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3. Wired Interface Companies - Cypress Semiconductor Corp. (The US) and Molex, Inc. (The US) are the Leading Key Players

The wired interface market was valued at 6.30 billion units in 2017 and is expected to reach 8.78 billion units by 2023, at a CAGR of 6.2% during the forecast period. The said market was valued at USD 17.87 billion in 2018, and is expected to reach USD 34.72 billion by 2023, at a CAGR of 14.2% between 2018 and 2023. The market has been segmented based on component type, device, and geography.

Major Wired Interface companies include: 

• Molex, Inc. (The US),
• Amphenol Corporation (The US),
• Japan Aviation Electronics Industry, Ltd. (Japan),
• TE Connectivity Ltd. (Switzerland),
• STMicroelectronics N.V. (Switzerland),
• NXP Semiconductors N.V. (The Netherlands),
• Microchip Technology Inc. (The US),
• Texas Instruments Inc. (The US),
• Cypress Semiconductor Corp. (The US),
• Rohm Co., Ltd. (Japan),
• Hirose Electric Co., Ltd. (Japan),
• ON Semiconductor Corporation (The US)

Product launches and product developments have been the key strategies adopted by companies to strengthen their businesses and gain a competitive edge in the wired interface market. These strategies collectively accounted for a share of 90% of the overall growth strategies adopted by key market players between January 2015 and February 2018. In addition to product launches and product developments, companies in the wired interface market have also adopted certifications and partnerships to enhance their product portfolios and expand their sales and distribution networks. These strategies helped the companies significantly increase their market shares and strengthen their positions in the overall wired interface market. These strategies collectively accounted for a share of 10% of the overall growth strategies adopted by key market players between January 2015 and February 2018.

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Global footprint and diversified market presence of Molex Inc. are its key strengths in the wired interface market. The company is continuously developing new products in the wired interface market to establish its leading position in the market. In recent years, the company registered strong growth related to the automotive industry in North America, Europe, and Asia Pacific owing to its USB-based interface solutions. The company intends to collaborate with automotive suppliers to embed its wired interface solutions for connected automotive applications. Furthermore, the company has started to investigate the possible use of its wired interface portfolio in other applications such as drones and consumer devices. Thus, in coming years, the company is expected to focus on diversifying its product use for different applications through partnering with other stakeholders, respectively. In February 2018, Molex Inc. partnered with INVECAS Inc. to develop automotive infotainment media modules, which can be used for advanced automotive applications.  

Cypress Semiconductor Corp. provides a range of USB offering such as controllers, hub and Power Delivery products to its consumer devices end-users globally. Further, it has created an excellent client base of consumer devices manufacturers over the span of 20 years. In recent years, the company has focused on diversifying its USB product application into automotive and IoT devices. Furthermore, the company focuses on improving its product launch efforts through investing more in R&D activities. Thus, this has helped the company to market its product in less time as compared to its competitors. In March 2018, Cypress Semiconductor Corp. launched the EZ-PD™ CCG3PA controller that supports the PD 3.0 standard with programmable power supply (PPS) and Qualcomm’s Quick Charge (QC) 4.0 protocol, which enable new power source product designs to provide improved fast-charging user experience.

Related Reports:

Wired Interface Market by Component Type (USB (USB TYPE C, and Other USB TYPE), HDMI, Thunderbolt, and DisplayPort), Device, and Geography (North America, Europe, Asia Pacific, and Rest of the World) - Global Forecast to 2023

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