Semiconductor Materials and Components Market Research Reports & Consulting

Market Reports

• Electronic Design Automation Market by Product Category (CAE, Semiconductor IP, PCB & MCM), Deployment Mode(On-premises, Cloud-based), End-Use Application, End User (Consumer Electronics Industry, Automotive, Healthcare), Region - Global Forecast to 2028

  The global electronic design automation market is expected to grow from USD 14.5 billion in 2022 to USD 26.2 billion by 2028, at a compound annual growth rate (CAGR) of 9.8% during the forecast period.The Key players such as Cadence Design Systems, Inc. (US), Synopsys, Inc. (US), Siemens (Germany), ANSYS, Inc. (US), Keysight Technologies, Inc. (US), Advance Micro Device Inc. (US), eInfochips (US), Altium Limited (Australia), Zuken Inc. (Japan), Silvaco, Inc. (US).

  • Published: May 2023
  • Price: $ 4950
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• Silicon Photonics Market with Recession Impact Analysis by Product (Transceivers, Switches, Sensors), Application (Data Centers & High-Performance Computing, Telecommunications), Waveguide, Component and Geography - Global Forecast to 2028

  The silicon photonics market is expected to grow from USD 1.3 billion in 2022 to USD 5.0 billion by 2028, at a compound annual growth rate (CAGR) of 28.5% during the forecast period.The Key Players Cisco Systems, Inc. (US), Intel Corporation (US), MACOM Technology Solutions (US), GlobalFoundries Inc. (US), Lumentum Operations LLC (US), Marvell Technology, Inc. (US), Coherent Corporation (US), International Business Machines Corporation (IBM) (US), STMicroelectronics N.V. (US), Rockley Photonics Holdings Limited (US).

  • Published: May 2023
  • Price: $ 4950
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• Semiconductor Manufacturing Equipment Market by Front-end Equipment, Back-end Equipment, Fab Facility Equipment (Automation , Chemical Control, Gas Control), Product Type, Dimension, Supply Chain Participant and Region - Global Forecast to 2028

  The semiconductor manufacturing equipment market is expected to grow from USD 91.2 billion in 2023 to USD 149.8 billion by 2028, at a compound annual growth rate (CAGR) of 10.4% during the forecast period.The key players such as Tokyo Electron Limited (Japan); Lam Research Corporation (US); ASML (Netherlands); Applied Materials, Inc. (US); KLA Corporation (US); SCREEN Holdings Co., Ltd. (Japan); Teradyne, Inc. (US); Advantest Corporation (Japan); Hitachi, Ltd. (Japan); Plasma-Therm (US).

  • Published: May 2023
  • Price: $ 4950
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• 3D IC and 2.5D IC Packaging Market by Packaging Technology (3D Wafer-Level Chip Scale Packaging, 3D TSV and 2.5D), Application (Logic, Memory, MEMS/Sensors, Imaging & Optoelectronics, LED), End User and Region - Global Forecast to 2028

  The 3D IC and 2.5D IC packaging market is expected to grow from USD 49.3 billion in 2023 to USD 82.0 billion by 2028, at a compound annual growth rate (CAGR) of 10.7% during the forecast period. The The key players Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), Intel Corporation (US), ASE Technology Holding Co., Ltd. (Taiwan), Amkor Technology (US), Broadcom (US), Texas Instruments Inc. (US), United Microelectronics Corporation (Taiwan), JCET Group Co., Ltd. (China) and Powertech Technology Inc. (Taiwan).

  • Published: May 2023
  • Price: $ 4950
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• Millimeter Wave Technology Market by Product (Scanning Systems, Telecommunication Equipment), License Type (Unlicensed, Fully Licensed), Application (Mobile & Telecommunication, Automotive), Component, Frequency Band and Region - Global Forecast to 2028

  The millimeter wave technology market is expected to grow from USD 2.8 billion in 2023 to USD 7.9 billion by 2028, at a compound annual growth rate (CAGR) of 22.8% during the forecast period.The Major players Axxcss Wireless Solutions, Inc. (US), NEC Corporation (Japan), Siklu Communication (US), L3HARRIS Technologies, Inc. (US), Smiths Group PLC (UK), Millimeter Wave Products Inc. (US), Farran Technology (Ireland), Eravant (US), Keysight Technologies, Inc. (US), Avait Networks, Inc. (US), Vubiq Networks, Inc. (US), ELVA-1 (Latvia), Verana Networks (US), FastBack Networks (US), and Anokiwave (US).

  • Published: April 2023
  • Price: $ 4950
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• Silicon Carbide Market by Device (SiC Discrete Device, SiC Module), Wafer Size (Up to 150 MM, >150 MM), End-Use Application (Automotive, Energy & Power, Transportation, Industrial, Telecommunications) and Region - Global Forecast to 2028

  The global silicon carbide market is expected to grow from USD 1.8 billion in 2022 to USD 11.1 billion by 2028, at a compound annual growth rate (CAGR) of 36.4% during the forecast period.The Key Players STMicroelectronics N.V. (Switzerland); Infineon Technologies AG (Germany); WOLFSPEED, INC. (North Carolina); ON Semiconductor Corporation (Arizona); ROHM Co., Ltd. (Kyoto).

  • Published: April 2023
  • Price: $ 4950
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• Raman Spectroscopy Market by Type (Benchtop, Portable), Instrument (Microscopy, FT, Handheld & Portable), Sampling Technique (Surface-enhanced Raman Scattering, Tip-enhanced Raman Scattering), Application and Region- Global Forecast to 2028

  The Raman spectroscopy market is expected to grow from USD 0.8 billion in 2023 to USD 1.1 billion by 2028, at a compound annual growth rate (CAGR) of 7.0 during the forecast period.The Key Players Thermo Fisher Scientific Inc. (US), Mettler Toledo (Switzerland), Agilent Technologies Inc. (US), Bruker (US), Renishaw Plc (UK), Rigaku Corporation (Japan), Oxford Instruments (UK), Endress+Hauser Group Services AG (Switzerland), HORIBA Ltd. (Japan), PerkinElmer Inc. (US), Hamamatsu Photonics K.K (Japan), Metrohm AG (Switzerland), Anton Paar GmbH (Austria), JASCO (Japan), Tornado Spectral Systems (Canada), Enhanced Spectrometry, Inc. (US), Zolix (China), Smiths Detection (UK), Ocean Insight (US), Ostec (US), TSI (US), Laser Detect System (Israel), Photon Systems, Inc. (US), B&W Tek (US), and Real Time Analyzers (US).

  • Published: April 2023
  • Price: $ 4950
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• VCSEL Market by Type (Single-mode and Multimode), Material (GaAs, InP, GaN), Wavelength, Application (Sensing, Data Communication, Industrial Heating & Printing, Emerging), Data Rate, Industry and Region - Global Forecast to 2028

  The global VCSEL market is expected to grow from USD 1.6 billion in 2023 to USD 2.9 billion by 2028, at a compound annual growth rate (CAGR) of 13.6% during the forecast period.The players such as Lumentum (US), Coherent Corporation (US), AMS Osram (Austria), TRUMPF (Germany), Broadcom (US), Leonardo Electronics (US), MKS Instruments (US), Santec (Japan), VERTILAS (Germany), Vertilite (China), Alight Technologies (Denmark), Inneos (US), IQE (UK), Thorlabs (UK), TT Electronics (UK), Ushio America (US), WIN Semiconductors (Taiwan), and Frankfurt Laser Company (Germany) among others.

  • Published: February 2023
  • Price: $ 4950
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• LiDAR Market by Component (Laser Scanners, Navigation & Positioning Systems), Type (Solid State, Mechanical), Installation Type (Airborne and Ground Based), Range, Service, End-use Application, Region - Global Forecast to 2028

  The LiDAR market is expected to grow from USD 1.4 billion in 2023 to USD 3.7 billion in 2028, at a compound annual growth rate (CAGR) of 19.4% during the forecast period.The Key Players Leica Geosystems AG(Sweden), Trimble, Inc. (US), Teledyne Optech (Canada), FARO Technologies, Inc. (US),RIEGL Laser Measurement Systems GmbH (Austria), SICK AG (Germany), Quantum Spatial (US), Beijing SureStar Technology Co. Ltd. (China).

  • Published: January 2023
  • Price: $ 4950
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• Automotive Semiconductor Market by Component (Processor, Analog IC, Discrete power device, Sensor), Vehicle Type (Passenger Car, LCV, HCV), Fuel Type (Gasoline, Diesel, EV/HEV), Application (Powertrain, Safety, Chassis) - Global Forecast to 2027

  The automotive semiconductor market is expected to grow from USD 42.9 billion in 2022 to USD 70.0 billion by 2027, at a compound annual growth rate (CAGR) of 10.1% during the forecast period. The Major players Robert Bosch (Germany), Continental (Germany), Infineon Technologies (Germany), NXP Semiconductors (Netherlands), Sensata Technologies (US), Borgwarner, (US), Allegro Microsystems (US), DENSO (Japan), Analog Devices (US), ELMOS Semiconductor (Germany), STMicroelectronics (Switzerland), TE Connectivity (Switzerland), Onsemi (US), Renesas Electronics (Japan), ROHM Semiconductor (Japan), Aptiv (Ireland), CTS (US), Autoliv (Sweden), ZF Group (Germany), Quanergy (US), Toshiba (Japan), Magna International (Canada), Melexis (Belgium), Amphenol (US), and Valeo (France).

  • Published: December 2022
  • Price: $ 4950
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• Non-Volatile Memory (NVM) Market by Type (Flash, EPROM, nvSRAM, EEPROM, 3D NAND, MRAM, FRAM, NRAM, ReRAM, PMC), Wafer Size (200 mm, 300mm), End-user (Consumer Electronics, Enterprise Storage, Healthcare, Automotive) and Region - Global Forecast to 2027

  The non-volatile memory market is expected to grow from USD 74.6 billion in 2022 to USD 124.1 billion by 2027, at a compound annual growth rate (CAGR) of 10.7% during the forecast period. The key players SAMSUNG (South Korea), Western Digital Technologies, Inc. (US), KIOXIA Holdings Corporation (Japan), Micron Technology, Inc. (US), and SK HYNIX INC. (South Korea) among others. The other companies profiled in the report are Microchip Technology Inc. (US), ROHM CO., LTD. (Japan), Renesas Electronics Corporation (Japan), STMicroelectronics (US), Infineon Technologies AG (Germany), Nantero, Inc. (US), Crossbar Inc. (US), Everspin Technologies Inc. (US), Winbond (Taiwan), and Pure Storage, Inc. (US).

  • Published: December 2022
  • Price: $ 4950
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• Silicon on Insulator Market by Wafer Size (200 mm and less than 200 mm, 300 mm), Wafer Type (RF-SOI, FD-SOI, Power-SOI, Emerging-SOI), Technology (Smart Cut), Product (MEMS Devices, RF FEM Products), Application and Region - Global Forecast to 2027

  The global Silicon on Insulator market is expected to grow from USD 1.4 billion in 2022 to USD 2.9 billion by 2027, at a compound annual growth rate (CAGR) of 15.0% during the forecast period.The Key Players Soitec (France), Shin-Etsu Chemical (Japan), GlobalWafers (Taiwan), SUMCO Corporation (Japan), Shanghai Simgui Technology (China), GlobalFoundries (US), STMicroelectronics (Switzerland), Tower Semiconductor (Israel), NXP Semiconductors (Netherlands), Murata Manufacturing (Japan).

  • Published: December 2022
  • Price: $ 4950
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• Compound Semiconductor Market Size by Type (GaN, GaAs, SiC, InP), Product (LED, Optoelectronics, RF Devices, Power Electronics), Application (Telecommunication, General Lighting, Automotive, Consumer Devices, Power Supply) & Region - Global Forecast to 2027

  The global compound semiconductor market is expected to grow from USD 40.5 billion in 2022 to USD 55.8 billion by 2027, at a compound annual growth rate (CAGR) of 6.6% during the forecast period.The Key Players Nichia Corporation (Japan), Samsung Electronics Co., Ltd. (South Korea), ams OSRAM AG (Austria), Qorvo, Inc. (US), Skyworks Solutions, Inc. (US), Wolfspeed, Inc. (US), GaN Systems (Japan), Canon Inc. (Canada), Infineon Technologies AG (Germany), Mitsubishi Electric Corporation (Japan).

  • Published: November 2022
  • Price: $ 4950
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• Smart Card IC Market by Type (Microprocessor, Memory), Architecture (16-bit, 32-bit), Interface, Application (USIMs/eSIMs, ID Cards, Financial Cards), End-user Industry (Telecommunications, BFSI) and Region - Global Forecast to 2027

  The global smart card IC market is expected to grow from USD 2.9 billion in 2022 to USD 3.9 billion by 2027, at a compound annual growth rate (CAGR) of 6.3% during the forecast period.The Key Players Infineon Technologies AG (Germany), NXP Semiconductors N.V. (Netherland), Samsung Electronics Co., Ltd. (South Korea), STMicroelectronics N.V. (Switzerland), Microchip Technology Incorporated (US), CEC Huada Electronic Design Co., Ltd. (China), Analog Devices, Inc. (US), Sony Group Corporation (Japan), Toshiba Corporation (Japan), and ON Semiconductor Corporation (US)

  • Published: October 2022
  • Price: $ 4950
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• Piezoelectric Devices Market by Material (Piezoelectric Ceramics, Polymers), Product (Piezoelectric Actuators, Transducers, Motors), Application (Aerospace & Defense, Industrial, Consumer) and Region – Global Forecast to 2027

  The piezoelectric devices market is expected to grow from USD 30.8 billion in 2022 to USD 41.0 billion by 2027, at a compound annual growth rate (CAGR) of 5.9% during the forecast period.The Key Players CeramTec GmbH (Germany); CTS Corporation (US); Kistler Group (Switzerland); Physik Instrumente (PI) GmbH & Co. KG. (Germany); piezosystem jena GmbH (Germany); Piezo Technologies (US); Noliac A/S (Denmark); Aerotech Inc. (US); APC International, Ltd., (US); Mad City Labs, Inc. (US) are among the leading companies in the piezoelectric devices market. Apart from these, Kinetic Ceramics (US), Johnson Matthey Piezo Products GmbH (Germany), PI Ceramic (Germany), Piezo Solutions (US), DYTRAN INSTRUMENTS INCORPORATED (US), Piezomechanik Dr. Lutz Pickelmann GmbH (Germany), PiezoMotor (Sweden), PCB Piezotronics, Inc. (US).

  • Published: September 2022
  • Price: $ 4950
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• Thin Wafer Market by Wafer Size (125 mm, 200 mm, and 300 mm), Process (Temporary Bonding & Debonding and Carrier-less/Taiko Process), Technology, Application (MEMS, CIS, Memory, RF Devices, LED, Interposer, Logic) and Geography - Global Forecast to 2027

  The thin wafer market is expected to grow from USD 11.4 billion in 2022 to USD 20.6 billion by 2027, at a compound annual growth rate (CAGR) of 12.5% during the forecast period.The Key Players Shin-Etsu Chemical Co., Ltd. (Japan), SUMCO Corporation (Japan), GlobalWafers Co., Ltd. (Taiwan), Siltronic (Germany), SK Siltron (South Korea), SUSS MicroTec (Germany), Soitec (France), DISCO Corporation (Japan), 3M (US), and Applied Materials (US). Apart from these, Mechatronic Systemtechnik (Austria), Synova (Switzerland), EV Group (Austria), Wafer Works Corporation (Taiwan), Atecom technology Co., Ltd. (Taiwan), Siltronix Silicon Technologies (France), LDK Solar (China), UniversityWafer, Inc. (US).

  • Published: September 2022
  • Price: $ 4950
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• ALD Equipment Market by Film Type (Oxide, Metal, Sulfide, Nitride), Deposition Method, Application (Semiconductor) (More-than-Moore, Research & Development Facilities, More Moore), Application (Non-semiconductor) and Region - Global Forecast to 2027

  The ALD Equipment Market is expected to grow from USD 4.1 billion in 2021 to USD 6.0 billion by 2027, at a compound annual growth rate (CAGR) of 8.2% during the forecast period.The key players ASM International N.V. (Netherlands), Tokyo Electron Limited (Japan), Applied Materials, Inc. (US), Lam Research Corporation (US), Veeco Instruments Inc. (US), Kurt J. Lesker Company (US), Optorun Co., Ltd. (Japan), CVD Equipment Corporation (US), Eugene Technology Co. Ltd. (South Korea), and Beneq (Finland).

  • Published: August 2022
  • Price: $ 4950
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• Molded Interconnect Device (MID) Market by Product Type (Antennae & Connectivity, Sensor),by Process (Laser Direct Structuring, Two-shot Molding), by Industry (Consumer Electronics, Telecommunication, Medical) and Geography - Global Forecast to 2027

  The molded interconnect device (MID) market is expected to grow from USD 1.4 billion in 2022 to USD 2.7 billion by 2027, at a compound annual growth rate (CAGR) of 22.9% during the forecast period.The key players device (MID) market and analyzes their market shares. Players profiled in this report are Molex (US), TE Connectivity (Switzerland), Amphenol Corporation (US), LPKF Laser & Electronics (Germany), and Taoglas (Dublin), Harting (Germany), Arlington Plating Company (US), MID Solutions (Germany), 2E Mechatronic (Germany), KYOCERA AVX (US) and Johnan (Japan), Teprosa(Germany), Sunway Communication(China), Axon Cable(France), S2P (France), Suzhou Cicor Technology (China), TactoTek (Finland), DuraTech (US), Tekra (US), Yomura Technologies (Taiwan), MacDermid Alpha Electronics (US), Galtronics (US), Yazaki Corporation (Japan), Chogori Technology (Japan), Suzhou Zeeteq Electronics (Japan), Toyo Connectors (Japan) and SINOPLAST (China).

  • Published: August 2022
  • Price: $ 4950
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• Supercapacitor Market by Type (Double Layer Capacitors, Pseudocapacitors, Hybrid Capacitors), Electrode Material (Carbon, Metal Oxide, Conducting Polymers, Composites), Application (Automotive, Energy, Consumer Electronics) - Global Forecast to 2027

  The global supercapacitor market is expected to grow from USD 472 million in 2022 to USD 912 million by 2027, at a compound annual growth rate (CAGR) of 14.1% during the forecast period.The top players Panasonic Industry(Japan), Eaton(Ireland), Nippon Chemi-Con(Japan), Maxwell Technologies(South Korea), and Cap-XX(Australia)

  • Published: June 2022
  • Price: $ 4950
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• RF Tunable Filter Market by Type (Bandpass, Band Reject), Tuning Mechanism, Tuning Component, System (Handheld and Pocket Radio, Radar System), Application (Aerospace and Defense, Transportation, Smart Cities) and Geography - Global Forecast to 2027

  The global RF tunable filter market is projected to reach USD 168 million by 2027, at a CAGR of 10.8% during the forecast period. Analog Devices, Inc. (US), Dover Corporation (US), Smiths Group plc (UK), The LGL Group, Inc. (US), EXFO Inc. (Canada), DiCon Fiberoptics, Inc. (US), Netcom, Inc. (US), RF Products Inc. (US), Telonic Berkeley Corporation (US), and Coleman Microwave Company (US) are some of the key players in the RF tunable filter market.

  • Published: June 2022
  • Price: $ 4950
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• DRAM Module and Component Market by Type (LPDRAM, DDR5, DDR4, DDR3, GDDR, HBM), End-User Industries (Server, Mobile Devices, Computers, Consumer Electronics, Automobiles), Memory (above 8GB, 6-8GB, 3-4GB, 2GB) and Geography (2021-2027)

  The global DRAM module and components market size is expected to reach USD 110.7 billion by 2027, at a CAGR of 1.2% during the forecast period. Some of the key companies operating in the DRAM module and components market are Samsung Electronics Co., Ltd. (South Korea), SK Hynix Inc. (South Korea), Micron Technology, Inc. (US), Nanya Technology Corporation (Taiwan), Winbond Electronics Corporation (Taiwan), Powerchip Technology Corporation (Taiwan), ADATA Technology Co. Ltd. (Taiwan), Ramaxel Technology (Shenzhen) Co, Ltd (China), Kingston Technology Corporation (US), SMART Modular Technologies (US), and so on.

  • Published: April 2022
  • Price: $ 4950
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• Multilayer Ceramic Capacitor Market by Dielectric (Class I (C0G, X8G, U2J), and Class II (X7R, X5R, Y5V, X7S)), Rated Voltage (Low (Up to 50V), Medium (100-630V), and High (1000V & Above)), End User (Electronics, Automotive) (2022-2027)

  According to MarketsandMarkets, the multilayer ceramic capacitor (MLCC) market is projected to reach USD 26.6 billion by 2027, it is expected to grow at a Compound Annual Growth Rate (CAGR ) CAGR of 13.8% during the forecast period. Key players in the MLCC market are Murata (Japan), Samsung Electro-Mechanics (South Korea), TAIYO YUDEN (Japan), YAGEO (Taiwan), Walsin Technology (Taiwan), TDK (Japan), Vishay Intertechnology (US), Kyocera (Japan), Darfon Electronics (US), Samwha Capacitor Group (South Korea), Nippon Chemi-Con (Japan), MARUWA (Japan), Fujian Torch Electron Technology (China), Holy Stone Enterprise (Taiwan), and Knowles (US). SMEs/startups covered in the study are CalRamic Technologies (US), Viking Tech (Taiwan), Würth Elektronik Group (Germany), Exxelia (France), Johanson Dielectrics (US), NIC Components (US), Kingtronics Kt (Hong Kong), Semec (China), Shanghai Yongming Electronic (YMIN) (China), EYANG Technology Development (China), and Fenghua Advanced Technology (Hong Kong).

  • Published: April 2022
  • Price: $ 4950
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• ANPR System Market by Type (Fixed, Mobile, Portable), Component (ANPR Cameras, ANPR Software, Frame Grabbers, Triggers), Application, End-User (Government, Commercial, Institutions) & Region (North America, APAC, Europe, RoW) (2022-2027)

  The global ANPR system market is expected to grow from USD 3.1 billion in 2022 to USD 4.8 billion by 2027, at a compound annual growth rate (CAGR) of 9.2% during the forecast period.The major players Kapsch TrafficCom (Austria), Siemens (Germany), Conduent, Inc. (US), HikVision (China), Q-Free ASA (Norway), Genetec, Inc. (Canada), Adaptive Recognition (Hungary), Jenoptik Group (Germany), Axis Communications (Sweden), and Nedap (Netherlands).

  • Published: April 2022
  • Price: $ 4950
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• Ultra-low-power Microcontroller Market by Peripheral Device (Analog Devices and Digital Devices), Packaging Type (8-bit, 16-bit, and 32-bit), End-Use Application, & Region (North America, Europe, APAC, Rest of the World) (2022-2027)

  The Ultra-low-power microcontroller market is projected to reach USD 7.9 billion by 2027, it is expected to grow at a CAGR of 10.3% during the forecast period. The key players operating in the ultra-low-power microcontroller market include are Texas Instruments (US), Microchip Technology (US), STMicroelectronics (Switzerland), Renesas Electronic Corporation (Japan), and Infineon Technologies AG (Germany).

  • Published: February 2022
  • Price: $ 4950
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• Semiconductor Intellectual Property (IP) Market Size, Share & Industry Growth Analysis Report by Design IP (Processor IP, Memory IP, Interface IP, Other IPs), IP Source (Royalty, Licensing), IP Core (Hard IP, Soft IP), Vertical and Geography - Global Growth Driver and Industry Forecast to 2026

  The semiconductor intellectual property (IP) market is expected to grow from USD 5.5 billion in 2021 to USD 7.2 billion by 2026, at a CAGR of 5.4% during the forecast period. Major players in the semiconductor IP market include Arm Holdings Ltd (UK), Synopsys Inc(US), Cadence Design Systems, Inc (US) Imagination Technologies Ltd (UK), CEVA Inc (US),Lattice Semiconductor Corporation (US), Rambus Inc(US), eMemory Technology, Inc (Taiwan), Silicon Storage Technology, Inc (US) and VeriSilicon Microelectronics Co., Ltd. (China) among others.

  • Published: January 2022
  • Price: $ 4950
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• Fiber Optic Components Market by Component (Transceivers, AOCs, Cables, Amplifiers, Splitters, Connectors, Circulators), Data Rate, Application (Communications, Distributed Sensing, Lighting) and Region (2022-2027)

  The global fiber optic components market is expected to reach USD 37.5 billion by 2027; it is expected to grow at a CAGR of 8.9% during the forecast period. Key players in the fiber optic components market are II-VI Incorporated (US), Lumentum Holdings Inc. (US), Broadcom Inc. (US), Sumitomo Electric Industries (Japan), Accelink Technologies (China), Oclaro (US), Acacia Communications, Inc. (US), EMCORE Corporation (US), Fujitsu Optical Components (Japan), and Furukawa Electric (Japan). Many of these companies focus on adopting both organic and inorganic growth strategies, such as product launches and developments, expansions, acquisitions, alliances, and collaborations to strengthen their position in the market.

  • Published: January 2022
  • Price: $ 4950
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• Microwave Devices Market by Product (Active Devices, Passive Devices), Frequency (Ku-band, C-band, Ka-band, L-band, X-band, S-band), End User (Space & Communication, Military & Defense, Healthcare), and Geography - Global Forecast to 2027

  The Microwave Devices Market is expected to grow from USD 6.7 billion in 2021 to USD 9.0 billion by 2027, at a CAGR of 5.1% during the forecast period. The key players operating in the Microwave Devices market include Thales Group (France), L3 Harris, Technologies, Inc. (US), Teledyne Technologies Incorporated (US), Qorvo, Inc. (US), and CPI International, Inc. (US).

  • Published: December 2021
  • Price: $ 4950
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• Silicon Photomultiplier Market by Offering (NUV, RGB), Type (Analog, Digital), Application (LiDAR and 3D Ranging, BioPhotonics & Medical Imaging, High energy Physics), End User, and Geography 2026

  The silicon photomultiplier market is expected to reach USD 173 million by 2026, at a CAGR of 7.6% during the forecast period. Some of the key companies operating in the market are ON Semiconductor (US), Broadcom (US), Hamamatsu Photonics (Japan), First Sensor (Germany), KETEK GmbH (Germany), AdvanSiD (Italy), Cremat (US), Excelitas Technologies (US), and so on.

  • Published: December 2021
  • Price: $ 4950
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• Power Electronics Market by Device Type (Power Discrete, Power Module, Power IC), Material (Si, SiC, GaN), Vertical (ICT, Consumer Electronics, Industrial, Automotive, Aerospace), and Geography - Global Forecast to 2026

  The power electronics market is expected to grow from USD 37.4 billion in 2021 to USD 46.3 billion by 2026, at a CAGR of 4.4% during the forecast period. Major vendors in the power electronics market include Infineon Technologies (Germany), ON Semiconductor (US), STMicroelectronics (Switzerland), Mitsubishi Electric (Japan), Vishay Intertechnology (US), Fuji Electric (Japan), NXP Semiconductors (Netherlands), Renesas Electronics (Japan), Texas Instruments (US), Toshiba (Japan), ABB (Switzerland), GaN Systems (Canada), Littelfuse (US), Maxim Integrated (US), Microchip (US), ROHM (Japan), SEMIKRON (Germany), Transphorm (US), UnitedSiC (US), and Wolfspeed, A Cree Company (US), Euclid Techlabs (US), GeneSiC (US), EPC (US), Analog Devices (US), and Hitachi (Japan).

  • Published: November 2021
  • Price: $ 4950
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• Semiconductor Bonding Market Size, Share & Industry Growth Analysis Report by Type (Die Bonder, Wafer Bonder, and Flip Chip Bonder), Application (RF Devices, MEMS and Sensors, LED, 3D NAND and CMOS Image Sensors), Process Type, Technology and Region - Global Growth Driver and Industry Forecast to 2026

  The global semiconductor bonding market size is projected to reach USD 1,059 million by 2026; it is expected to grow at a CAGR of 3.6% during the forecasting period. The semiconductor bonding market is dominated by a few globally established players such as Intel Corporation (US), Google. Inc (US), NVIDIA Corporation (US), Xilinx Inc. (US), IBM Corporation (US), Advanced Micro Devices, Inc (US), Marvell Technology (Hamilton), and Qualcomm Technology (US).

  • Published: September 2021
  • Price: $ 4950
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• Optical Transceiver Market Size, Share and Industry Growth Analysis Report by Form Factor (SFF and SFP; SFP+ and SFP28; XFP; CXP), Data Rate, Wavelength, Fiber Type, Connector, Distance, Protocol, Application (Data Center, Enterprise), and Global Growth Driver and Industry Forecast to 2026

  According to MarketsandMarkets, the optical transceiver market is projected to reach USD 14.3 billion by 2026; it is expected to grow at a Compound Annual Growth Rate (CAGR) of 15.2% during the forecasting period. The key players in the optical transceiver market include II-VI (US), Broadcom (US), Lumentum (US), Sumitomo Electric industries (Japan), Accelink (China), Smartoptics (Norway), Infinera (US), Fujitsu optical Components (Japan), Hisense Broadband (China), Huawei (China), Innolight (China), Ciena (US), Mellanox (US) (the company was acquired by Nvidia in April 2020), Applied Optoelectronics (US), Amphenol (US), Intel (US), NEC (Japan), Cisco (US), NeoPhotonics (US), Perle Systems (Canada), FOCI (Taiwan), Source Photonics (US), Solid Optics (US), Eoptolink (China), and Reflex Photonic (Canada) (the company was acquired by Smiths Interconnect (US) in November 2019). uSenlight (Taiwan), and Precision Optical Transceivers (US), POET Technologies (US), ProLabs (US), Elenion Technologies (US), HRB Technologies (India), and Alpine Optoelectronics (China) are few startup companies that provide such type of transceivers.

  • Published: August 2021
  • Price: $ 4950
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• Metamaterial Market by Material Type (Electromagnetic, Terahertz, Photonic, Tunable, FSS, and others), Application (Communication Antenna, Windscreen, Solar Panel, sensors, Display, and Medical Imaging), Vertical and Geography (2021-2026)

  The metamaterial market is projected to reach USD 1,457 million by 2026. It is expected to grow at a CAGR of 36.7% during the forecast period. A few of the key players in the metamaterial market are Kymeta Corporation (US), Metamaterial Technologies Inc. (Canada), Metamagnetics (US), Jem Engineering (US), Teraview (UK), Echodyne Inc. (US), Multiwave (Europe), Nanohmics Inc. (US), Metashield LLC (US), and Mediwise (UK).

  • Published: March 2021
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• Micro Server IC Market by offering (Hardware, Software), Processor type (X86, ARM) Application (Web Hosting and Enterprise Applications, Analytics and Cloud Computing, Edge Computing), End-User (Enterpises and Data Center) and Region 2026

  The Micro Server IC Market is expected to grow from USD 1.2 billion in 2021 to USD 2.2 billion by 2026, at a CAGR of 12.6% during the forecast period. Intel Corporation (US), Advanced Micro Devices, Inc. (US), Hewlett Packard Enterprise Development LP (US), Quanta Computer Inc. (Taiwan), NVIDIA Corporation (US), Ambedded Technology Co., Ltd. (Taiwan), Dell Inc. (US), Fujitsu (Japan), Marvell (US), Super Micro Computer Inc. (US), Ampere Computing LLC. (US), Bamboo (UK), christmann informationstechnik + medien GmbH & Co. KG (Germany), HIRO micro data centers (Netherlands), Huawei Technologies Co. Ltd. (China), IBM (US), Lattice Semiconductor (US), NXP Semiconductors (Netherlands), SiPearl (France), and STMicroelectronics (Switzerland) are some of the key players in the micro server IC market.

  • Published: February 2021
  • Price: $ 4950
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• Photolithography Equipment Market by Type (EUV, DUV), Light Source (Mercury Lamps, Excimer Lasers, Fluorine Lasers, Laser-Produced Plasma), Wavelength, End User and Geography - Global Forecast to 2025

  The photolithography equipment market is projected to reach USD 18.0 billion by 2025; it is expected to grow at a CAGR of 9.1% during the forecast period. The companies profiled in this report are ASML (Netherland), Canon (Japan), Nikon (Japan), NuFlare Technology (Japan), Onto Innovations (US), Veeco Instrument (US), SUSS Microtek (Germany), NXQ (US), EV Group (US).

  • Published: January 2021
  • Price: $ 4950
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• Crystal Oscillator Market Size, Share, Industry Growth Analysis Report by General Circuity (SPXO, TCXO, VCXO), Crystal Cut (AT Cut, BT Cut, SC Cut), Mounting Scheme (Surface Mount, Through-Hole) Application (Consumer Electronics) and Global Growth Driver and Industry Forecast to 2025

  The Crystal Oscillator Market is expected to grow from USD 2.8 billion in 2020 to USD 3.1 billion by 2025, at a CAGR of 2.1% during the forecast period. Seiko Epson Corporation (Japan), Nihon Dempa Kogyo Co., Ltd. (Japan), TXC Corporation (Taiwan), KYOCERA Crystal Device Corporation (Japan), Daishinku Corp. (Japan), Microchip Technology Inc. (US), Murata Manufacturing Co., Ltd. (Japan), Hosonic Electronic Co., Ltd. (Taiwan), SiTime Corporation (US), and Siward Crystal Technology Co., Ltd. (Taiwan), are some of the key players in the crystal oscillator market.

  • Published: January 2021
  • Price: $ 4950
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• Audio Codec Market by Component Type (Hardware and Software), Application (Desktop and Laptop, Mobile Phone and Tablet, Headphones, Headset and Wearable Devices), and Region - Global Forecast to 2025

  The audio codec market is expected to reach USD 7.8 billion in 2025, at a CAGR of 5.5% during the forecasting period. Key players in the audio codec market include Cirrus Logic (US), Qualcomm (US) and Realtek Semiconductor (Taiwan). Cirrus Logic is a well-known player for providing innovative and customized audio codec solutions and products in the audio market. Strong brand name and customer base are among the key factors that resulted in the leading position of Qualcomm in the market. Apart from the strong brand name and customer base, the company has strong R&D capabilities and geographic presence. Qualcomm focuses on strategies such as product launches and product development to strengthen its product portfolio and maintain its position in the audio codec market.

  • Published: December 2020
  • Price: $ 4950
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• Magnetic Refrigeration Market by Product ((Refrigeration Systems (Beverage Cooler, Cabinet Display, Refrigerator), Air Conditioning Systems)), Application (Domestic, Commercial, Transportation, and Industrial), and Geography - Global Forecast to 2027

  The Magnetic Refrigeration Market is expected to grow from USD 4 million by 2022 to USD 165 million by 2027, at a CAGR of 105.4% during the forecast period. Ubiblue (France), Haier Smart Home Co., Ltd (China), Camfridge Ltd (UK), Astronautics Corporation of America (US), VACUUMSCHMELZE GmbH & Co. KG (Germany), BASF SE (Germany), ERAMET (France), Samsung Electronics Co., Ltd (South Korea), Toshiba Corporation (Japan), Whirlpool Corporation (US), MagnoTherm Solutions (Germany), Millipore Sigma (US), General Engineering and Research (US), KIRSCH (Germany), CCS SA (Switzerland), TCS Micropumps Ltd (UK), Kiutra (Germany) and Cemafroid (France) are among a few of the key players in the magnetic refrigeration market.

  • Published: October 2020
  • Price: $ 4950
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• Microprocessor and GPU Market with COVID-19 Impact Analysis by Architecture, Functionality, GPU Type, Deployment, Application (Consumer Electronics, Server and Data Center, Automotive, BFSI, Industrial), and Geography - Global Forecast to 2025

  The Microprocessor and GPU Market is expected to grow from USD 103.0 billion in 2020 to USD 138.2 billion by 2025, at a CAGR of 6.1% during the forecast period. Intel (US), Samsung (South Korea), Qualcomm (US), Nvidia (US), AMD (US), MediaTek (Taiwan), Broadcom (US), Texas Instruments (US), IBM (US), and Marvell (Bermuda) are the key players in the global microprocessor and GPU market. These players are increasingly undertaking strategies such as product launches and development, expansions, partnerships, collaborations, joint-ventures, and acquisitions to increase their market share.

  • Published: September 2020
  • Price: $ 4950
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• Hermetic Packaging Market with COVID-19 impact by Configuration (Multilayer Ceramic Packages, Metal Can Packages, Pressed Ceramic Packages), Type (Ceramic-Metal Sealing, Glass-Metal Sealing), Application, Industry, and Region - Global Forecast to 2025

  The Hermetic Packaging Market is expected to grow from USD 3.5 billion in 2020 to USD 4.3 billion by 2025, at a CAGR of 4.3% during the forecast period. The key players operating in the hermetic packaging market include SCHOTT (Germany), AMETEK, Inc. (US), Amkor Technology, Inc. (US), Texas Instruments Incorporated (US), Teledyne Technologies (US), Kyocera Corporation (Japan), Materion Corporation (US), Egide (France), Micross Components Inc. (US), and Legacy Technologies Inc. (US).

  • Published: August 2020
  • Price: $ 4950
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• 3D Machine Vision Market with COVID-19 impact Analysis by Offering (Hardware and Software), Product (PC-based and Smart Camera-based), Application, Vertical (Industrial and Non-Industrial) & Geography - Global Forecast till 2025

  The 3D machine vision market was valued at USD 1.5 billion in 2020 and is projected to reach USD 2.4 billion by 2025; it is expected to grow at a CAGR of 9.4% from 2020 to 2025. The key players in the ecosystem of the 3D machine vision market profiled in this report are OMRON Corporation (Japan), Keyence Corporation (Japan), Cognex Corporation (US), Basler AG (Germany), National Instruments (US), ISRA Vision AG (Germany), TKH group (Netherlands), Stemmer Imaging (Germany), MVTec Software GmbH (Germany), and Tordivel AS (Norway). These players have adopted various growth strategies, such as product launches, acquisitions, partnerships, and agreements, to expand their presence in the global machine vision market further. Acquisitions and new product launches and developments have been the most dominating strategies adopted by major players from January 2017 to May 2020, which helped them to innovate on their product offerings, cope up with the COVID-19 outbreak and broaden their customer base.

  • Published: July 2020
  • Price: $ 4950
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• Wafer Cleaning Equipment Market with COVID-19 impact analysis by Equipment Type (Single-wafer Spray System, Batch Spray Cleaning System, and Scrubbers), Application, Technology, Operation Mode, Wafer Size, and Geography - Global Forecast to 2025

  The global wafer cleaning equipment market is expected to reach USD 11.2 billion by 2025, at a CAGR of 9.9% during the forecasting period. The report profiles key players, including SCREEN Holdings Co., Ltd. (Japan), Tokyo Electron Limited (Japan), Applied Materials (US), LAM Research (US), Shibaura Mechatronics Corporation (Japan), PVA TePLA AG (Germany), Entregris Inc., (US), Semes Co. Ltd. (US), Modutek Corporation (Japan), and Veeco Instruments (US). These companies focus on adopting both organic and inorganic growth strategies, such as new product launches, partnerships, agreements, mergers and acquisitions, and expansions to strengthen their position in the market.

  • Published: July 2020
  • Price: $ 4950
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• Embedded System Market by Hardware (MPU, MCU, Application-specific Integrated Circuits, DSP, FPGA, and Memories), Software (Middleware, Operating Systems), System Size, Functionality, Application, Region - Global Forecast to 2025

  The Embedded System Market is expected to grow from USD 86.5 billion in 2020 to USD 116.2 billion by 2025, at a CAGR of 6.1% during the forecast period. Intel (US), Renesas (Japan), STMicroelectronics (Switzerland), NXP Semiconductors (Netherlands), Texas Instruments (US), Microchip (US), Cypress Semiconductors (US), Qualcomm (US), Analog Devices (US), and Infineon Technologies (Germany) are the key players operating in the embedded system market. These players are increasingly undertaking strategies such as product launches, expansions, agreements, joint ventures, partnerships, collaborations, mergers, and acquisitions to increase their market share.

  • Published: March 2020
  • Price: $ 4950
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• RF Semiconductor Market by Device (Filter, Power Amplifier, Switch, Low Noise Amplifier), Frequency Band, Material (GaAs, GaN, Si) Application (Consumer Devices, Automotive, Telecommunication, Aerospace & Defense), and Region - Global Forecast to 2025

  The global RF semiconductor market is expected to reach USD 26.2 billion by 2025, at a CAGR of 8.5% during the forecasting period. Major players in the RF semiconductor industry include Qorvo (US), Skyworks (US), Qualcomm (US), Analog Devices (US), NXP Semiconductors (Netherlands), Cree (US), MACOM (US), Microchip Technology (US), Murata Manufacturing (Japan), and Texas Instruments (US).

  • Published: March 2020
  • Price: $ 4950
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• IGBT & Thyristor Market by Packaging Type (IGBT Discrete, IGBT Module), Power Rating (Medium Power IGBT, High Power IGBT), Voltage (Below 400V, 600-650V), Application (Power Transmission Systems, Motor Drives), and Region - Global Forecast to 2025

  The global IGBT market size is estimated to grow from USD 5.3 billion in 2020 to USD 6.6 billion by 2025, at a CAGR of 4.6%. On the other hand, the global thyristor market size is estimated to grow from USD 781 million in 2020 to USD 849 million by 2025; at a CAGR of 1.7% during the forecasting period. Infineon Technologies AG (Germany), Fuji Electric Co., Ltd. (Japan), ON Semiconductor (US), Mitsubishi Electric Corporation (Japan), and STMicroelectronics (Switzerland) are the key players in the IGBT & thyristor market. These players are increasingly undertaking strategies such as product launches, partnerships, collaborations, contracts, agreements, acquisitions, and expansions to increase their market share.

  • Published: February 2020
  • Price: $ 4950
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• Non-volatile Memory Express (NVMe) Market by Product (SSDs, Servers, All-flash Arrays, Adapters), Deployment Location (On-premise, Remote, Hybrid), Communication Standard (Ethernet, Fibre Channel, InfiniBand), Vertical, and Region - Global Forecast to 2025

  The Non-volatile Memory Express (NVMe) Market is expected to grow from USD 44.6 billion in 2020 to USD 163.5 billion by 2025, at a CAGR of 29.7% during the forecast period. Samsung Electronics Co., Ltd. (Samsung) (South Korea), Western Digital Corporation (Western Digital) (US), Intel Corporation (Intel) (US), Dell EMC (US), Hewlett Packard Enterprise (HPE) (US), Broadcom Inc. (Broadcom) (US), Micron Technology, Inc. (Micron Technology) (US), Cisco Systems, Inc. (Cisco) (US), Toshiba Corporation (Toshiba) (Japan), and NetApp, Inc. (NetApp) (US) are the prominent players in the NVMe market.

  • Published: February 2020
  • Price: $ 4950
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• Die Bonder Equipment Market by Type (Semiautomatic Die Bonder, Fully Automatic Die Bonder), Bonding Technique, Supply Chain Participant (IDM Firms, OSAT Companies), Device, Application (Consumer Electronics), and Region - Global Forecast to 2024

  The Die Bonder Equipment Market is expected to grow from USD 820 million in 2019 to USD 972 million by 2024, at a CAGR of 3.5% during the forecast period. BE Semiconductor Industries N.V. (Netherlands), ASM Pacific Technology Ltd. (Singapore), Kulicke & Soffa (Singapore), Mycronic AB (Sweden), Palomar Technologies, Inc. (US), West·Bond, Inc. (US), MicroAssembly Technologies, Ltd. (Israel), Finetech GmbH & Co. KG (Germany), Dr. Tresky AG (Switzerland), Smart Equipment Technology (France) are the key players in the die bonder equipment market. These players are increasingly undertaking strategies such as product launches, expansions, agreements, partnerships, collaborations, and acquisitions to increase their market share.

  • Published: November 2019
  • Price: $ 4950
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• Ion Milling System Market by Electron Microscopy Type (SEM, TEM, FIB), Sample Material, Application (Semiconductor Manufacturing, Geological Institutes, Medical Research Institutes), and Geography - Global Forecast to 2024

  The Ion Milling System Market is expected to grow from USD 1.5 billion in 2019 to USD 2.3 billion by 2024, at a CAGR of 8.5% during the forecast period. Key players in the market include Veeco Instruments Inc. (US), Leica Microsystems Gmbh (Germany), Hitachi High-Technologies Corporation (Japan), Gatan, Inc. (US), Intlvac Thin Film Corporation (US), AJA International Inc. (US), Nano-Master, Inc. (US), Nordiko Technical Services Ltd. (UK), scia Systems GmbH (Germany), and Technoorg Linda co. ltd. (Hungary).

  • Published: August 2019
  • Price: $ 4950
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• Pneumatic Tube System Market by System Type, System Configuration (Multiline, Single-Line, & Point-to-Point), Function (Fully Automatic & Semi-Automatic), End User (Medical and Healthcare, Commercial, & Industrial), and Region - Global Forecast to 2024

  The overall pneumatic tube system market is expected to grow from USD 1.9 billion in 2019 to USD 2.6 billion by 2024, at a CAGR of 6.9%. The growth of market is driven by factors such as demand for automation in material handling across industries, growing medical automation for reproducibility and accuracy, emerging e-commerce industry, and enhanced productivity enabled by improved supply chain processes. Thriving recycling and waste treatment worldwide and technological innovation with improved capabilities are expected to provide huge growth opportunities to players in the market. The report profiles the most promising players in the market. The market is highly dynamic because of the presence of a significant number of big and small players operating in it. Key players in the market are Aerocom Systems (Germany), Swisslog Holding (Switzerland), Pevco (US), Kelly Systems (US), Quirepace (UK), Eagle Pneumatic (US), Telecom Bedrijfscommunicatie (Netherlands), Siebtechnik (Germany), Hamilton Security (US), Airlink International (US), Hanazeder Electronic (Austria), Colombo Pneumatic Tube Systems (US), Hanter Ingenjörsteknik (Sweden), Oppent (Italy), S&S Engineering (Japan), Air-Log (Germany), Thalmayr (Austria), Zip Pneumatics (US), Lamson Group (US), and Sumetzberger (US).

  • Published: May 2019
  • Price: $ 4950
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• High Density Interconnect Market by Product (4–6 Layers HDI, 8–10 Layers HDI, and 10+ Layers HDI), End User (Automotive, Consumer Electronics, Telecommunications, Medical), Application, and Geography - Global Forecast to 2023

  The high density interconnect (HDI) market is expected to grow from USD 9.5 billion in 2018 to USD 16.9 billion by 2023, at a CAGR of 12.3% from 2018 to 2023. A few key factors driving the growth of this market are increasing adoption of advanced electronics and safety measures in the automotive vertical and growing demand for smart consumer electronics and wearable devices. Unimicron (Taiwan), Compeq Co. (Taiwan), TTM Technologies (US), Austria Technologie & Systemtechnik (Austria), Zhen Ding Tech. (Taiwan), IBIDEN (Japan), MEIKO ELECTRONICS Co. (Japan), FUJITSU INTERCONNECT TECHNOLOGIES (Japan), Tripod Technology Corp. (Taiwan), Unitech (Taiwan), SAMSUNG ELECTRO-MECHANICS (South Korea), Daeduck GDS Co (South Korea), DAP Corp. (South Korea), Korea Circuit (South Korea), CMK (Japan), NCAB Group (Sweden), SIERRA CIRCUITS (US), and Multek (Hong Kong) are among the major players in the HDI market.

  • Published: January 2019
  • Price: $ 4950
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• Substrate-Like PCB Market by Line/Spacing (25/25 & 30/30 µm and Less than 25/25 µm), Inspection Technology (Automated Optical Inspection, Direct Imaging, Automated Optical Shaping), Application, and Geography - Global Forecast to 2024

  The substrate-like PCB market is expected to grow from USD 1.1 billion in 2018 to USD 2.6 billion by 2024, at a compound annual growth rate (CAGR) of 15.6% during the forecast period. The high adoption of SLPs by leading OEMs, surge in demand for smart consumer electronics and wearable devices, and impactful benefits of SLPs are the major factors driving the growth of the substrate-like PCB market. AT&S (Austria); TTM Technologies (US); Samsung Electro-Mechanics (South Korea); Korea Circuit (South Korea); Kinsus Interconnect Technology (Taiwan); Zhen Ding Technology (Taiwan); Unimicron (Taiwan); Compeq (Taiwan); Ibiden (Japan); Daeduck Electronics (South Korea); ISU Petasys (South Korea); Tripod Technology Corporation (Taiwan); LG Innotek (South Korea) are major players in the substrate-like PCB market.

  • Published: January 2019
  • Price: $ 4950
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