Semiconductor Manufacturing Equipment Market

The report "Semiconductor Manufacturing Equipment Market by Lithography, Wafer Surface Conditioning, Etching, CMP, Deposition, Wafer Cleaning, Assembly & Packaging, Dicing, Bonding, Metrology, Wafer/IC Testing, Logic, Memory, MPU, Discrete - Global Forecast to 2029" The US Semiconductor Manufacturing Equipment market is expected to reach USD 15.75 billion by 2029, up from USD 12.13 billion in 2024, at a CAGR of 5.4% from 2024 to 2029.

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The US market for semiconductor manufacturing equipment has experienced growth in recent years, owing to increased investment in domestic semiconductor device fabrication facilities, increased demand for high-end chips from automotive, consumer electronics, and industrial customers, and government incentives to increase domestic chip manufacturing capacity. Improvements in fab processes like EUV lithography and advanced packaging also fuel the market growth. The US is also endowed with the strengths of having major semiconductor manufacturing equipment companies within its midst, and this supports continued innovation and supply chain resilience. Furthermore, ongoing efforts to reduce overdependence on international suppliers and improve domestic semiconductor production capabilities are creating additional growth prospects. The US semiconductor manufacturing equipment market is expected to witness steady growth during the forecast period, solidifying its central role in the global semiconductor value chain.

Logic segment to dominate the product type segment of the market during the forecast period.

Logic semiconductors form a significant segment of the US semiconductor manufacturing equipment market, driven by growing demand for high-performance computing, smart devices, and AI applications. The segment is led by advanced digital logic devices like application-specific integrated circuits (ASICs) and field-programmable gate arrays (FPGAs), which are crucial for processors, microcontrollers, and specialized integrated circuits. Production of these advanced devices requires cutting-edge wafer fabrication equipment, including photolithography equipment, etching semiconductor tools, deposition machines, and chemical mechanical planarization (CMP) tools for precise layering and flatness of surfaces. High-speed processing and flexibility also require cutting-edge packaging technology. Large chipmakers in the US are ramping up logic semiconductor production to serve the exploding demand from AI data centers, and that requires leading-edge chip manufacturing machines to make next-generation processors. Advances in semiconductor device fabrication technologies are improving manufacturing precision and scalability, increasing the position of the US market to support logic device manufacturing across industries such as consumer electronics, automotive, and artificial intelligence systems.

Deposition to register the highest CAGR in the market during the forecast period.

The US semiconductor manufacturing equipment market's deposition segment remains imperative for front-end processes as demand for leading-edge chips in AI, 5G, and IoT applications continues to rise. As the technology advances towards 5nm and 3nm nodes, thin-film deposition technologies with high precision such as atomic layer deposition (ALD) and chemical vapor deposition (CVD) support the creation of ultra-thin, uniform films necessary for device performance and reliability. As part of these advancements, semiconductor fabs increasingly rely on silicon wafer manufacturing machines and advanced deposition semiconductor tools to produce next-generation processors with improved performance and efficiency. For instance, in December 2024, Tokyo Electron Limited (Japan) introduced the LEXIA-EX sputtering equipment for next-generation memory and logic devices, which supports DRAM and 3D NAND production and offers improved uniformity, lower CO2 emissions, and better productivity.  With the US CHIPS Act speeding up local semiconductor device fabrication, which in turn speeds up the need for wafer fabrication equipment, major firms including Applied Materials, Inc. (US), Lam Research Corporation (US), and Plasma-Therm (US) continue to spend in R&D expenses.

Rising demand for autonomous vehicle processors and expansion of 5G technology to propel US semiconductor manufacturing equipment market

The US semiconductor manufacturing equipment market is growing fast due to strong demand for advanced electronics, increasing the number of IoT devices, and the push for local semiconductor production in response to global supply chain disruptions. Major breakthroughs include bringing AI and machine learning into production processes, expansion of 5G technology, and migrating to lower nanometer nodes for improved chip performance. The production of high-performance processors for driverless cars, which require accuracy and dependability, is one of the primary drivers fueling demand for advanced chip manufacturing machines and semiconductor tools. For instance, companies like Intel (US) and NVIDIA (US) use cutting-edge semiconductor machine tools to develop next-generation chips. Market leaders in the country are Applied Materials, Inc., Lam Research Corporation, KLA Corporation, Teradyne, Inc., and Plasma-Therm, which lead with their innovative solutions and strategic R&D investments. The market is also set to continue its growth as the US government encourages local semiconductor device fabrication with initiatives such as the CHIPS Act.

Key Players

The report profiles key players such as Applied Materials, Inc. (US), ASML (Netherlands), Tokyo Electron Limited (Japan), Lam Research Corporation (US), KLA Corporation (US), SCREEN Holdings Co., Ltd. (Japan), Teradyne, Inc. (US), Advantest Corporation (Japan), Hitachi High-Tech Corporation (Japan), and Plasma-Therm (US). These players have adopted various organic and inorganic growth strategies such as product launches, expansions, partnerships, collaborations, acquisitions, and agreements to strengthen their position in the market.

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