Substrate-Like PCB Market

Market Leadership - Substrate-Like PCB Market

The global substrate-like PCB market is expected to grow from USD 1.1 billion in 2018 to USD 2.6 billion by 2024, at a compound annual growth rate (CAGR) of 15.6% during the forecast period. Major factors driving the growth of the substrate like PCB market are high adoption of SLPs by leading OEMs and surge in demand for smart consumer electronics and wearable devices.

Major players in the substrate-like PCB market include AT&S (Austria);  TTM Technologies (US); Samsung Electro-Mechanics (South Korea); Korea Circuit (South Korea); Kinsus Interconnect Technology (Taiwan); Zhen Ding Technology (Taiwan); Unimicron (Taiwan); Compeq (Taiwan); Ibiden (Japan); Daeduck Electronics (South Korea); ISU Petasys (South Korea); Tripod Technology Corporation (Taiwan); LG Innotek (South Korea). These players have adopted various growth strategies, such as agreements and product launches to further expand their presence in the global substrate-like PCB market. Agreement, collaborations, and expansions have been the most dominating strategies adopted by key players from 2016 to 2018, which helped them to strengthen their product portfolio and broaden their customer base.

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Kinsus (Taiwan) Interconnect Technology is one of the major providers of substrate-like PCBs in 2017. Established in September 2000 and headquartered in Taoyuan City, Taiwan, Kinsus Interconnect Technology manufactures electronic products and materials. Kinsus Interconnect Technology is a subsidiary of ASUSTeK Computer Inc. The company is a global IC substrate supplier and is engaged in developing and manufacturing ball grid array, flip chip, and high-end technology substrates for semiconductor industries. For the SLP market, Kinsus is an IC substrate provider and a major supplier of substrate-like PCBs for an iPhone i8 manufactured by Apple. Apart from Apple, Kinsus is also a supplier for Qualcomm, Broadcom, and Nvidia.

Ibiden (Japan) is an important player in the substrate-like PCB market. Established in 1912 as an electronic power company and headquartered in Ogaki City, Japan, Ibiden is engaged in R&D, manufacturing, and distributing PCBs. As of March 2018, the company had 13,961 employees worldwide. The company provides products that are based on ceramic technology. The company has 33 subsidiaries; 14 of them are in Japan and 19 in overseas. The company has strong presence in Asia, Europe, and North America. As Ibiden is a global supplier, the company business is focused on electronics substrates and ceramics components. The company provides package substrates (PKG) for personal computers and packages (CSP) for smartphones and tablet devices and motherboards/printed wiring boards (PWB). The company has adopted mSAP technology to provide SLP; hence, it is one of the major suppliers of Apple.

Related Reports:

Substrate-Like PCB Market by Line/Spacing (25/25 & 30/30 µm and Less than 25/25 µm), Inspection Technology (Automated Optical Inspection, Direct Imaging, Automated Optical Shaping), Application, and Geography - Global Forecast to 2023

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Report Code
SE 6851
RI Published ON
1/9/2019
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