The thermally conductive filler dispersants market is projected to reach USD 0.4 billion by 2028, at a CAGR of 10.2% from USD 0.3 billion in 2023. The growth of the global thermally conductive filler dispersants market is driven by the need for efficient heat dissipation in various industries and the development of new and improved materials with higher thermal conductivity. In addition, the demand for these dispersants is driven by various industries such as electronics, automotive, healthcare, aerospace, and telecommunication for heat dissipation applications.
The key global players in the thermally conductive filler dispersants market are BYK (Germany), Shin-Etsu Chemical (Japan), Dow Chemical Company (US), JNC Corporation (Japan), Momentive Performance Materials (US), Kusumoto Chemicals (Japan), Evonik (Germany), Croda International (UK), Lubrizol Corporation (US), and Wacker Chemie (Germany) among others. These companies are strong in their home regions and explore geographic diversification alternatives to grow their businesses. They focus on increasing their market shares through new product launches and other expansions.
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BYK is a division of the ALTANA Group that is globally successful in the additives & instruments industry. The company offers a wide range of products such as surface additives, rheology additives, defoamers and air release additives, processing additives, viscosity reducers, wax additive, and wetting & dispersing additives for coating & printing inks, plastics, adhesives & sealants, cleaners, floor coating, lubricants, construction chemistry, oil & gas, and foundry industry. The company provides its products under two segments, namely, additives for industrial applications and instruments. It offers conductive filler dispersants for thermal interface material under the additives for industrial applications segment. It operates in Asia, Europe, and Americas. The company has eight subsidiaries and 18 production facilities worldwide.
In October 2022, BYK launched BYK-MAX CT 4275, is a specially developed additives that can be used in a wide variety of polyamides and thermoplastic. BYK-MAX CT 4275 is used to enhance the performance of thermal interface materials by improving the dispersion and incorporation of the additive into the thermoplastic matrix, resulting in improved thermal conductivity and mechanical properties.
Shin-Etsu Co. Ltd is a leading manufacturer of silicone-based thermal interface materials (TIMs) that fill the gaps between heat generating components and heat sinks, providing an optimal heat dissipation solution tailored to the required usage and performance from a wide range of product lineups. The company has developed silicone thermal interface materials for applications in electric vehicles and hybrid electric vehicles. The company provides its product in four segments including infrastructure materials, electronics materials, functional materials, and processing & specialized services. The company offers conductive filler dispersants for thermal interface materials market under electronics materials segment. It operates in Europe, Americas, Asia, and Middle East & Africa. The company has 60 manufacturing facilities present in 34 countries.
In April 2022, Shin-Etsu Co. Ltd. developed thermal interface silicone rubber sheet series (TC-BGI Series) for use in components of electric vehicles as the technology for high voltage devices advances. It is a hard, thermal-interface silicone rubber sheet that combines good levels of voltage resistance and heat dissipation.
Thermally Conductive Filler Dispersants Market by Dispersant Structure Type (Silicone-Based, Non-Silicone Based), Filler Material (Ceramic, Metal, Carbon-Based), Application (Thermal Insulation Glue), End-Use Industry, & Region - Global Forecast to 2028
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