developments from April 2019 to October 2022.
Customization Options:
With the given market data, MarketsandMarkets offers customizations according to the specific requirements of companies. The following customization options are available for the report:
- Detailed analysis and profiling of additional market players based on various blocks of the supply chain
How is Convection Devices or Conduction Devices going to impact the Thermal Management Market?
Both convection and conduction devices play an important role in thermal management, which involves managing the heat generated by electronic devices and preventing overheating. Here are some ways that convection and conduction devices are likely to impact the thermal management market:
Increased efficiency: Convection and conduction devices can both help to improve the efficiency of thermal management systems by providing effective ways to transfer heat away from electronic components. Convection devices, such as fans and heat sinks, use air flow to dissipate heat, while conduction devices, such as thermal interface materials and heat pipes, use materials with high thermal conductivity to transfer heat.
Growing demand for compact and portable devices: With the increasing trend towards smaller and more portable electronic devices, there is a growing need for thermal management solutions that are compact and lightweight. Both convection and conduction devices are important for achieving this, as they can be designed to be small and efficient.
Expansion of applications: Convection and conduction devices are used in a wide range of industries, from automotive to aerospace to medical devices. As new applications emerge, there is likely to be growing demand for thermal management solutions that can meet the unique requirements of each industry.
Integration with other technologies: As the Internet of Things (IoT) and other connected technologies continue to evolve, there is likely to be growing demand for thermal management solutions that can be integrated with these systems. For example, smart thermostats and other IoT devices could be used to monitor and control the temperature of electronic components, helping to optimize performance and reduce energy consumption.
Outlook and Growth of Thermal Management and Conduction Devices Market
The thermal management and conduction devices market is expected to experience strong growth in the coming years, driven by a range of factors, including the increasing use of electronic devices in a wide range of industries, growing demand for compact and portable solutions, and ongoing technological advancements. Here are some key trends that are likely to shape the outlook for this market:
Increasing demand for thermal management solutions: With the rapid growth of industries such as automotive, aerospace, and consumer electronics, there is a growing need for thermal management solutions that can help to prevent overheating and ensure reliable performance. This is driving demand for a range of conduction and convection devices, such as heat sinks, fans, and thermal interface materials.
Growing trend towards miniaturization: As electronic devices become smaller and more complex, there is a growing need for thermal management solutions that are compact and lightweight. This is driving innovation in the development of new materials, designs, and manufacturing techniques for conduction devices, such as heat pipes and vapor chambers.
Advancements in technology: As technology continues to evolve, there are many new opportunities for growth and innovation in the thermal management and conduction devices market. For example, the use of advanced materials and manufacturing processes is enabling the development of more efficient and reliable thermal solutions, while the integration of IoT technologies is enabling real-time monitoring and control of temperature.
Increasing focus on energy efficiency: With growing concerns about climate change and energy consumption, there is an increasing focus on the development of energy-efficient thermal management solutions. This is driving the adoption of new technologies, such as phase change materials and advanced heat exchangers, which can help to reduce energy consumption and improve overall system efficiency.
Industries That Will Be Impacted in the Future by Convection Devices
Convection devices, such as fans and heat sinks, are important components of thermal management systems, which are used to manage the heat generated by electronic devices and prevent overheating. Here are some examples of the industries that are likely to be impacted by convection devices in the future:
Electronics: The electronics industry is one of the primary users of convection devices, as they are essential for managing the heat generated by components such as microprocessors and graphic cards. As the demand for high-performance computing and smaller, more compact devices continues to grow, there is likely to be increasing demand for more efficient and effective thermal management solutions.
Automotive: As the automotive industry continues to adopt more advanced electronics, there is a growing need for thermal management solutions that can ensure reliable performance and prevent overheating. Convection devices, such as fans and heat sinks, are essential for achieving this, and are used in a range of applications, from engine control units to infotainment systems.
Aerospace: The aerospace industry is another major user of convection devices, particularly for avionics and other electronic components used in aircraft. With the increasing focus on reducing weight and improving efficiency in aerospace design, there is likely to be growing demand for more compact and lightweight thermal management solutions.
Medical devices: Medical devices such as imaging equipment and diagnostic tools generate a significant amount of heat, which must be managed to ensure accurate and reliable performance. Convection devices, such as fans and heat sinks, are often used in these applications to ensure that the devices operate within their designed temperature range.
Data centers: With the growth of cloud computing and other data-intensive applications, there is a growing need for efficient and effective thermal management solutions in data centers. Convection devices, such as fans and heat sinks, are often used to manage the heat generated by servers and other electronic equipment, helping to ensure reliable performance and minimize downtime.
Top companies in conduction devices market
The conduction devices market is dominated by companies that produce heat sinks, heat pipes, thermal interface materials, and other thermal management solutions. Honeywell International, Laird Thermal Systems, Delta Electronics, Fujipoly America Corporation, and Wakefield-Vette are some of the top companies in the conduction devices market, serving a wide range of industries, including electronics, automotive, aerospace, medical, and telecommunications. The demand for conduction devices is likely to continue to grow as the demand for high-performance electronics and more efficient, reliable devices continues to increase.
Growth opportunities and latent adjacency in Thermal Management Market