Thermal interface pads & material are used widely in aerospace, consumer electronics, and telecom equipment industries, sealing and shielding processes, and power supply unit applications. Thermal interface pads & material can be a cost effective approach for the various industries as they help increase productivity in a cost-effective way. Technological advancements have made a positive impact on the Thermal interface pads & material market. These advancements have helped to improve the performance of Thermal interface pads & material in terms of quality and accuracy.
Thermal interface pads & material are used for transferring heat between microprocessors and heat sinks in integrated circuits. This market has been segmented based on type and application. The said market has been categorized based on type into phase change material, thermal pads, thermal grease, and others. The market has been segmented based on application into consumer electronics, telecom equipment, power supply units, and others.
This report covers all aspects pertaining to Thermal interface pads & material in terms of type, applications, product, and geographic analysis.
The key revenue pockets for the Thermal interface pads & material are expected to comprise PCM and thermal pads markets. The major players in this segment are 3M (U.S.), Dow Corning (U.S.), Parker Chomerics (U.S.), Liard technologies (U.K.), Jones Tech PLC (China), and Henkel AG (Germany).
This market is expected to have a huge growth potential due to their various benefits. The demand for telecom equipment industry is currently driving TIM market. This is mainly because of the huge demand for thermal interface pads & material in this sector. Moreover, the usage of thermal pads and PCM pads in consumer electronics and power supply units is rising.
The global TIM market is estimated to reach at $1379.02 million by 2020, at a CAGR of 8.47% from 2015 to 2020. The market for phase change materials is expected to grow at a healthy CAGR in the forecast period. This growth is expected to be heralded by consumer electronics, telecom equipment, and power supply units industries. APAC is the biggest Thermal interface pads & material market, followed by North America and Europe.
Thermal Interface Pads & Material Market by Type (Phase Change Material, Thermal Grease, Thermal Pads), Products (MOSFET, Thyristor, IGBT), Application (Consumer Electronics, Telecom Equipment, Power Supply Units) - Forecast to 2020
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