The molded interconnect device (MID) market is expected to grow from USD 1.4 billion in 2022 to USD 2.7 billion by 2027; it is expected to grow at a CAGR of 13.6% during the forecast period. The rising use of MIDs in medical devices is growing the molded interconnect device (MID) market during the forecast period.
Major players in the molded interconnect device (MID) market have primarily adopted acquisition and collaboration strategies to strengthen their position in the market.
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Molex (US), TE Connectivity (Switzerland), are major players in molded interconnect device (MID) market.
Molex designs, develops, and manufactures electronic components and solutions. The company offers connectors, sockets and edge cards, cable assemblies, optical solutions, printed circuit boards, industrial products, and antennae. It also offers a wide range of MID technologies—laser direct structuring (LDS) is one of them. The company offers its LDS technology to various verticals, including automotive, medical, industrial, and consumer electronics.
TE Connectivity (Switzerland)
TE Connectivity designs and manufactures connectivity solutions and sensors. The company operates through three business segments-Transportation Solution, Industrial Solution, and Communication Solution-in Asia Pacific, Europe, the Middle East, and Africa (EMEA), and the Americas. Its product portfolio comprises terminals, sensors, wires and cables, electronic components, and others. In addition, the company offers a broad portfolio of antenna technologies, including standard and custom antennae, with two-shot molding, stamped metal, flexible printed circuit (FPC), printed circuit board (PCB), and LDS solutions. TE Connectivity is a global leader in the MID technology ecosystem.
Molded Interconnect Device (MID) Market by Product Type (Antennae & Connectivity, Sensor),by Process (Laser Direct Structuring, Two-shot Molding), by Industry (Consumer Electronics, Telecommunication, Medical) and Geography - Global Forecast to 2027
Mr. Aashish Mehra
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