The global die bonder equipment market size is projected to grow from USD 820 million in 2019 to USD 972 million by 2024; it is expected to grow at a CAGR of 3.5% from 2019 to 2024. Key factors fueling the growth of this market include the growing demand for miniature electronic components and the increasing adoption of stacked die technology in IoT devices.
Key players in the die bonder equipment market include companies operating at different stages of the die bonding equipment value chain. These companies are BE Semiconductor Industries N.V. (Netherlands), ASM Pacific Technology Ltd. (Singapore), Kulicke & Soffa (Singapore), Mycronic AB (Sweden), Palomar Technologies, Inc. (US), West·Bond, Inc. (US), MicroAssembly Technologies, Ltd. (Israel), Finetech GmbH & Co. KG (Germany), Dr. Tresky AG (Switzerland), Smart Equipment Technology (France), HYBOND, Inc. (US), SHIBUYA CORPORATION (Japan), Anza Technology, Inc. (US), Tresky GmbH (Germany), DIAS Automatic (HK) Ltd (China), Shinkawa Ltd. (Japan), FOUR TECHNOS Co., Ltd. (Japan), Fasford Technology Co., Ltd. (Japan), UniTemp GmbH (Germany), and TPT Wire Bonder GmbH & Co. KG (Germany). These companies focus on adopting both organic and inorganic growth strategies, such as product launches, expansions, agreements, partnerships, collaborations, and acquisitions to strengthen their position in the market.
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Top Players in the Die Bonder Equipment Market:
BE Semiconductor Industries N.V. (Besi) (Netherlands) is a supplier of semiconductor assembly equipment for semiconductor manufacturers, electronics and industrial companies, and assembly subcontractors. The company develops assembly processes and equipment for substrate and wafer-level packaging applications in several markets, including automotive, computing, electronics, and mobile internet. Die bonders offered by the company find applications in automobiles, SiP power devices, IoT general ICs, computers, PCs, mobiles, and high-performance computing memory. The company has been focusing on offering its die bonder equipment for mobile/wearables, advanced SiP devices, and automotive applications, which is expected to strengthen its position in the said market. Over the last 3 years, at an annual average rate, the company has been investing nearly 7% of its total revenue in R&D. However, the company has not launched any die bonder equipment in the last few years. Hence, the company could focus on releasing new products in the near future to remain competitive in the market.
ASM Pacific Technology Ltd. (Singapore) is a leading provider of semiconductor assembly and packaging equipment and materials to semiconductor & electronics industries across the world. The company designs, manufactures, and markets machines, tools, and materials used in the semiconductor industry. Die bonder equipment offered by the company find applications in power electronics, multi-chip modules (MCMs), optoelectronics, photonics, MEMS, MOEMS, etc. The company has adopted expansions, acquisitions, and agreements as its key strategies to sustain its position in the die bonder equipment market. For instance, in May 2019, the company opened its new R&D center in Hong Kong, and in April 2018, the company acquired AMICRA Microtechnologies GmbH (Germany) to enter the flip chip and die bonder equipment market. Also, at an annual average rate, the company has been investing 8% in its R&D activities for the last 3 years. ASM Pacific Technology Ltd. could consider focusing on introducing new die bonder equipment in the coming years to ensure its leading position in the market under study.
Die Bonder Equipment Market by Type (Semiautomatic Die Bonder, Fully Automatic Die Bonder), Bonding Technique, Supply Chain Participant (IDM Firms, OSAT Companies), Device, Application (Consumer Electronics), and Region - Global Forecast to 2024
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