The co-packaged optics market is projected to grow from USD 15 million in 2023 to USD 49 million by 2028, registering a CAGR of 26.5% during the forecast period. Growing investment by techgiants to develop datacenters and introduction of ultra-high-definition videostreaming are expected to propel the co-packaged optics market in the next five years. However, fiber routing complexity and risk of damage to the fibers during installation will likely pose challenges for the industry players.
Key players operating in the co-packaged optics market include Broadcom (US), Molex (US), Marvell (US), RANOVUS (Canada), Ragile Networks Inc. (US), SENKO (US), Quanta Computer Inc. (Taiwan), Furukawa Electric Co., Ltd. (Japan), among others. Major strategies adopted by top players to enhance their product portfolios, increase their market share, and expand their presence in the market include new product launches and deals such as acquisitions and partnerships.
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Broadcom is a global technology company that designs, develops, and supplies semiconductor and infrastructure software solutions. It operates through two business segments: Semiconductor Solutions and Infrastructure Software. The semiconductor solutions segment manages data movement in data centers, telecom, enterprise, and embedded networking applications. The infrastructure software segment provides a mainframe, enterprise, and storage area networking solutions portfolio. The company offers its co-packaged optics products under the semiconductor solutions segment.
RANOVUS is a Canadian company that develops and manufactures photonic integrated circuits (PICs) for high-performance optical interconnects. It specializes in developing high-speed networking solutions for data centers and cloud computing applications. The company offers advanced optical networking technologies to improve data transmission speeds, reduce latency, and lower power consumption. Its products include silicon photonics-based optical interconnects, optical transceivers, and switches. RANOVUS provides high-performance networking solutions for hyperscale data centers, HPC, AI/ML, and cloud-based applications.
Marvell is one of the leading suppliers of data infrastructure semiconductor solutions, spanning the data center core to the network edge. The company’s first-generation cloud-optimized co-packaged optics (CPO) technology platform with faster connectivity and reduced power consumption. It includes 2.5D/3D highly integrated silicon photonics, including lasers, TIAs, drivers, and its industry-leading PAM4 DSP. Marvell (announced its first-generation cloud-optimized CPO technology platform that includes 2.5D/3D highly integrated silicon photonics, including lasers, TIAs, drivers, and its industry-leading PAM4 DSP.
Co-Packaged Optics Market by Type (CPO, NPO), Data Rates (less than 1.6 T & 1.6 T, 3.2 T, 6.4 T), Application (Data Center and High-performance Computing, and Telecommunication and Networking), Packaging Technology and Region - Global Forecast to 2028
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