High Density Interconnect Market

Market Leader - High Density Interconnect Market

The high density interconnect (HDI) market is expected to grow from USD 9.5 billion in 2018 to USD 16.9 billion by 2023, at a CAGR of 12.3% from 2018 to 2023. A few key factors driving the growth of this market are increasing adoption of advanced electronics and safety measures in the automotive vertical and growing demand for smart consumer electronics and wearable devices.

Compeq Co. (Taiwan), TTM Technologies (US), Austria Technologie & Systemtechnik (Austria), Unimicron (Taiwan), Zhen Ding Tech. (Taiwan), IBIDEN (Japan), MEIKO ELECTRONICS Co. (Japan), FUJITSU INTERCONNECT TECHNOLOGIES (Japan), Tripod Technology Corp. (Taiwan), Unitech (Taiwan), SAMSUNG ELECTRO-MECHANICS (South Korea), Daeduck GDS Co (South Korea), DAP Corp. (South Korea), Korea Circuit (South Korea), CMK (Japan), NCAB Group (Sweden), SIERRA CIRCUITS (US), and Multek (Hong Kong) are among the major players in the HDI market. Most of the leading companies have used acquisitions, collaborations, and partnerships as key the strategies to boost their revenues.

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Top 2 Market Players:

TTM Technologies (US) manufactures and sells PCBs and backplane assemblies. It is one of the largest PCB manufacturers in the world. The company offers a range of PCBs, including conventional PCBs, HDI PCBs, flexible PCBs, rigid-flex PCBs, custom assemblies and system integration products, and IC substrates. It focuses on the production of advanced technology products and offers a one-stop manufacturing solution (from engineering support to prototype development through final mass production). To grow in the HDI market, the company has adopted inorganic growth strategies. It has a history of executing successful acquisitions that have been key to its growth and profitability. In April 2018, TTM Technologies acquired Anaren (US), with an aim to significantly increase its RF products designing capability (for aerospace & defense), deepen its customer engagement in aerospace & defense and networking/communications verticals, and complement its focus on high-technology PCB products manufacturing

Compeq Co. (Taiwan) is involved in R&D, manufacturing, and distribution of PCBs. The company provides multilayer PCBs, HDI PCBs, high layer count (HLC) PCBs, and FPCs and rigid-flexible PCBs. The company's products are used in mobile phones, routers, gateways, servers, workstations, desktops, laptops, computer peripheral products, LCD televisions, digital cameras, gaming consoles, and personal digital assistants. To grow in the HDI market, the company has focused on its technological capability. For instance, the company decreased the trace width/spacing to 25ěm to develop highly accurate and complex HDI boards. Furthermore, the company focuses on enhancing its partnership with its customers to develop cutting-edge products and capture market opportunities.

Related Reports:

High Density Interconnect Market by Product (4–6 Layers HDI, 8–10 Layers HDI, and 10+ Layers HDI), End User (Automotive, Consumer Electronics, Telecommunications, Medical), Application, and Geography - Global Forecast to 2023

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Report Code
SE 6883
RI Published ON
1/31/2019
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