Electrical & Electronics Composites Market worth $16.01 billion by 2030
The report "Electrical & Electronics Composites Market by Fiber Type (Glass Fiber Composites, Carbon Fiber Composites, Natural Fiber Composites), Resin Type (Thermoset Composites, Thermoplastic Composites), Manufacturing Process (Lay-up, Compression Molding, Injection Molding, RTM, Filament Winding, Pultrusion), and Region- Global Forecast to 2030", is expected to reach USD 16.01 billion by 2030 from USD 10.56 billion in 2025, at a CAGR of 8.7% from 2025 to 2030
Browse 170 market data Tables and 60 Figures spread through 250 Pages and in-depth TOC on "Electrical & Electronics Composites Market by Fiber Type (Glass Fiber Composites, Carbon Fiber Composites, Natural Fiber Composites), Resin Type (Thermoset Composites, Thermoplastic Composites), Manufacturing Process (Lay-up, Compression Molding, Injection Molding, RTM, Filament Winding, Pultrusion), and Region- Global Forecast to 2030"
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The electrical and electronics composites market is registering significant growth as various industries gradually transition towards lighter and more thermally stable materials with higher strength. The global market is being driven by factors such as rapid miniaturization, developments in 5G technologies, and a growing number of electric and renewable energy technologies, among others. The market growth and competition are also driven by factors that include significant fluctuations due to changes in market forces and raw materials, emphasizing appropriate product and market forecasting. Several market forces will be constantly monitored and tracked, with market changes measured and quantified.
In 2024, glass fiber accounted for the largest share in terms of value in the electrical & electronics composites market.
The largest share of the electrical/electronic composites market continues to be held by glass fibre because of the balance of performance, cost, and compatibility with many types of resin systems it provides. For electrical/electronic rigid composite manufacturers and users, the key reasons for the major use of glass fibre are its exceptional moisture, electrical workplace insulation and long-term reliability, due to the stresses and voltage fluctuations electrical components face on a continual basis. Another reason for the use of glass fibre is that it can be molded into complex shapes while retaining the structural properties required for use as a protective component, PCB substrate, electrical housing and electrical insulator.
The Thermoset resin type is expected to dominate the market terms of value in the electrical & electronics composites market during the forecasted period.
Electric and electronic composite markets are dominated by thermoset resins due to their superior performance for thermal and electrical stresses over time and their critical application in both high-tech and safety-sensitive applications when high precision is required (this is why thermosetting materials must be specified as part of high-tech or safety-sensitive applications). Crosslinked molecular structures create durability and dimensional stability (excluding mechanical deformation due to wear) even in extreme environmental conditions, such as those associated with encapsulations, printed circuit boards, bushings and insulation, etc. Additionally, the high chemical resistance of thermoset resins and the fact that thermoset resins do not soften when exposed to thermal loads allows thermoset resins to outperform other resin types used in long-term applications.
In 2024, compression molding manufacturing process accounted for the third-largest share in terms of value in the electrical & electronics composites market.
Compression molding holds the third-largest share of the electrical and electronics composites market because it produces high-volume, cost-efficient components with consistent quality. This process is particularly popular for making parts like electrical connectors, switchgear components, insulators, and protective casings. In these applications, durability, dimensional precision, and uniform mechanical strength are crucial. Its capacity to handle a variety of thermoset and thermoplastic materials allows manufacturers to customize products for specific electrical performance needs. Additionally, compression molding has shorter cycle times and lower tooling costs compared to other processes, which makes it appealing for mid- to large-scale production.
Europe accounts for the third-largest share of the electrical & electronics composites Market.
The electrical and electronics composites market has a large presence in Europe, where there is growing demand for many industries where electrical and electronic equipment is extensively used (Power Transmission Industry, Automotive Electronics Industry, etc.). The major factors contributing to the growth of European electrical and electronic composites are: A well-developed Infrastructure Network (Manufacturing), along with Robust Research and Development Capabilities (RD), with an ever-increasing emphasis on the use of lightweight, energy-efficient Composite Materials in the Electric Vehicle Sector.
Overall, although Europe has somewhat slower growth rates than the Asia-Pacific region and North America, due to the strength and being well-established in the Electrical and Electronic Composite Manufacturing Industry, as well as strong Manufacturing Capabilities and an increasing Trend towards Lightweight Materials. The focus on and adoption of Composite Materials in the Electrical and Electronic Industries will continue to increase in the coming years.
Key Players
Prominent companies include Toray Industries, Inc. (Japan), Teijin Limited (Japan), Mitsubishi Chemical Holdings Corporation (Japan), Owens Corning (US), Hexcel Corporation (US), SGL Group (Germany), Nippon Electric Glass Co. Ltd. (Japan), Huntsman International LLC. (US), and Solvay (Belgium).
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