Molded Interconnect Device (MID) Market

Molex (US) and TE Connectivity (Switzerland) are the Major Players in the Molded Interconnect Device (MID) Market

The molded interconnect device (MID) market is expected to grow from USD 1.4 billion in 2022 to USD 2.7 billion by 2027; it is expected to grow at a CAGR of 13.6% during the forecast period. The rising use of MIDs in medical devices is growing the molded interconnect device (MID) market during the forecast period.

Major players in the molded interconnect device (MID) market have primarily adopted acquisition and collaboration strategies to strengthen their position in the market.    

To know about the assumptions considered for the study download the pdf brochure 

  • In April 2022, Phillips-Medisize, a Molex company, has collaborated with SOTECH Health to develop a breath sensor system that detects COVID-19 in less than 30 seconds. Phillips-Medisize will help with its human-centric product design, rapid prototyping, and end-to-end manufacturing expertise.
  •  In December 2021, Molex acquired Keyssa Technologies’ core technology and IP to develop high-speed contactless connectors. Keyssa’s wireless chip-to-chip technology will enable Molex’s mmWave antenna connectivity to meet growing demands for high data transmission.

Molex (US), TE Connectivity (Switzerland), are major players in molded interconnect device (MID) market.

Molex (US)

Molex designs, develops, and manufactures electronic components and solutions. The company offers connectors, sockets and edge cards, cable assemblies, optical solutions, printed circuit boards, industrial products, and antennae. It also offers a wide range of MID technologies—laser direct structuring (LDS) is one of them. The company offers its LDS technology to various verticals, including automotive, medical, industrial, and consumer electronics.

TE Connectivity (Switzerland)

TE Connectivity designs and manufactures connectivity solutions and sensors. The company operates through three business segments-Transportation Solution, Industrial Solution, and Communication Solution-in Asia Pacific, Europe, the Middle East, and Africa (EMEA), and the Americas. Its product portfolio comprises terminals, sensors, wires and cables, electronic components, and others. In addition, the company offers a broad portfolio of antenna technologies, including standard and custom antennae, with two-shot molding, stamped metal, flexible printed circuit (FPC), printed circuit board (PCB), and LDS solutions. TE Connectivity is a global leader in the MID technology ecosystem.

Related Reports:

Molded Interconnect Device (MID) Market by Product Type (Antennae & Connectivity, Sensor),by Process (Laser Direct Structuring, Two-shot Molding), by Industry (Consumer Electronics, Telecommunication, Medical) and Geography - Global Forecast to 2027

Contact:
Mr. Aashish Mehra
MarketsandMarkets™ INC.
630 Dundee Road
Suite 430
Northbrook, IL 60062
USA : 1-888-600-6441
[email protected]

Report Code
SE 6567
RI Published ON
8/8/2022
Choose License Type
BUY NOW
  • SHARE
X
Request Customization
Speak to Analyst
Speak to Analyst
OR FACE-TO-FACE MEETING
PERSONALIZE THIS RESEARCH
  • Triangulate with your Own Data
  • Get Data as per your Format and Definition
  • Gain a Deeper Dive on a Specific Application, Geography, Customer or Competitor
  • Any level of Personalization
REQUEST A FREE CUSTOMIZATION
LET US HELP YOU!
  • What are the Known and Unknown Adjacencies Impacting the Molded Interconnect Device (MID) Market
  • What will your New Revenue Sources be?
  • Who will be your Top Customer; what will make them switch?
  • Defend your Market Share or Win Competitors
  • Get a Scorecard for Target Partners
REQUEST A FREE WORKSHOP
ADJACENT MARKETS
REQUEST BUNDLE REPORTS
+1-888-600-6441
  • Call Us
  • +1-888-600-6441 (Corporate office hours)
  • +1-888-600-6441 (US/Can toll free)
  • +44-800-368-9399 (UK office hours)
CONNECT WITH US
ABOUT TRUST ONLINE
©2022 MarketsandMarkets Research Private Ltd. All rights reserved