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The global electronic design automation market is expected to grow from USD 14.5 billion in 2022 to USD 26.2 billion by 2028, at a compound annual growth rate (CAGR) of 9.8% during the forecast period.The Key players such as Cadence Design Systems, Inc. (US), Synopsys, Inc. (US), Siemens (Germany), ANSYS, Inc. (US), Keysight Technologies, Inc. (US), Advance Micro Device Inc. (US), eInfochips (US), Altium Limited (Australia), Zuken Inc. (Japan), Silvaco, Inc. (US).
The silicon photonics market is expected to grow from USD 1.3 billion in 2022 to USD 5.0 billion by 2028, at a compound annual growth rate (CAGR) of 28.5% during the forecast period.The Key Players Cisco Systems, Inc. (US), Intel Corporation (US), MACOM Technology Solutions (US), GlobalFoundries Inc. (US), Lumentum Operations LLC (US), Marvell Technology, Inc. (US), Coherent Corporation (US), International Business Machines Corporation (IBM) (US), STMicroelectronics N.V. (US), Rockley Photonics Holdings Limited (US).
The semiconductor manufacturing equipment market is expected to grow from USD 91.2 billion in 2023 to USD 149.8 billion by 2028, at a compound annual growth rate (CAGR) of 10.4% during the forecast period.The key players such as Tokyo Electron Limited (Japan); Lam Research Corporation (US); ASML (Netherlands); Applied Materials, Inc. (US); KLA Corporation (US); SCREEN Holdings Co., Ltd. (Japan); Teradyne, Inc. (US); Advantest Corporation (Japan); Hitachi, Ltd. (Japan); Plasma-Therm (US).
The 3D IC and 2.5D IC packaging market is expected to grow from USD 49.3 billion in 2023 to USD 82.0 billion by 2028, at a compound annual growth rate (CAGR) of 10.7% during the forecast period. The The key players Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), Intel Corporation (US), ASE Technology Holding Co., Ltd. (Taiwan), Amkor Technology (US), Broadcom (US), Texas Instruments Inc. (US), United Microelectronics Corporation (Taiwan), JCET Group Co., Ltd. (China) and Powertech Technology Inc. (Taiwan).
The millimeter wave technology market is expected to grow from USD 2.8 billion in 2023 to USD 7.9 billion by 2028, at a compound annual growth rate (CAGR) of 22.8% during the forecast period.The Major players Axxcss Wireless Solutions, Inc. (US), NEC Corporation (Japan), Siklu Communication (US), L3HARRIS Technologies, Inc. (US), Smiths Group PLC (UK), Millimeter Wave Products Inc. (US), Farran Technology (Ireland), Eravant (US), Keysight Technologies, Inc. (US), Avait Networks, Inc. (US), Vubiq Networks, Inc. (US), ELVA-1 (Latvia), Verana Networks (US), FastBack Networks (US), and Anokiwave (US).
The global silicon carbide market is expected to grow from USD 1.8 billion in 2022 to USD 11.1 billion by 2028, at a compound annual growth rate (CAGR) of 36.4% during the forecast period.The Key Players STMicroelectronics N.V. (Switzerland); Infineon Technologies AG (Germany); WOLFSPEED, INC. (North Carolina); ON Semiconductor Corporation (Arizona); ROHM Co., Ltd. (Kyoto).
The Raman spectroscopy market is expected to grow from USD 0.8 billion in 2023 to USD 1.1 billion by 2028, at a compound annual growth rate (CAGR) of 7.0 during the forecast period.The Key Players Thermo Fisher Scientific Inc. (US), Mettler Toledo (Switzerland), Agilent Technologies Inc. (US), Bruker (US), Renishaw Plc (UK), Rigaku Corporation (Japan), Oxford Instruments (UK), Endress+Hauser Group Services AG (Switzerland), HORIBA Ltd. (Japan), PerkinElmer Inc. (US), Hamamatsu Photonics K.K (Japan), Metrohm AG (Switzerland), Anton Paar GmbH (Austria), JASCO (Japan), Tornado Spectral Systems (Canada), Enhanced Spectrometry, Inc. (US), Zolix (China), Smiths Detection (UK), Ocean Insight (US), Ostec (US), TSI (US), Laser Detect System (Israel), Photon Systems, Inc. (US), B&W Tek (US), and Real Time Analyzers (US).
The global VCSEL market is expected to grow from USD 1.6 billion in 2023 to USD 2.9 billion by 2028, at a compound annual growth rate (CAGR) of 13.6% during the forecast period.The players such as Lumentum (US), Coherent Corporation (US), AMS Osram (Austria), TRUMPF (Germany), Broadcom (US), Leonardo Electronics (US), MKS Instruments (US), Santec (Japan), VERTILAS (Germany), Vertilite (China), Alight Technologies (Denmark), Inneos (US), IQE (UK), Thorlabs (UK), TT Electronics (UK), Ushio America (US), WIN Semiconductors (Taiwan), and Frankfurt Laser Company (Germany) among others.
The LiDAR market is expected to grow from USD 1.4 billion in 2023 to USD 3.7 billion in 2028, at a compound annual growth rate (CAGR) of 19.4% during the forecast period.The Key Players Leica Geosystems AG(Sweden), Trimble, Inc. (US), Teledyne Optech (Canada), FARO Technologies, Inc. (US),RIEGL Laser Measurement Systems GmbH (Austria), SICK AG (Germany), Quantum Spatial (US), Beijing SureStar Technology Co. Ltd. (China).
The automotive semiconductor market is expected to grow from USD 42.9 billion in 2022 to USD 70.0 billion by 2027, at a compound annual growth rate (CAGR) of 10.1% during the forecast period. The Major players Robert Bosch (Germany), Continental (Germany), Infineon Technologies (Germany), NXP Semiconductors (Netherlands), Sensata Technologies (US), Borgwarner, (US), Allegro Microsystems (US), DENSO (Japan), Analog Devices (US), ELMOS Semiconductor (Germany), STMicroelectronics (Switzerland), TE Connectivity (Switzerland), Onsemi (US), Renesas Electronics (Japan), ROHM Semiconductor (Japan), Aptiv (Ireland), CTS (US), Autoliv (Sweden), ZF Group (Germany), Quanergy (US), Toshiba (Japan), Magna International (Canada), Melexis (Belgium), Amphenol (US), and Valeo (France).
The non-volatile memory market is expected to grow from USD 74.6 billion in 2022 to USD 124.1 billion by 2027, at a compound annual growth rate (CAGR) of 10.7% during the forecast period. The key players SAMSUNG (South Korea), Western Digital Technologies, Inc. (US), KIOXIA Holdings Corporation (Japan), Micron Technology, Inc. (US), and SK HYNIX INC. (South Korea) among others. The other companies profiled in the report are Microchip Technology Inc. (US), ROHM CO., LTD. (Japan), Renesas Electronics Corporation (Japan), STMicroelectronics (US), Infineon Technologies AG (Germany), Nantero, Inc. (US), Crossbar Inc. (US), Everspin Technologies Inc. (US), Winbond (Taiwan), and Pure Storage, Inc. (US).
The global Silicon on Insulator market is expected to grow from USD 1.4 billion in 2022 to USD 2.9 billion by 2027, at a compound annual growth rate (CAGR) of 15.0% during the forecast period.The Key Players Soitec (France), Shin-Etsu Chemical (Japan), GlobalWafers (Taiwan), SUMCO Corporation (Japan), Shanghai Simgui Technology (China), GlobalFoundries (US), STMicroelectronics (Switzerland), Tower Semiconductor (Israel), NXP Semiconductors (Netherlands), Murata Manufacturing (Japan).
The global compound semiconductor market is expected to grow from USD 40.5 billion in 2022 to USD 55.8 billion by 2027, at a compound annual growth rate (CAGR) of 6.6% during the forecast period.The Key Players Nichia Corporation (Japan), Samsung Electronics Co., Ltd. (South Korea), ams OSRAM AG (Austria), Qorvo, Inc. (US), Skyworks Solutions, Inc. (US), Wolfspeed, Inc. (US), GaN Systems (Japan), Canon Inc. (Canada), Infineon Technologies AG (Germany), Mitsubishi Electric Corporation (Japan).
The global smart card IC market is expected to grow from USD 2.9 billion in 2022 to USD 3.9 billion by 2027, at a compound annual growth rate (CAGR) of 6.3% during the forecast period.The Key Players Infineon Technologies AG (Germany), NXP Semiconductors N.V. (Netherland), Samsung Electronics Co., Ltd. (South Korea), STMicroelectronics N.V. (Switzerland), Microchip Technology Incorporated (US), CEC Huada Electronic Design Co., Ltd. (China), Analog Devices, Inc. (US), Sony Group Corporation (Japan), Toshiba Corporation (Japan), and ON Semiconductor Corporation (US)
The piezoelectric devices market is expected to grow from USD 30.8 billion in 2022 to USD 41.0 billion by 2027, at a compound annual growth rate (CAGR) of 5.9% during the forecast period.The Key Players CeramTec GmbH (Germany); CTS Corporation (US); Kistler Group (Switzerland); Physik Instrumente (PI) GmbH & Co. KG. (Germany); piezosystem jena GmbH (Germany); Piezo Technologies (US); Noliac A/S (Denmark); Aerotech Inc. (US); APC International, Ltd., (US); Mad City Labs, Inc. (US) are among the leading companies in the piezoelectric devices market. Apart from these, Kinetic Ceramics (US), Johnson Matthey Piezo Products GmbH (Germany), PI Ceramic (Germany), Piezo Solutions (US), DYTRAN INSTRUMENTS INCORPORATED (US), Piezomechanik Dr. Lutz Pickelmann GmbH (Germany), PiezoMotor (Sweden), PCB Piezotronics, Inc. (US).
The thin wafer market is expected to grow from USD 11.4 billion in 2022 to USD 20.6 billion by 2027, at a compound annual growth rate (CAGR) of 12.5% during the forecast period.The Key Players Shin-Etsu Chemical Co., Ltd. (Japan), SUMCO Corporation (Japan), GlobalWafers Co., Ltd. (Taiwan), Siltronic (Germany), SK Siltron (South Korea), SUSS MicroTec (Germany), Soitec (France), DISCO Corporation (Japan), 3M (US), and Applied Materials (US). Apart from these, Mechatronic Systemtechnik (Austria), Synova (Switzerland), EV Group (Austria), Wafer Works Corporation (Taiwan), Atecom technology Co., Ltd. (Taiwan), Siltronix Silicon Technologies (France), LDK Solar (China), UniversityWafer, Inc. (US).
The ALD Equipment Market is expected to grow from USD 4.1 billion in 2021 to USD 6.0 billion by 2027, at a compound annual growth rate (CAGR) of 8.2% during the forecast period.The key players ASM International N.V. (Netherlands), Tokyo Electron Limited (Japan), Applied Materials, Inc. (US), Lam Research Corporation (US), Veeco Instruments Inc. (US), Kurt J. Lesker Company (US), Optorun Co., Ltd. (Japan), CVD Equipment Corporation (US), Eugene Technology Co. Ltd. (South Korea), and Beneq (Finland).
The molded interconnect device (MID) market is expected to grow from USD 1.4 billion in 2022 to USD 2.7 billion by 2027, at a compound annual growth rate (CAGR) of 22.9% during the forecast period.The key players device (MID) market and analyzes their market shares. Players profiled in this report are Molex (US), TE Connectivity (Switzerland), Amphenol Corporation (US), LPKF Laser & Electronics (Germany), and Taoglas (Dublin), Harting (Germany), Arlington Plating Company (US), MID Solutions (Germany), 2E Mechatronic (Germany), KYOCERA AVX (US) and Johnan (Japan), Teprosa(Germany), Sunway Communication(China), Axon Cable(France), S2P (France), Suzhou Cicor Technology (China), TactoTek (Finland), DuraTech (US), Tekra (US), Yomura Technologies (Taiwan), MacDermid Alpha Electronics (US), Galtronics (US), Yazaki Corporation (Japan), Chogori Technology (Japan), Suzhou Zeeteq Electronics (Japan), Toyo Connectors (Japan) and SINOPLAST (China).
The global supercapacitor market is expected to grow from USD 472 million in 2022 to USD 912 million by 2027, at a compound annual growth rate (CAGR) of 14.1% during the forecast period.The top players Panasonic Industry(Japan), Eaton(Ireland), Nippon Chemi-Con(Japan), Maxwell Technologies(South Korea), and Cap-XX(Australia)
The global RF tunable filter market is projected to reach USD 168 million by 2027, at a CAGR of 10.8% during the forecast period. Analog Devices, Inc. (US), Dover Corporation (US), Smiths Group plc (UK), The LGL Group, Inc. (US), EXFO Inc. (Canada), DiCon Fiberoptics, Inc. (US), Netcom, Inc. (US), RF Products Inc. (US), Telonic Berkeley Corporation (US), and Coleman Microwave Company (US) are some of the key players in the RF tunable filter market.
The global DRAM module and components market size is expected to reach USD 110.7 billion by 2027, at a CAGR of 1.2% during the forecast period. Some of the key companies operating in the DRAM module and components market are Samsung Electronics Co., Ltd. (South Korea), SK Hynix Inc. (South Korea), Micron Technology, Inc. (US), Nanya Technology Corporation (Taiwan), Winbond Electronics Corporation (Taiwan), Powerchip Technology Corporation (Taiwan), ADATA Technology Co. Ltd. (Taiwan), Ramaxel Technology (Shenzhen) Co, Ltd (China), Kingston Technology Corporation (US), SMART Modular Technologies (US), and so on.
According to MarketsandMarkets, the multilayer ceramic capacitor (MLCC) market is projected to reach USD 26.6 billion by 2027, it is expected to grow at a Compound Annual Growth Rate (CAGR ) CAGR of 13.8% during the forecast period. Key players in the MLCC market are Murata (Japan), Samsung Electro-Mechanics (South Korea), TAIYO YUDEN (Japan), YAGEO (Taiwan), Walsin Technology (Taiwan), TDK (Japan), Vishay Intertechnology (US), Kyocera (Japan), Darfon Electronics (US), Samwha Capacitor Group (South Korea), Nippon Chemi-Con (Japan), MARUWA (Japan), Fujian Torch Electron Technology (China), Holy Stone Enterprise (Taiwan), and Knowles (US). SMEs/startups covered in the study are CalRamic Technologies (US), Viking Tech (Taiwan), Würth Elektronik Group (Germany), Exxelia (France), Johanson Dielectrics (US), NIC Components (US), Kingtronics Kt (Hong Kong), Semec (China), Shanghai Yongming Electronic (YMIN) (China), EYANG Technology Development (China), and Fenghua Advanced Technology (Hong Kong).
The global ANPR system market is expected to grow from USD 3.1 billion in 2022 to USD 4.8 billion by 2027, at a compound annual growth rate (CAGR) of 9.2% during the forecast period.The major players Kapsch TrafficCom (Austria), Siemens (Germany), Conduent, Inc. (US), HikVision (China), Q-Free ASA (Norway), Genetec, Inc. (Canada), Adaptive Recognition (Hungary), Jenoptik Group (Germany), Axis Communications (Sweden), and Nedap (Netherlands).
The Ultra-low-power microcontroller market is projected to reach USD 7.9 billion by 2027, it is expected to grow at a CAGR of 10.3% during the forecast period. The key players operating in the ultra-low-power microcontroller market include are Texas Instruments (US), Microchip Technology (US), STMicroelectronics (Switzerland), Renesas Electronic Corporation (Japan), and Infineon Technologies AG (Germany).
The semiconductor intellectual property (IP) market is expected to grow from USD 5.5 billion in 2021 to USD 7.2 billion by 2026, at a CAGR of 5.4% during the forecast period. Major players in the semiconductor IP market include Arm Holdings Ltd (UK), Synopsys Inc(US), Cadence Design Systems, Inc (US) Imagination Technologies Ltd (UK), CEVA Inc (US),Lattice Semiconductor Corporation (US), Rambus Inc(US), eMemory Technology, Inc (Taiwan), Silicon Storage Technology, Inc (US) and VeriSilicon Microelectronics Co., Ltd. (China) among others.
The global fiber optic components market is expected to reach USD 37.5 billion by 2027; it is expected to grow at a CAGR of 8.9% during the forecast period. Key players in the fiber optic components market are II-VI Incorporated (US), Lumentum Holdings Inc. (US), Broadcom Inc. (US), Sumitomo Electric Industries (Japan), Accelink Technologies (China), Oclaro (US), Acacia Communications, Inc. (US), EMCORE Corporation (US), Fujitsu Optical Components (Japan), and Furukawa Electric (Japan). Many of these companies focus on adopting both organic and inorganic growth strategies, such as product launches and developments, expansions, acquisitions, alliances, and collaborations to strengthen their position in the market.
The Microwave Devices Market is expected to grow from USD 6.7 billion in 2021 to USD 9.0 billion by 2027, at a CAGR of 5.1% during the forecast period. The key players operating in the Microwave Devices market include Thales Group (France), L3 Harris, Technologies, Inc. (US), Teledyne Technologies Incorporated (US), Qorvo, Inc. (US), and CPI International, Inc. (US).
The silicon photomultiplier market is expected to reach USD 173 million by 2026, at a CAGR of 7.6% during the forecast period. Some of the key companies operating in the market are ON Semiconductor (US), Broadcom (US), Hamamatsu Photonics (Japan), First Sensor (Germany), KETEK GmbH (Germany), AdvanSiD (Italy), Cremat (US), Excelitas Technologies (US), and so on.
The power electronics market is expected to grow from USD 37.4 billion in 2021 to USD 46.3 billion by 2026, at a CAGR of 4.4% during the forecast period. Major vendors in the power electronics market include Infineon Technologies (Germany), ON Semiconductor (US), STMicroelectronics (Switzerland), Mitsubishi Electric (Japan), Vishay Intertechnology (US), Fuji Electric (Japan), NXP Semiconductors (Netherlands), Renesas Electronics (Japan), Texas Instruments (US), Toshiba (Japan), ABB (Switzerland), GaN Systems (Canada), Littelfuse (US), Maxim Integrated (US), Microchip (US), ROHM (Japan), SEMIKRON (Germany), Transphorm (US), UnitedSiC (US), and Wolfspeed, A Cree Company (US), Euclid Techlabs (US), GeneSiC (US), EPC (US), Analog Devices (US), and Hitachi (Japan).
The global semiconductor bonding market size is projected to reach USD 1,059 million by 2026; it is expected to grow at a CAGR of 3.6% during the forecasting period. The semiconductor bonding market is dominated by a few globally established players such as Intel Corporation (US), Google. Inc (US), NVIDIA Corporation (US), Xilinx Inc. (US), IBM Corporation (US), Advanced Micro Devices, Inc (US), Marvell Technology (Hamilton), and Qualcomm Technology (US).
According to MarketsandMarkets, the optical transceiver market is projected to reach USD 14.3 billion by 2026; it is expected to grow at a Compound Annual Growth Rate (CAGR) of 15.2% during the forecasting period. The key players in the optical transceiver market include II-VI (US), Broadcom (US), Lumentum (US), Sumitomo Electric industries (Japan), Accelink (China), Smartoptics (Norway), Infinera (US), Fujitsu optical Components (Japan), Hisense Broadband (China), Huawei (China), Innolight (China), Ciena (US), Mellanox (US) (the company was acquired by Nvidia in April 2020), Applied Optoelectronics (US), Amphenol (US), Intel (US), NEC (Japan), Cisco (US), NeoPhotonics (US), Perle Systems (Canada), FOCI (Taiwan), Source Photonics (US), Solid Optics (US), Eoptolink (China), and Reflex Photonic (Canada) (the company was acquired by Smiths Interconnect (US) in November 2019). uSenlight (Taiwan), and Precision Optical Transceivers (US), POET Technologies (US), ProLabs (US), Elenion Technologies (US), HRB Technologies (India), and Alpine Optoelectronics (China) are few startup companies that provide such type of transceivers.
The metamaterial market is projected to reach USD 1,457 million by 2026. It is expected to grow at a CAGR of 36.7% during the forecast period. A few of the key players in the metamaterial market are Kymeta Corporation (US), Metamaterial Technologies Inc. (Canada), Metamagnetics (US), Jem Engineering (US), Teraview (UK), Echodyne Inc. (US), Multiwave (Europe), Nanohmics Inc. (US), Metashield LLC (US), and Mediwise (UK).
The Micro Server IC Market is expected to grow from USD 1.2 billion in 2021 to USD 2.2 billion by 2026, at a CAGR of 12.6% during the forecast period. Intel Corporation (US), Advanced Micro Devices, Inc. (US), Hewlett Packard Enterprise Development LP (US), Quanta Computer Inc. (Taiwan), NVIDIA Corporation (US), Ambedded Technology Co., Ltd. (Taiwan), Dell Inc. (US), Fujitsu (Japan), Marvell (US), Super Micro Computer Inc. (US), Ampere Computing LLC. (US), Bamboo (UK), christmann informationstechnik + medien GmbH & Co. KG (Germany), HIRO micro data centers (Netherlands), Huawei Technologies Co. Ltd. (China), IBM (US), Lattice Semiconductor (US), NXP Semiconductors (Netherlands), SiPearl (France), and STMicroelectronics (Switzerland) are some of the key players in the micro server IC market.
The photolithography equipment market is projected to reach USD 18.0 billion by 2025; it is expected to grow at a CAGR of 9.1% during the forecast period. The companies profiled in this report are ASML (Netherland), Canon (Japan), Nikon (Japan), NuFlare Technology (Japan), Onto Innovations (US), Veeco Instrument (US), SUSS Microtek (Germany), NXQ (US), EV Group (US).
The Crystal Oscillator Market is expected to grow from USD 2.8 billion in 2020 to USD 3.1 billion by 2025, at a CAGR of 2.1% during the forecast period. Seiko Epson Corporation (Japan), Nihon Dempa Kogyo Co., Ltd. (Japan), TXC Corporation (Taiwan), KYOCERA Crystal Device Corporation (Japan), Daishinku Corp. (Japan), Microchip Technology Inc. (US), Murata Manufacturing Co., Ltd. (Japan), Hosonic Electronic Co., Ltd. (Taiwan), SiTime Corporation (US), and Siward Crystal Technology Co., Ltd. (Taiwan), are some of the key players in the crystal oscillator market.
The audio codec market is expected to reach USD 7.8 billion in 2025, at a CAGR of 5.5% during the forecasting period. Key players in the audio codec market include Cirrus Logic (US), Qualcomm (US) and Realtek Semiconductor (Taiwan). Cirrus Logic is a well-known player for providing innovative and customized audio codec solutions and products in the audio market. Strong brand name and customer base are among the key factors that resulted in the leading position of Qualcomm in the market. Apart from the strong brand name and customer base, the company has strong R&D capabilities and geographic presence. Qualcomm focuses on strategies such as product launches and product development to strengthen its product portfolio and maintain its position in the audio codec market.
The Magnetic Refrigeration Market is expected to grow from USD 4 million by 2022 to USD 165 million by 2027, at a CAGR of 105.4% during the forecast period. Ubiblue (France), Haier Smart Home Co., Ltd (China), Camfridge Ltd (UK), Astronautics Corporation of America (US), VACUUMSCHMELZE GmbH & Co. KG (Germany), BASF SE (Germany), ERAMET (France), Samsung Electronics Co., Ltd (South Korea), Toshiba Corporation (Japan), Whirlpool Corporation (US), MagnoTherm Solutions (Germany), Millipore Sigma (US), General Engineering and Research (US), KIRSCH (Germany), CCS SA (Switzerland), TCS Micropumps Ltd (UK), Kiutra (Germany) and Cemafroid (France) are among a few of the key players in the magnetic refrigeration market.
The Microprocessor and GPU Market is expected to grow from USD 103.0 billion in 2020 to USD 138.2 billion by 2025, at a CAGR of 6.1% during the forecast period. Intel (US), Samsung (South Korea), Qualcomm (US), Nvidia (US), AMD (US), MediaTek (Taiwan), Broadcom (US), Texas Instruments (US), IBM (US), and Marvell (Bermuda) are the key players in the global microprocessor and GPU market. These players are increasingly undertaking strategies such as product launches and development, expansions, partnerships, collaborations, joint-ventures, and acquisitions to increase their market share.
The Hermetic Packaging Market is expected to grow from USD 3.5 billion in 2020 to USD 4.3 billion by 2025, at a CAGR of 4.3% during the forecast period. The key players operating in the hermetic packaging market include SCHOTT (Germany), AMETEK, Inc. (US), Amkor Technology, Inc. (US), Texas Instruments Incorporated (US), Teledyne Technologies (US), Kyocera Corporation (Japan), Materion Corporation (US), Egide (France), Micross Components Inc. (US), and Legacy Technologies Inc. (US).
The 3D machine vision market was valued at USD 1.5 billion in 2020 and is projected to reach USD 2.4 billion by 2025; it is expected to grow at a CAGR of 9.4% from 2020 to 2025. The key players in the ecosystem of the 3D machine vision market profiled in this report are OMRON Corporation (Japan), Keyence Corporation (Japan), Cognex Corporation (US), Basler AG (Germany), National Instruments (US), ISRA Vision AG (Germany), TKH group (Netherlands), Stemmer Imaging (Germany), MVTec Software GmbH (Germany), and Tordivel AS (Norway). These players have adopted various growth strategies, such as product launches, acquisitions, partnerships, and agreements, to expand their presence in the global machine vision market further. Acquisitions and new product launches and developments have been the most dominating strategies adopted by major players from January 2017 to May 2020, which helped them to innovate on their product offerings, cope up with the COVID-19 outbreak and broaden their customer base.
The global wafer cleaning equipment market is expected to reach USD 11.2 billion by 2025, at a CAGR of 9.9% during the forecasting period. The report profiles key players, including SCREEN Holdings Co., Ltd. (Japan), Tokyo Electron Limited (Japan), Applied Materials (US), LAM Research (US), Shibaura Mechatronics Corporation (Japan), PVA TePLA AG (Germany), Entregris Inc., (US), Semes Co. Ltd. (US), Modutek Corporation (Japan), and Veeco Instruments (US). These companies focus on adopting both organic and inorganic growth strategies, such as new product launches, partnerships, agreements, mergers and acquisitions, and expansions to strengthen their position in the market.
The Embedded System Market is expected to grow from USD 86.5 billion in 2020 to USD 116.2 billion by 2025, at a CAGR of 6.1% during the forecast period. Intel (US), Renesas (Japan), STMicroelectronics (Switzerland), NXP Semiconductors (Netherlands), Texas Instruments (US), Microchip (US), Cypress Semiconductors (US), Qualcomm (US), Analog Devices (US), and Infineon Technologies (Germany) are the key players operating in the embedded system market. These players are increasingly undertaking strategies such as product launches, expansions, agreements, joint ventures, partnerships, collaborations, mergers, and acquisitions to increase their market share.
The global RF semiconductor market is expected to reach USD 26.2 billion by 2025, at a CAGR of 8.5% during the forecasting period. Major players in the RF semiconductor industry include Qorvo (US), Skyworks (US), Qualcomm (US), Analog Devices (US), NXP Semiconductors (Netherlands), Cree (US), MACOM (US), Microchip Technology (US), Murata Manufacturing (Japan), and Texas Instruments (US).
The global IGBT market size is estimated to grow from USD 5.3 billion in 2020 to USD 6.6 billion by 2025, at a CAGR of 4.6%. On the other hand, the global thyristor market size is estimated to grow from USD 781 million in 2020 to USD 849 million by 2025; at a CAGR of 1.7% during the forecasting period. Infineon Technologies AG (Germany), Fuji Electric Co., Ltd. (Japan), ON Semiconductor (US), Mitsubishi Electric Corporation (Japan), and STMicroelectronics (Switzerland) are the key players in the IGBT & thyristor market. These players are increasingly undertaking strategies such as product launches, partnerships, collaborations, contracts, agreements, acquisitions, and expansions to increase their market share.
The Non-volatile Memory Express (NVMe) Market is expected to grow from USD 44.6 billion in 2020 to USD 163.5 billion by 2025, at a CAGR of 29.7% during the forecast period. Samsung Electronics Co., Ltd. (Samsung) (South Korea), Western Digital Corporation (Western Digital) (US), Intel Corporation (Intel) (US), Dell EMC (US), Hewlett Packard Enterprise (HPE) (US), Broadcom Inc. (Broadcom) (US), Micron Technology, Inc. (Micron Technology) (US), Cisco Systems, Inc. (Cisco) (US), Toshiba Corporation (Toshiba) (Japan), and NetApp, Inc. (NetApp) (US) are the prominent players in the NVMe market.
The Die Bonder Equipment Market is expected to grow from USD 820 million in 2019 to USD 972 million by 2024, at a CAGR of 3.5% during the forecast period. BE Semiconductor Industries N.V. (Netherlands), ASM Pacific Technology Ltd. (Singapore), Kulicke & Soffa (Singapore), Mycronic AB (Sweden), Palomar Technologies, Inc. (US), West·Bond, Inc. (US), MicroAssembly Technologies, Ltd. (Israel), Finetech GmbH & Co. KG (Germany), Dr. Tresky AG (Switzerland), Smart Equipment Technology (France) are the key players in the die bonder equipment market. These players are increasingly undertaking strategies such as product launches, expansions, agreements, partnerships, collaborations, and acquisitions to increase their market share.
The Ion Milling System Market is expected to grow from USD 1.5 billion in 2019 to USD 2.3 billion by 2024, at a CAGR of 8.5% during the forecast period. Key players in the market include Veeco Instruments Inc. (US), Leica Microsystems Gmbh (Germany), Hitachi High-Technologies Corporation (Japan), Gatan, Inc. (US), Intlvac Thin Film Corporation (US), AJA International Inc. (US), Nano-Master, Inc. (US), Nordiko Technical Services Ltd. (UK), scia Systems GmbH (Germany), and Technoorg Linda co. ltd. (Hungary).
The overall pneumatic tube system market is expected to grow from USD 1.9 billion in 2019 to USD 2.6 billion by 2024, at a CAGR of 6.9%. The growth of market is driven by factors such as demand for automation in material handling across industries, growing medical automation for reproducibility and accuracy, emerging e-commerce industry, and enhanced productivity enabled by improved supply chain processes. Thriving recycling and waste treatment worldwide and technological innovation with improved capabilities are expected to provide huge growth opportunities to players in the market. The report profiles the most promising players in the market. The market is highly dynamic because of the presence of a significant number of big and small players operating in it. Key players in the market are Aerocom Systems (Germany), Swisslog Holding (Switzerland), Pevco (US), Kelly Systems (US), Quirepace (UK), Eagle Pneumatic (US), Telecom Bedrijfscommunicatie (Netherlands), Siebtechnik (Germany), Hamilton Security (US), Airlink International (US), Hanazeder Electronic (Austria), Colombo Pneumatic Tube Systems (US), Hanter Ingenjörsteknik (Sweden), Oppent (Italy), S&S Engineering (Japan), Air-Log (Germany), Thalmayr (Austria), Zip Pneumatics (US), Lamson Group (US), and Sumetzberger (US).
The high density interconnect (HDI) market is expected to grow from USD 9.5 billion in 2018 to USD 16.9 billion by 2023, at a CAGR of 12.3% from 2018 to 2023. A few key factors driving the growth of this market are increasing adoption of advanced electronics and safety measures in the automotive vertical and growing demand for smart consumer electronics and wearable devices. Unimicron (Taiwan), Compeq Co. (Taiwan), TTM Technologies (US), Austria Technologie & Systemtechnik (Austria), Zhen Ding Tech. (Taiwan), IBIDEN (Japan), MEIKO ELECTRONICS Co. (Japan), FUJITSU INTERCONNECT TECHNOLOGIES (Japan), Tripod Technology Corp. (Taiwan), Unitech (Taiwan), SAMSUNG ELECTRO-MECHANICS (South Korea), Daeduck GDS Co (South Korea), DAP Corp. (South Korea), Korea Circuit (South Korea), CMK (Japan), NCAB Group (Sweden), SIERRA CIRCUITS (US), and Multek (Hong Kong) are among the major players in the HDI market.
The substrate-like PCB market is expected to grow from USD 1.1 billion in 2018 to USD 2.6 billion by 2024, at a compound annual growth rate (CAGR) of 15.6% during the forecast period. The high adoption of SLPs by leading OEMs, surge in demand for smart consumer electronics and wearable devices, and impactful benefits of SLPs are the major factors driving the growth of the substrate-like PCB market. AT&S (Austria); TTM Technologies (US); Samsung Electro-Mechanics (South Korea); Korea Circuit (South Korea); Kinsus Interconnect Technology (Taiwan); Zhen Ding Technology (Taiwan); Unimicron (Taiwan); Compeq (Taiwan); Ibiden (Japan); Daeduck Electronics (South Korea); ISU Petasys (South Korea); Tripod Technology Corporation (Taiwan); LG Innotek (South Korea) are major players in the substrate-like PCB market.