The global hermetic packaging market size is expected to grow from USD 3.5 billion in 2020 to USD 4.3 billion by 2025 at a CAGR of 4.3%. The growth of this market is attributed to the increasing use of hermetic packaging for protecting highly sensitive electronic components and increasing demand from industries such as aerospace and automotive electronics.
Key players in the hermetic packaging market include SCHOTT (Germany), AMETEK, Inc. (US), Amkor Technology, Inc. (US), Texas Instruments Incorporated (US), Teledyne Technologies (US), Kyocera Corporation (Japan), Materion Corporation (US), Egide (France), Micross Components Inc. (US), and Legacy Technologies Inc. (US). These players have adopted various growth strategies such as contracts, agreements, acquisitions, product launches, expansions, and partnerships to increase their presence in the global market.
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SCHOTT is primarily engaged in the development and manufacturing of glasses and glass ceramics, specialty materials, components, and systems in electronic packaging, advanced optics, flat glass, lighting and imaging, home tech, pharmaceutical packaging, and tubing segment. The company’s electronic packaging business unit develops and manufactures hermetic seals and other components for the long-term protection of sensitive electronics. This segment mainly serves customers from a wide range of application markets that include automotive & energy, consumer electronics, medical technology, and data & telecommunications.
AMETEK, Inc. (US)
AMETEK manufactures electromechanical devices and electronic instruments for the global electronics and semiconductor market. AMETEK operates more than 150 facilities and 100 sales & service locations worldwide. The company’s major subsidiaries/brands include Coining Inc., Hermetic Seal Corporation (HSC), AMETEK Aegis, Sealtron, AMETEK SCP, and Glasseal Products, Inc. HSC primarily designs and manufactures hermetically sealed connectors, headers, pressure bulkheads, and feedthroughs. It provides glass-to-metal-sealed interconnection devices to many companies involved in the defense, aerospace, nuclear, geophysical, and medical fields. Moreover, AMETEK Aegis offers glass-to-metal-seal hermetic packages (platforms, plug-ins, and flatpacks) for the microelectronic industry. Sealtron manufactures circular hermetically sealed connectors.
Hermetic Packaging Market with COVID-19 impact by Configuration (Multilayer Ceramic Packages, Metal Can Packages, Pressed Ceramic Packages), Type (Ceramic-Metal Sealing, Glass-Metal Sealing), Application, Industry, and Region - Global Forecast to 2025
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