Board-to-Board Connectors Suppliers

The global board-to-board connector market is projected to grow from USD 12.42 billion in 2025 to USD 16.05 billion by 2030, at a CAGR of 5.3% during the forecast period. The demand for board-to-board connectors is growing due to the increasing miniaturization and high-density electronic designs in consumer electronics, automotive, and industrial automation sectors. As devices become smaller yet more powerful, these connectors enable compact, reliable interconnections between PCBs while maintaining signal integrity and mechanical stability. The rise of 5G, IoT, and AI-powered systems further drives the demand for high-speed, high-frequency connectors. Additionally, electric vehicles and smart manufacturing equipment require robust connectors that support higher currents and data rates, fueling adoption. Their modularity, design flexibility, and suitability for automated assembly also make them essential in modern electronic systems.

Some key players in the board-to-board connector market include TE Connectivity (Ireland), Amphenol Corporation (US), Hirose Electric Co., Ltd. (Japan), Molex (US), and Japan Aviation Electronics Industry, Ltd. (Japan). These players have employed organic and inorganic growth strategies, including collaborations, product launches, and partnerships, to expand their international footprint and capture a larger share of the board-to-board connector market.

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Major Board-to-Board Connector Companies Include:

• TE Connectivity (Ireland)
• Amphenol Corporation (US)
• Hirose Electric Co Ltd. (Japan)
• Molex (US)
• Japan Aviation Electronics Industry, Ltd. (Japan)
• Samtec (US)
• CSCONN Corporation (China)
• Omron Corporation (Japan)
• Kyocera Corporation (Japan)
• FIT Hon Teng Limited (Taiwan)
• HARTING Technology Group (Germany)

For instance, in September 2025, TE Connectivity (TE) introduced its in-vehicle device connectivity portfolio to meet the evolving demands of automotive electronic control units (ECUs) and next-generation vehicle platforms, such as software-defined vehicles. The portfolio features a comprehensive range of connector solutions, including board-to-board, wire-to-board, flex-to-board, and wire-to-wire options.

TE Connectivity (Ireland):

TE Connectivity is a global technology leader dedicated to designing and manufacturing a range of connectivity and sensor solutions. The company operates through three primary business segments: Transportation Solutions, Industrial Solutions, and Communications Solutions. Each of these segments offers board-to-board connector solutions specifically designed for various applications, including telecommunications, industrial automation, and transportation. The Transportation Solutions segment delivers advanced products and technologies for the automotive, commercial transportation, and sensor markets. Its offerings include electrical and electronic distribution systems, connectors, sensors, antennas, and relays—all designed to improve vehicle safety, efficiency, and connectivity. The Industrial Solutions segment supports a range of industries by providing connectors, terminals, cable assemblies, sensors, and customized solutions. Its core competencies lie in its advanced connector technologies, high-precision manufacturing, and broad portfolio of interconnect solutions that support high-speed data, power, and signal transmission. It focuses on organic and inorganic strategies, such as product launch, acquisition, and partnerships.

Amphenol Corporation (US):

Amphenol Corporation is a leading global company recognized for its expertise in designing, producing, and promoting a wide range of electrical, electronic, and fiber optic connectors and interconnect systems. The company’s extensive portfolio includes antennas, sensors, sensor-based products, coaxial cables, and high-speed specialty cables. Leveraging this broad product offering, it has established itself as one of the major players in the interconnect industry. It operates through three primary business segments: Harsh Environment Solutions, Communications Solutions, and Interconnect and Sensor Systems. Each of these segments offers connectors and interconnect solutions, including board-to-board connectors, high-speed interconnect systems, and fiber optic interconnect products. These solutions are engineered to meet the complex demands of various industries, including automotive, aerospace, industrial, military, mobile networks, and data centers. Its core competencies center on its extensive expertise in interconnect solutions, including board-to-board, wire-to-board, and high-speed data connectors. It is recognized for its ability to deliver high-reliability, durable products that perform under harsh environmental and industrial conditions. It follows organic growth strategies, such as product launches.

Market Ranking

The board-to-board connector market is fragmented, with key players, such as TE Connectivity (Ireland), Amphenol Corporation (US), Hirose Electric Co., Ltd. (Japan), Molex (US), and Japan Aviation Electronics Industry, Ltd. (Japan), collectively holding a significant market share. These companies offer a range of interconnect solutions, supporting various pitch sizes, data speeds, and form factors for applications across the consumer electronics, automotive, industrial, and communication sectors. TE Connectivity and Amphenol focus on high-speed, high-reliability connectors for automotive and industrial systems. At the same time, Hirose and Japan Aviation Electronics specialize in compact, fine-pitch solutions for consumer and communication devices. Molex emphasizes modular and high-density designs, which are well-suited for data centers and IoT devices. Together, these companies drive innovation through miniaturization, higher data transfer capabilities, and enhanced durability. At the same time, smaller firms and startups develop customized, application-specific connectors for emerging technologies, such as 5G, EVs, and advanced robotics.

Related Reports:

Board-to-Board Connector Market by Type (Male Connectors, Socket), Connector Type (Mezzanine, Backplane), Mounting (Surface-mount Technology, Through-hole Technology, Press-Fit, Hybrid), Pitch (<1 mm, 1 mm to 2 mm, >2 mm) - Global Forecast to 2030

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