The global silicon carbide market was valued at USD 1.8 billion in 2022 and is projected to reach USD 11.1 billion by 2028; it is expected to register a CAGR of 36.4% during the forecast period. Increasing use of SiC devices in power electronics and higher mechanical, electrical, and thermal properties of SiC than regular silicon are attributed to the increasing use of silicon carbide in automotive end-use application.
STMicroelectronics N.V.; Infineon Technologies AG; WOLFSPEED, INC.; ON Semiconductor Corporation; ROHM Co., Ltd.; Fuji Electric Co., Ltd.; Toshiba Corporation; Hitachi Ltd.; Microchip Technology Inc.; Mitsubishi Electric Corporation; Semikron Danfoss; Qorvo, Inc.; GeneSiC Semiconductor Inc.; TT Electronics; Vishay Intertechnology, Inc.; WeEn Semiconductors; Solitron Devices; Coherent Corp. (II-VI Incorporated); Sanan IC; Shanghai Hanxin Technology; Century Jinguang; Global Power Technology Co., Ltd.; BYD Semiconductor Co., Ltd.; InventChip Technology Co., Ltd.; and CRRC are some of the key players in the silicon carbide market. To retain their presence in the silicon carbide market, these players have adopted growth strategies. Product launches and developments have been the most dominating strategy adopted by the key players from 2020 to 2023 to help them broaden their customer base.
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STMicroelectronics N.V. (STM) is a global semiconductor company that designs, develops, manufactures, and markets a broad range of products used in a wide variety of applications as automotive, industrial, personal electronics and communications equipment, computers and peripherals. For the automotive and industrial end-use applications, the company caters to a broad customer base, especially in the industrial sector, with a broad and deep product portfolio. In personal electronics and communications equipment, computers, and peripherals, the company has a selective approach in terms of customers and technologies, and products. It leverages its broad portfolio to address high-volume applications. The company markets thousands of products sold to over 200,000 customers. It has a broad product portfolio, including fully depleted silicon-on-insulator (FD-SOI) technology offering superior performance and power efficiency compared to bulk CMOS, bipolar CMOS (“Bi-CMOS”) and radio frequency silicon-on insulator (RF-SOI) for mixed-signal and high-frequency applications, as well as a combination of Bipolar, CMOS and DMOS (BCD), vertically integrated power (VIPower), and intelligent integrated gallium-nitride (STI2GaN) technologies for smart power applications, Power MOSFET, silicon carbide (SiC) and gallium nitride (GaN) for high-efficiency systems, micro-electro-mechanical systems (MEMS) technologies for sensors and actuators, embedded memory technologies for the company’s microcontrollers and differentiated optical sensing technologies for its optical sensing solutions.
Infineon Technologies AG is a leader in semiconductor solutions. The company is engaged in the development, production, and marketing of a wide range of semiconductor solutions for automotive, communication, consumer electronics, industrial, and security solutions applications. As of 2022, the company had 31,250 patents and had registered about 1,750 new patents.
The products offered by the company are used in automotive, industrial power control, power management, consumer electronics, computing and data storage, switches and routers, and security in IoT applications.
The company operates through five segments, namely, Automotive, Industrial Power Control, Power & Sensor Systems, Connected Secure Systems, and Other Operating Segments. Through its Automotive; Industrial Power Control; and Power & Sensor Systems segments, the company offers SiC products. The products mainly include metal–oxide–semiconductor field-effect transistor (MOSFET), diodes, and modules.
WOLFSPEED, INC. formerly known as Cree, Inc., is a manufacturer and provider of semiconductor products for the transportation, industrial, energy, and communications markets. It manufactures silicon carbide (SiC) schottky diodes, metal-oxide-semiconductor field-effect transistors (MOSFETs), power modules, as well as radio frequency (RF) products for use in the field of aerospace, defense, and communication infrastructure. The company also operates as an integrated materials supplier and provides SiC substrates, semi-insulating SiC substrates, and a range of epitaxial layers. The material products and power devices provided by the company are used in electric vehicles, power supplies, motor drivers, and solar & transportations applications.
ROHM Co., Ltd. engages in the manufacturing of electronic components such as integrated circuits (ICs), discrete semiconductors, power devices, and modules. The company offers Sic power devices to customers across the world and operates through four business segments—ICs, Discrete semiconductor devices, Modules, and Others. It offers SiC through the Discrete semiconductor devices and Modules business segments. The company has presence in Japan, the Americas, Asia, and Europe. It has R&D as well as organization centers in US, Europe, South Korea, Shanghai, Shenzhen, Hong Kong, India, and Taiwan. It follows Industry-Academia collaboration with Ritsumeikan University, Doshisha University, and Kyoto University to carry out R&D activities on SiC. The major subsidiaries of the company include LAPIS Semiconductor Co., Ltd. (Japan), ROHM Co. Ltd. Korea Corporation (South Korea), ROHM Co., Ltd. Shenzhen Co. Ltd. (China), ROHM Co. Ltd. Singapore Pte Ltd. (Singapore), ROHM Semiconductor Taiwan Co. Ltd. (Taiwan), and ROHM Semiconductor GmbH (Germany).
ON Semiconductor Corporation designs, manufactures, and supplies semiconductor products and solutions. It provides products for applications such as automotive, medical, aerospace and defense, industrial, 5G & cloud power, Internet of things (IoT), communications, wireless, networking, consumer, personal electronics, medical, and computing. The company sells its products through distributors and directly to customers.
The company has three operating and reportable segments, namely, the Power Solutions Group (PSG), the Advanced Solutions Group (ASG), and the Intelligent Sensing Group (ISG). Through its PSG segment, the company provides a wide array of silicon carbide analog, discrete, and module and integrated semiconductor products that perform multiple application functions, including power switching, power conversion, signal conditioning, circuit protection, signal amplification, and voltage regulation functions.
Silicon Carbide Market by Device (SiC Discrete Device, SiC Module), Wafer Size (Up to 150 MM, >150 MM), End-Use Application (Automotive, Energy & Power, Transportation, Industrial, Telecommunications) and Region - Global Forecast to 2028
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