Here are relevant reports on : thermal-interface-materials-market
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Bookbinding Materials Market by Binding Type (Adhesive Bonded, Mechanically Bonded), Material Type (Paper Cover Materials, Leather, Adhesives, Cloth/Fabric/Spine Reinforcing Materials, Cover Boards), Application, & Region - Global Forecast to 2028
The bookbinding materials market is expected to grow from USD 8.5 billion in 2023 to USD 9.5 billion by 2028, at a CAGR of 2.3% during the forecast period. Henkel AG (Germany), H.B. Fuller (US), Arkema (US), The Dow Chemical Company (US), and UPM Global (Finland) are the key players in the global bookbinding materials market.
- Published: October 2023
- Price: $ 4950
- TOC Available:
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Near Infrared Absorbing Materials Market by Material (Organic Materials, Inorganic Materials), Function (High Transparency, Absorption, Heat Resistance), Absorption Range (700-1000nm, 1000nm), End Use Industry, Region - Global Forecast to 2028
The near infrared absorbing materials market is expected to grow from USD 308 million in 2023 to USD 453 million by 2028, at a CAGR of 7.9% during the forecast period. The key players in this market Sumitomo Metal Mining Co., Ltd. (Japan), Nanophase Technologies Corporation (US), Heraeus Holding (Germany), Keeling & Walker (UK), Edmund Optics (US), Merck (US), 3M (US), (Japan), Resonac Holdings Corporation (Japan), Advanced nano products co ltd (South Korea), Nippon Shokubai Co., Ltd.(Japan).
- Published: July 2023
- Price: $ 4950
- TOC Available:
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Video as a Sensor Market by Camera Type (IP, Thermal, Machine Vision, Hyperspectral), Sensor (Image Motion, Infrared), Product Type (Video Surveillance, Thermal Imaging, Hyperspectral Imaging, Machine Vision & Monitoring) - Global Forecast to 2029
The global video as a sensor market is expected to grow from USD 69.52 billion in 2024 to USD 101.89 billion by 2029, at a compound annual growth rate (CAGR) of 7.9% during the forecast period.The key players Honeywell International Inc. (US), Motorola Solutions, Inc. (US), Dahua Technology Co., Ltd (China), Bosch Security Systems GmbH (Germany),Hangzhou Hikvision Digital, Technology Co., Ltd. (China), AT&T (US), IBM Corporation (US), Cisco Systems, Inc. (US), Axis Communications AB (Sweden), Johnson Controls Inc. (Ireland), Sony Group Corporation (Japan), Sharp Corporation (Japan),Teledyne Technologies Incorporated (US),Corning Incorporated (US),Pixart Imaging Inc. (Taiwan).
- Published: February 2025
- Price: $ 4950
- TOC Available:
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Thin Insulation Market by Type (Sheets & Films, Vacuum Insulation Panels, Coatings), Material (Metals, Aersgels, Silica), Application (Building Thermal Insulation, Pipe Coating Insulation, Thermal Packaging), and by Region - Global Trends & Forecasts to 2021
The global thin insulation market size, in terms of value, is projected to reach USD 2.12 Billion by 2021, at a CAGR of 5.8% between 2016 and 2021. The increasing infrastructure development activities in Asia-Pacific and North America and continuous new product launches and joint ventures & collaborations undertaken by different companies are the key factors for the growth of the global thin insulation market.
- Published: July 2016
- Price: $ 4950
- TOC Available:
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Variable Data Printing Market in Labels by Label Type (Release Liner, Linerless), Composition (Facestock, Topcoat), Printing Technology (Thermal Transfer, Direct Thermal, Electrophotography, Inkjet), End-use Sector, Region - Forecast to 2021
The variable data printing market size will grow from USD 10.79 Billion in 2016 to reach USD 22.27 Billion by 2021, at an estimated CAGR of 15.61%. The global variable data printing market is driven by basic factors, which include strong growth in demand, especially in pharmaceutical, food & beverage and other sectors. These drivers are supported by the high rise in demand from the Asia-Pacific region. Product innovations and technological developments in the market are expected to create strong investment opportunities.
- Published: June 2016
- Price: $ 4950
- TOC Available:
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Thermal Paper Market by Type (Conventional Thermal Paper, Top-Coated Thermal Paper, Synthetic-Base Thermal Paper), Technology (Direct Thermal, Thermal Transfer), Application (Point Of Sale, Lottery & Gaming, Tags & Labels), End-Use Industry (Packaging and Labelling, Printing, Retail), Region - Global Forecast to 2025
The research methodology used to estimate and forecast the Thermal Paper market began with capturing data on key vendor revenues through secondary sources, such as Hoovers, Bloomberg, Chemical Weekly, Factiva, and various other government and private websites and databases. The vendor offerings were taken into consideration to determine the market segmentation. After arriving at the overall market size, the total market was split into several segments and sub-segments, which were later verified through primary research by conducting extensive interviews with key personnel, such as CEOs, VPs, directors, and executives. Data triangulation and market breakdown procedures were employed to complete the overall market engineering process and arrive at the exact statistics for all segments and sub-segments of the market. The breakdown of profiles of primaries is depicted in the figure below.
- Published: March 2026
- Price: $ 4950
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Aerospace Materials Market by Type (Aluminum Alloys, Steel Alloys, Titanium Alloys, Super Alloys, Composite Materials), Aircraft Type (Commercial Aircraft, Business & General Aviation, Helicopters), and Region - Global Forecast to 2030
The aerospace materials market is expected to grow from USD 43.0 billion in 2025 to USD 62.3 billion by 2030, at a CAGR of 7.7% during the forecast period. Prominent companies in the aerospace materials market include Syensqo (Belgium), Toray Industries, Inc. (Japan), Hexcel Corporation (US), Teijin Limited (Japan), Huntsman International LLC (US), VSMPO-AVISMA Corporation (Russia), SGL Carbon (Germany), Mitsubishi Chemical Advanced Materials (Japan), DuPont (US), SABIC (Saudi Arabia), Swiss Steel Group (Switzerland), ATI (US), Alcoa Corporation (US), China Ansteel Group Corporation Limited (China), and Precision Castparts Corp. (PCC) (US), among others.
- Published: September 2025
- Price: $ 4950
- TOC Available:
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Recycled Materials for Mobility Applications Market by Material Type (Polymer Materials, Composites), Vehicle Type (Passenger Cars, Commercial Vehicles), Component, Application (OEMs, Aftermarkets), And Region - Global Forecast to 2027
The recycled materials for mobility applications market is expected to grow from USD 2.5 billion in 2022 to USD 3.9 billion by 2027, at a CAGR of 8.6% during the forecast period. The major players active in the market are Toray Industries, Inc., (Japan), Solvay (Belgium), Faurecia (France), Continental AG (Germany), Neste (Finland), Unifi, Inc. (US), Celanese Corporation (US), Custom Polymers, Inc. (US), Procotex (Belgium), Carbon Fiber Recycling (US), SGL Carbon (Germany), and Wellman Advanced Materials (US).
- Published: March 2023
- Price: $ 4950
- TOC Available:
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Welding Materials Market by Type (Electrodes & Filler Materials, Fluxes & Wires, Gases), Technology (Arc, Resistance, Oxy-Fuel Welding), End-use Industry (Transportation, Building & Construction, Heavy Industries), and Region - Global Forecast to 2030
The welding materials market is expected to grow from USD 18.86 billion in 2025 to USD 22.53 billion by 2030, at a CAGR of 3.62% during the forecast period. The report profiles key companies including Air Liquide (France), Air Products Inc. (US), ESAB (US), Illinois Tool Works Inc. (US), Linde plc (Germany), Lincoln Electric Holdings, Inc. (US), Ador Welding (India), Tianjin Bridge Welding Materials Group Co., Ltd. (China), Kobe Steel, Ltd. (Japan), and voestalpine AG (Austria). These players have adopted various growth strategies to expand their global presence and increase their market share.
- Published: September 2025
- Price: $ 4950
- TOC Available:
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Semiconductor & IC Packaging Materials Market by Type (Organic substrate, Bonding wires, Leadframes, Encapsulation resins, Ceramic packages, Die attach materials, Solder balls), Packaging Technology, End-use industry, and Region - Global Forecast to 2029
The semiconductor & ic packaging materials market is expected to grow from USD 43.9 billion in 2024 to USD 70.9 billion by 2029, at a CAGR of 10.1% during the forecast period. The key players in this market are LG Chem Ltd. (South Korea), Jiangsu ChangJian Technology Co., Ltd. (China), Henkel AG & Co. KGaA (Germany), Kyocera Corporation (Japan), ASE (Taiwan), Siliconware Precision Industries Co., Ltd. (Taiwan), Amkor Technology (US), Texas Instruments (US), IBIDEN CO., LTD. (Japan), Powertech Technology Inc. (Taiwan) etc.
- Published: March 2024
- Price: $ 4950
- TOC Available:
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