The extreme ultraviolet (EUV) lithography market is projected to grow from USD 15.84 billion in 2026 to USD 30.36 billion by 2032, at a CAGR of 11.4%. The extreme ultraviolet (EUV) lithography market is driven by the accelerating adoption of data-driven technologies, artificial intelligence (AI), and high-performance computing (HPC) applications, which enable more advanced and efficient semiconductor solutions. As industries increasingly rely on data analytics, artificial intelligence (AI), and machine learning (ML) to enhance decision-making and operational efficiency, demand for high-density, high-performance integrated circuits (ICs) is growing. EUV lithography is central to this demand, enabling the production of semiconductors that deliver the computational power and energy efficiency required to support these advanced technologies.
EUV lithography plays a crucial role in enabling the development of smaller transistors and tighter interconnects, thereby directly increasing transistor density and computational performance. These advancements are significant for HPC systems, which handle computationally intensive tasks. EUV's precise patterning capabilities are essential for the accurate production of complex chip designs, such as those needed for AI accelerators and deep learning processors. This allows semiconductor manufacturers to meet the rigorous performance requirements of next-generation HPC applications.
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ASML is the dominant and sole supplier of EUV lithography systems, holding a central position in enabling advanced semiconductor manufacturing at leading-edge technology nodes. The company’s strength lies in its deep system integration capabilities, which combine EUV exposure tools, productivity upgrades, and long-term service support critical for high-volume manufacturing. An integrated ecosystem of prominent component providers supports ASML’s EUV platforms. ZEISS Group supplies high-precision EUV optics that ensure pattern accuracy at advanced technology nodes, while TRUMPF provides high-power laser systems critical to EUV light-source performance and throughput. KLA Corporation and Lasertec Corporation support EUV manufacturing with advanced inspection, metrology, and mask-quality solutions that improve yield and defect control. AGC Inc. delivers advanced glass and mask blank materials essential for reliable EUV photomask production. This ecosystem ensures scalable, high-volume EUV production.
In October 2025, Lasertec Corporation launched the ACTIS A200HiT Series to enhance photomask and mask-blank inspection, supporting defect detection, yield, and quality standards as chip complexity increases, reinforcing its position as a leading supplier of precision inspection tools.
In March 2025, ASML and imec entered into a multi-year strategic partnership to advance semiconductor research and drive sustainable innovation across Europe. The collaboration encompasses joint R&D initiatives, shared access to pilot production lines, and deep integration across ASML's full technology portfolio, including 0.55 NA EUV, 0.33 NA EUV, DUV immersion, YieldStar optical metrology, and HMI single- and multi-beam technologies to accelerate technology maturation and promote more sustainable manufacturing practices.
ASML
ASML is a leader in the semiconductor industry, specializing in the design and supply of cutting-edge lithography systems that drive innovation in chip production. Founded as ASM Lithography Holding NV and renamed ASML in 2001, the company operates through a single reportable segment, Advanced Semiconductor Equipment Systems, which integrates its lithography, metrology, and inspection technologies. This segment is structured around seven core technology platforms: EXE, NXE, Argon Fluoride (ArF) Immersion, Krypton Fluoride (KrF), ArF Dry, Metrology & Inspection, and I-line.
ASML supplies both extreme ultraviolet (EUV) and deep ultraviolet (DUV) lithography systems, along with refurbished solutions, serving major memory and logic chip manufacturers worldwide. The company offers EUV lithography through the EXE and NXE technology platforms. Its products are primarily marketed and distributed through a direct global sales organization. The company operates seven manufacturing facilities and maintains strategically positioned R&D and production sites across the Netherlands, the US, China, Taiwan, and South Korea. With operations in more than 60 locations and key subsidiaries such as ASML Netherlands B.V., ASML US Inc., ASML Hong Kong Ltd., ASML Germany GmbH, and ASML Ireland Ltd., the company demonstrates a deeply integrated and expansive international presence.
KLA Corporation
KLA Corporation is a global provider of advanced process control and process-enabling solutions for the electronics industry. The company designs and delivers equipment and services that support the fabrication of wafers, reticles, integrated circuits, packaging, and printed circuit boards. By combining expertise in physics, engineering, and data science, KLA works closely with a wide range of customers to address the complex challenges of semiconductor manufacturing.
In the Extreme ultraviolet (EUV) lithography sector, KLA provides specialized systems and components that enable precise photomask and wafer inspection, thereby enhancing yield, accuracy, and reliability in next-generation semiconductor production. Its solutions are critical to advancing EUV-based lithography technologies and supporting high-precision process control.
KLA operates through three main business segments: Semiconductor Process Control, PCB and Component Inspection, and Specialty Semiconductor Process. The Semiconductor Process Control segment, which includes reticle metrology systems, is particularly relevant to EUV lithography. The company maintains a strong global footprint, with operations in key semiconductor markets including North America, Europe, Japan, China, Taiwan, South Korea, Israel, and Asia.
Market Ranking
The extreme ultraviolet (EUV) lithography market for components is highly consolidated, with the top five players collectively accounting for an estimated 63–73% of the overall market, reflecting the significant technological complexity, high capital intensity, and long development cycles associated with EUV components. Within this ecosystem, KLA Corporation and ZEISS Group play a critical role as key component and subsystem providers rather than end-to-end system manufacturers. KLA’s strong position is driven by its advanced metrology and inspection solutions, which are essential for EUV process control, defect detection, and yield optimization at leading-edge nodes, and by its broad installed base and global service footprint. ZEISS Group holds a strategically irreplaceable position due to its dominance in EUV optics, particularly high-precision mirrors and optical systems that are fundamental to EUV scanner performance and accuracy.
Related Reports:
Extreme Ultraviolet (EUV) Lithography Market by Component (Light Sources, Optics, Masks), System Type (0.33 NA EUV System (NXE), 0.55 NA EUV System (EXE)), Integrated Device Manufacturers, Foundries, Logic Chips, Memory Chips - Global Forecast to 2032
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