HOME › Research Insight › The Thermal Interface Materials (TIMs) Market is Driven by Increasing Expansions and New Product Launches by Leading Market Players

The TIMs market is projected to reach USD 2.33 Billion by 2021, at a CAGR of 11.2% between 2016 and 2021. The market for TIMs is fragmented with the presence of different end-use industries. Rising need for miniaturization of electronic devices and increasing demand from the consumer electronics and telecom industries are driving the TIMs market.

New product launch is the key strategy adopted by industry players to expand their share in theTIMs market. This strategy accounted for a share of 67.4% of all growth strategies adopted by the market players between 2011 and 2016. Besides new product launches, companies also adopted the strategy of merger & acquisition to expand their global reach. This strategy accounted for 16.3% of all developments witnessed between 2011 and 2016. Companies such as Henkel AG & Co. KGaA (U.S.), Bergquist Company (U.S.), Indium Corporation (U.S.), Parker Chomerics (U.S.), Dow Corning (U.S.), Laird Technologies (U.S.), Momentive Performance Materials Inc. (U.S.), and Zalman Tech Co., Ltd. (South Korea) made several new product launches during 2011–2016.

The key participants in the TIMs market such as Henkel AG & Co. KGaA (U.S.), Bergquist Company (U.S.), Indium Corporation (U.S.), Parker Chomerics (U.S.), Dow Corning (U.S.), Laird Technologies (U.S.), Momentive Performance Materials Inc. (U.S.), and Zalman Tech Co., Ltd. (South Korea) are profiled in this report. These companies adopted the highest number of strategies in comparison to other players in the global market from 2011 to 2016.

Henkel AG & Co. KGaA (U.S.) and Bergquist Company (U.S.) are the most active player in the TIMs market. They accounted for the largest share of all the developmental activities undertaken in the market. The company follows dynamic growth strategies such as expansions and new product launches to enhance its presence in Asia-Pacific.  For instance, in March 2016, Henkel AG & Co. KGaA (U.S.) formulated a new a thermally conductive Techno melt material. With the ability to transfer heat through the encapsulating layer, thermally conductive Techno melt products offer dual-function performance in a single material solution.

Momentive Performance Materials Inc. (U.S.) also has a strong foothold in the TIMs market. The company launched a line of thermal management products. The product offering includes TC1050 heat spreaders for board-level and system-level thermal management, TMP-EX heat sinks for die-level heat removal with coefficient of thermal expansion (CTE) matching, and TMP-FX thermal straps for flexible heat dissipation at both board and chip levels. The company is focused on both organic and inorganic growth strategies and has enhanced its product portfolio with various developments such as new product launches and joint ventures & collaborations to meet the growing demand from its potential end users.

Related Reports:

Thermal Interface Materials Market by Type (Greases & adhesives, Tapes & Films, Gap Fillers, Metal-Based TIMs, and Phase Change Materials), Application (Computers, Telecom, Medical Devices, Automotive Electronics), and Region - Global Forecast to 2021

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