Electronic Adhesives Market

Emerging demand in the Asia-Pacific region is the reason behind increased consumption of electronic adhesives

Electronic adhesives have gained prominence in the recent past due to the technological advancements in the electronics industry. As a result, the demand for electronic adhesives is expected to grow in line with the electronics industry.

The growth in the electronics industry is highly influencing the changing trends in the electronic adhesives market. The developments in the electronic adhesives market are due to technological advancements in electronics industry and newer regional markets, especially in the Asia-Pacific region. Recently, there has been a shift of demand and production facilities from North America and Europe to the Asia-Pacific region. This is evident from the fact that Asia-Pacific is the global leader of electronic adhesives market with more than 60% market share, in terms of value as estimated in 2013.

By 2019, the Asia-Pacific region is expected to be world’s largest consumer of electronic adhesives with an estimated market of $3.8 billion. North America and Europe are losing their market dominance as the Asia-Pacific region is being considered as an emerging market for electronics. The several developing countries in the Asia-Pacific region are focusing on their expansions in the emerging markets contributing to the growth of the industry in the region. The electronic adhesives market in North America and Europe is estimated to grow at a slow pace in the next five years as only a few key industrial developments are expected to take place in these regions.

In terms of volume, the electrically conductive adhesives are estimated to consume around 50% of the market size by 2019. Other emerging electronic adhesives, such as the UV curing are estimated to grow rapidly in the next five years, followed by the thermally conductive ones.

Related Reports:

Electronic Adhesives Market by Type (Electrically Conductive, Thermally Conductive, UV Curing & others), Form (Liquid, Solid & Paste), Application (Semiconductor & IC and Printed Circuit Boards (PCB)), and Geography - Regional Trends & Forecast to 2019

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Report Code
CH 2530
Published ON
Nov, 2015
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