Molded Interconnect Device (MID) Market by Process (LDS, 2-Shot Molding, Film Techniques), Product (Antennae & Connectivity Modules, Connectors & Switches, Sensors, Lighting), Industry, and Geography - Global Forecast to 2023
The global Molded Interconnect Device (MID) Market was valued at USD 684.2 million in 2017 and is estimated to reach USD 1,798.3 million by 2023, at a CAGR of 15.0% during the forecast period.
Rising demand for miniaturization in consumer electronics industry to fuel MID market growth
There is growing demand for today’s portable electronic devices featuring multiple functions in a small package. To meet the requirement of miniaturization, there is a need to bring mechanical and electrical systems together in a complete product. This can be easily achieved using MID; it helps in combining the circuitry, housing, connectors, and cables into one whole part. In consumer electronics, there is increasing demand for integrating more electronic circuits into smaller spaces. For instance, smartphone requires an antenna; instead of designing a stand-alone antenna,
Market Dynamics
The Objectives of the Study are as follows:
- To describe and forecast the molded interconnect device (MID) market, in terms of value, by process, product type, and industry
- To describe and forecast the market, in terms of value, for various segments, by region North America, Europe, Asia Pacific (APAC), and Rest of the World (RoW)
- To provide detailed information regarding the major factors (drivers, restraints, opportunities, and challenges) influencing the MID market growth
- To strategically analyze micromarkets with respect to individual growth trends, prospects, and contribution to the overall market
- To strategically profile key players and comprehensively analyze their market position in terms of ranking and core competencies, and detail the competitive landscape for market leaders
- To analyze strategies/developments such as collaborations, agreements, partnerships, mergers and acquisitions, and product launches and developments in the MID market
The base year used for this study is 2017, and the forecast period considered is 2018–2023.
Research Methodology
The research methodology used to estimate and forecast the MID market begins with obtaining data through secondary research from secondary sources such as Research Association 3-D MID e.V., Journal of Mechanical Science and Technology, and white papers of leading players in the market. The bottom-up procedure has been employed to arrive at the overall size of the MID market from the revenues of key players. After arriving at the overall market size, the total market has been split into several segments and subsegments, which have been verified through primary research by conducting extensive interviews with officials such as CEOs, VPs, directors, and executives. The market breakdown and data triangulation procedures have been employed to complete the overall market engineering process and arrive at the exact statistics for all segments and subsegments. The breakdown of the profiles of primaries has been depicted in the following figure.
To know about the assumptions considered for the study, download the pdf brochure
The key players operating in the MID market are Molex (US), LPKF (Germany), TE Connectivity (Switzerland), HARTING (Germany), APC (US), JOHNAN (Japan), MID Solutions (Germany), 2E mechatronic (Germany), and Multiple Dimensions (Switzerland).
Key Questions
- Most of the suppliers have adopted product launch & development and collaboration & agreement as key strategies, as could be seen from recent developments. Where will it take the industry in the mid to long term?
- Which are the key players in the market, and how intense is the competition?
Target Audience
- Raw material and manufacturing equipment suppliers
- System integrators
- Technology developers
- Integrated circuit designers
- MID original equipment manufacturers (OEMs)
- Integrated device manufacturers
- Research organizations
- Associations, organizations, and alliances related to MID
This study answers several questions for stakeholders, primarily regarding the market segments to focus on in the next 2–5 years for prioritizing efforts and investments.
Report Scope:
This research report categorizes the overall MID market based on process, product type, industry, and geography.
MID Market, by Process
- Laser Direct Structuring
- 2-Shot Molding
- Film Techniques
MID Market, by Product Type
- Antennae & Connectivity Modules
- Connectors & Switches
- Sensors
- Lighting
- Others
MID Market, by Industry
- Telecommunications
- Consumer Electronics
- Medical
- Automotive
- Industrial
MID Market, by Region
- North America
- Europe
- Asia Pacific (APAC)
- Rest of the World (RoW)
Available Customizations
With the given market data, MarketsandMarkets offers customizations according to the company’s specific needs. The following customization options are available for the report:
Company Information
- Detailed analysis and profiling of additional market players on the basis of various blocks of value chain
Process Analysis
- Further breakdown of process by geography
- Further breakdown of process by product type
The MID market is expected to reach USD 1,798.3 million by 2023 from USD 894.1 million in 2018, at a CAGR of 15.0% from 2018 to 2023. Major factors driving the growth of this market include the increasing use of MID in medical devices, rising demand for miniaturization in the consumer electronics industry, and growing need to reduce e-waste. For the past few years, the healthcare industry has been focusing on minimizing its spending on medical devices and equipment, as well as adopting the latest technologies (with fast operations and miniaturized components compared with the existing ones). Designing miniaturized and portable equipment requires miniaturized components. MID technology meets these requirements of medical device OEMs.
In this report, the Molded Interconnect Device market has been segmented based on process, product type, industry, and geography. The consumer electronics industry accounted for the largest share of the MID market in 2017. MIDs are used in consumer electronics for the internal antenna of cellular phones, which replaces the normal antenna stub. Furthermore, using antenna as part of the phone’s internal fixtures helps in reducing volume by achieving more efficient space utilization. Therefore, growth in smartphones, tablets, and laptops would increase the adoption of MIDs in this industry, which would further fuel the growth of the MID market in the coming years.
The market for laser direct structuring is expected to grow at the highest CAGR during the forecast period. LDS equipment is used to manufacture MIDs. LDS consists of various steps, such as injection molding, laser activation, metallization, and assembly. LPKF is the sole manufacturer of LDS equipment. It allows to eliminate components in electronic devices, such as antennae in smartphones, thus reducing assembly time and device production cost. Moreover, the introduction of 5G mobile communications technology will lead to the rise in demand for smartphone antennae, which in turn will increase demand for LDS equipment.
By region, the MID market has been segmented into North America, Europe, APAC, and RoW. APAC is expected to account for the largest size of the overall MID market during the forecast period. APAC is expected to offer lucrative opportunities for the MID market growth owing to the growing base for communication infrastructure, communication devices, and consumer electronics. APAC is one of the key regions for players dealing with smartphones and wearable devices. The trend of miniaturization of components in smartphones and wearables will drive the Molded Interconnect Device market in this region.
Automotive
MIDs have a thriving market in the automotive industry. This is largely due to the wide-scale adoption of MID in various automotive applications, such as steering wheel hubs, brake sensors, position sensors, and lighting. In automotive, MID reduces the wiring and combines the connector and housing in 1 piece, and through selective plating, it incorporates all the required circuitry. Such benefits of MIDs encourage this industry to adopt MID technology, thereby fueling the Molded Interconnect Device market
MIDs are used in consumer electronics for the internal antenna of cellular phones, which replaces the normal antenna stub. Furthermore, using antenna as part of the phone’s internal fixtures helps in reducing volume by achieving more efficient space utilization. Therefore, growth in smartphones, tablets, and laptops would increase the adoption of MIDs in this industry, which would further fuel the growth of the MID market in the coming years.
Telecommunications
To save production costs and reduce production time for devices, telecommunications equipment manufacturers are focusing on developing products where electrical and mechanical functions can be combined in a single product. In telecommunications, MID finds application in connectors, security shields, and telecommunications boxes, among others. Therefore, increase in the usage of MID in telecommunications applications would drive the MID market in the coming years.
Medical
The medical industry is implementing and adopting new technologies to provide better services to patients. MID technology has been used in medical devices to improve product quality. MID finds application in portable devices such as glucose meters and hearing aids. MID helps miniaturize monitoring devices for medication, which improves their diagnostic capabilities. Therefore, the increasing adoption of MID in medical devices is expected to boost the MID market growth in the coming years.
Critical questions that the report answers:
- Where will all these developments take the industry in the mid to long term?
- Will the suppliers continue to explore new avenues for MID?
- What are the upcoming industrial applications for Molded Interconnect Device?
MID technology is incompatible with modern area-array based electronic packages. Electronic packages need multilayer structure for the routing of high-count I/O devices, which is not possible using MID. MIDs have only one electrical layer. Hence, due to the lack of multilayer structure, Molded Interconnect Device is incompatible with electronic packages. To overcome this limitation, manufacturers are working on developing a compatible fine-pitch multilayer process.
The key players operating in the Molded Interconnect Device market are Molex (US), LPKF (Germany), TE Connectivity (Switzerland), HARTING (Germany), APC (US), JOHNAN (Japan), MID Solutions (Germany), 2E mechatronic (Germany), and Multiple Dimensions (Switzerland).
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Table of Contents
1 Introduction (Page No. - 12)
1.1 Study Objectives
1.2 Definition
1.3 Study Scope
1.3.1 Years Considered for Study
1.4 Currency
1.5 Stakeholders
2 Research Methodology (Page No. - 15)
2.1 Research Data
2.1.1 Secondary Data
2.1.1.1 Key Data From Secondary Sources
2.1.2 Primary Data
2.1.2.1 Key Data From Primary Sources
2.1.2.2 Breakdown of Primaries
2.2 Market Size Estimation
2.2.1 Bottom-Up Approach
2.2.2 Top-Down Approach
2.3 Market Breakdown and Data Triangulation
2.4 Research Assumptions
3 Executive Summary (Page No. - 23)
4 Premium Insight (Page No. - 27)
4.1 Attractive Opportunities for Molded Interconnect Device Market Growth
4.2 Market for Consumer Electronics Industry, By Product Type
4.3 Market for Antennae and Connectivity Modules, By Industry
4.4 Market in Europe, By Process
4.5 Molded Interconnect Device Market, By Region
5 Market Overview (Page No. - 31)
5.1 Introduction
5.2 Market Dynamics
5.2.1 Drivers
5.2.1.1 Increasing Use of MID in Medical Devices
5.2.1.2 Rising Demand for Miniaturization in Consumer Electronics Industry
5.2.1.3 Increasing Need to Reduce E-Waste
5.2.2 Restraints
5.2.2.1 Technological Monopoly of Lds Equipment Manufacturer
5.2.3 Opportunities
5.2.3.1 Rising Use of MID in Automotive Industry
5.2.3.2 Growth in IoT Devices
5.2.4 Challenges
5.2.4.1 Incompatibility With Electronic Packages
6 Industry Trends (Page No. - 34)
6.1 Introduction
6.2 In-Mold Electronics (IME)
6.2.1 Applications
6.2.2 Building Blocks
7 Molded Interconnect Device Market, By Process (Page No. - 35)
7.1 Introduction
7.2 Laser Direct Structuring
7.3 2-Shot Molding
7.4 Film Techniques
8 Molded Interconnect Device Market, By Product Type (Page No. - 37)
8.1 Introduction
8.2 Antennae and Connectivity Modules
8.3 Sensors
8.4 Connectors and Switches
8.5 Lighting
8.6 Others
9 Molded Interconnect Device Market, By Industry (Page No. - 42)
9.1 Introduction
9.2 Telecommunications
9.3 Consumer Electronics
9.4 Automotive
9.5 Medical
9.6 Industrial
10 Geographic Analysis (Page No. - 48)
10.1 Introduction
10.2 North America
10.2.1 US
10.2.2 Canada
10.3 Europe
10.3.1 Germany
10.3.2 Switzerland
10.3.3 France
10.3.4 Rest of Europe
10.4 Asia Pacific (APAC)
10.4.1 China
10.4.2 Japan
10.4.3 South Korea
10.4.4 Rest of APAC
10.5 Rest of the World (RoW)
10.5.1 South America
10.5.2 Middle East and Africa
11 Competitive Landscape (Page No. - 62)
11.1 Introduction
11.2 Market Player Ranking Analysis
11.3 Competitive Situations and Trends
11.3.1 Expansions
11.3.2 Merger and Acquisitions
11.3.3 Product Development
11.3.4 Agreement
12 Company Profiles (Page No. - 66)
12.1 Introduction
12.2 Key Players
(Business Overview, Products Offered, Recent Developments, MnM View, SWOT Analysis)*
12.2.1 Molex
12.2.2 LPKF Laser & Electronics
12.2.3 TE Connectivity
12.2.4 HARTING
12.2.5 Arlington Plating Company
12.2.6 JOHNAN
12.2.7 MID Solutions
12.2.8 2E Mechatronic
12.2.9 Multiple Dimensions
*Business Overview, Products Offered, Recent Developments, MnM View, SWOT Analysis Might Not Be Captured in Case of Unlisted Companies.
12.3 Other Important Players
12.3.1 Laser Micronics
12.3.2 Teprosa
12.3.3 Axon Cable
12.3.4 S2P
12.3.5 Suzhou Cicor Technology Co. Ltd
12.3.6 IME Vendors
12.3.6.1 Dowdupont
12.3.6.2 Tactotek
12.3.6.3 Dura Tech Industries
12.3.6.4 Tekra
12.3.6.5 Yomura Technologies
13 Appendix (Page No. - 85)
13.1 Insights of Industry Experts
13.2 Discussion Guide
13.3 Knowledge Store: Marketsandmarkets’ Subscription Portal
13.4 Available Customizations
13.5 Related Reports
13.6 Author Details
List of Tables (31 Tables)
Table 1 Molded Interconnect Device Market, By Process, 2015–2023 (USD Million)
Table 2 Market, By Product Type, 2015–2023 (USD Million)
Table 3 Market for Antennae and Connectivity Modules, By Industry, 2015–2023 (USD Million)
Table 4 Molded Interconnect Device Market for Sensors, By Industry, 2015–2023 (USD Million)
Table 5 Market for Connectors and Switches, By Industry, 2015–2023 (USD Million)
Table 6 Market for Lighting, By Industry, 2015–2023 (USD Million)
Table 7 Market for Others, By Industry, 2015–2023 (USD Million)
Table 8 Market, By Industry, 2015–2023 (USD Million)
Table 9 Market for Telecommunications, By Product Type, 2015–2023 (USD Million)
Table 10 Market for Consumer Electronics, By Product Type, 2015–2023 (USD Million)
Table 11 Market for Automotive, By Product Type, 2015–2023 (USD Million)
Table 12 Market for Medical, By Product Type, 2015–2023 (USD Million)
Table 13 Market for Industrial, By Product Type, 2015–2023 (USD Million)
Table 14 Market, By Region, 2015–2023 (USD Million)
Table 15 Market in North America, By Country, 2015–2023 (USD Million)
Table 16 Market in North America, By Process, 2015–2023 (USD Million)
Table 17 Molded Interconnect Device Market in North America, By Industry, 2015–2023 (USD Million)
Table 18 Market in Europe, By Country, 2015–2023 (USD Million)
Table 19 Market in Europe, By Process, 2015–2023 (USD Million)
Table 20 Market in Europe, By Industry, 2015–2023 (USD Million)
Table 21 Market in APAC, By Country, 2015–2023 (USD Million)
Table 22 Market in APAC, By Process, 2015–2023 (USD Million)
Table 23 Market in APAC, By Industry, 2015–2023 (USD Million)
Table 24 Molded Interconnect Device Market in RoW, By Region, 2015–2023 (USD Million)
Table 25 Market in RoW, By Process, 2015–2023 (USD Million)
Table 26 Molded Interconnect Device Market in RoW, By Industry, 2015–2023 (USD Million)
Table 27 Ranking of Key Players in Market (2017)
Table 28 Expansions 2017–2018
Table 29 Merger and Acquisitions, 2015–2017
Table 30 Product Development, 2017
Table 31 Agreement, 2017
List of Figures (24 Figures)
Figure 1 Molded Interconnect Device Market Segmentation
Figure 2 Molded Interconnect Devices Market : Report Design
Figure 3 Process Flow
Figure 4 Market Size Estimation Methodology: Bottom-Up Approach
Figure 5 Market Size Estimation Methodology: Top-Down Approach
Figure 6 Data Triangulation
Figure 7 Assumptions for Research Study
Figure 8 Laser Direct Structuring to Lead Market During Forecast Period
Figure 9 Antennae and Connectivity Modules to Hold Largest Size of Market By 2023
Figure 10 Molded Interconnect Device Market for Automotive to Grow at Highest CAGR During Forecast Period
Figure 11 Market to Grow at Highest CAGR in Germany During Forecast Period
Figure 12 Increasing Use of Molded Interconnect Devices in Automotive Industry to Offer Opportunities for Market Growth
Figure 13 Antennae and Connectivity Modules to Lead Market for Consumer Electronics During Forecast Period
Figure 14 Automotive to Grow at Highest CAGR During Forecast Period
Figure 15 Laser Direct Structuring Held Largest Share of Market in Europe in 2017
Figure 16 Molded Interconnect Device Market to Grow at Highest CAGR in Europe From 2018 to 2023
Figure 17 Rising Demand for Miniaturization in Consumer Electronics Industry Driving the MID Market
Figure 18 Market: Geographic Snapshot
Figure 19 Molded Interconnect Device Market Snapshot: North America
Figure 20 Market Snapshot: Europe
Figure 21 Molded Interconnect Device Market Snapshot: APAC
Figure 22 Companies Adopted Expansion as Key Growth Strategy During 2016–2018
Figure 23 LPKF: Company Snapshot
Figure 24 TE Connectivity: Company Snapshot
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