MEMS Packaging Substrates Market

The global MEMS packaging substrate market is projected to be valued at USD 2.40 billion in 2025 and is anticipated to attain USD 3.23 billion by 2030, with a CAGR of 6.1% from 2025 to 2030. The expansion of the market is fueled by the increasing adoption of MEMS sensors within the IoT and consumer electronics sectors, as well as the increasing requirement for device miniaturization. The enhanced utilization of sensors in smartphones, wearables, AR/VR, and smart home devices necessitates substrates that are high-performing, compact, and dependable. Advanced materials such as silicon, glass, and ceramics facilitate miniaturization, high-density integration, and protection in next-generation connected devices.

Shin-Etsu Chemical Co., Ltd. (Japan), KYOCERA Corporation (Japan), AGC Inc. (Japan), SCHOTT (Germany), and Okmetic (Finland) are among the leading companies in the MEMS packaging substrate market. Market players have diversified their offerings, launching new products and expanding their geographic presence through collaborations, alliances, and partnerships.

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Major MEMS Packaging Substrates Companies Include:

• CoorsTek Inc. (US)
• CeramTec GmbH (Germany)
• KYOCERA Corporation (Japan)
• AGC Inc. (Japan)
• PLANOPTIK AG (Germany)
• Shin-Etsu Chemical Co., Ltd. (Japan)
• WaferPro (US)
• SCHOTT (Germany)
• Okmetic (Finland)
• HongRuiXing (Hubei) Electronics Co., Ltd. (China)

In October 2025, Kyocera and Kyoto Fusioneering partnered to co-develop advanced ceramic materials for fusion energy systems, with Kyocera also investing in the startup. The collaboration focuses on silicon carbide (SiC) composites for fusion reactors, Solid Oxide Electrolysis Cell (SOEC) components for tritium recovery, and other ceramic technologies to enable stable, efficient fusion power generation.

In January 2025, SCHOTT successfully completed the acquisition of QSIL GmbH, integrating its advanced quartz glass facility and 275 employees. The merger strengthened SCHOTT’s high-performance materials and manufacturing capabilities, improved supply chain resilience for microchip producers, and reaffirmed its commitment to supporting innovative semiconductor technologies in AI, autonomous systems, and next-generation applications.

Shin-Etsu Chemical Co., Ltd.

Shin-Etsu Chemical Co., Ltd. is a leading global materials company dedicated to sustainable practices and providing high-value solutions to society and industry through advanced materials technologies. Its mission includes supplying essential materials for modern life, supporting technological innovation, and helping achieve the Sustainable Development Goals (SDGs), establishing the company as a major player in both industrial and consumer markets worldwide.

Shin-Etsu operates across four main business segments: Infrastructure Materials, Electronics Materials, Functional Materials, and Processing & Specialized Services. The infrastructure segment focuses on PVC resins, caustic soda, and PVA, supporting construction, water supply, and housing with world-class production capacity and stable supply. Electronics Materials include semiconductor silicon wafers, LED packaging materials, photoresists, photomask blanks, and rare earth magnets, serving applications in semiconductors, AI, and data centers. Functional Materials encompass silicones, cellulose derivatives, and silicon metal used in pharmaceuticals, cosmetics, and environmental applications. Processing & Specialized Services provide resin-processed products, wafer cases, precision transport equipment, and engineering solutions. MEMS packaging substrates, falling under Electronics Materials and Processing & Specialized Services, utilize semiconductor wafers, packaging solutions, and precision assembly technologies to support MEMS device fabrication.

KYOCERA Corporation

Kyocera Corporation is a global leader in fine ceramics and electronic components, dedicated to advancing society through sustainable innovation. Over more than sixty years, the company has expanded into various markets including information and communications, automotive, environment and energy, and medical and healthcare. Its extensive portfolio includes fine ceramic components, MEMS packaging substrates, capacitors, connectors, semiconductor devices, LCDs, touch panels, optical components, document imaging equipment, solar energy systems, and high-performance ceramic medical implants. This mix of industrial and consumer products enables Kyocera to serve both traditional industries and emerging technology sectors.

Kyocera’s business is organized into three main reporting segments: Core Components Business, Electronic Components Business, and Solutions Business. The Core Components Business supplies fine ceramic parts for semiconductor equipment, automotive camera modules, ceramic and organic packages, and boards used to protect electronic components and ICs across semiconductor, automotive, industrial, and ICT markets. The Electronic Components Business offers capacitors, crystal devices, connectors, and power semiconductor devices, serving areas like communications, automotive, industrial equipment, and consumer electronics. The Solutions Business includes industrial tools, printers and multifunction devices, document management systems, mobile phones, ICT solutions, and related services. Additionally, the “Others” segment covers activities such as the GaN device business and R&D not directly tied to a specific segment. MEMS packaging substrates are part of the Core Components Business since this division includes ceramic and organic packages designed to protect ICs and electronic components, which directly match MEMS device packaging needs.

Market Ranking

The MEMS packaging substrate market is competitive, with the top five players (KYOCERA Corporation (Japan), AGC Inc. (Japan), Shin-Etsu Chemical Co., Ltd. (Japan), SCHOTT (Germany), and Okmetic (Finland)) collectively holding around 25–30% of the total market share in 2024. These companies leverage their extensive product portfolios, global distribution networks, and strong customer relationships to maintain leadership across consumer electronics, automotive, telecommunications, and other sectors. The high market concentration creates significant entry barriers for new entrants, as success in this sector requires large capital investments, long-term reliability, and compliance with strict security regulations.

Related Reports:

MEMS Packaging Substrates Market by Substrate Type (Glass, Ceramic, Organic, Silicon), Application (Sensor, Actuator), Vertical (Consumer Electronics, Automotive, Industrial, Healthcare, Defense, Aerospace) and Region - Global Forecast to 2030

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