The overall HMC and HBM market is expected to increase from USD 922.7 Million in 2018 to USD 3,842.5 Million by 2023, at a CAGR of 33.02% between 2018 and 2023. The key opportunities for the manufacturers of HMC and HBM include the high demand for cloud-based services and growing big data. Some of the key factors driving this market are the growing need for high-bandwidth, low power consuming, and highly scalable memories; increasing adoption of artificial intelligence; and rising trend of miniaturization of electronic devices
Key players in the HMC and HBM market include Samsung (South Korea), Micron (US), SK Hynix (South Korea), Intel (US), and AMD (US). Most of the leading companies have followed organic growth strategies such as product launches. The leading strategies in this market such as technological investments and product launches help companies to grow and remain technically competitive in the market. The major companies in market are also focused on partnerships, agreements, and collaborations to expand their business.
Leading players in the HMC and HBM market:
Samsung has been at the top position because of its wide contribution to the parent market share and high financial power. The company’s strong market position, coupled with strong brand equity, imparts a significant competitive edge. The company is part of the hybrid memory cube consortium and has begun the mass production of its high-bandwidth memory for computing, enterprise servers and advanced graphics, and network systems. In 2016, the company became the world’s first company to start the mass production of the 4GB HBM2 memory. The company focuses on R&D activities for the development of the advanced memory segment which includes leading-edge DRAM and NAND flash-based solutions. As a result, the company holds more than 850 patents related to HBM2 and TSV technologies. For instance, the company also started the mass production of its 8GB HBM2 in July 2017. Also, the company already is working to deliver HBM3 in the market with further improvements in density, bandwidth, and power efficiency.
Micron ranked second in the market. The company is a leader and the only provider of the hybrid memory cube in the market. Presently, it offers the hybrid memory cube for networking and computing applications and expects this innovative technology to migrate to consumer applications within the next three to five years. For instance, the company’s short-reach HMC is used in ASIC, FPGA, and CPU. Micron has a strong manufacturing facility spread across the US, China, Japan, Malaysia, Singapore, and Taiwan. The company focuses on achieving cost-efficiency by streamlining the complex process involved in the development of 3D memories. The company is involved in an intensive R&D for the development of next-generation memory such as 3DXpoint, 3D NAND, and Hybrid Memory Cube. Micron aims to release the hybrid memory cube 3.0 Specification in 2018. To get these products in the market, the company focuses on inorganic growth strategies, such as collaborating with industry players who could use and integrate its HMC technology in their products.
Hybrid Memory Cube (HMC) and High-bandwidth Memory (HBM) Market by Memory Type (HMC and HBM), Product type (GPU, CPU, APU, FPGA, ASIC), Application (Graphics, High-performance Computing, Networking, Data Centers), and Geography - Global Forecast to 2023
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