Silicon on Insulator Market

Soitec (France), Shin-Etsu Chemical (Japan) and GlobalWafers (Taiwan) are leading players in Silicon on Insulator (SOI) Market

The Silicon on Insulator (SOI) market is projected to grow from USD 894 million in 2019 to USD 2,186 million by 2024, at a CAGR of 19.6% from 2019 to 2024. Increasing investments in the SOI ecosystem by wafer manufacturers and foundry players and growing use of SOI wafers in consumer electronics are key factors driving the growth of the SOI market across the globe.

Key players in this market are focusing on enhancing their product portfolios and increasing their market share through the strategies of product launches and developments, agreements, partnerships, collaborations, acquisitions, joint ventures, and expansions. Several market players have adopted product launches and developments as a key business strategy to enhance their position in the SOI market over the past few years. For instance, in November 2018, GlobalFoundries (US) announced the launch of 300 mm Silicon Germanium (SiGe) foundry technology for deployment in 300 mm wafer manufacturing line used for terabit communication and automotive radar applications. Apart from the strategy of product launches and developments, leading players of the market have also adopted strategies of agreements and collaborations to expand their businesses. For instance, in February 2019, Soitec (France) expanded its collaboration with Samsung Foundry (South Korea) to ensure the volume supply of FD-SOI wafers to it. This development is expected to strengthen the product portfolio and position of Soitec in the SOI market.

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Soitec (France): Founded 1992 and is headquartered in Bernin (France), Soitec is one of the leading producers and suppliers of SOI wafers. The company has 40 different customers, 4 production lines, and 3,000 patents. It designs and produces innovative semiconductor materials that are used in the manufacturing of electronic components. Its substrates are used to manufacture chips for consumer electronic devices such as smartphones; automotive applications; IoT applications; computer servers; and data centers. The company also offers smart cut, smart stacking, and epitaxy technologies for the semiconductor industry. It mainly manufactures 200 mm and 300 mm SOI wafers.

Shin-Etsu Chemical (Japan): Founded in 1926 and headquartered in Tokyo (Japan), Shin-Etsu Chemical manufactures and sells Polyvinyl Chloride (PVC), semiconductor silicon wafers, silicones, and rare earth magnets. It operates through Polyvinyl Chloride (PVC), specialty chemicals, semiconductor silicon, silicones, electronics & functional, and processing business segments. The company offers semiconductor silicon wafers used as substrate materials in personal computers, smartphones, televisions, and automobiles as well as compound semiconductor products used in outdoor displays, traffic lights, in-vehicle stop lamps, and sensor light sources.

Some of the subsidiaries of Shin-Etsu Chemical are Shintech (US), Shin-Etsu Handotai (Japan), Shin-Etsu Handotai America (US), Shin-Etsu Polymer (Japan), S.E.H. Malaysia SDM Bhd. (Malaysia), Shin-Etsu Engineering (Japan), Shin-Etsu PVC B.V. (Netherlands), and Shin-Etsu Handotai Europe (UK).

GlobalWafers (Taiwan): Founded in 2011 and headquartered in Hsinchu (Taiwan), GlobalWafers is a manufacturer and supplier of silicon wafers/ingots. Initially, it was a business unit of Sino-American Silicon Products Inc. (SAS). In addition to the manufacturing of silicon wafers/ingots, GlobalWafers also has a dedicated research center in Taiwan. The company offers its products for both, domestic and overseas customers. It offers SOI wafers for use in different applications.

Some of the affiliated companies of GlobalWafers are GlobitTech (US), Sino-American Silicon Products (Taiwan), Kunshan Sino Silicon Technology (China), and GlobalWafers Japan (Japan). In December 2016, GlobalWafers acquired SunEdison Semiconductor Limited (US) to expand its presence in the market.

Related Reports:

Silicon on Insulator (SOI) Market by Wafer Size (200 mm and Less Than 200 mm, 300 mm), Wafer Type (RF-SOI, FD-SOI), Technology (Smart Cut, Layer Transfer), Product (RF FEM, MEMS), Application (Consumer Electronics, Automotive) - Global Forecast to 2024

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