Universal Flash Storage Market

Arasan Chip Systems Inc. (US) and Samsung Electronics Co., Ltd are the Leading Players in the Universal Flash Storage Market

Universal flash storage is the next-generation data storage technology for both embedded as well as removable flash memory-based storage solutions used in e-readers, digital cameras, gaming consoles, high-resolution displays, laptops, smartphones, and tablets. The universal flash storage standard is high-performance, serial interface that competently moves data between a host processor and mass storage devices. Universal flash storage transfers follow the SCSI architecture model, but with a subset of SCSI commands. Due to the full-duplex topology of the UFS technology, it aids in faster performance with the improved responsiveness of the devices with universal flash storage implemented in it.

The universal flash storage market is anticipated to be valued at USD 9.97 Billion by 2023, at a CAGR of 18.6% between 2017 and 2023. The growth in this market can be attributed to the growing demand for electronic devices with faster performance and improved responsiveness, rising adoption of high-speed data transfer technologies, and increasing upsurge in demand for wearable electronics.

Arasan Chip Systems Inc. (US), Cadence Design Systems, Inc. (US), GDA Technologies Inc. (US), Micron Technology, Inc. (US), Phison Electronics Corporation, Inc. (Taiwan), Samsung Electronics Co., Ltd. (South Korea), Silicon Motion Technology Corporation (US), SK Hynix, Inc. (South Korea), Synopsys, Inc. (US), and Toshiba Corporation (Japan) are the key players in the universal flash storage market. New product launches and developments, partnerships, collaborations, and joint ventures are some of the key strategies adopted by the major players to gain a competitive edge in the universal flash storage market.

Samsung Electronics Co., Ltd. is one of the leading players in the universal flash storage market. The company holds the pioneering position in the universal flash storage market owing to its comprehensive product portfolio. The company offers UFS solutions under the Device Solutions division. DRAM, flash storage, including V-NAND technology, Client SSD, Enterprise SSD, eMMC, are also being offered under this business division. The company’s wide portfolio of products and services helps it compete in different market segments at different levels of the value chain. The company’s dedicated memory business unit extensively works for the development of various DRAM and NAND products with higher densities. In July 2016, the company launched the removable memory card line-up, with a capacity up to 256 GB. These removable memory cards are based on the JEDEC UFS 1.0 card extension standard. These cards are meant for high-resolution mobile shooting devices, such as 3D VR cameras, DSLR cameras, drones, and action cams.

Toshiba Corporation is a renowned inventor of flash memory. Flash memory is playing a pivotal role in the advancement of industrial equipment and automobiles for achieving eco-friendly society. The company’s UFS product portfolio includes UFS solutions with a capacity of 32 GB, 64 GB, and 128 GB. All these UFS solutions provide an interface compliant with the JEDEC/UFS 2.0 version. This makes these storage media quite suitable for embedded storage devices. The company focuses on continuous investment in the memory business to offer advanced memory storage solutions. For instance, in August 2017, the company announced its investment in manufacturing equipment at Yokkaichi. UFS solutions are gaining significance due to the rising adoption of IoT and growing demand for wearable devices.

SK Hynix, Inc. is one of the key players in the semiconductor memory market. The company is one of the major shareholders in the non-volatile memory market. Memory devices and solutions are the key business areas of the company. The company is focused on agreements and strategic partnerships, such as agreements for cross-licensing of patents and supplying NAND flash products. These are aimed at gaining competitive advantage in the high value-added premium semiconductor markets. For instance, in June 2016SK Hynix partnered with many Chinese companies, such as China Mobile, Huawei, Lenovo, Mediatek, Qualcomm and Xiaomi; and to have an advantage in the competitive mobile market, the company held the 2016 SK Hynix Mobile Solutions Day in Shenzhen, China. In August 2016, the company announced the commencement of mass production of UFS 2.1 solutions on its own second-generation 3D NAND flash, in-house firmware and controller. These solutions are available in 32, 64, and 128 GB variants.

Related Reports:

Universal Flash Storage Market by Capacity (32 GB, 64 GB, 128 GB, 256 GB, 512 GB), Configuration, End Use (Automotive Electronics, Digital cameras, Gaming Consoles, High-Resolution Displays, Smartphones), Application, and Geography - Global Forecast to 2023

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Report Code
SE 5631
RI Published ON
10/6/2017
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