Hybrid Bonding Companies

The global hybrid bonding market is expected to grow from USD 164.7 million in 2025 to USD 633.9 million by 2030, at a CAGR of 21.2% between 2025 and 2032. The market is primarily driven by the semiconductor industry’s shift toward advanced 3D integration to overcome scaling limitations. Manufacturers across logic, memory, and high-performance computing increasingly require higher interconnect density, lower power consumption, and improved signal integrity, all of which hybrid bonding enables more effectively than traditional packaging methods. Growing adoption of chiplets, the rising demand for compact and energy-efficient consumer and automotive electronics, and sustained investments in advanced packaging infrastructure, particularly in Asia Pacific, further support market expansion. This accelerates the transition toward next-generation heterogeneous integration.

Some prominent players in the hybrid bonding market are EV Group (EVG) (Austria), Applied Materials, Inc. (US), SUSS MicroTec SE (Germany), Besi (Netherlands), and Kulicke and Soffa Industries, Inc. (Singapore). Key growth strategies adopted by these players include partnerships, expansions, and product launches.

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Major Hybrid Bonding Companies Include:

• EV Group (EVG) (Austria)
• Applied Materials, Inc. (US)
• SUSS MicroTec SE (Germany)
• Besi (Netherlands)
• Kulicke & Soffa Industries, Inc. (Singapore)
• Tokyo Electron (TEL) (Japan)
• ASMPT (Singapore)

For instance, in September 2025, EVG Group introduced the EVG 40 D2W, the industry’s first dedicated die-to-wafer overlay metrology platform designed to perform 100% die overlay measurements on 300 mm wafers with exceptional precision and production-level speed.

EV Group (EVG)

EVG Group is a recognized pioneer in hybrid bonding, having established a strong foundation in wafer-to-wafer and die-to-wafer bonding technologies. The company’s comprehensive equipment lineup, covering surface preparation, cleaning, alignment, and bonding, enables high precision and reliability in fine-pitch interconnects. Its early-mover advantage, proven process know-how, and long-standing relationships with leading semiconductor and packaging manufacturers strengthen its leadership in advanced 3D integration. It focuses on organic and inorganic strategies. For instance, in September 2025, the company introduced the EVG 40 D2W, the industry’s first dedicated die-to-wafer overlay metrology platform designed to perform 100% die overlay measurements on 300 mm wafers with exceptional precision and production-level speed. It continues to invest in process development and customer collaboration via its Heterogeneous Integration Competence Center (HICC). Additionally, the expansion of its manufacturing facility, “Manufacturing V,” and enhanced regional presence in North America and Asia underline its commitment to meeting global demand for 3D Packaging and heterogeneous integration.

Applied Materials, Inc.

Applied Materials, Inc. holds a strong competitive advantage in the hybrid bonding market through its deep expertise in materials engineering, wafer-level process integration, and semiconductor equipment innovation. The company consistently invests heavily in research and development (R&D)—allocating over 10% of its annual revenue to R&D, with spending rising from 10.7% in 2022 to 11.9% in 2024. This sustained commitment enables it to deliver end-to-end hybrid bonding solutions that meet the complex requirements of die-to-wafer and wafer-to-wafer integration. Its extensive technology portfolio across deposition, etching, metrology, and surface preparation allows it to co-optimize processes for advanced 2.5D and 3D device architectures. Furthermore, its strategic collaboration with BE Semiconductor Industries (Besi) enhances its ability to offer fully integrated hybrid bonding platforms, solidifying its position as a key enabler of high-performance, energy-efficient semiconductor packaging essential for AI, high-performance computing (HPC), and data-intensive applications.

Company Ranking

The hybrid bonding market shows a relatively high level of concentration, with the top five players—EV Group (EVG) (Austria), SUSS MicroTec SE (Germany), Applied Materials (US), BE Semiconductor Industries (Netherlands), and Kulicke & Soffa Industries, Inc. (Singapore)—collectively accounting for 59.5–64.5% of the overall market. Their leadership is rooted in deep process expertise, broad equipment portfolios, and strong alignment with the roadmap of advanced packaging and 3D integration. These companies supply core technologies, such as wafer bonders, surface preparation systems, metrology tools, and related automation solutions, all of which are critical for enabling high-density interconnects in logic, memory, CIS, and HPC devices. In addition, their long-standing collaborations with global foundries and IDMs allow them to influence technology development cycles and secure early design wins for next-generation packaging nodes. Significant and sustained R&D investments, global customer support networks, and proven manufacturing capabilities further reinforce their competitive strength and position them as key enablers of the hybrid bonding ecosystem.

Related Reports:

Hybrid Bonding Market by Wafer-to-Wafer (W2W), Die-to-Wafer (D2W), Die-to-Die (D2D), Wafer Bonder, Surface Prep Tool, Inspection & Metrology Tool, Cleaning & CMP System, 2.5D Packaging, and 3D Stacked IC - Global Forecast to 2032

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