Here are relevant reports on : nucleotide-market
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Genomics Market by Product (Reagents, Kits, Instruments), Services (Genome Profiling, Bioinformatics), Technology (Sequencing, PCR, ISH, Flow Cytometry), Study Type (Epigenomics), Application (Drug Discovery, Diagnostics, Agri) - Global Forecast to 2030
The global genomics market, valued at US$44.52 billion in 2024, stood at US$47.07 billion in 2025 and is projected to advance at a resilient CAGR of 12.6% from 2024 to 2030, culminating in a forecasted valuation of US$85.09 billion by the end of the period. The growth of the genomics market is driven by increasing government funding for genomics projects, a rising prevalence of viral and inherited disorders, advancements in NGS platforms, and the expansion of applications in genomics.
- Published: November 2025
- Price: $ 4950
- TOC Available:
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Motion Sensor Market by Motion Technology (IR, Ultrasonic, Microwave, Dual Technology, & Tomographic), Application (Consumer Electronics, Automotive, Aerospace & Defense, Healthcare, & Industrial), and Geography - Global Forecast to 2025-2031
The global motion sensor market was valued at USD 1.11 billion in 2023 and is estimated to reach USD 1.93 billion by 2031, at a CAGR of 7.2% between 2025 and 2031. The growth of the motion sensor market is driven by factors such as high demand for consumer electronics, lucrative opportunities in developing countries, and increased defense spending to upgrade related products. Rising adoption of wearable electronics and increasing requirement to commercialize IoT are a few major factors that are expected to provide growth opportunities to players in the motion sensor market. The report profiles the most promising players in the market. The market is highly dynamic because of the presence of a significant number of big and small players operating in it. Key players in the market are STMicroelectronics (Switzerland), Murata Manufacturing (Japan), Honeywell International (Japan), NXP Semiconductors (Japan), Analog Devices (US), Microchip Technology (US), TDK InvenSense (US), Bosch Sensortec (Germany), Memsic (US), Kionix (US), TE Connectivity (Switzerland), IFM Electronic (US), Sensata Technologies (US), Xsens Technologies (Netherlands), Colibrys (Switzerland), Seiko Epson (Japan), KVH Industries (US), InnaLabs (Ireland), Qualtre (US), and Panasonic Electric Works (Germany).
- Published: January 2026
- Price: $ 4950
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Skinless Servers Market, Global Forecast & Analysis (2011 - 2016)
Skinless servers are manufactured with a reduced amount of rack, chassis and, in some cases, motherboard components, to maximize server density potential and reduce material use and power consumption. It does not used outside sheet like metal covering that’s why is called skinless. Google introduced first skin less server in the market. Skinless server have many common feature like blade server many vendor seems that the market of balde and skinless server are same. Skinless servers are majorly purchased by cloud service providers (CSP) rather than corporate customers, and are often custom or semi-custom manufactured to cloud service providers (CSP)specification.
- Published: January 2026
- Price: $ 4950
- TOC Available:
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Smart Fabric (Intelligent Fabric, Electronic Textiles, Smart Textiles) Market - Global Forecast & Analysis (2012 - 2017) By Products (Sensors, Smart Phones, Sensor-Based Devices, Bluetooth Low Energy, Software, Apps And The Internet, Conductive Fabrics, Conductive Pressure-Sensing Fabrics), & By Applications (Fashion And Entertainment, Sports And Fitness Monitoring, Medical And Healthcare, Transportation, Protection And Military)
Smart fabric is fabric that enable computing, digital components, and electronics to be embedded in them. Part of the development of wearable technology, they are known as intelligent clothing or smart clothing because they allow for the incorporation of built-in technological elements in everyday textiles and clothes. Electronic textiles do not strictly encompass wearable computing because emphasis is placed on the seamless integration between the fabric and the electronic elements, such as cables, microcontrollers, sensors and actuators.
- Published: January 2026
- Price: $ 4950
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Mobile Fraud Detection Market, Global Forecast & Analysis (2011 - 2016)
As the use of payment through mobile grows gradually than the risk of mobile fraud comes into existence. It is based on phone's location information independent of the browser (IP address), so the user does not have to have his or her mobile browser application open for this to work; the phone only needs to be turned on. The two architectures that are used to obtain location information: One relies on device information using the GPS-API applications and the other employs APIs provided through mobile network operators that don't require the users to opt in to releasing this information.
- Published: January 2026
- Price: $ 4950
- TOC Available:
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Chip Implants for Non-Medical Applications Market, Global Forecast & Analysis (2011 - 2016)
The first implant industry has come a long way since the first heart pacemaker. There are various such other devices such as drug infusion pumps which would have been imposible without the development of sophisticated sensors on a chip and the miniaturization of mechanical parts.
- Published: January 2026
- Price: $ 4950
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Managed Print Services Market by Deployment Mode (On Premise, Cloud based, and Hybrid), Channel Type (Printer/Copier Manufacturers, System Integrators/Resellers, and ISVs), Application, Organization Size, and Geography - Global Forecast to 2023
The managed print services market is expected to grow from USD 28.40 Billion in 2016 to USD 50.78 Billion by 2023, at a CAGR of 8.51% between 2017 and 2023. This report provides the market size and future growth potential of the managed print services market across different segments such as deployment mode, channel type, applications, organization size, and geography. Some of the major players in the managed print services market are Xerox Corporation (US), HP Development Company, L.P. (US), Ricoh Company, Ltd. (Japan), and Lexmark International, Inc. (US).
- Published: August 2017
- Price: $ 4950
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Through-Silicon Vias (TSV) IC Packaging Market, Global Forecast & Analysis (2011-2016)
Advancment in IC packaging allows the end product to be smaller like smart cell phone,Tablets. Through silicon vias (TSV) is an advanced teqnique of pckaging where electronic product occupy less space and provide more connectivity. TSV is used to connect multiple ICs togeher in one package. TSV can be used in a no. of market including DRAMs, MPUs, PLDs, special purpose logic communications chips, CMOS image sensors, and graphics chips.
- Published: January 2026
- Price: $ 4950
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ESL Design Tools Market, Global Forecast & Analysis (2011 - 2016)
It is mainly a tool to promote various design methodologies and tool flows which helps the designers and programmers in the next generation systems. It is one of the fastest growing segment of the EDA market.
- Published: January 2026
- Price: $ 4950
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System in Package Market by Packaging Technology (2D IC, 2.5D IC, 3D IC), Package Type (BGA, SOP), Packaging Method (Flip Chip, Wire Bond), Device (RF Front-End, RF Amplifier), Application (Consumer Electronics, Communications) - Global Forecast to 2023
The system in package market is likely to witness high growth in the coming years due to the increasing need for advanced architecture in electronic products and the growing market for smartphones, tablets, and gaming devices. The system in package market is expected to grow from USD 5.44 Billion in 2016 to USD 9.07 Billion by 2023, at a CAGR of 9.4% between 2017 and 2023. The base year considered for the study is 2016, and the forecast period is between 2017 and 2023. ASE Group (Taiwan), Amkor Technology (US), JCET (China), Chipmos Technologies (Taiwan), Chipbond Technology (Taiwan), KYEC (Taiwan), Intel (US), Samsung Electronics (South Korea), Texas Instruments (US), and Signetics (South Korea) are the major players operating in the system in package market.
- Published: November 2017
- Price: $ 4950
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